LM160_14 TI1 | Alldatasheet
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 LM160/LM360HighSpeedDifferentialComparator Check forSamples: LM160 ,LM360 1FEATURES DESCRIPTION The LM160/LM360 isa very high speed differential 2• Ensured high speed: 20 ns max input,complementaryTTL outputvoltagecomparator• Tightdelaymatching on both outputs with improved characteristics over the
- Complementary TTL outputs μA760/μA760C, for which it is a pin-for-pin replacement.The device has been optimizedfor• High inputimpedance greaterspeed, inputimpedance and fan-out,and• Low speed variationwithoverdrivevariation lowerinputoffsetvoltage.Typicallydelayvariesonly
- Fan-outof4 3 ns foroverdrivevariationsof5 mV to400 mV.
- Low inputoffsetvoltage Complementary outputshaving minimum skew are
- Series74 TTL compatible provided.Applicationsinvolvehigh speed analog to digitalconvertorsand zero-crossingdetectorsindisk filesystems. CONNECTION DIAGRAMS Figure1.Package Number LMC0008C (1) Figure2.Package Number D0008A or P0008E (1) AlsoavailableinSMD# 5962-8767401 These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings (1)(2) PositiveSupplyVoltage +8V NegativeSupplyVoltage −8V Peak OutputCurrent 20 mA DifferentialInputVoltage ±5V InputVoltage V+ ≥ VIN ≥ V− ESD Tolerance(3) 1600V OperatingTemperature LM160 −55°C to+125°C Range LM360 0°C to+70°C StorageTemperatureRange −65°C to+150°C Lead Temperature (Soldering,10 sec.) 260°C SolderingInformation Infrared(15seconds) 220°C See AN-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices. (1) The devicemay be damaged ifused beyond themaximum ratings. (2) RefertoRETS 160X forLM160H, LM160J-14 and LM160J militaryspecifications. (3) Human body model,1.5kΩ inserieswith100 pF.
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 ElectricalCharacteristics (TMIN ≤ TA ≤ TMAX ) Parameter Conditions Min Typ Max Units OperatingConditions SupplyVoltageVCC + 4.5 5 6.5 V SupplyVoltageVCC − −4.5 −5 −6.5 V InputOffsetVoltage R S ≤ 200Ω 2 5 mV InputOffsetCurrent 0.5 3 μA InputBiasCurrent 5 20 μA OutputResistance(EitherOutput) VOUT = VOH 100 Ω Response Time TA = 25°C, VS = ±5V (1)(2) 13 25 ns TA = 25°C, VS = ±5V (4)(2) 14 ns Response Time Differencebetween Outputs (tpd of+VIN1)− (tpd of−VIN2) TA = 25°C (1)(2) 2 ns (tpd of+VIN2)− (tpd of−VIN1) TA = 25°C (1)(2) 2 ns (tpd of+VIN1)− (tpd of+VIN2) TA = 25°C (1)(2) 2 ns (tpd of−VIN1)− (tpd of−VIN2) TA = 25°C (1)(2) 2 ns InputResistance f= 1 MHz 17 kΩ InputCapacitance f= 1 MHz 3 pF AverageTemperatureCoefficientof R S = 50Ω 8 μV/°CInputOffsetVoltage AverageTemperatureCoefficientof 7 nA/°CInputOffsetCurrent Common Mode InputVoltageRange VS = ±6.5V ±4 ±4.5 V DifferentialInputVoltageRange ±5 V OutputHighVoltage(EitherOutput) IOUT = −320 μA,VS = ±4.5V 2.4 3 V OutputLow Voltage(EitherOutput) ISINK = 6.4mA 0.25 0.4 V PositiveSupplyCurrent VS = ±6.5V 18 32 mA NegativeSupplyCurrent VS = ±6.5V −9 −16 mA (1) Response timemeasured fromthe50% pointofa 30 mVp-p 10 MHz sinusoidalinputtothe50% pointoftheoutput. (2) Measurements aremade inAC TestCircuit,Fanout= 1 (3) Response timemeasured fromthe50% pointofa 2 Vp-p 10 MHz sinusoidalinputtothe50% pointoftheoutput. (4) Response timemeasured fromthestartofa 100 mV inputstepwith5 mV overdrivetothetimewhen theoutputcrossesthelogic threshold. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM160 LM360
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics InputCurrent vs Ambient OffsetVoltage Temperature Supply Current vs Ambient InputCharacteristics Temperature Delay ofOutput 1 With PropagationDelay vs Respect toOutput 2 vs Ambient Temperature Ambient Temperature
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) Common-Mode Pulse Response Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM160 LM360
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com AC TEST CIRCUIT VIN=±50 mV FANOUT=1 FANOUT=4 V+=+5V R=2.4k R=630 Ω V−=−5V C=15 pF C=30 pF
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LM160,LM360 www.ti.com SNOSBJ4C –MAY 1999–REVISED MARCH 2013 SCHEMATIC DIAGRAM Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM160 LM360
LM160,LM360 SNOSBJ4C –MAY 1999–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionB (March 2013)toRevisionC Page
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www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM360M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 360M LM360M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM 360M LM360MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM 360M LM360MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM 360M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
www.ti.com 1-Nov-2013 Addendum-Page 2 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM360MX SOIC D 8 2500 367.0 367.0 35.0 LM360MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 Pack Materials-Page 2
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