LM1558 TI | Alldatasheet
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LM1458,LM1558 www.ti.com SNOSBU4D –APRIL 1998–REVISED MARCH 2013 LM1458/LM1558DualOperationalAmplifier Check forSamples: LM1458 ,LM1558 1FEATURES 2• No Frequency Compensation Required • Low-Power Consumption
- Short-CircuitProtection • 8-Lead TO-99 and 8-Lead PDIP
- Wide Common-Mode and DifferentialVoltage • No Latch Up When InputCommon Mode Ranges Range isExceeded
DESCRIPTION
The LM1458 and the LM1558 are generalpurpose dual operationalamplifiers.The two amplifiersshare a common biasnetworkand power supplyleads.Otherwise,theiroperationiscompletelyindependent. The LM1458 isidenticalto the LM1558 exceptthatthe LM1458 has itsspecificationsguaranteedover the temperaturerangefrom0°C to+70°C insteadof−55°C to+125°C. Connection Diagram Figure1. TO-99 Package Figure2.Dual-In-LinePackage (Top View) (Top View) See Package Number LMC (O-MBCY-W8) See Package Number D (R-PDSO-G8) or P (R-PDIP-T8) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM1458,LM1558 SNOSBU4D –APRIL 1998–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1)(2)(3) SupplyVoltage LM1558 ±22V LM1458 ±18V Power Dissipation(4) LM1558H/LM1458H 500 mW LM1458N 400 mW DifferentialInputVoltage ±30V InputVoltage(5) ±15V OutputShort-CircuitDuration Continuous OperatingTemperatureRange LM1558 −55°C to+125°C LM1458 0°C to+70°C StorageTemperatureRange −65°C to+150°C Lead Temperature(Soldering,10 sec.) 260°C SolderingInformation Soldering(10seconds) 260°C Vapor Phase (60seconds) 215°C Infrared(15seconds) 220°C See AN-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices. ESD tolerance(6) 300V (1) “AbsoluteMaximum Ratings”indicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notguaranteespecificperformancelimits. (2) RefertoRETS 1558V forLM1558J and LM1558H militaryspecifications. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (4) The maximum junctiontemperatureoftheLM1558 is150°C, whilethatoftheLM1458 is100°C. Foroperatingatelevatedtemperatures, devicesintheLMC package must be deratedbased on a thermalresistanceof150°C/W, junctiontoambientor20°C/W, junctionto case.ForthePDIP thedevicemust be deratedbased on a thermalresistanceof187°C/W, junctiontoambient. (5) Forsupplyvoltageslessthan±15V,theabsolutemaximum inputvoltageisequaltothesupplyvoltage. (6) Human body model,1.5kΩ inserieswith100 pF. ElectricalCharacteristics(1) Parameter Conditions LM1558 LM1458 Units Min Typ Max Min Typ Max InputOffsetVoltage TA = 25°C, R S ≤ 10 kΩ 1.0 5.0 1.0 6.0 mV InputOffsetCurrent TA = 25°C 80 200 80 200 nA InputBiasCurrent TA = 25°C 200 500 200 500 nA InputResistance TA = 25°C 0.3 1.0 0.3 1.0 M Ω SupplyCurrentBoth TA = 25°C, VS = ±15V 3.0 5.0 3.0 5.6 mAAmplifiers LargeSignalVoltageGain TA = 25°C, VS = ±15V 50 160 20 160 V/mV VOUT = ±10V,R L ≥ 2 kΩ InputOffsetVoltage R S ≤ 10 kΩ 6.0 7.5 mV InputOffsetCurrent 500 300 nA InputBiasCurrent 1.5 0.8 μA LargeSignalVoltageGain VS = ±15V,VOUT = ±10V 25 15 V/mV R L ≥ kΩ OutputVoltageSwing VS = ±15V,R L = 10 kΩ ±12 ±14 ±12 ±14 V R L = 2 kΩ ±10 ±13 ±10 ±13 V (1) These specificationsapplyforVS = ±15V and −55°C ≤ TA ≤ 125°C, unlessotherwisespecified.WiththeLM1458, however,all specificationsarelimitedto0°C ≤ TA ≤ 70°C and VS = ±15V.
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LM1458,LM1558 www.ti.com SNOSBU4D –APRIL 1998–REVISED MARCH 2013 ElectricalCharacteristics(1)(continued) Parameter Conditions LM1558 LM1458 Units Min Typ Max Min Typ Max InputVoltageRange VS = ±15V ±12 ±12 V Common Mode R S ≤ 10 kΩ 70 90 70 90 dBRejectionRatio SupplyVoltage R S ≤ 10 kΩ 77 96 77 96 dBRejectionRatio SCHEMATIC DIAGRAM Numbers inparenthesesarepinnumbers foramplifierB. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM1458 LM1558
LM1458,LM1558 SNOSBU4D –APRIL 1998–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (March 2013)toRevisionD Page
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM1458 MWC Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -40 to 85 LM1458M/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458M/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458N/NOPB Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM1458N LM1458N/NOPB.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM1458N LM1458N/NOPBG4.B Active Production PDIP (P) | 8 40 | TUBE Yes NIPDAU Level-1-NA-UNLIM 0 to 70 LM1458N LM1558H Active Production TO-99 (LMC) | 8 500 | OTHER No Call TI Level-1-NA-UNLIM -55 to 125 ( LM1558H, LM1558H LM1558H/NOPB Active Production TO-99 (LMC) | 8 500 | OTHER Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM1558H, LM1558H MC1558G Active Production TO-99 (LMC) | 8 500 | OTHER No Call TI Level-1-NA-UNLIM -55 to 125 ( LM1558H, LM1558H (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. Addendum-Page 1
www.ti.com 23-May-2025 (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1458MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM1458M/NOPB D SOIC 8 95 495 8 4064 3.05 LM1458M/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM1458N/NOPB P PDIP 8 40 502 14 11938 4.32 LM1458N/NOPB.B P PDIP 8 40 502 14 11938 4.32 LM1458N/NOPBG4.B P PDIP 8 40 502 14 11938 4.32 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .305-.335 [7.75-8.51] .165-.185 [4.19-4.70] .010-.040 [0.25-1.02] SEATING PLANE .040 MAX [1.02] .335-.370 [8.51-9.40] .110-.160 [2.79-4.06] .028-.034 [0.71-0.86] .500 MIN [12.7] .225 [5.72] 8X .016-.021 [0.41-0.53] .200 [5.08] .100 [2.54] UNCONTROLLED LEAD DIA .055[1.397] MAX .029-.045 [0.74-1.14]
45 TYP
TO-CAN - 5.72 mm max heightLMC0008A TRANSISTOR OUTLINE 4220610/B 09/2024 NOTES: 1. All linear dimensions are in inches [millimeters]. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Pin numbers shown for reference only. Numbers may not be marked on package. 4. Reference JEDEC registration MO-002/TO-99. MAX .010 [0.25] C A A
www.ti.com EXAMPLE BOARD LAYOUT (45 ) TYP .003 MAX [0.07] ALL AROUND 7X .003 MAX [0.07] ALL AROUND ( .200 ) [5.08] ( .055) [1.4] 7X ( .055) [1.4] METAL 8X ( .031) VIA [0.8] (R.002 ) TYP [0.05] TO-CAN - 5.72 mm max heightLMC0008A TRANSISTOR OUTLINE 4220610/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 12X 7X SOLDER MASK OPENING SOLDER MASK OPENING METAL
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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