LM136-2.5-N_14 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 16
Technical content
LM136-2.5-N www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013 LM136-2.5-N,LM236-2.5-N,LM336-2.5-NVReferenceDiode Check forSamples: LM136-2.5-N 1FEATURES The LM136-2.5-Nseriesisusefulas a precision2.5V2• Low Temperature Coefficient low voltagereferencefordigitalvoltmeters,power• Wide OperatingCurrentof400 μA to10 mA suppliesor op amp circuitry.The 2.5V make it• 0.2Ω Dynamic Impedance convenienttoobtaina stablereferencefrom5V logic supplies.Further,sincetheLM136-2.5-Noperatesas• ±1% InitialToleranceAvailable a shuntregulator,itcan be used as eithera positive• SpecifiedTemperature Stability ornegativevoltagereference.• EasilyTrimmed forMinimum Temperature Drift The LM136-2.5-Nisratedforoperationover−55°C to• FastTurn-On +125°C whiletheLM236-2.5-Nisratedovera −25°C to+85°C temperaturerange.DESCRIPTION The LM336-2.5-Nisratedforoperationovera 0°C toThe LM136-2.5-N/LM236-2.5-Nand LM336-2.5-N +70°C temperature range. See the connectionintegratedcircuitsare precision2.5V shuntregulator diagramsforavailablepackages.diodes. These monolithicIC voltage references operateas a low-temperature-coefficient2.5V zener with0.2Ω dynamic impedance.A thirdterminalon the LM136-2.5-N allows the reference voltage and temperaturecoefficienttobe trimmedeasily. Connection Diagram TO-92 PlasticPackage TO MetalCan Package Figure1.Bottom View Figure2.Bottom View See Package Number LP See Package Number NDV Figure3.Top View See Package Number D Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM136-2.5-N SNVS749F –MAY 1998–REVISED APRIL 2013 www.ti.com TypicalApplications Figure4. 2.5VReference †Adjustto2.490V *Any siliconsignaldiode Figure5. 2.5VReferencewithMinimum Temperature Coefficient Figure6. Wide InputRange Reference
2 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM136-2.5-N
LM136-2.5-N www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013 These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) ReverseCurrent 15 mA ForwardCurrent 10 mA StorageTemperature −60°C to+150°C OperatingTemperatureRange (3) LM136 −55°C to+150°C LM236 −25°C to+85°C LM336 0°C to+70°C SolderingInformation TO-92 Package (10sec.) 260°C Infrared(15sec.) 220°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.Electricalspecificationsdo notapplywhen operatingthedevicebeyond itsspecifiedoperatingconditions. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Forelevatedtemperatureoperation,Tjmax is: LM136 150°C LM236 125°C LM336 100°C Thermal Resistance TO-92 TO SOIC θja(JunctiontoAmbient) 180°C/W (0.4″ leads) 440°C/W 165°C/W 170°C/W (0.125″ lead) θja(JunctiontoCase) n/a 80°C/W n/a Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM136-2.5-N
LM136-2.5-N SNVS749F –MAY 1998–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1) Parameter Conditions LM136A-2.5-N/ LM336B-2.5-N Units LM236A-2.5-N LM336-2.5-N LM136-2.5-N/ LM236-2.5-N Min Typ Max Min Typ Max Reverse TA=25°C, 2.6 6 2.6 10 mV Breakdown 400 μA≤IR ≤10 mA Change With Current ReverseDynamic TA=25°C, IR =1 mA, f= 100 Hz 0.2 0.6 0.2 1 Ω Impedance Temperature VR Adjustedto2.490V 0°C ≤TA≤70°C (LM336) 1.8 6 mV Stability(2) IR =1 mA Figure15 −25°C ≤TA≤+85°C 3.5 9 mV(LM236H, LM236Z) −25°C ≤ TA ≤ +85°C 7.5 18 mV (LM236M) −55°C ≤TA≤+125°C (LM136) 12 18 mV Reverse 400 μA≤IR ≤10 mA 3 10 3 12 mV Breakdown Change With Current ReverseDynamic IR =1 mA 0.4 1 0.4 1.4 Ω Impedance Long Term StabilityTA=25°C ±0.1°C, IR =1 mA, 20 20 ppmt= 1000 hrs (1) Unlessotherwisespecified,theLM136-2.5-Nisspecifiedfrom−55°C ≤ TA ≤ +125°C, theLM236-2.5-Nfrom−25°C ≤ TA ≤ +85°C and theLM336-2.5-Nfrom0°C ≤ TA ≤ +70°C. (2) TemperaturestabilityfortheLM336 and LM236 familyisspecifiedby design.Designlimitsareensured(butnot100% production tested)overtheindicatedtemperatureand supplyvoltageranges.These limitsarenotused tocalculateoutgoingqualitylevels.Stability isdefinedas themaximum change inVreffrom25°C toTA (min)orTA (max).
4 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM136-2.5-N
LM136-2.5-N www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013 TypicalPerformance Characteristics Reverse VoltageChange Zener Noise Voltage Figure7. Figure8. Dynamic Impedance Response Time Figure9. Figure10. Reverse Characteristics Forward Characteristics Figure11. Figure12. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM136-2.5-N
LM136-2.5-N SNVS749F –MAY 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Temperature Drift Figure13. APPLICATION HINTS The LM136 seriesvoltagereferencesare much easiertouse thanordinaryzenerdiodes.Theirlow impedance and wide operatingcurrentrangesimplifybiasinginalmostany circuit.Further,eitherthebreakdown voltageor thetemperaturecoefficientcan be adjustedtooptimizecircuitperformance. Figure14 shows an LM136 witha 10k potentiometerforadjustingthe reversebreakdown voltage.With the additionofR1 thebreakdown voltagecan be adjustedwithoutaffectingthetemperaturecoefficientofthedevice. The adjustmentrangeisusuallysufficienttoadjustforboththeinitialdevicetoleranceand inaccuraciesinbuffer circuitry. Ifminimum temperaturecoefficientis desired,two diodes can be added in serieswith the adjustment potentiometeras shown in Figure15. When the deviceisadjustedto 2.490V the temperaturecoefficientis minimized.Almostany siliconsignaldiodecan be used forthispurposesuch as a 1N914, 1N4148 ora 1N457. For propertemperaturecompensationthediodesshouldbe inthesame thermalenvironmentas theLM136. Itis usuallysufficienttomount thediodesneartheLM136 on theprintedcircuitboard.The absoluteresistanceofR1 isnotcriticaland any valuefrom2k to20k willwork. Figure14.LM136 With Pot forAdjustment of Figure15.Temperature CoefficientAdjustment Breakdown Voltage (TrimRange = ±70 mV typical) (TrimRange = ±120 mV typical)
6 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM136-2.5-N
LM136-2.5-N www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013 *L1 60 turns#16 wireon ArnoldCore A-254168-2 †Efficiency≈ 80% Figure16. Low Cost 2 Amp SwitchingRegulator† Figure17. PrecisionPower RegulatorwithLow Temperature Coefficient Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM136-2.5-N
LM136-2.5-N SNVS749F –MAY 1998–REVISED APRIL 2013 www.ti.com Figure18. 5V Crowbar *Does notaffecttemperaturecoefficient Figure19. Trimmed 2.5VReferencewithTemperature CoefficientIndependentofBreakdown Voltage Figure20. AdjustableShunt Regulator
8 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM136-2.5-N
LM136-2.5-N www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013 Figure21. LinearOhmmeter Figure22. Op Amp withOutput Clamped Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM136-2.5-N
LM136-2.5-N SNVS749F –MAY 1998–REVISED APRIL 2013 www.ti.com Figure23. BipolarOutput Reference Figure24. 2.5VSquare Wave Calibrator Figure25. 5V BufferedReference
10 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM136-2.5-N
LM136-2.5-N www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013 Figure26. Low Noise BufferedReference Schematic Diagram Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM136-2.5-N
LM136-2.5-N SNVS749F –MAY 1998–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionE (April2013)toRevisionF Page
12 SubmitDocumentationFeedback Copyright© 1998–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM136-2.5-N
www.ti.com 17-Dec-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM136AH-2.5 ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 125 ( LM136AH2.5 ~ LM136AH2.5) LM136AH-2.5/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM136AH2.5 ~ LM136AH2.5) LM136H-2.5 ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 125 ( LM136H2.5 ~ LM136H2.5) LM136H-2.5/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM136H2.5 ~ LM136H2.5) LM236H-2.5 ACTIVE TO NDV 3 1000 TBD Call TI Call TI -25 to 85 ( LM236H2.5 ~ LM236H2.5) LM236H-2.5/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -25 to 85 ( LM236H2.5 ~ LM236H2.5) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 17-Dec-2014 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
www.ti.com H03H (Rev F)
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated