LM360 TI | Alldatasheet
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 LM160/LM360HighSpeedDifferentialComparator Check forSamples: LM160 ,LM360 1FEATURES DESCRIPTION The LM160/LM360 isa very high speed differential 2• Ensured high speed: 20 ns max input,complementaryTTL outputvoltagecomparator• Tightdelaymatching on both outputs with improved characteristics over the
- Complementary TTL outputs μA760/μA760C, for which it is a pin-for-pin replacement.The device has been optimizedfor• High inputimpedance greaterspeed, inputimpedance and fan-out,and• Low speed variationwithoverdrivevariation lowerinputoffsetvoltage.Typicallydelayvariesonly
- Fan-outof4 3 ns foroverdrivevariationsof5 mV to400 mV.
- Low inputoffsetvoltage Complementary outputshaving minimum skew are
- Series74 TTL compatible provided.Applicationsinvolvehigh speed analog to digitalconvertorsand zero-crossingdetectorsindisk filesystems. CONNECTION DIAGRAMS Figure1.Package Number LMC0008C (1) Figure2.Package Number D0008A or P0008E (1) AlsoavailableinSMD# 5962-8767401 These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings (1)(2) PositiveSupplyVoltage +8V NegativeSupplyVoltage −8V Peak OutputCurrent 20 mA DifferentialInputVoltage ±5V InputVoltage V+ ≥ VIN ≥ V− ESD Tolerance(3) 1600V OperatingTemperature LM160 −55°C to+125°C Range LM360 0°C to+70°C StorageTemperatureRange −65°C to+150°C Lead Temperature (Soldering,10 sec.) 260°C SolderingInformation Infrared(15seconds) 220°C See AN-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices. (1) The devicemay be damaged ifused beyond themaximum ratings. (2) RefertoRETS 160X forLM160H, LM160J-14 and LM160J militaryspecifications. (3) Human body model,1.5kΩ inserieswith100 pF.
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 ElectricalCharacteristics (TMIN ≤ TA ≤ TMAX ) Parameter Conditions Min Typ Max Units OperatingConditions SupplyVoltageVCC + 4.5 5 6.5 V SupplyVoltageVCC − −4.5 −5 −6.5 V InputOffsetVoltage R S ≤ 200Ω 2 5 mV InputOffsetCurrent 0.5 3 μA InputBiasCurrent 5 20 μA OutputResistance(EitherOutput) VOUT = VOH 100 Ω Response Time TA = 25°C, VS = ±5V (1)(2) 13 25 ns TA = 25°C, VS = ±5V (4)(2) 14 ns Response Time Differencebetween Outputs (tpd of+VIN1)− (tpd of−VIN2) TA = 25°C (1)(2) 2 ns (tpd of+VIN2)− (tpd of−VIN1) TA = 25°C (1)(2) 2 ns (tpd of+VIN1)− (tpd of+VIN2) TA = 25°C (1)(2) 2 ns (tpd of−VIN1)− (tpd of−VIN2) TA = 25°C (1)(2) 2 ns InputResistance f= 1 MHz 17 kΩ InputCapacitance f= 1 MHz 3 pF AverageTemperatureCoefficientof R S = 50Ω 8 μV/°CInputOffsetVoltage AverageTemperatureCoefficientof 7 nA/°CInputOffsetCurrent Common Mode InputVoltageRange VS = ±6.5V ±4 ±4.5 V DifferentialInputVoltageRange ±5 V OutputHighVoltage(EitherOutput) IOUT = −320 μA,VS = ±4.5V 2.4 3 V OutputLow Voltage(EitherOutput) ISINK = 6.4mA 0.25 0.4 V PositiveSupplyCurrent VS = ±6.5V 18 32 mA NegativeSupplyCurrent VS = ±6.5V −9 −16 mA (1) Response timemeasured fromthe50% pointofa 30 mVp-p 10 MHz sinusoidalinputtothe50% pointoftheoutput. (2) Measurements aremade inAC TestCircuit,Fanout= 1 (3) Response timemeasured fromthe50% pointofa 2 Vp-p 10 MHz sinusoidalinputtothe50% pointoftheoutput. (4) Response timemeasured fromthestartofa 100 mV inputstepwith5 mV overdrivetothetimewhen theoutputcrossesthelogic threshold. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM160 LM360
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics InputCurrent vs Ambient OffsetVoltage Temperature Supply Current vs Ambient InputCharacteristics Temperature Delay ofOutput 1 With PropagationDelay vs Respect toOutput 2 vs Ambient Temperature Ambient Temperature
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) Common-Mode Pulse Response Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM160 LM360
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com AC TEST CIRCUIT VIN=±50 mV FANOUT=1 FANOUT=4 V+=+5V R=2.4k R=630 Ω V−=−5V C=15 pF C=30 pF
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 SCHEMATIC DIAGRAM Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM160 LM360
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionB (March 2013)toRevisionC Page
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM360M Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM 360M LM360M/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM 360M LM360M/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM 360M LM360MX Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 LM 360M LM360MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM 360M LM360MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM 360M (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1
www.ti.com 23-May-2025 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM360MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM360M/NOPB D SOIC 8 95 495 8 4064 3.05 LM360M/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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