LM361 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 20
Technical content
LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 LM161/LM361HighSpeedDifferentialComparators Check forSamples: LM161 ,LM361 1FEATURES DESCRIPTION The LM161/LM361 isa very high speed differential 2• Independentstrobes input,complementaryTTL outputvoltagecomparator• Ensured high speed: 20 ns max withimprovedcharacteristicsovertheSE529/NE529
- Tightdelaymatching on both outputs forwhich itisa pin-for-pinreplacement.The device has been optimizedforgreaterspeed performance• Complementary TTL outputs and lowerinputoffsetvoltage.Typicallydelayvaries• Operates from op amp supplies: ±15V only3 ns forover-drivevariationsof5 mV to500 mV.
- Low speed variationwithoverdrivevariation Itmay be operatedfromop amp supplies(±15V).
- Low inputoffsetvoltage Complementary outputshaving maximum skew are
- Versatilesupply voltagerange provided.Applicationsinvolvehigh speed analog to digitalconvertersand zero-crossingdetectorsindisk filesystems. CONNECTION DIAGRAMS SOIC or PDIP Package Figure1. Top View Figure2. Package Number LME0010C Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com LOGIC DIAGRAM *Outputislowwhen currentisdrawn fromstrobepin. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) PositiveSupplyVoltage,V+ +16V NegativeSupplyVoltage,V− −16V Gate SupplyVoltage,VCC +7V OutputVoltage +7V DifferentialInputVoltage ±5V InputCommon Mode Voltage ±6V Power Dissipation 600 mW StorageTemperatureRange −65°C to+150°C OperatingTemperatureRange TMIN TMAX LM161 −55°C to+125°C −25°C to+85°C LM361 0°C to+70°C Lead Temp. (Soldering,10 seconds) 260°C ForAny DeviceLead Below V− 0.3V (1) The devicemay be damaged by use beyond themaximum ratings. OperatingConditions Min Typ Max LM161 5V 15V SupplyVoltageV+ LM361 5V 15V LM161 −6V −15V SupplyVoltageV− LM361 −6V −15V LM161 4.5V 5V 5.5V SupplyVoltageVCC LM361 4.75V 5V 5.25V ESD Tolerance(1) 1600V seconds) Infrared(15seconds) 220°C (1) Human body model,1.5kΩ inserieswith100 pF. (2) See AN-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices.
2 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM161 LM361
LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 ElectricalCharacteristics(1)(2)(1) (V+ = +10V, VCC = +5V, V− = −10V,TMIN ≤ TA ≤ TMAX ,unlessnoted) Parameter Conditions Limits Units LM161 LM361 Min Typ Max Min Typ Max InputOffsetVoltage 1 3 1 5 mV 5 10 μA InputBiasCurrent TA=25°C 20 30 μA 2 2 μA InputOffsetCurrent TA=25°C 3 5 μA VoltageGain TA=25°C 3 3 V/mV InputResistance TA=25°C, f=1kHz 20 20 kΩ VCC =4.75V,Logical“0”OutputVoltage 0.4 0.4 VISINK=6.4mA StrobeInput“1”Current VCC =5.25V, 200 200 μA(OutputEnabled) VSTROBE =2.4V StrobeInput“0”Current VCC =5.25V, −1.6 −1.6 mA(OutputDisabled) VSTROBE =0.4V StrobeInput“0”Voltage VCC =4.75V 0.8 0.8 V StrobeInput“1”Voltage VCC =4.75V 2 2 V OutputShortCircuitCurrent VCC =5.25V,VOUT =0V −18 −55 −18 −55 mA SupplyCurrentI+ V+=10V, V−=−10V, 4.5 mA VCC =5.25V, −55°C ≤TA≤125°C SupplyCurrentI+ V+=10V, V−=−10V, 5 mA VCC =5.25V, 0°C ≤TA≤70°C SupplyCurrentI− V+=10V, V−=−10V, 10 mA VCC =5.25V, −55°C ≤TA≤125°C SupplyCurrentI− V+=10V, 10 mA V−=−10V,VCC =5.25V, 0°C ≤TA≤70°C SupplyCurrentICC V+=10V, V−=−10V, 18 mA VCC =5.25V, −55°C ≤TA≤125°C SupplyCurrentICC V+=10V, V−=−10V, 20 mA VCC =5.25V, 0°C ≤TA≤70°C TransientResponse VIN = 50 mV overdrive(3) PropagationDelayTime (tpd(0)) TA=25°C 14 20 14 20 ns PropagationDelayTime (tpd(1)) TA=25°C 14 20 14 20 ns DelayBetween OutputA and B TA=25°C 2 5 2 5 ns StrobeDelayTime (tpd(0)) TA=25°C 8 8 ns StrobeDelayTime (tpd(1)) TA=25°C 8 8 ns (1) Typicalthermalimpedancesareas follows: (2) RefertoRETS161X forLM161H and LM161J militaryspecifications. (3) Measurements usingAC Testcircuit,Fanout= 1.The devicesarefasteratlowsupplyvoltages. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM161 LM361
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics InputCurrents vs Ambient OffsetVoltage Temperature Figure3. Figure4. Supply Currentvs InputCharacteristics Ambient Temperature Figure5. Figure6. Supply Currentvs PropagationDelay vs Supply Voltage Ambient Temperature Figure7. Figure8.
4 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM161 LM361
LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) StrobeDelay Delay ofOutput 1 With vs Respect toOutput 2 vs Ambient Ambient Temperature Temperature Figure9. Figure10. Common-Mode PropagationDelay vs Pulse Response Supply Voltage Figure11. Figure12. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM161 LM361
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com AC TEST CIRCUIT VIN = ±50 mV FANOUT = 1 FANOUT = 4 V− = −10V C=15 pF C = 30 pF V+ = +10V R = 2.4k R = 680Ω VCC = 5.25V
6 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM161 LM361
LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 SCHEMATIC DIAGRAM LM161 R10, R16: 85 R11, R17: 205 Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM161 LM361
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionB (March 2013)toRevisionC Page
8 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM161 LM361
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM361H/NOPB Active Production TO-100 (LME) | 10 500 | TUBE Yes Call TI Level-1-NA-UNLIM 0 to 70 ( LM361H, LM361H) LM361H/NOPB.B Active Production TO-100 (LME) | 10 500 | TUBE Yes Call TI Level-1-NA-UNLIM 0 to 70 ( LM361H, LM361H) LM361M Obsolete Production SOIC (D) | 14 - - Call TI Call TI 0 to 70 LM361M LM361M/NOPB Active Production SOIC (D) | 14 55 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM361M LM361M/NOPB.B Active Production SOIC (D) | 14 55 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM361M LM361MX/NOPB Active Production SOIC (D) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM361M LM361MX/NOPB.B Active Production SOIC (D) | 14 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM361M LM361N/NOPB Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM361N LM361N/NOPB.B Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM361N (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative Addendum-Page 1
www.ti.com 23-May-2025 and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM361MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM361M/NOPB D SOIC 14 55 495 8 4064 3.05 LM361M/NOPB.B D SOIC 14 55 495 8 4064 3.05 LM361N/NOPB N PDIP 14 25 502 14 11938 4.32 LM361N/NOPB.B N PDIP 14 25 502 14 11938 4.32 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C A 9.40 8.51 ( 3.56) STAND-OFF 0.86 0.71 5.84 2.92 8.51 7.75
5.72 MAX
4.70 4.19
1.02 MAX
10X 12.7 MIN 10X 0.53 0.41 1.02
0.25 STAND-OFF
1.397 MAX
1.14 0.74
36 TYP
TO-CAN - 5.72 mm max heightLME0010A TRANSISTOR OUTLINE 4220604/B 09/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration MO-006/TO-100.
0.25 C A
SCALE 0.800
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
9X 0.07 MAX ALL AROUND ( 5.84) ( 1.4) 9X ( 1.4) METAL 10X ( 0.8) VIA (R0.05) TYP (36 ) TYP TO-CAN - 5.72 mm max heightLME0010A TRANSISTOR OUTLINE 4220604/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 12X 9X SOLDER MASK OPENING SOLDER MASK OPENING METAL
www.ti.com PACKAGE OUTLINE C TYP6.2 5.8
1.75 MAX
12X 1.27 14X 0.51 0.31 7.62 TYP0.25 0.13 0 - 8 0.25 0.10 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 8.75 8.55 B NOTE 4 4.0 3.8 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side. 5. Reference JEDEC registration MS-012, variation AB. 1 14
0.25 C A B
0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.800
www.ti.com EXAMPLE BOARD LAYOUT (5.4)
0.07 MIN
14X (1.55) 14X (0.6) 12X (1.27) (R0.05) TYP 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X 7 8 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (5.4) 12X (1.27) 14X (0.6) 14X (1.55) 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 7 8 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2025, Texas Instruments Incorporated