LM335A TI | Alldatasheet
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Sample & Buy T echnical Documents Tools & Software Support & Community LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160E –MAY 1999–REVISED FEBRUARY 2015 LMx35,LMx35APrecisionTemperatureSensors
1 Features 3 Description
The LM135 series are precision, easily-calibrated, 1• Directly Calibrated to the Kelvin Temperature integrated circuit temperature sensors. Operating asScale a 2-terminal zener, the LM135 has a breakdown• 1°C Initial Accuracy Available voltage directly proportional to absolute temperature
- Operates from 400 μA to 5 mA at 10 mV/°K. With less than 1-Ω dynamic impedance, the device operates over a current range of 400 μA to• Less than 1-Ω Dynamic Impedance 5 mA with virtually no change in performance. When• Easily Calibrated calibrated at 25°C, the LM135 has typically less than
- Wide Operating Temperature Range 1°C error over a 100°C temperature range. Unlike other sensors, the LM135 has a linear output.• 200°C Overrange
- Low Cost Applications for the LM135 include almost any type of temperature sensing over a −55°C to 150°C temperature range. The low impedance and linear2 Applications output make interfacing to readout or control circuitry• Power Supplies are especially easy.
- Battery Management The LM135 operates over a −55°C to 150°C• HVAC temperature range while the LM235 operates over a
- Appliances −40°C to 125°C temperature range. The LM335 operates from −40°C to 100°C. The LMx35 devices are available packaged in hermetic TO transistor packages while the LM335 is also available in plastic TO-92 packages. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM135 TO-46 (3) 4.699 mm × 4.699 mm LM135A LM235 TO-92 (3) 4.30 mm × 4.30 mm LM235A LM335 SOIC (8) 4.90 mm × 3.91 mm LM335A (1) For all available packages, see the orderable addendum at the end of the datasheet. Basic Temperature Sensor Simplified Schematic Calibrated Sensor An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160E –MAY 1999–REVISED FEBRUARY 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2013) to Revision E Page
- Added Pin Configuration and Functions section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Changes from Revision C (November 2012) to Revision D Page
2 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160E –MAY 1999–REVISED FEBRUARY 2015
5 Pin Configuration and Functions
TO-46 (NDV) TO-92 (LP)3 Pins 3 PinsBottom View Bottom View SOIC (D)
8 Pins
— — 1 N.C. — — 2 — No Connection — — 3 – — — 4 O Negative output ADJ — — 5 I Calibration adjust pin — — 6 N.C. — No Connection — — 7 + — — 8 I Positive input Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160E –MAY 1999–REVISED FEBRUARY 2015 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)(4) MIN MAX UNIT Reverse Current 15 mA Forward Current 10 mA 8-Pin SOIC Package −65 150 °CStorage temperature, Tstg TO / TO-92 Package −60 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Refer to RETS135H for military specifications. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Continuous (TMIN ≤ TA ≤ TMAX) −55 150 °C LM135, LM135A Intermittent (1) 150 200 Continuous (TMIN ≤ TA ≤ TMAX) −40 125 °C Specified Temperature LM235, LM235A Intermittent (1) 125 150 Continuous (TMIN ≤ TA ≤ TMAX) −40 100 °C LM335, LM335A Intermittent (1) 100 125 Forward Current 0.4 1 5 mA (1) Continuous operation at these temperatures for 5,000 hours for LP package may decrease life expectancy of the device.
6.3 Thermal Information
THERMAL METRIC(1) UNITSOIC (D) TO-92 (LP) TO-46 (NDV)
8 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 165 202 400 °C/W RθJC Junction-to-case thermal resistance — 170 — (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Temperature Accuracy: LM135/LM235, LM135A/LM235A(1)
PARAMETER TEST CONDITIONS UNIT MIN TYP MAX MIN TYP MAX Uncalibrated Temperature Error TC = 25°C, IR = 1 mA 0.5 1 1 3 °C Uncalibrated Temperature Error TMIN ≤ TC ≤ TMAX, IR = 1 1.3 2.7 2 5 °C mA Temperature Error with 25°C TMIN ≤ TC ≤ TMAX, IR = 1 0.3 1 0.5 1.5 °C mA Calibration Calibrated Error at Extended TC = TMAX (Intermittent) 2 2 °C Temperature Non-Linearity IR = 1 mA 0.3 0.5 0.3 1 °C (1) Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
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Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A
LM135,LM135A,LM235,LM235A,LM335,LM335A www.ti.com SNIS160E –MAY 1999–REVISED FEBRUARY 2015
6.5 Temperature Accuracy: LM335, LM335A(1)
PARAMETER TEST CONDITIONS UNIT MIN TYP MAX MIN TYP MAX Uncalibrated Temperature Error TC = 25°C, IR = 1 mA 1 3 2 6 °C Uncalibrated Temperature Error TMIN ≤ TC ≤ TMAX, IR = 1 2 5 4 9 °C mA Temperature Error with 25°C TMIN ≤ TC ≤ TMAX, IR = 1 0.5 1 1 2 °C mA Calibration Calibrated Error at Extended TC = TMAX (Intermittent) 2 2 °C Temperature Non-Linearity IR = 1 mA 0.3 1.5 0.3 1.5 °C (1) Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
6.6 Electrical Characteristics
See (1). LM135/LM235/LM135A/LM LM335/LM335A 235APARAMETER TEST CONDITIONS UNIT MIN TYP MAX MIN TYP MAX Operating Output Voltage Change 400 μA ≤ IR ≤ 5 mA, At 2.5 10 3 14 mV with Current Constant Temperature Dynamic Impedance IR = 1 mA 0.5 0.6 Ω Output Voltage Temperature 10 10 mV/°C Coefficient Time Constant Still Air 80 80 sec 100 ft/Min Air 10 10 sec Stirred Oil 1 1 sec Time Stability TC = 125°C 0.2 0.2 °C/khr (1) Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A
6.7 Typical Characteristics
Figure 1. Reverse Voltage Change Figure 2. Calibrated Error Figure 3. Reverse Characteristics Figure 4. Response Time Figure 5. Dynamic Impedance Figure 6. Noise Voltage
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LM135,LM135A,LM235,LM235A,LM335,LM335A SNIS160E –MAY 1999–REVISED FEBRUARY 2015 www.ti.com
7 Detailed Description
7.1 Overview
range. The low impedance and linear output make interfacing to readout or control circuitry especially easy. The LM135 operates over a −55°C to 150°C temperature range while the LM235 operates over a −40°C to 125°C temperature range. The LM335 operates from −40°C to 100°C. Operating as a 2-terminal zener, the LM135 has a breakdown voltage directly proportional to absolute temperature at 10 mV/°K. With less than 1-Ω dynamic impedance, the device operates over a current range of 400 μA to 5 mA with virtually no change in performance. When calibrated at 25°C, the LM135 has typically less than 1°C error over a 100°C temperature range. Unlike other sensors, the LM135 has a linear output.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Temperature Calibration Using ADJ Pin
Included on the LM135 chip is an easy method of calibrating the device for higher accuracies. A pot connected across the LM135 with the arm tied to the adjustment terminal (as shown in Figure 12) allows a 1-point calibration of the sensor that corrects for inaccuracy over the full temperature range. This single point calibration works because the output of the LM135 is proportional to absolute temperature with the extrapolated output of sensor going to 0-V output at 0 K (−273.15°C). Errors in output voltage versus temperature are only slope (or scale factor) errors so a slope calibration at one temperature corrects at all temperatures. The output of the device (calibrated or uncalibrated) can be expressed as: where
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Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A
- T is the unknown temperature in degrees Kelvin
- To is a reference temperature in degrees Kelvin (1) By calibrating the output to read correctly at one temperature the output at all temperatures is correct. Nominally the output is calibrated at 10 mV/K. Calibrate for 2.982V at 25°C
Figure 12. Calibrated Sensor
7.4 Device Functional Modes
is recommended. For more information on calibration, see Temperature Calibration Using ADJ Pin.
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
heating can reduce accuracy. The LM135 should be operated at the lowest current suitable for the application. operating temperature as well as any external loads. the same as scale factor errors.
8.2 Typical Application
Figure 13. Basic Temperature Sensor
8.2.1 Design Requirements
Table 1. Design Parameters
8.2.2 Detailed Design Procedure
could be up to 1 K maximum from the LM135A, for example.
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8.2.3 Application Curve
Figure 14. Reverse Characteristics
8.3 System Examples
Figure 15. Wide Operating Supply Figure 16. Minimum Temperature Sensing Figure 17. Average Temperature Sensing Figure 18. Isolated Temperature Sensor
Figure 19. Simple Temperature Controller Figure 20. Simple Temperature Control Adjust R1 for correct output. Figure 21. Ground Referred Fahrenheit Figure 22. Centigrade Thermometer To calibrate adjust R2 for 2.554V across LM336. Adjust R1 for correct output. Figure 23. Fahrenheit Thermometer
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8.3.1 Thermocouple Cold Junction Compensation
Figure 24. Thermocouple Cold Junction Compensation
- Adjust R1 for Seebeck Coefficient times ambient temperature (in degrees K) across R3.
- Short LM335 and adjust R2 for voltage across R3 corresponding to thermocouple type.
- Adjust R1 for the voltage across R3 equal to the Seebeck Coefficient times ambient temperature in degrees Kelvin.
- Adjust R2 for voltage across R4 corresponding to thermocouple.
- Apply signal in place of thermocouple and adjust
- Short non-inverting input of LM308A and output ofSelect R3 and R4 for thermocouple type LM329B to ground.
- Adjust R1 so that VOUT = 2.982V @ 25°C.
- Remove short across LM329B and adjust R2 so
- Remove short across thermocouple.
Figure 25. Single Power Supply Cold Junction Figure 26. Centigrade Calibrated Thermocouple Figure 27. Differential Temperature Sensor Figure 28. Differential Temperature Sensor
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9 Power Supply Recommendations
Ensure the LM335 is biased properly with a current ranging 0.4 mA to 5 mA.
10 Layout
10.1 Layout Guidelines
device to a surface and the temperature should be within about 0.01°C of the surface temperature. by the TO92 package could greatly depend on velocity of the airflow as well. shown in Figure 33 with the smallest possible geometry traces connecting back to rest of the PCB.
10.2 Layout Example
Figure 33. Layout Example
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10.3 Waterproofing Sensors
above the melting point of the core. The unfilled 0.5-inch end melts and provides a seal over the device.
10.4 Mounting the Sensor at the End of a Cable
biasing the LM135 on. Table 2 shows the wire AWG and the length of wire that would cause 1°C error. Figure 34. Cable Connected Temperature Sensor Table 2. Wire Length for 1°C Error Due to Wire Drop (1) For IR = 0.5 mA, the trim pot must be deleted.
11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
specified conditions of operating temperature and current. temperature at specified conditions of current and case temperature. over a temperature range at a specified operating current with the 25°C error adjusted to zero.
11.2 Related Links
resources, tools and software, and quick access to sample or buy. Table 3. Related Links
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
www.ti.com 29-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM135AH Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -55 to 150 ( LM135AH, LM135AH LM135AH.B Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -55 to 150 ( LM135AH, LM135AH LM135AH/NOPB Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -55 to 150 ( LM135AH, LM135AH LM135AH/NOPB.B Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -55 to 150 ( LM135AH, LM135AH LM135H Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -55 to 150 ( LM135H, LM135H) LM135H.B Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -55 to 150 ( LM135H, LM135H) LM135H/NOPB Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -55 to 150 ( LM135H, LM135H) LM135H/NOPB.B Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -55 to 150 ( LM135H, LM135H) LM235AH Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -40 to 125 ( LM235AH, LM235AH LM235AH.B Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -40 to 125 ( LM235AH, LM235AH LM235AH/NOPB Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 125 ( LM235AH, LM235AH LM235AH/NOPB.B Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 125 ( LM235AH, LM235AH LM235H Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -40 to 125 ( LM235H, LM235H) LM235H.B Active Production TO (NDV) | 3 500 | SMALL T&R No Call TI Level-1-NA-UNLIM -40 to 125 ( LM235H, LM235H) LM235H/NOPB Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 125 ( LM235H, LM235H) LM235H/NOPB.B Active Production TO (NDV) | 3 500 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 125 ( LM235H, LM235H) LM335A MWC Active Production WAFERSALE (YS) | 0 1 | null - Call TI Call TI -40 to 85 LM335AH/NOPB Active Production TO (NDV) | 3 1000 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 100 ( LM335AH, LM335AH LM335AH/NOPB.B Active Production TO (NDV) | 3 1000 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 100 ( LM335AH, LM335AH LM335AM Last Time Buy Production SOIC (D) | 8 95 | TUBE No Call TI Level-1-235C-UNLIM -40 to 100 LM335 AM Addendum-Page 1
www.ti.com 29-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM335AM/NOPB Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 100 LM335 AM LM335AMX NRND Production SOIC (D) | 8 2500 | LARGE T&R No Call TI Level-1-235C-UNLIM -40 to 100 LM335 AM LM335AMX.B NRND Production SOIC (D) | 8 2500 | LARGE T&R No Call TI Level-1-235C-UNLIM -40 to 100 LM335 AM LM335AMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK - Call TI N/A for Pkg Type -40 to 100 LM335 AZ LM335AZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK - Call TI N/A for Pkg Type -40 to 100 LM335 AZ LM335H Active Production TO (NDV) | 3 1000 | SMALL T&R No Call TI Level-1-NA-UNLIM -40 to 100 ( LM335H, LM335H) LM335H.B Active Production TO (NDV) | 3 1000 | SMALL T&R No Call TI Level-1-NA-UNLIM -40 to 100 ( LM335H, LM335H) LM335H/NOPB Active Production TO (NDV) | 3 1000 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 100 ( LM335H, LM335H) LM335H/NOPB.B Active Production TO (NDV) | 3 1000 | SMALL T&R Yes Call TI Level-1-NA-UNLIM -40 to 100 ( LM335H, LM335H) LM335M NRND Production SOIC (D) | 8 95 | TUBE No Call TI Level-1-235C-UNLIM -40 to 100 LM335 M LM335M.B NRND Production SOIC (D) | 8 95 | TUBE No Call TI Level-1-235C-UNLIM -40 to 100 LM335 M LM335M/NOPB Obsolete Production SOIC (D) | 8 - - Call TI Call TI -40 to 100 LM335 M LM335MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335Z/LFT7 Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type - LM335 Z LM335Z/LFT7.B Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type -40 to 100 LM335 Z LM335Z/NOPB Active Production TO-92 (LP) | 3 1800 | BULK - Call TI N/A for Pkg Type -40 to 100 LM335 Z Addendum-Page 2
www.ti.com 29-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM335Z/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK - Call TI N/A for Pkg Type -40 to 100 LM335 Z (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM335AMX SOIC D 8 2500 367.0 367.0 35.0 LM335AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM335MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM335AM D SOIC 8 95 495 8 4064 3.05 LM335AM D SOIC 8 95 495 8 4064 3.05 LM335M D SOIC 8 95 495 8 4064 3.05 LM335M D SOIC 8 95 495 8 4064 3.05 LM335M.B D SOIC 8 95 495 8 4064 3.05 LM335M.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE 1.22 0.72 ( 2.54) 1.16 0.92 4.95 4.55 0.76 MAX 2.67 MAX UNCONTROLLED LEAD DIA
0.64 MAX
(MIL/AERO)
1.397 MAX
(COMMERCIAL)
12.7 MIN
3X 0.483 0.407 5.32-5.56 TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. SCALE 1.250
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
( 1.2) METAL 2X ( 1.2) METAL 3X ( 0.7) VIA (R0.05) TYP (2.54) (1.27) TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X SOLDER MASK OPENING SOLDER MASK OPENING
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
www.ti.com PACKAGE OUTLINE 3X 2.67 2.03 5.21 4.44 5.34 4.32 2X 1.27 0.13 3X 0.55 0.38 4.19 3.17
3.43 MIN
3X 0.43 0.35 (2.54) NOTE 3 2X 2.9 2.4
4 MAX
0.076 MAX
(0.51) TYP (1.5) TYP TO-92 - 5.34 mm max heightLP0003A TO-92 4215214/C 04/2025 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. EJECTOR PIN OPTIONAL PLANE SEATING STRAIGHT LEAD OPTION 3 2 1 SCALE 1.200 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
(1.07) (1.5) 2X (1.5) 2X (1.07) (1.27) (2.54) FULL R TYP ( 1.4)0.05 MAX ALL AROUND TYP (2.6) (5.2) (R0.05) TYP 3X ( 0.9) HOLE 2X ( 1.4) METAL 3X ( 0.85) HOLE (R0.05) TYP 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING 1 2 3 LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X METAL TYP SOLDER MASK OPENING SOLDER MASK OPENING METAL 1 2 3
www.ti.com TAPE SPECIFICATIONS 19.0 17.5 13.7 11.7 11.0 8.5
0.5 MIN
3.7-4.3 TYP 9.75 8.50 2.9
2.4 TYP
6.75 5.95 13.0 12.4 (2.5) TYP 16.5 15.5 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 FOR FORMED LEAD OPTION PACKAGE
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