LM140K TI | Alldatasheet

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Figure 4. TO-3 Metal Can (Bottom View) during storage or handling to prevent electrostatic damage to the MOS gates. (2) Specifications and availability for military grade LM140H/883 and LM140K/883 can be found in the LM140QML datasheet (SNVS382). package and the case-to-ambient thermal resistance of the heatsink. (5) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ. package and the case-to-ambient thermal resistance of the heatsink.

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www.ti.com SNVS994 –JULY 2013 55°C ≤ TJ ≤ + 150°C unless otherwise specified(1) Output Voltage 5V 12V 15V Symbol Input Voltage (unless otherwise noted) 10V 19V 23V Units Parameter Conditions Min Typ Max Min Typ Max Min Typ Max VMIN ≤ VIN ≤ VMAX (7.5 ≤ VIN ≤ 20) (14.8 ≤ VIN ≤ 27) (17.9 ≤ VIN ≤ 30) V ΔVO Line IO = 500 mA 10 18 22 mV Regulation TJ = 25°C, ΔVIN, −55°C ≤ TJ (7.5 ≤ VIN ≤ 20) (14.8 ≤ VIN ≤ 27) (17.9 ≤ VIN ≤ 30) V ≤ +150°C TJ = 25°C 3 10 4 18 4 22 mV TJ = 25°C 4 9 10 mV Over Temperature 12 30 30 mV ΔVIN (8 ≤ VIN ≤ 12) (16 ≤ VIN ≤ 22) (20 ≤ VIN ≤ 26) V ΔVO Load TJ = 5 mA ≤ IO ≤ 1.5A 10 25 12 32 12 35 mV Regulation 25°C 250 mA ≤ IO ≤ 15 19 21 mV 750 mA Over Temperature, 25 60 75 mV 5 mA ≤ IO ≤ 1A IQ Quiescent TJ = 25°C 6 6 6 mA Current Over Temperature 6.5 6.5 6.5 mA ΔIQ Quiescent 5 mA ≤ IO ≤ 1A 0.5 0.5 0.5 mA Current TJ = 25°C, IO = 1A 0.8 0.8 0.8 mAChange VMIN ≤ VIN ≤ VMAX (7.5 ≤ VIN ≤ 20) (14.8 ≤ VIN ≤ 27) (17.9 ≤ VIN ≤ 30) V IO = 500 mA 0.8 0.8 0.8 mA VMIN ≤ VIN ≤ VMAX (8 ≤ VIN ≤ 25) (15 ≤ VIN ≤ 30) (17.9 ≤ VIN ≤ 30) V VN Output Noise TA = 25°C, 10 Hz ≤ f ≤ 100 40 75 90 μV Voltage kHz Ripple TJ = 25°C, f = 120 Hz, IO = 68 80 61 72 60 70 dB Rejection 1A or f = 120 Hz, IO = 500 mA, 68 61 60 dB Over Temperature, VMIN ≤ VIN ≤ VMAX (8 ≤ VIN ≤ 18) (15 ≤ VIN ≤ 25) (18.5 ≤ VIN ≤ 28.5) V RO Dropout TJ = 25°C, IO = 1A 2.0 2.0 2.0 V Voltage Output f = 1 kHz 8 18 19 mΩ Resistance Short-Circuit TJ = 25°C 2.1 1.5 1.2 A Current Peak Output TJ = 25°C 2.4 2.4 2.4 A Current Average TC Min, TJ = 0°C, IO = 5 mA −0.6 −1.5 −1.8 mV/°C of VO VIN Input Voltage TJ = 25°C Required to 7.5 14.5 17.5 VMaintain Line Regulation (1) All characteristics are measured with a 0.22 μF capacitor from input to ground and a 0.1 μF capacitor from output to ground. All characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%). Output voltage changes due to changes in internal temperature must be taken into account separately. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM140K

Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10.

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SNVS994 –JULY 2013 www.ti.com Equivalent Schematic

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Product Folder Links: LM140K

Figure 19. Transients less than or equal to this number. temperature rise vs power dissipation for the heatsink. Figure 20. Fixed Output Regulator

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Figure 24. Positive and Negative Regulator

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www.ti.com 20-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM140K-12 Active Production TO-3 (NDS) | 2 50 | TRAY NON-STD No Call TI Call TI -55 to 125 LM140K 12P+ LM140K-12/NOPB Active Production TO-3 (NDS) | 2 50 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 LM140K 12P+ LM140K-15 Active Production TO-3 (NDS) | 2 50 | TRAY NON-STD No Call TI Call TI -55 to 125 LM140K 15P+ LM140K-15/NOPB Active Production TO-3 (NDS) | 2 50 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 LM140K 15P+ LM140K-5.0 Active Production TO-3 (NDS) | 2 50 | TRAY NON-STD No Call TI Call TI -55 to 125 LM140K 5.0P+ LM140K-5.0/NOPB Active Production TO-3 (NDS) | 2 50 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 LM140K 5.0P+ (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1

www.ti.com 20-May-2025 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 21-May-2025 TRAY L - Outer tray length without tabs KO - Outer tray height W - Outer tray width P1 - Tray unit pocket pitch CW - Measurement for tray edge (Y direction) to corner pocket center CL - Measurement for tray edge (X direction) to corner pocket center Text Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array matrix Max temperature (°C) L (mm) W (mm) (µm) (mm) CL (mm) CW (mm) Pack Materials-Page 1

www.ti.com PACKAGE OUTLINE UNCONTROLLED LEAD DIA .025 [0.64] MAX (MIL/AERO) .055 [1.397] MAX (COMMERCIAL) SEATING PLANE 1.177-1.197 [29.9-30.4] 2X R .495-.510 [12.57-12.95] 2X .151-.161 [3.84-4.09] 2X R.168-.178 [4.27-4.52] .325-.352 [1.52-1.78] .420-.500 [10.67-12.70] .880-.915 [22.35-23.24] .116 MAX [2.95] .210-.220 [5.33-5.59] .425-.435 [10.80-11.05] .760-.775 [19.30-19.69] .660-.670 [16.76-17.02] 2X .038-.043 [0.97-1.09] .980-1.020 [24.89-25.91] TO-CAN - 8.94 mm max heightNDS0002A TRANSISTOR OUTLINE 4214773/B 09/2024 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SCALE 0.500

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