LM134H

LM334 TI | Alldatasheet

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 LM134/LM234/LM3343-TerminalAdjustableCurrentSources Check forSamples: LM134 ,LM234 ,LM334 1FEATURES The sense voltageused toestablishoperatingcurrent2• Operates From 1V to40V in the LM134 is 64mV at 25°C and is directly• 0.02%/V CurrentRegulation proportionalto absolute temperature (°K). The• Programmable From 1μA to10mA simplestone externalresistorconnection,then, generatesa currentwith ≈+0.33%/°C temperature• True 2-TerminalOperation dependence.Zero driftoperationcan be obtainedby• Availableas FullySpecifiedTemperature addingone extraresistorand a diode.Sensor Applicationsfor the currentsources includebias• ±3% InitialAccuracy networks,surge protection,low power reference, The LM134 isspecifiedovera temperaturerange ofThe LM134/LM234/LM334 are truefloatingcurrent −55°C to+125°C, theLM234 from −25°C to+100°Csourceswithno separatepower supplyconnections. and the LM334 from 0°C to +70°C. These devicesInaddition,reverseappliedvoltagesofup to20V will are availablein TO hermetic,TO-92 and SOIC-8draw only a few dozen microamperes of current, plasticpackages.allowingthe devicesto act as both a rectifierand currentsourceinAC applications. Connection Diagrams Figure1.SOIC-8 SurfaceMount Package Figure2.SOIC-8 AlternativePinoutSurfaceMount LM334MX/NOPB) (LM334SM; LM334SM/NOPB; LM334SMX; LM334SMX/NOPB)See Package Number D See Package Number D Figure3.TO MetalCan Package (Bottom View) Figure4.TO-92 PlasticPackage (Bottom View) See Package Number NDV See Package Number LP Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2000–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) V+ toV− ForwardVoltage LM134/LM234/LM334 40V LM234-3/LM234-6 30V V+ toV− ReverseVoltage 20V R PintoV− Voltage 5V SetCurrent 10 mA Power Dissipation 400 mW ESD Susceptibility(3) 2000V OperatingTemperatureRange (4) LM134 −55°C to+125°C LM234/LM234-3/LM234-6 −25°C to+100°C LM334 0°C to+70°C SolderingInformation TO-92 Package (10sec.) 260°C Infrared(15sec.) 220°C (1) “AbsoluteMaximum Ratings”indicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Human body model,100pF dischargedthrougha 1.5kΩ resistor. (4) Forelevatedtemperatureoperation,TJ max is: LM134 150°C LM234 125°C LM334 100°C See ThermalCharacteristics. Thermal Characteristics overoperatingfree-airtemperaturerange(unlessotherwisenoted) Thermal Resistance TO-92 TO SOIC-8 θja(JunctiontoAmbient) 180°C/W (0.4″ leads) 440°C/W 165°C/W 160°C/W (0.125″ leads) θjc(JunctiontoCase) N/A 32°C/W 80°C/W

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 ElectricalCharacteristics(1) LM134/LM234 LM334 Parameter Conditions Units Min Typ Max Min Typ Max SetCurrentError,V+=2.5V(2) 10μA ≤ ISET ≤ 1mA 3 6 % 1mA < ISET ≤ 5mA 5 8 % 2μA ≤ ISET < 10μA 8 12 % RatioofSetCurrenttoBias 100μA ≤ ISET ≤ 1mA 14 18 23 14 18 26 Current 1mA ≤ ISET ≤ 5mA 14 14 2 μA≤ISET ≤100 μA 18 23 18 26 Minimum OperatingVoltage 2μA ≤ ISET ≤ 100μA 0.8 0.8 V 100μA < ISET ≤ 1mA 0.9 0.9 V 1mA < ISET ≤ 5mA 1.0 1.0 V withInputVoltage 5V ≤ V+ ≤ 40V 0.01 0.03 0.01 0.05 %/V 1mA < ISET ≤ 5mA 1.5V≤ V ≤ 5V 0.03 0.03 %/V 5V ≤ V ≤ 40V 0.02 0.02 %/V TemperatureDependence of 25μA ≤ ISET ≤ 1mA 0.96T T 1.04T 0.96T T 1.04T SetCurrent(3) EffectiveShuntCapacitance 15 15 pF (1) Unlessotherwisespecified,testsareperformedatTj= 25°C withpulsetestingso thatjunctiontemperaturedoes notchange duringtest (2) SetcurrentisthecurrentflowingintotheV+ pin.FortheBasic2-TerminalCurrentSourcecircuitshown inFigure13.ISET isdetermined by thefollowingformula:ISET = 67.7mV/R SET (@ 25°C).Setcurrenterrorisexpressedas a percentdeviationfromthisamount.ISET increasesat0.336%/°C @ Tj= 25°C (227μV/°C). (3) ISET isdirectlyproportionaltoabsolutetemperature(°K).ISET atany temperaturecan be calculatedfrom:ISET = Io (T/To)where Io isISET measured atTo (°K). ElectricalCharacteristics(1) LM234-3 LM234-6 Parameter Conditions Units Min Typ Max Min Typ Max SetCurrentError,V+=2.5V (2) 100μA ≤ ISET ≤ 1mA ±1 ±2 % TJ = 25° EquivalentTemperatureError ±3 ±6 °C RatioofSetCurrenttoBias 100μA ≤ ISET ≤ 1mA 14 18 26 14 18 26 Current Minimum OperatingVoltage 100μA ISET ≤ 1mA 0.9 0.9 V withInputVoltage 5V ≤ V+ ≤ 30V 0.01 0.03 0.01 0.05 %/V TemperatureDependence of 100μA ≤ ISET ≤ 1mA 0.98T T 1.02T 0.97T T 1.03T SetCurrent(3) EquivalentSlopeError ±2 ±3 % EffectiveShuntCapacitance 15 15 pF (1) Unlessotherwisespecified,testsareperformedatTj= 25°C withpulsetestingso thatjunctiontemperaturedoes notchange duringtest (2) SetcurrentisthecurrentflowingintotheV+ pin.FortheBasic2-TerminalCurrentSourcecircuitshown inFigure13.ISET isdetermined by thefollowingformula:ISET = 67.7mV/R SET (@ 25°C).Setcurrenterrorisexpressedas a percentdeviationfromthisamount.ISET increasesat0.336%/°C @ Tj= 25°C (227μV/°C). (3) ISET isdirectlyproportionaltoabsolutetemperature(°K).ISET atany temperaturecan be calculatedfrom:ISET = Io (T/To)where Io isISET measured atTo (°K). Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics Maximum Slew Rate Output Impedance LinearOperation Figure5. Figure6. Start-Up TransientResponse Figure7. Figure8. VoltageAcross R SET (VR ) CurrentNoise Figure9. Figure10.

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 TypicalPerformance Characteristics(continued) Turn-On Voltage RatioofISET toIBIAS Figure11. Figure12. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com APPLICATION HINTS The LM134 has been designedforease ofapplication,buta generaldiscussionofdesignfeaturesispresented heretofamiliarizethedesignerwithdevicecharacteristicswhichmay notbe immediatelyobvious.These include theeffectsofslewing,power dissipation,capacitance,noise,and contactresistance. CalculatingR SET The totalcurrentthroughtheLM134 (ISET )isthesum ofthecurrentgoingthroughtheSET resistor(IR )and the LM134's biascurrent(IBIAS),as shown inFigure13. Figure13. Basic CurrentSource A graph showing theratioofthesetwo currentsissuppliedunderRatioof ISET to IBIAS inTypicalPerformance Characteristics. The currentflowingthroughR SET isdeterminedby VR , which isapproximately214μV/°K (64 mV/298°K ∼ 214μV/°K). (1) Since(fora givensetcurrent)IBIAS issimplya percentageofISET ,theequationcan be rewritten where

• n istheratioofISET toIBIAS as specifiedinElectricalCharacteristicsand shown inthegraph (2) Sincen istypically18 for2μA ≤ ISET ≤ 1mA, theequationcan be furthersimplifiedto (3) formost setcurrents. Slew Rate At slewratesabove a giventhreshold(seecurve),theLM134 may exhibitnon-linearcurrentshifts.The slewing rateatwhich thisoccursisdirectlyproportionaltoISET .At ISET = 10μA, maximum dV/dtis0.01V/μs;atISET = 1mA, thelimitis1V/μs.Slew ratesabove thelimitdo notharm theLM134, orcause largecurrentstoflow. Thermal Effects Internalheatingcan have a significanteffecton currentregulationforISET greaterthan100μA.Forexample,each 1V increaseacrossthe LM134 at ISET = 1 mA willincreasejunctiontemperatureby ≈0.4°C instillair.Output current(ISET )has a temperaturecoefficientof≈0.33%/°C, so thechange incurrentdue totemperaturerisewillbe effects,therefore,must be taken intoaccountwhen DC regulationiscriticaland ISET exceeds 100μA. Heat sinkingoftheTO package ortheTO-92 leadscan reducethiseffectby more than3:1.

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 Shunt Capacitance Incertainapplications,the15 pF shuntcapacitanceoftheLM134 may have tobe reduced,eitherbecause of loadingproblems or because itlimitsthe AC outputimpedance of the currentsource.This can be easily accomplishedby bufferingtheLM134 withan FET as shown intheapplications.Thiscan reducecapacitanceto lessthan3 pF and improveregulationby atleastan orderofmagnitude.DC characteristics(withtheexception ofminimum inputvoltage),arenotaffected. Noise Currentnoisegeneratedby theLM134 isapproximately4 timestheshotnoiseofa transistor.IftheLM134 is used as an activeloadfora transistoramplifier,inputreferrednoisewillbe increasedby about12dB. Inmany cases,thisisacceptableand a singlestageamplifiercan be builtwitha voltagegainexceeding2000. Lead Resistance The sense voltagewhich determinesoperatingcurrentof the LM134 is less than 100mV. At thislevel, thermocoupleor leadresistanceeffectsshouldbe minimizedby locatingthe currentsettingresistorphysically closetothedevice.Socketsshouldbe avoidedifpossible.Ittakesonly0.7Ω contactresistancetoreduceoutput currentby 1% atthe1 mA level. Sensing Temperature The LM134 makes an idealremote temperaturesensor because itscurrentmode operationdoes not lose accuracyoverlongwireruns.OutputcurrentisdirectlyproportionaltoabsolutetemperatureindegreesKelvin, accordingtothefollowingformula: (4) CalibrationoftheLM134 isgreatlysimplifiedbecause ofthefactthatmost oftheinitialinaccuracyisdue toa gainterm(slopeerror)and notan offset.Thismeans thata calibrationconsistingofa gainadjustmentonlywill trimbothslopeand zeroatthesame time.Inaddition,gainadjustmentisa one pointtrimbecause theoutputof theLM134 extrapolatestozeroat0°K,independentofR SET orany initialinaccuracy. Figure14. Gain Adjustment This propertyof the LM134 isillustratedin the accompanying graph.Line abc isthe sensor currentbefore trimming.Linea′b′c′ isthe desiredoutput.A gaintrimdone at T2 willmove the outputfrom b to b′ and will simultaneouslycorrecttheslopeso thattheoutputatT1 and T3 willbe correct.Thisgaintrimcan be done on R SET oron theloadresistorused toterminatetheLM134. Slopeerroraftertrimwillnormallybe lessthan±1%. To maintainthisaccuracy,however,a lowtemperaturecoefficientresistormust be used forR SET . A 33 ppm/°C driftof R SET willgivea 1% slopeerrorbecause the resistorwillnormallysee about the same temperaturevariationsas theLM134. SeparatingR SET fromtheLM134 requires3 wiresand has leadresistance problems,so is not normallyrecommended. Metal filmresistorswithlessthan 20 ppm/°C driftare readily available.Wirewound resistorsmay alsobe used where beststabilityisrequired. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com Applicationas a Zero Temperature CoefficentCurrentSource Adding a diode and a resistorto the standardLM134 configurationcan cancelthe temperature-dependent characteristicoftheLM134. The circuitshown inFigure15 balancesthepositivetempco oftheLM134 (about +0.23mV/°C) withthenegativetempco ofa forward-biasedsilicondiode(about−2.5mV/°C). Figure15. Zero Tempco CurrentSource The setcurrent(ISET ) isthesum ofI1 and I2,each contributingapproximately50% ofthesetcurrent,and IBIAS. IBIAS is usuallyincludedin the I1 term by increasingthe VR value used forcalculationsby 5.9%. (See CALCULATING R SET .) (5) The firststepistominimizethetempco ofthecircuit,usingthefollowingequations.An example isgivenusinga valueof+227μV/°C as thetempco oftheLM134 (whichincludestheIBIAS component),and −2.5mV/°C as the tempco ofthediode(forbestresults,thisvalueshouldbe directlymeasured orobtainedfromthemanufacturer ofthediode). (6) (7) With theR 1 toR 2 ratiodetermined,valuesforR 1 and R 2 shouldbe determinedtogivethedesiredsetcurrent. The formulaforcalculatingthesetcurrentatT = 25°C isshown below,followedby an example thatassumes the forwardvoltagedropacrossthediode(VD )is0.6V,thevoltageacrossR 1 is67.7mV (64mV + 5.9% toaccount forIBIAS),and R 2/R1 = 10 (fromthepreviouscalculations).

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 (8) This circuitwilleliminatemost of the LM134's temperaturecoefficient,and itdoes a good job even ifthe estimatesofthediode'scharacteristicsarenotaccurate(asthefollowingexample willshow).For lowesttempco witha specificdiodeatthedesiredISET ,however,thecircuitshouldbe builtand testedovertemperature.Ifthe measured tempco of ISET ispositive,R 2 shouldbe reduced.Ifthe resultingtempco isnegative,R 2 shouldbe increased.The recommended diodeforuse inthiscircuitisthe 1N457 because itstempco iscenteredat 11 timesthetempco oftheLM134, allowingR 2 = 10 R 1.You can alsouse thiscircuittocreatea currentsourcewith non-zerotempcos by settingthetempco component ofthetempco equationtothedesiredvalueinsteadof0. EXAMPLE: A 1mA, Zero-Tempco CurrentSource First,solveforR 1 and R 2: (9) The valuesofR 1 and R 2 can be changed tostandard1% resistorvalues(R1 = 133Ω and R 2 = 1.33kΩ)withless thana 0.75% error. Iftheforwardvoltagedropofthediodewas 0.65V insteadoftheestimateof0.6V (anerrorof8%), theactualset currentwillbe (10) an erroroflessthan5%. Ifthe estimateforthe tempco of the diode'sforwardvoltagedrop was off,the tempco cancellationis still reasonablyeffective.Assume thetempco ofthediodeis2.6mV/°C insteadof2.5mV/°C (an errorof4%). The tempco ofthecircuitisnow: (11) A 1mA LM134 currentsource withno temperaturecompensationwould have a set resistorof 68Ω and a resultingtempco of (12) So even ifthediode'stempco variesas much as ±4% fromitsestimatedvalue,thecircuitstilleliminates98% of theLM134's inherenttempco. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com TypicalApplications *SelectR3 = VREF /583μA.VREF may be any stablepositivevoltage≥ 2V TrimR3 tocalibrate Figure16. Ground ReferredFahrenheitThermometer Figure17. TerminatingRemote Sensor forVoltageOutput *Outputimpedance oftheLM134 atthe“R ”pinisapproximately where R 2 istheequivalentexternalresistanceconnectedfromtheV− pintoground.Thisnegativeresistancecan be reducedby a factorof5 ormore by insertingan equivalentresistorR 3 = (R2/16)inserieswiththeoutput. Figure18. Low Output Impedance Thermometer

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 Figure19. Low Output Impedance Thermometer *SelectR1 and C1 foroptimum stability Figure20. HigherOutput Current Figure21. Basic 2-TerminalCurrentSource Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com Figure22. Micropower Bias Figure23. Low InputVoltageReferenceDriver Figure24. Ramp Generator

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 *SelectratioofR1 toR2 toobtainzerotemperaturedrift Figure25. 1.2VReferenceOperates on 10 μA and 2V *SelectratioofR1 toR2 forzerotemperaturedrift Figure26. 1.2VRegulatorwith1.8VMinimum Input Figure27. Zener Biasing Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com *For±10% adjustment,selectR SET 10% high,and make R1 ≈ 3 R SET Figure28. AlternateTrimming Technique Figure29. BufferforPhotoconductiveCell *SelectQ1 orQ2 toensureatleast1V acrosstheLM134. Vp (1− ISET /IDSS )≥ 1.2V.

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013 Figure30. FET Cascoding forLow Capacitanceand/orUltraHigh Output Impedance *ZOUT ≈ −16 • R1 (R1/VIN must notexceed ISET ) Figure31. GeneratingNegativeOutput Impedance *Use minimum valuerequiredtoensurestabilityofprotecteddevice.Thisminimizesinrushcurrenttoa directshort. Figure32. In-LineCurrentLimiter Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM134 LM234 LM334

LM134,LM234,LM334 SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com Schematic Diagram

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LM134,LM234,LM334 www.ti.com SNVS746E –MARCH 2000–REVISED MAY 2013

REVISION HISTORY

Changes from RevisionC (April2013)toRevisionD Page Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM134 LM234 LM334

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM134 MDC Active Production DIESALE (Y) | 0 400 | NOT REQUIRED Yes Call TI Level-1-NA-UNLIM -40 to 85 LM134H Active Production TO (NDV) | 3 1000 | BULK No Call TI Level-1-NA-UNLIM -55 to 125 ( LM134H, LM134H) LM134H/NOPB Active Production TO (NDV) | 3 1000 | BULK Yes Call TI Level-1-NA-UNLIM -55 to 125 ( LM134H, LM134H) LM234Z-3/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -25 to 100 LM234 Z-3 LM234Z-3/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -25 to 100 LM234 Z-3 LM234Z-6/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -25 to 100 LM234 Z-6 LM234Z-6/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -25 to 100 LM234 Z-6 LM334 MWC Active Production WAFERSALE (YS) | 0 1 | NOT REQUIRED - Call TI Level-1-NA-UNLIM -40 to 85 LM334M/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM334 M LM334M/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM334 M LM334MX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM334 M LM334MX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM334 M LM334SM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM334 SM LM334SM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 LM334 SM LM334SMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM334 SM LM334SMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 LM334 SM LM334Z/LFT1 Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type - LM334 Z LM334Z/LFT1.B Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type -40 to 85 LM334 Z Addendum-Page 1

www.ti.com 23-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM334Z/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type 0 to 70 LM334 Z LM334Z/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes Call TI N/A for Pkg Type -40 to 85 LM334 Z (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM334MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM334SMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM334M/NOPB D SOIC 8 95 495 8 4064 3.05 LM334M/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM334SM/NOPB D SOIC 8 95 495 8 4064 3.05 LM334SM/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3

www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800

www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5

www.ti.com PACKAGE OUTLINE 3X 2.67 2.03 5.21 4.44 5.34 4.32

12.7 MIN

2X 1.27 0.13 3X 0.55 0.38 4.19 3.17

3.43 MIN

3X 0.43 0.35 (2.54) NOTE 3 2X 2.9 2.4

4 MAX

0.076 MAX

(0.51) TYP (1.5) TYP TO-92 - 5.34 mm max heightLP0003A TO-92 4215214/C 04/2025 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. EJECTOR PIN OPTIONAL PLANE SEATING STRAIGHT LEAD OPTION 3 2 1 SCALE 1.200 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION SCALE 1.200

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

(1.07) (1.5) 2X (1.5) 2X (1.07) (1.27) (2.54) FULL R TYP ( 1.4)0.05 MAX ALL AROUND TYP (2.6) (5.2) (R0.05) TYP 3X ( 0.9) HOLE 2X ( 1.4) METAL 3X ( 0.85) HOLE (R0.05) TYP 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING 1 2 3 LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X METAL TYP SOLDER MASK OPENING SOLDER MASK OPENING METAL 1 2 3

www.ti.com TAPE SPECIFICATIONS 19.0 17.5 13.7 11.7 11.0 8.5

0.5 MIN

3.7-4.3 TYP 9.75 8.50 2.9

2.4 TYP

6.75 5.95 13.0 12.4 (2.5) TYP 16.5 15.5 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 FOR FORMED LEAD OPTION PACKAGE

www.ti.com PACKAGE OUTLINE 1.22 0.72 ( 2.54) 1.16 0.92 4.95 4.55 0.76 MAX 2.67 MAX UNCONTROLLED LEAD DIA

0.64 MAX

(MIL/AERO)

1.397 MAX

(COMMERCIAL) 3X 0.483 0.407 5.32-5.56 TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. SCALE 1.250

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

( 1.2) METAL 2X ( 1.2) METAL 3X ( 0.7) VIA (R0.05) TYP (2.54) (1.27) TO-CAN - 2.67 mm max heightNDV0003H TRANSISTOR OUTLINE 4219876/B 09/2024 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X SOLDER MASK OPENING SOLDER MASK OPENING

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