LM185QML TI | Alldatasheet

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+V REF N/C N/C ADJ N/C N/C N/C N/C N/C LM185QML www.ti.com SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 LM185QMLAdjustableMicropowerVoltageReferences Check forSamples: LM185QML 1FEATURES DESCRIPTION The LM185 are micropower 3-terminaladjustable 2• Adjustablefrom 1.24Vto5.30V band-gap voltagereferencediodes.Operatingfrom• OperatingCurrentof10μA to20mA 1.24to5.3V and overa 10μA to20mA currentrange,

  • 1Ω Dynamic Impedance they featureexceptionallylow dynamic impedance and good temperaturestability.On-chiptrimmingis• Low Temperature Coefficient used to providetightvoltagetolerance.Since the LM185 band-gap referenceuses onlytransistorsand resistors,low noise and good long-termstability result. Carefuldesignof the LM185 has made the device tolerantofcapacitiveloading,making iteasy touse in almostany referenceapplication.The wide dynamic operatingrange allowsitsuse withwidelyvarying supplieswithexcellentregulation. The extremelylowpower drainoftheLM185 makes it usefulformicropowercircuitry.Thisvoltagereference can be used to make portablemeters,regulatorsor general purpose analog circuitrywith batterylife approachingshelflife.Further,the wide operating currentallowsitto replaceolderreferenceswitha tightertolerancepart. Connection Diagrams Figure1.PFM MetalCan Package (Bottom View) Figure2.20-LeadlessChip Carrier(Top View) See Package Number NDV0003H See Package Number NAJ0020A Figure3.10-Lead CLGA (Top View) See Package Number NAC0010A Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2005–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com Block Diagram Schematic Diagram These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.

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www.ti.com SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 AbsoluteMaximum Ratings(1) ReverseCurrent 30mA ForwardCurrent 10mA OperatingTemperatureRange −55°C ≤ TA ≤ 125°C StorageTemperature −55°C ≤ TA ≤ 150°C Maximum JunctionTemperatureTJmax 150°C Lead Temperature(soldering,10 seconds) 300°C ThermalResistance θJA LCCC Package (StillAir) 100°C/W flow) MetalCan Package (StillAir) 300°C/W MetalCan Package (500LF/Min 139°C/W Airflow) flow) θJC LCCC Package 25°C/W MetalCan Package 57°C/W Package Weight(Typical) LCCC Package TBD MetalCan Package TBD ESD Tolerance(2) 500V (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhich operationofthedeviceisintendedtobe functional.Forguaranteedspecificationsand testconditions,see theElectricalCharacteristics. (2) Human body model,1.5kΩ inserieswith100 pF. Table1.QualityConformance Inspection Mil-Std-883,Method 5005 -Group A Subgroup Description Temp °C

1 Statictestsat 25

2 Statictestsat 125

3 Statictestsat -55

4 Dynamic testsat 25

5 Dynamic testsat 125

6 Dynamic testsat -55

7 Functionaltestsat 25

9 Switchingtestsat 25

10 Switchingtestsat 125

11 Switchingtestsat -55

12 Settlingtimeat 25

13 Settlingtimeat 125

14 Settlingtimeat -55

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SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com LM185B ElectricalCharacteristicsDC Parameters Sub-Symbol Parameter Conditions Notes Min Max Unit groups VRef ReferenceVoltage IR = 100µA 1.228 1.252 V 1 1.215 1.255 V 2,3 IR = 9µA 1.228 1.252 V 1 IR = 10µA 1.215 1.255 V 2,3 IR = 1mA 1.228 1.252 V 1 1.215 1.255 V 2,3 IR = 20mA 1.228 1.252 V 1 1.215 1.255 V 2,3 VR = 5.3V,IR = 100µA 1.228 1.252 V 1 1.215 1.255 V 2,3 VR = 5.3V,IR = 45µA 1.288 1.252 V 1 VR = 5.3V,IR = 50µA 1.215 1.255 V 2,3 VR = 5.3V,IR = 1.0mA 1.288 1.252 V 1 1.215 1.255 V 2,3 VR = 5.3V,IR = 20mA 1.288 1.252 V 1 1.215 1.255 V 2,3 ΔVRef/ΔIR ReferenceVoltage 9µA ≤ IR ≤ 1mA 1.0 mV 1 Change withCurrent 10µA ≤ IR ≤ 1mA 1.5 mV 2,3 1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2,3 VR = 5.3V,45µA ≤ IR ≤ 1mA 1.0 mV 1 VR = 5.3V,50µA ≤ IR ≤ 1mA 1.5 mV 2,3 VR = 5.3V,1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2,3 ΔVRef / ReferenceVoltage VR = 5.3V,IR = 100µA 3.0 mV 1 ΔVO Change withOutput 6.0 mV 2,3Voltage IF Feedback Current IR = 9µA 20 nA 1 IR = 10µA 25 nA 2,3 IR = 20mA 20 nA 1 25 nA 2,3 VR = 5.3V,IR = 45µA 20 nA 1 VR = 5.3V,IR = 50µA 25 nA 2,3 VR = 5.3V,IR = 20mA 20 nA 1 25 nA 2,3 IC Minimum Operating VR = VRef See (1) 9.0 µA 1 Current See (1) 10 µA 2,3 VR = 5.3V See (1) 45 µA 1 See (1) 50 µA 2,3 (1) Functionaltest.

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www.ti.com SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 LM185BY ElectricalCharacteristicsDC Parameters Sub-Symbol Parameter Conditions Notes Min Max Unit groups VRef ReferenceVoltage IR = 100µA 1.228 1.252 V 1 1.215 1.255 V 2,3 IR = 9µA 1.228 1.252 V 1 IR = 10µA 1.215 1.255 V 2,3 IR = 1mA 1.228 1.252 V 1 1.215 1.255 V 2,3 IR = 20mA 1.228 1.252 V 1 1.215 1.255 V 2,3 VR = 5.3V,IR = 100µA 1.228 1.252 V 1 1.215 1.255 V 2,3 VR = 5.3V,IR = 45µA 1.288 1.252 V 1 VR = 5.3V,IR = 50µA 1.215 1.255 V 2,3 VR = 5.3V,IR = 1.0mA 1.288 1.252 V 1 1.215 1.255 V 2,3 VR = 5.3V,IR = 20mA 1.288 1.252 V 1 1.215 1.255 V 2,3 ΔVRef/ΔIR ReferenceVoltage 9µA ≤ IR ≤ 1mA 1.0 mV 1 Change withCurrent 10µA ≤ IR ≤ 1mA 1.5 mV 2,3 1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2,3 VR = 5.3V,45µA ≤ IR ≤ 1mA 1.0 mV 1 VR = 5.3V,50µA ≤ IR ≤ 1mA 1.5 mV 2,3 VR = 5.3V,1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2,3 ΔVRef / ReferenceVoltage VR = 5.3V,IR = 100µA 3.0 mV 1 ΔVO Change withOutput 6.0 mV 2,3Voltage IF Feedback Current IR = 9µA 20 nA 1 IR = 10µA 25 nA 2,3 IR = 20mA 20 nA 1 25 nA 2,3 VR = 5.3V,IR = 45µA 20 nA 1 VR = 5.3V,IR = 50µA 25 nA 2,3 VR = 5.3V,IR = 20mA 20 nA 1 25 nA 2,3 IC Minimum Operating VR = VRef See (1) 9.0 µA 1 Current See (1) 10 µA 2,3 VR = 5.3V See (1) 45 µA 1 See (1) 50 µA 2,3 TC Temperature See (2) 50 PPM/ °C 1,2,3 Coefficient (1) Functionaltest. (2) The averagetemperaturecoefficientisdefinedas themaximum deviationofreferencevoltage,atallmeasured temperaturesbetween theoperatingTMin & TMax ,dividedby (TMax − TMin).The measured temperatures(TMeasured)are−55°C, 25°C, & 125°C orΔVRef /(TMax − TMin) Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM185QML

SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics Temperature Driftof3 RepresentativeUnits Feedback Current Figure4. Figure5. Minimum OperatingCurrent Reverse Characteristics Figure6. Figure7. Reverse Characteristics Forward Characteristics Figure8. Figure9.

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www.ti.com SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) Output Noise Voltage Dynamic Output Impedance Figure10. Figure11. Response Time Figure12. Temperature CoefficientTypical LM185 Figure13. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM185QML

SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com TYPICAL APPLICATIONS Precision10V Reference Low AC Noise Reference Figure14. Figure15. 25V Low CurrentShunt Regulator 200 mA Shunt Regulator Figure16. Figure17. Series-Shunt20 mA Regulator High EfficiencyLow Power Regulator Figure18. Figure19.

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www.ti.com SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 VoltageLevelDetector VoltageLevelDetector Figure20. Figure21. FastPositiveClamp BidirectionalClamp 2.4V+ ΔVD1 ±2.4V Figure22. Figure23. BidirectionalAdjustableClamp BidirectionalAdjustableClamp ±1.8Vto ±2.4V ±2.4Vto ±6V Figure24. Figure25. *D1 can be any LED, VF=1.5V to2.2Vat3 mA. D1 may actas an indicator.D1 willbe on ifITHRESHOLD fallsbelowthe thresholdcurrent,exceptwithI=O. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM185QML

SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com Simple FloatingCurrentDetector PrecisionFloatingCurrentDetector Figure26. Figure27. CurrentSource CentigradeThermometer, 10mV/ °C Figure28. Figure29. FreezerAlarm 1.2VReference Figure30. Figure31.

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www.ti.com SNVS386D –NOVEMBER 2005–REVISED MARCH 2013 5.0VReference Figure32. REVISION HISTORY SECTION Released Revision Section Originator Changes 11/08/05 A New Release,Corporateformat L.Lytle 2 MDS datasheetsconvertedintoone Corp. datasheetformat.MNLM185B-X Rev 0B0 and MNLM185BY-X Rev 0B0 willbe archived. 04/06/06 B OrderingInformationTable,WG R. Malone Added NSID, ConnectionDiagram,Physical ConnectionDiagram,Absolute DimensionDwg, ThermalResistanceand Maximum RatingsSection,Physical Package WeightforNAC package.RevisionA DimensionsSection willbe Archived. 06/12/08 C LM185B and LM185BY Electrical LarryMcGee CorrectIC test,VR = VREF condition,subgroup Section 1,2,3 moved limitstothemaximum column. RevisionB willbe Archived. 03/27/13 D All Changed layoutofNationalData SheettoTI format. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM185QML

www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 5962-9091402QYA Active Production CFP (NAC) | 10 54 | TUBE No SNPB Level-1-NA-UNLIM -55 to 125 LM185BWG /883 Q 5962-90914 02QYA ACO 02QYA >T LM185BWG/883 Active Production CFP (NAC) | 10 54 | TUBE No SNPB Level-1-NA-UNLIM -55 to 125 LM185BWG /883 Q 5962-90914 02QYA ACO 02QYA >T (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 7-Oct-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 21-May-2025 TRAY L - Outer tray length without tabs KO - Outer tray height W - Outer tray width P1 - Tray unit pocket pitch CW - Measurement for tray edge (Y direction) to corner pocket center CL - Measurement for tray edge (X direction) to corner pocket center Text Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array matrix Max temperature (°C) L (mm) W (mm) (µm) (mm) CL (mm) CW (mm) Pack Materials-Page 1

www.ti.com PACKAGE OUTLINE 8X .050 .002 [1.27 0.05] 10X .017 .002 [0.43 0.05] .241+.020 -.005 [6.12+0.50 -0.12 .2410 .0030 [6.121 0.076] .410 .010 [10.41 0.25] .005 MIN [0.12] TYP .010 .002 [0.25 0.05] .070+.010 -.020 [1.78+0.25 -0.50 .008 .004 TYP [0.2 0.1] .045 MAX TYP [1.14] R.015 .002 [0.38 0.05] 0 -4 .040 .003 [1.02 0.07] .006 .002 TYP [0.15 0.05] CFP - 2.33mm max heightNAC0010A CERAMIC FLATPACK .004 [0.1] NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. For solder thickness and composition, see the "Lead Finish Composition/Thickness" link in the packaging section of the Texas Instruments website 3. Lead 1 identification shall be: a) A notch or other mark within this area b) A tab on lead 1, either side 4. No JEDEC registration as of December 2021 4215196/D 08/2022 5 6 NOTE 3 LEAD 1 ID SUPPLIER OPTION NOTE 3 SEE DETAIL A SEATING PLANE DETAIL A TYPICAL SCALE 1.800

www.ti.com EXAMPLE BOARD LAYOUT (8X .050 ) [1.27] (R.002 ) TYP [0.05] .003 MIN [0.07] ALL AROUND .003 MAX [0.07] ALL AROUND (10X .090 ) [2.29] (10X .027 ) [0.69] (.37 ) [9.4] CFP - 2.33mm max heightNAC0010A CERAMIC FLATPACK SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 7X 4215196/D 08/2022 NON SOLDERMASK DEFINED METAL OPENING SOLDERMASK EXPOSED METAL SOLDERMASK DEFINED SOLDERMASK OPENING SOLDER MASK METAL UNDER EXPOSED METAL

A SIZESCALE PAGE 4 OF REVISIONS BY/APP'DDATEE.C.N.DESCRIPTIONREV DAVID CHIN / ANIS FAUZI12/30/20212197877RELEASE TO DOCUMENT CONTROLA K. SINCERBOX02/14/20222198820NO CHANGE TO DRAWING; REVISION FOR YODA RELEASE;B D. CHIN / K. SINCERBOX02/18/20222198845CHANGE PIN 1 ID LOCATION ON PINC 4215196 REV D

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