LM385-ADJ TI | Alldatasheet
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 LM185/LM285/LM385AdjustableMicropowerVoltageReferences Check forSamples: LM185-ADJ ,LM285-ADJ ,LM385-ADJ Carefuldesignof the LM185 has made the device1FEATURES tolerantofcapacitiveloading,making iteasy touse in 2• Adjustablefrom 1.24Vto5.30V almostany referenceapplication.The wide dynamic
- OperatingCurrentof10μA to20mA operatingrange allowsitsuse withwidelyvarying supplieswithexcellentregulation.• 1% and 2% InitialTolerance
- 1Ω Dynamic Impedance The extremelylowpower drainoftheLM185 makes it usefulformicropowercircuitry.Thisvoltagereference• Low Temperature Coefficient can be used to make portablemeters,regulatorsor The LM185 isratedforoperationover a −55°C to20mA currentrange,they featureexceptionallylow 125°C temperaturerange,whilethe LM285 israteddynamic impedance and good temperaturestability. −40°C to 85°C and the LM385 0°C to 70°C. TheOn-chip trimmingis used to providetightvoltage LM185 isavailableina hermeticTO package and atolerance.SincetheLM185 band-gapreferenceuses LCCC package, while the LM285/LM385 areonly transistorsand resistors,low noise and good availablein a low-costTO-92 package, as wellaslong-termstabilityresult. SOIC. Connection Diagram Figure1. TO-92 Package Figure2. TO Package Bottom View Bottom View Figure3. SOIC Package Figure4. 20-LCCC Top View Top View Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2000–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com Block Diagram TypicalApplications Figure5. 1.2VReference Figure6. 5.0VReference These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 AbsoluteMaximum Ratings(1)(2)(3) ReverseCurrent 30mA ForwardCurrent 10mA OperatingTemperatureRange (4) LM185 Series −55°C to125°C LM285 Series −40°C to85°C LM385 Series 0°C to70°C ESD Susceptibility(5) 2kV StorageTemperature −55°C to150°C SolderingInformation Vapor Phase (60sec.) 215°C Infrared(15sec.) 220°C See An-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices. (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional.Forspecificationsand testconditions,see theElectricalCharacteristics.The specifications applyonlyforthetestconditionslisted. (2) RefertoRETS185H formilitaryspecifications. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (4) Forelevatedtemperatureoperation,see Table1 and ThermalCharacteristics. (5) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. Table1.TJ(max) forElevatedTemperature Operation DEVICE TJ(max) (°C) LM185 150 LM285 125 LM385 100 Thermal Characteristics Over operatingfree-airtemperaturerange(unlessotherwisenoted) Thermal Resistance TO-92 TO-46 SOIC 180°C/W (0.4″ leads) θJA (JunctiontoAmbient) 440°C/W 165°C/W 170°C/W (0.125″ leads) θJC (JunctiontoCase) N/A 80°C/W N/A Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1) LM185, LM285 LM385 LM185BX, LM285 LM385 LM185BY LM385BX,LM185B, LM385BY UnitsParameter Conditions LM285BX, (Limit)Typ TypLM285BY Tested Design Tested Design Tested Design Tested Design Limit Limit Limit Limit Limit Limit Limit Limit Voltage 1.255 1.215 Voltage (max)1mA < IR < 20mA 4 10 20 10 20 5 15 25 15 25Change with Current Dynamic IR = 100μA, f= Output 100Hz Impedance IAC = 0.1IR VOUT = 0.3 0.4 ΩVREF VOUT = 0.7 1 5.3V Reference IR = 100μA Voltage mVChange with 1 3 6 3 6 2 5 10 5 10 (max)Output Voltage Feedback 13 20 25 20 25 16 30 35 30 35 nA (max) Current Minimum VOUT = VREF 6 9 10 9 10 7 11 13 11 13 μA Operating (max)VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60Current(see curve) Output IR = 100μA,10Hz < f μVrms Wideband < 10kHz Noise VOUT = VREF 50 50 VOUT = 5.3V 170 170 Average IR = 100μA X Suffix 30 30 Temperature Y Suffix 50 50 ppm/°cCoefficient (max)All 150 150 150 150(4) Others Long Term IR = 100μA,T = 1000 20 20 ppm Stability Hr, TA = 25°C ± 0.1°C (1) Parametersidentifiedwithboldfacetypeapplyattemperatureextremes.Allothernumbers applyatTA = TJ = 25°C. Unlessotherwise specified,allparametersapplyforVREF < VOUT < 5.3V. (2) Productiontested. (3) Not productiontested.These limitsarenottobe used tocalculateaverageoutgoingqualitylevels. (4) The averagetemperaturecoefficientisdefinedas themaximum deviationofreferencevoltageatallmeasured temperaturesfromTMIN toTMAX ,dividedby TMAX − TMIN .The measured temperaturesare−55,−40,0,25,70,85,125°C.
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 TypicalPerformance Characteristics Temperature Driftof3 RepresentativeUnits Feedback Current Figure7. Figure8. Minimum OperatingCurrent Reverse Characteristics Figure9. Figure10. Reverse Characteristics Forward Characteristics Figure11. Figure12. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Output Noise Voltage Dynamic Output Impedance Figure13. Figure14. Response Time Figure15. Temperature CoefficientTypical LM185 (left), LM285 (center), LM385 (right) Figure16.
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 TYPICAL APPLICATIONS Figure17.Precision10V Reference Figure18.Low AC Noise Reference Figure19.25V Low CurrentShunt Regulator Figure20.200 mA Shunt Regulator Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com Figure21.Series-Shunt20 mA Regulator Figure22.High EfficiencyLow Power Regulator Figure23.VoltageLevelDetector Figure24.VoltageLevelDetector Figure25.FastPositiveClamp Figure26.BidirectionalClamp 2.4V+ ΔVD1 ±2.4V
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 Figure27.BidirectionalAdjustableClamp Figure28.BidirectionalAdjustableClamp ±1.8Vto ±2.4V ±2.4Vto ±6V Figure29. Simple FloatingCurrentDetector Figure30. CurrentSource Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com *D1 can be any LED, VF=1.5V to2.2Vat3 mA. D1 may actas an indicator.D1 willbe on ifITHRESHOLD fallsbelowthe thresholdcurrent,exceptwithI=O. Figure31. PrecisionFloatingCurrentDetector Figure32. CentigradeThermometer, 10mV/ °C Figure33. FreezerAlarm
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 Schematic Diagram Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionE (April2013)toRevisionF Page
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM185BH Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM185BH, LM185BH LM185BH/NOPB Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM185BH, LM185BH LM285BXZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM285 BXZ LM285BXZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM285 BXZ LM285BYM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM285 BYZ LM285BYZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM285 BYZ LM285M/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285M/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285Z/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM285 Z LM285Z/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM285 Z Addendum-Page 1
www.ti.com 23-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM385BM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BXZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 BXZ LM385BXZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 BXZ LM385BYZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 BYZ LM385BYZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 BYZ LM385BZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 BZ LM385BZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 BZ LM385M/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385M/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385Z/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 Z LM385Z/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM385 Z (1) Status: For more details on status, see our product life cycle. Addendum-Page 2
www.ti.com 23-May-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM285BYM/NOPB D SOIC 8 95 495 8 4064 3.05 LM285BYM/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM285M/NOPB D SOIC 8 95 495 8 4064 3.05 LM285M/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM385BM/NOPB D SOIC 8 95 495 8 4064 3.05 LM385BM/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM385M/NOPB D SOIC 8 95 495 8 4064 3.05 LM385M/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE 1.22 0.72 ( 2.54) 1.16 0.92 4.95 4.55 0.76 MAX 2.67 MAX UNCONTROLLED LEAD DIA
0.64 MAX
(MIL/AERO)
1.397 MAX
(COMMERCIAL)
12.7 MIN
3X 0.483 0.407 5.32-5.56 TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. SCALE 1.250
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
( 1.2) METAL 2X ( 1.2) METAL 3X ( 0.7) VIA (R0.05) TYP (2.54) (1.27) TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X SOLDER MASK OPENING SOLDER MASK OPENING
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
www.ti.com PACKAGE OUTLINE 3X 2.67 2.03 5.21 4.44 5.34 4.32 2X 1.27 0.13 3X 0.55 0.38 4.19 3.17
3.43 MIN
3X 0.43 0.35 (2.54) NOTE 3 2X 2.9 2.4
4 MAX
0.076 MAX
(0.51) TYP (1.5) TYP TO-92 - 5.34 mm max heightLP0003A TO-92 4215214/C 04/2025 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. EJECTOR PIN OPTIONAL PLANE SEATING STRAIGHT LEAD OPTION 3 2 1 SCALE 1.200 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
(1.07) (1.5) 2X (1.5) 2X (1.07) (1.27) (2.54) FULL R TYP ( 1.4)0.05 MAX ALL AROUND TYP (2.6) (5.2) (R0.05) TYP 3X ( 0.9) HOLE 2X ( 1.4) METAL 3X ( 0.85) HOLE (R0.05) TYP 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING 1 2 3 LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X METAL TYP SOLDER MASK OPENING SOLDER MASK OPENING METAL 1 2 3
www.ti.com TAPE SPECIFICATIONS 19.0 17.5 13.7 11.7 11.0 8.5
0.5 MIN
3.7-4.3 TYP 9.75 8.50 2.9
2.4 TYP
6.75 5.95 13.0 12.4 (2.5) TYP 16.5 15.5 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 FOR FORMED LEAD OPTION PACKAGE
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