LM185-1.2QML_14 TI1 | Alldatasheet
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- Low Temperature Coefficient dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage• Radiation Qualified Option tolerance. Since the LM185-1.2 band-gap reference– 100 krad uses only transistors and resistors, low noise and – Low Dose Rate Tested at 10 mrad/s good long term stability result. Careful design of the LM185-1.2 has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185-1.2 makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. Connection Diagrams
Figure 1. LCCC Package Figure 2. TO Package – Bottom View Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are the property of their respective owners. necessarily include testing of all parameters.
Figure 3. CLGA Package during storage or handling to prevent electrostatic damage to the MOS gates.
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temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. (3) Human body model, 1.5KΩ in series with 100pF. Table 1. Mil-Std-883, Method 5005 - Group A
1 Static tests at 25
2 Static tests at 125
3 Static tests at -55
4 Dynamic tests at 25
5 Dynamic tests at 125
6 Dynamic tests at -55
7 Functional tests at 25
9 Switching tests at 25
10 Switching tests at 125
11 Switching tests at -55
12 Settling time at 25
13 Settling time at 125
14 Settling time at -55
LM185-1.2QML SNVS384B –OCTOBER 2005–REVISED JANUARY 2014 www.ti.com LM185–1.2 Electrical Characteristics DC Parameters Sub-Symbol Parameter Conditions Notes Min Max Units groups VRef Reverse Breakdown Voltage IR = 10µA 1.223 1.247 V 1 IR = 20µA 1.205 1.26 V 2, 3 IR = 1mA 1.223 1.247 V 1 1.205 1.26 V 2, 3 IR = 20mA 1.223 1.247 V 1 1.205 1.26 V 2, 3 ΔVRef / ΔIR Reverse Breakdown Voltage 10µA ≤ IR ≤ 1mA -1.0 1.0 mV 1 Change with Current 20µA ≤ IR ≤ 1mA -1.5 1.5 mV 2, 3 1mA ≤ IR ≤ 20mA -10.0 10.0 mV 1 -20.0 20.0 mV 2, 3 VF Forward Bias Voltage IF = 2mA -1.0 -0.4 V 1 LM185–1.2 Electrical Characteristics DC Drift Parameters Delta calculations performed on QMLV devices at group B, subgroup 5, unless otherwise specified on the IPI. Sub-Symbol Parameter Conditions Notes Min Max Units groups VR Reverse Breakdown Voltage IR = 10µA -0.01 0.01 V 1 IR = 20mA -0.01 0.01 V 1 LM185BY–1.2 Electrical Characteristics DC Parameters Sub-Symbol Parameter Conditions Notes Min Max Units groups VRef Reverse Breakdown Voltage IR = 10µA 1.223 1.247 V 1 IR = 20µA 1.205 1.26 V 2, 3 IR = 1mA 1.223 1.247 V 1 1.205 1.26 V 2, 3 IR = 20mA 1.223 1.247 V 1 1.205 1.26 V 2, 3 ΔVRef / ΔIR Reverse Breakdown Voltage 10µA ≤ IR ≤ 1mA -1.0 1.0 mV 1 Change with Current 20µA ≤ IR ≤ 1mA -1.5 1.5 mV 2, 3 1mA ≤ IR ≤ 20mA -10.0 10.0 mV 1 -20.0 20.0 mV 2, 3 VF Forward Bias Voltage IF = 2mA -1.0 -0.4 V 1 TC Temperature Coefficient (1) 50 PPM/°C 2, 3 (1) The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between the operating TMin & TMax, divided by (TMax − TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax − TMin)
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Product Folder Links: LM185-1.2QML
LM185-1.2QML www.ti.com SNVS384B –OCTOBER 2005–REVISED JANUARY 2014 LM185-1.2RLQV SMD 5962R8759461 Post 100 krad Electrical Characteristics DC Parameters(1)(2) Sub-Symbol Parameter Conditions Notes Min Max Units groups ΔVRef Change in Reverse Breakdown IR = 10µA (3) -3 3 % 1 Voltage IR = 1mA (3) -3 3 % 1 ΔVRef / ΔIR Reverse Breakdown Voltage 10µA ≤ IR ≤ 1mA -15 15 mV 1 Change with Current 1mA ≤ IR ≤ 20mA -25 25 mV 1 VF Forward Bias Voltage IF = 2mA -1.0 -0.4 V 1 (1) Radiation hardness assured (RHA) products are those with an "RLQV" suffix in the Texas Instruments' part number or those with an "R" in the SMD number, following "5962". (2) Testing and qualification for RHA products is done on a wafer level according to MIL-STD-883, Test Method 1019. Testing is performed with a 1.5X overtest. To be rated at 100 krad(Si) units are tested to 150 krad(Si) with all parameters remaining inside the post 100 krad Electrical DC test limits in this table. Interim test points are taken at 50, 75 and 100 krad(Si). (3) Change from the 0 rad reading. Copyright © 2005–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM185-1.2QML
Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9.
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Figure 15. Wide Input Range Reference Figure 16. Micropower Reference from 9V Battery Figure 17. Reference from 1.5V Battery **Figure 18. Micropower* 5V Regulator**
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- Short LM385-1.2, adjust R3 for IOUT= temp at 1μA/°K
- Remove short, adjust R2 for correct reading in centigrade
Figure 21. 0°C−100°C Thermometer Figure 22. Lower Power Thermometer
- Short LM385-1.2, adjust R3 for IOUT= temp at 1.8μA/°K
- Remove short, adjust R2 for correct reading in °F
Figure 23. 0°F−50°F Thermometer
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LM185-1.2QML SNVS384B –OCTOBER 2005–REVISED JANUARY 2014 www.ti.com REVISION HISTORY SECTION Released Revision Section Originator Changes 10/07/05 A New Release, Corporate format L. Lytle 2 MDS data sheets converted into one Corp. data sheet format. MNLM185-1.2-X Rev 2A3 and MNLM185BY-1.2-X Rev 0B0 data sheets will be archived. 03/27/13 A All Changed layout of National Data Sheet to TI format 01/07/14 B Features, Electrical Characteristics, K. Kruckmeyer Added post irradiation test limits and typical Typical Performance Characteristics radiation drift plots for radiation qualified option.
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Product Folder Links: LM185-1.2QML
www.ti.com 17-May-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-8759401VXA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401VXA Q 5962-8759401VYA ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG -1.2-QV Q 5962-87594 01VYA ACO 01VYA >T 5962-8759401XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401XA Q 5962-8759401YA ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG -1.2/883 Q 5962-87594 01YA ACO 01YA >T 5962-8759405XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759405XA Q 5962R8759461VXA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 R8759461VXA Q LM185BYH1.2-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759405XA Q LM185H-1.2-QV ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401VXA Q LM185H-1.2-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759401XA Q LM185H-1.2/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185-1.2 Q LM185H-1.2RLQV ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 R8759461VXA Q LM185WG-1.2-QV ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG -1.2-QV Q 5962-87594 01VYA ACO 01VYA >T LM185WG-1.2/883 ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG -1.2/883 Q 5962-87594 01YA ACO 01YA >T LM185WG-1.2RLQV PREVIEW CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG
www.ti.com 17-May-2014 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples -1.2RLQV Q (5962-87594 ~ 5962R87594) (01VYA ACO ~ 61VYA ACO) 01VYA >T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 17-May-2014 Addendum-Page 3 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM185-1.2QML, LM185-1.2QML-SP :
- Military: LM185-1.2QML
- Space: LM185-1.2QML-SP NOTE: Qualified Version Definitions:
- Military - QML certified for Military and Defense Applications
- Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
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