LM1458MX TI1 | Alldatasheet
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LM1458,LM1558 www.ti.com SNOSBU4D –APRIL 1998–REVISED MARCH 2013 LM1458/LM1558DualOperationalAmplifier Check forSamples: LM1458 ,LM1558 1FEATURES 2• No Frequency Compensation Required • Low-Power Consumption
- Short-CircuitProtection • 8-Lead TO-99 and 8-Lead PDIP
- Wide Common-Mode and DifferentialVoltage • No Latch Up When InputCommon Mode Ranges Range isExceeded
DESCRIPTION
The LM1458 and the LM1558 are generalpurpose dual operationalamplifiers.The two amplifiersshare a common biasnetworkand power supplyleads.Otherwise,theiroperationiscompletelyindependent. The LM1458 isidenticalto the LM1558 exceptthatthe LM1458 has itsspecificationsguaranteedover the temperaturerangefrom0°C to+70°C insteadof−55°C to+125°C. Connection Diagram Figure1. TO-99 Package Figure2.Dual-In-LinePackage (Top View) (Top View) See Package Number LMC (O-MBCY-W8) See Package Number D (R-PDSO-G8) or P (R-PDIP-T8) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM1458,LM1558 SNOSBU4D –APRIL 1998–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1)(2)(3) SupplyVoltage LM1558 ±22V LM1458 ±18V Power Dissipation(4) LM1558H/LM1458H 500 mW LM1458N 400 mW DifferentialInputVoltage ±30V InputVoltage(5) ±15V OutputShort-CircuitDuration Continuous OperatingTemperatureRange LM1558 −55°C to+125°C LM1458 0°C to+70°C StorageTemperatureRange −65°C to+150°C Lead Temperature(Soldering,10 sec.) 260°C SolderingInformation Soldering(10seconds) 260°C Vapor Phase (60seconds) 215°C Infrared(15seconds) 220°C See AN-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices. ESD tolerance(6) 300V (1) “AbsoluteMaximum Ratings”indicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notguaranteespecificperformancelimits. (2) RefertoRETS 1558V forLM1558J and LM1558H militaryspecifications. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (4) The maximum junctiontemperatureoftheLM1558 is150°C, whilethatoftheLM1458 is100°C. Foroperatingatelevatedtemperatures, devicesintheLMC package must be deratedbased on a thermalresistanceof150°C/W, junctiontoambientor20°C/W, junctionto case.ForthePDIP thedevicemust be deratedbased on a thermalresistanceof187°C/W, junctiontoambient. (5) Forsupplyvoltageslessthan±15V,theabsolutemaximum inputvoltageisequaltothesupplyvoltage. (6) Human body model,1.5kΩ inserieswith100 pF. ElectricalCharacteristics(1) Parameter Conditions LM1558 LM1458 Units Min Typ Max Min Typ Max InputOffsetVoltage TA = 25°C, R S ≤ 10 kΩ 1.0 5.0 1.0 6.0 mV InputOffsetCurrent TA = 25°C 80 200 80 200 nA InputBiasCurrent TA = 25°C 200 500 200 500 nA InputResistance TA = 25°C 0.3 1.0 0.3 1.0 M Ω SupplyCurrentBoth TA = 25°C, VS = ±15V 3.0 5.0 3.0 5.6 mAAmplifiers LargeSignalVoltageGain TA = 25°C, VS = ±15V 50 160 20 160 V/mV VOUT = ±10V,R L ≥ 2 kΩ InputOffsetVoltage R S ≤ 10 kΩ 6.0 7.5 mV InputOffsetCurrent 500 300 nA InputBiasCurrent 1.5 0.8 μA LargeSignalVoltageGain VS = ±15V,VOUT = ±10V 25 15 V/mV R L ≥ kΩ OutputVoltageSwing VS = ±15V,R L = 10 kΩ ±12 ±14 ±12 ±14 V R L = 2 kΩ ±10 ±13 ±10 ±13 V (1) These specificationsapplyforVS = ±15V and −55°C ≤ TA ≤ 125°C, unlessotherwisespecified.WiththeLM1458, however,all specificationsarelimitedto0°C ≤ TA ≤ 70°C and VS = ±15V.
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LM1458,LM1558 www.ti.com SNOSBU4D –APRIL 1998–REVISED MARCH 2013 ElectricalCharacteristics(1)(continued) Parameter Conditions LM1558 LM1458 Units Min Typ Max Min Typ Max InputVoltageRange VS = ±15V ±12 ±12 V Common Mode R S ≤ 10 kΩ 70 90 70 90 dBRejectionRatio SupplyVoltage R S ≤ 10 kΩ 77 96 77 96 dBRejectionRatio SCHEMATIC DIAGRAM Numbers inparenthesesarepinnumbers foramplifierB. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM1458 LM1558
LM1458,LM1558 SNOSBU4D –APRIL 1998–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (March 2013)toRevisionD Page
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www.ti.com 27-Jul-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM1458M ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 1458M LM1458M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM 1458M LM1458MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458N ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM1458N LM1458N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM1458N LM1558H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 LM1558H LM1558H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM1558H MC1458CP1 ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM1458N MC1458P1 ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM1458N MC1558G ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 LM1558H (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
www.ti.com 27-Jul-2013 Addendum-Page 2 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1458MX SOIC D 8 2500 349.0 337.0 45.0 LM1458MX/NOPB SOIC D 8 2500 349.0 337.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2
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