LM135 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 24
Technical content
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 LM135/LM235/LM335,LM135A/LM235A/LM335APrecisionTemperatureSensors Check forSamples: LM135 ,LM135A ,LM235 ,LM235A ,LM335 ,LM335A 1FEATURES • EasilyCalibrated
- Wide OperatingTemperature Range 2• DirectlyCalibratedin°Kelvin
- 200°C Overrange• 1°C InitialAccuracy Available
- Low Cost• Operates from 400 μA to5 mA
- Less than 1Ω Dynamic Impedance
DESCRIPTION
The LM135 seriesare precision,easily-calibrated,integratedcircuittemperaturesensors.Operatingas a 2- terminalzener,theLM135 has a breakdown voltagedirectlyproportionaltoabsolutetemperatureat+10 mV/°K. Withlessthan1Ω dynamic impedance thedeviceoperatesovera currentrangeof400 μA to5 mA withvirtually no change inperformance.When calibratedat25°C theLM135 has typicallylessthan1°C errorovera 100°C temperaturerange.UnlikeothersensorstheLM135 has a linearoutput. ApplicationsfortheLM135 includealmostany typeoftemperaturesensingovera −55°C to150°C temperature range.The lowimpedance and linearoutputmake interfacingtoreadoutorcontrolcircuitryespeciallyeasy. The LM135 operatesover a −55°C to 150°C temperaturerange whilethe LM235 operatesover a −40°C to 125°C temperaturerange.The LM335 operatesfrom −40°C to100°C. The LM135/LM235/LM335 are available packaged inhermeticTO transistorpackageswhiletheLM335 isalsoavailableinplasticTO-92 packages. Schematic Diagram These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1)(2) ReverseCurrent 15 mA ForwardCurrent 10 mA StorageTemperature 8-PinSOIC Package −65°C to150°C SpecifiedOperatingTemp. Range Continuous Intermittent(3) LM135, LM135A −55°C to150°C 150°C to200°C LM235, LM235A −40°C to125°C 125°C to150°C LM335, LM335A −40°C to100°C 100°C to125°C Lead Temp. (Soldering,10 seconds) 8-PinSOIC Package: 300°C Vapor Phase (60seconds): 215°C Infrared(15seconds): 220°C (1) RefertoRETS135H formilitaryspecifications. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) Continuousoperationatthesetemperaturesfor10,000hoursforNDV package and 5,000hoursforLP package may decreaselife expectancyofthedevice. Temperature Accuracy(1) LM135/LM235, LM135A/LM235A Parameter Conditions LM135A/LM235A LM135/LM235 Units Min Typ Max Min Typ Max UncalibratedTemperatureError TC = 25°C, IR = 1 mA 0.5 1 1 3 °C UncalibratedTemperatureError TMIN ≤ TC ≤ TMAX ,IR = 1 mA 1.3 2.7 2 5 °C TemperatureErrorwith25°C TMIN ≤ TC ≤ TMAX ,IR = 1 mA 0.3 1 0.5 1.5 °C Calibration CalibratedErroratExtended TC = TMAX (Intermittent) 2 2 °C Temperatures Non-Linearity IR = 1 mA 0.3 0.5 0.3 1 °C (1) Accuracymeasurements aremade ina well-stirredoilbath.Forotherconditions,selfheatingmust be considered. Temperature Accuracy(1) LM335, LM335A Parameter Conditions LM335A LM335 Units Min Typ Max Min Typ Max UncalibratedTemperatureError TC = 25°C, IR = 1 mA 1 3 2 6 °C UncalibratedTemperatureError TMIN ≤ TC ≤ TMAX ,IR = 1 mA 2 5 4 9 °C TemperatureErrorwith25°C TMIN ≤ TC ≤ TMAX ,IR = 1 mA 0.5 1 1 2 °C Calibration CalibratedErroratExtended TC = TMAX (Intermittent) 2 2 °C Temperatures Non-Linearity IR = 1 mA 0.3 1.5 0.3 1.5 °C (1) Accuracymeasurements aremade ina well-stirredoilbath.Forotherconditions,selfheatingmust be considered.
2 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 ElectricalCharacteristics(1) LM135/LM235 LM335 Parameter Conditions LM135A/LM235A LM335A Units Min Typ Max Min Typ Max OperatingOutputVoltage 400 μA ≤ IR ≤ 5 mA 2.5 10 3 14 mV Change withCurrent AtConstantTemperature Dynamic Impedance IR = 1 mA 0.5 0.6 Ω OutputVoltageTemperature +10 +10 mV/°C Coefficient Time Constant StillAir 80 80 sec 100 ft/MinAir 10 10 sec StirredOil 1 1 sec Time Stability TC = 125°C 0.2 0.2 °C/khr (1) Accuracymeasurements aremade ina well-stirredoilbath.Forotherconditions,selfheatingmust be considered. ThermalResistance 8-PinSOIC TO-92 TO θJA (JunctiontoAmbient) 165°C/W 202°C/W 400°C/W θJC (JunctiontoCase) N/A 170°C/W N/A CONNECTION DIAGRAMS Figure1.8-PinSOIC Figure2.TO-92 Figure3.TO SurfaceMount Package PlasticPackage MetalCan Package (1) Top View Bottom View Bottom View Package Number M08A Package Z03A Package Number H03H (1) Case isconnectedtonegativepin. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics Reverse VoltageChange CalibratedError Figure4. Figure5. Reverse Characteristics Response Time Figure6. Figure7. Dynamic Impedance Noise Voltage Figure8. Figure9.
4 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) Thermal ResistanceJunctiontoAir Thermal Time Constant Figure10. Figure11. Thermal Response inStillAir Thermal Response inStirredOilBath Figure12. Figure13. Forward Characteristics Figure14. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com
APPLICATION INFORMATION
Includedon theLM135 chipisan easy method ofcalibratingthedeviceforhigheraccuracies.A potconnected acrossthe LM135 withthe arm tiedto the adjustmentterminalallowsa 1-pointcalibrationof the sensorthat correctsforinaccuracyoverthefulltemperaturerange. Thissinglepointcalibrationworks because theoutputoftheLM135 isproportionaltoabsolutetemperaturewith the extrapolatedoutputof sensor going to 0V outputat 0°K (−273.15°C). Errorsin outputvoltageversus temperatureare onlyslope(orscalefactor)errorsso a slopecalibrationat one temperaturecorrectsat all temperatures. The outputofthedevice(calibratedoruncalibrated)can be expressedas: (1) where T istheunknown temperatureand To isa referencetemperature,bothexpressedindegreesKelvin.By calibratingtheoutputtoreadcorrectlyatone temperaturetheoutputatalltemperaturesiscorrect.Nominallythe outputiscalibratedat10 mV/°K. To insuregood sensingaccuracyseveralprecautionsmust be taken.Likeany temperaturesensingdevice,self heatingcan reduceaccuracy.The LM135 shouldbe operatedatthelowestcurrentsuitablefortheapplication. Sufficientcurrent,ofcourse,must be availabletodriveboththesensorand thecalibrationpotatthemaximum operatingtemperatureas wellas any externalloads. Ifthesensorisused inan ambientwhere thethermalresistanceisconstant,selfheatingerrorscan be calibrated out.Thisispossibleifthedeviceisrun witha temperaturestablecurrent.Heatingwillthenbe proportionalto zenervoltageand thereforetemperature.Thismakes theselfheatingerrorproportionaltoabsolutetemperature thesame as scalefactorerrors. WATERPROOFING SENSORS Meltableinnercore heat shrinkabletubingsuch as manufacturedby Raychem can be used to make low-cost waterproofsensors.The LM335 isinsertedintothetubingabout½ ″ from theend and thetubingheatedabove themeltingpointofthecore.The unfilled½ ″ end meltsand providesa sealoverthedevice. TypicalApplications Figure15. Basic Temperature Sensor Figure17. Wide OperatingSupply Figure16. CalibratedSensor *Calibratefor2.982Vat25°C
6 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 Figure18. Minimum Temperature Sensing Figure20. Remote Temperature Sensing Wirelengthfor1°C errordue towiredrop Figure19. Average Temperature Sensing IR = 1 mA IR = 0.5mA (1) AWG FEET FEET 14 4000 8000 16 2500 5000 18 1600 3200 20 1000 2000 22 625 1250 24 400 800 (1) ForIR = 0.5mA, thetrimpotmust be deleted. Figure21. IsolatedTemperature Sensor Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com Figure22. Simple Temperature Controller Figure23. Simple Temperature Control Figure24. Ground ReferredFahrenheitThermometer *AdjustR2 for2.554VacrossLM336. AdjustR1 forcorrectoutput. Figure25. CentigradeThermometer *Adjustfor2.7315VatoutputofLM308
8 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 Figure26. FahrenheitThermometer *To calibrateadjustR2 for2.554VacrossLM336. AdjustR1 forcorrectoutput. Figure27. THERMOCOUPLE COLD JUNCTION COMPENSATION CompensationforGrounded Thermocouple *SelectR3 forproperthermocoupletype THERMO-COUPLE R3 (±1%) SEEBECK COEFFICIENT J 377Ω 52.3μV/°C T 308Ω 42.8μV/°C K 293Ω 40.8μV/°C S 45.8Ω 6.4μV/°C Adjustments:Compensates forbothsensorand resistortolerances 1. ShortLM329B 2. AdjustR1 forSeebeck Coefficienttimesambienttemperature(indegreesK) acrossR3. 3. ShortLM335 and adjustR2 forvoltageacrossR3 correspondingtothermocoupletype. J 14.32mV K 11.17mV T 11.79mV S 1.768mV Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com Figure28. SinglePower Supply Cold JunctionCompensation *SelectR3 and R4 forthermocoupletype THERMO-COUPLE R3 R4 SEEBECK COEFFICIENT J 1.05K 385Ω 52.3μV/°C T 856Ω 315Ω 42.8μV/°C K 816Ω 300Ω 40.8μV/°C S 128Ω 46.3Ω 6.4μV/°C Adjustments: 1. AdjustR1 forthevoltageacrossR3 equaltotheSeebeck CoefficienttimesambienttemperatureindegreesKelvin. 2. AdjustR2 forvoltageacrossR4 correspondingtothermocouple. J 14.32mV T 11.79mV K 11.17mV S 1.768mV
10 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 Figure29. CentigradeCalibratedThermocouple Thermometer TerminatethermocouplereferencejunctionincloseproximitytoLM335. Adjustments: 1.Applysignalinplaceofthermocoupleand adjustR3 fora gainof245.7. 2.Shortnon-invertinginputofLM308A and outputofLM329B toground. 3.AdjustR1 so thatVOUT = 2.982V@ 25°C. 4.Remove shortacrossLM329B and adjustR2 so thatVOUT = 246 mV @ 25°C. 5.Remove shortacrossthermocouple. Figure30. FastCharger forNickel-Cadmium Batteries †AdjustD1 to50 mV greaterVZ thanD2. Charge terminateson 5°C temperaturerise.CoupleD2 tobattery. Figure31. DifferentialTemperature Sensor Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com Figure32. DifferentialTemperature Sensor Figure33. VariableOffsetThermometer ‡ †Adjustforzerowithsensorat0°C and 10T potsetat0°C *Adjustforzerooutputwith10T potsetat100°C and sensorat100°C ‡Outputreadsdifferencebetween temperatureand dialsettingof10T pot
12 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160D –MAY 1999–REVISED MARCH 2013 Figure34. Ground ReferredCentigradeThermometer Figure35. AirFlow Detector* *Selfheatingisused todetectairflow DEFINITION OF TERMS OperatingOutput Voltage:The voltageappearingacrossthepositiveand negativeterminalsofthedeviceat specifiedconditionsofoperatingtemperatureand current. UncalibratedTemperature Error:The errorbetween theoperatingoutputvoltageat10 mV/°K and case temperatureatspecifiedconditionsofcurrentand case temperature. CalibratedTemperature Error:The errorbetween operatingoutputvoltageand case temperatureat10 mV/°K overa temperaturerangeata specifiedoperatingcurrentwiththe25°C erroradjustedtozero. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160D –MAY 1999–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (March 2013)toRevisionD Page
14 SubmitDocumentationFeedback Copyright© 1999–2013,Texas InstrumentsIncorporated
ProductFolderLinks:LM135 LM135A LM235 LM235A LM335 LM335A
www.ti.com 9-Jun-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM135AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 150 LM135AH LM135AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 150 LM135AH LM135H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 150 LM135H LM135H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 150 LM135H LM235AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 125 LM235AH LM235AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM235AH LM235H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 125 LM235H LM235H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM235H LM335A MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM LM335AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 100 LM335AH LM335AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 100 LM335AH LM335AM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 100 LM335 AM LM335AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 100 LM335 AM LM335AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM LM335 AZ LM335AZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 100 LM335 AZ LM335H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 100 LM335H
www.ti.com 9-Jun-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM335H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 100 LM335H LM335M ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 100 LM335 M LM335M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 100 LM335 M LM335MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335Z/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM335 Z LM335Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 100 LM335 Z (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 9-Jun-2013 Addendum-Page 3 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM335AMX SOIC D 8 2500 367.0 367.0 35.0 LM335AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM335MX SOIC D 8 2500 367.0 367.0 35.0 LM335MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 Pack Materials-Page 2
www.ti.com H03H (Rev F)
Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated