LM1036

LM1036 TI1 | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 23

Technical content

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 LM1036DualDC OperatedTone/Volume/BalanceCircuit Check forSamples: LM1036 1FEATURES DESCRIPTION The LM1036 is a DC controlledtone (bass/treble), 2• Wide Supply VoltageRange, 9V to16V volume and balancecircuitforstereoapplicationsin• Large Volume ControlRange, 75 dB Typical car radio,TV and audio systems. An additional

• Tone Control,±15 dB Typical controlinputallowsloudness compensation to be simplyeffected.• Channel Separation,75 dB Typical
• Low Distortion,0.06% TypicalforAn Input Four controlinputsprovidecontrolofthebass,treble, balanceand volume functionsthroughapplicationofLevelof0.3Vrms DC voltagesfrom a remote controlsystem or,• High SignaltoNoise,80 dB Typicalforan alternatively,from fourpotentiometerswhich may beInputLevelof0.3Vrms biasedfroma zenerregulatedsupplyprovidedon the
• Few ExternalComponents Required circuit. Each tone responseisdefinedby a singlecapacitor chosen togivethedesiredcharacteristic. Block and Connection Diagram Figure1. PDIP and SOIC Packages See Package Numbers NFH0020A or DW0020B Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1995–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) SupplyVoltage 16V ControlPinVoltage(Pins4,7,9,12,14) VCC OperatingTemperatureRange 0°C to+70°C StorageTemperatureRange −65°C to+150°C Power Dissipation 1W Lead Temp. (Soldering,10 seconds) 260°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. ElectricalCharacteristics(1) VCC =12V, TA=25°C (unlessotherwisestated) Parameter Conditions Min Typ Max Units SupplyVoltageRange Pin11 9 16 V SupplyCurrent 35 45 mA ZenerRegulatedOutput Pin17 Voltage 5.4 V Current 5 mA Maximum OutputVoltage Pins8,13;f=1kHz VCC =9V, Maximum Gain 0.8 Vrms VCC =12V 0.8 1.0 Vrms Maximum InputVoltage Pins2,19;f=1kHz,VCC 2V 1.3 1.6 Vrms Gain=−10 dB InputResistance Pins2,19;f=1kHz 20 30 kΩ OutputResistance Pins8,13;f=1kHz 20 Ω Maximum Gain V(Pin12)=V(Pin17);f=1kHz −2 0 2 dB Volume ControlRange f=1kHz 70 75 dB Gain Tracking f=1kHz Channel1–Channel2 0 dB through−40 dB 1 3 dB −40 dB through−60 dB 2 dB BalanceControlRange Pins8,13;f=1kHz 1 dB −26 −20 dB Bass ControlRange (2) f=40Hz,C b=0.39μF V(Pin14)=V(Pin17) 12 15 18 dB V(Pin14)=0V −12 −15 −18 dB TrebleControlRange (2) f=16 kHz,C t,=0.01μF V(Pin4)=V(Pin17) 12 15 18 dB V(Pin4)=0V −12 −15 −18 dB TotalHarmonicDistortion f=1kHz,VIN=0.3Vrms Gain=0 dB 0.06 0.3 % Gain=−30 dB 0.03 % ChannelSeparation f=1kHz,Maximum Gain 60 75 dB (1) The maximum permissibleinputlevelisdependenton toneand volume settings.See ApplicationNotes. (2) The tonecontrolrangeisdefinedby capacitorsC b and C t.See ApplicationNotes.

2 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 ElectricalCharacteristics(1)(continued) VCC =12V, TA=25°C (unlessotherwisestated) Parameter Conditions Min Typ Max Units Signal/NoiseRatio Unweighted100 Hz–20 kHz 80 dB Maximum Gain,0 dB=0.3 Vrms CCIR/ARM (3) Gain=0 dB,VIN=0.3Vrms 75 79 dB Gain=−20 dB,VIN=1.0Vrms 72 dB OutputNoiseVoltageatMinimum Gain CCIR/ARM (3) 10 16 μV SupplyRippleRejection 200 mVrms, 1 kHz Ripple 35 50 dB ControlInputCurrents Pins4,7,9,12,14 (V=0V) −0.6 −2.5 μA FrequencyResponse −1 dB (FlatResponse 250 kHz

20 Hz–16 kHz)

(3) Gaussiannoise,measured overa periodof50 ms perchannel,witha CCIR filterreferencedto2 kHz and an average-responding meter. Copyright© 1995–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM1036

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics Volume ControlCharacteristics Balance ControlCharacteristic Figure2. Figure3. Tone ControlCharacteristic Tone Characteristic(Gainvs Frequency) Figure4. Figure5. Tone Characteristic(Gainvs Frequency) Loudness Compensated Volume Characteristic Figure6. Figure7.

4 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) InputSignalHandlingvs Supply Voltage THD vs Gain Figure8. Figure9. Channel Separationvs Frequency Loudness ControlCharacteristic Figure10. Figure11. Output Noise Voltagevs Gain THD vs InputVoltage Figure12. Figure13. Copyright© 1995–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM1036

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com ApplicationNotes TONE RESPONSE The maximum boostand cutcan be optimizedforindividualapplicationsby selectionoftheappropriatevaluesof C t (treble)and C b (bass). The toneresponsesaredefinedby therelationships: where

• ab=at=0 formaximum bass and trebleboostrespectively
• ab=at=1 formaximum cut (1) For thevaluesofC b and C t of0.39μF and 0.01μF as shown intheApplicationCircuit,15 dB ofboostorcutis obtainedat40 Hz and 16 kHz. ZENER VOLTAGE A zenervoltage(pin17=5.4V)isprovidedwhich may be used tobiasthecontrolpotentiometers.Settinga DC levelofone halfofthezenervoltageon thecontrolinputs,pins4,9,and 14,resultsinthebalancedgainand flat responsecondition.Typicalspread on the zener voltageis±100 mV and thismust be takenintoaccountif controlsignalsareused whicharenotreferencedtothezenervoltage.Ifthisisthecase,thentheywillneed to be derivedwithsimilaraccuracy. LOUDNESS COMPENSATION A simpleloudnesscompensationmay be effectedby applyinga DC controlvoltagetopin7.Thisoperateson the tonecontrolstagestoproducean additionalboostlimitedby themaximum boostdefinedby C b and C t.There is no loudnesscompensationwhen pin7 isconnectedto pin17. Pin 7 can be connectedto pin12 to givethe loudnesscompensated volume characteristicas illustratedwithouttheadditionoffurtherexternalcomponents. (Tone settingsare forflatresponse,C b and C t as givenin ApplicationCircuit.)Modificationto the loudness characteristicispossibleby changingthecapacitorsC b and C t fora differentbasicresponseor,by a resistor networkbetween pins7 and 12 fora differentthresholdand slope. SIGNAL HANDLING The volume controlfunctionoftheLM1036 iscarriedoutintwo stages,controlledby theDC voltageon pin12, to improvesignalhandlingcapabilityand providea reductionof outputnoiselevelat reduced gain.The first stageisbeforethetonecontrolprocessingand providesan initial15 dB ofgainreduction,so ensuringthatthe tonesectionsarenotoverdrivenby largeinputlevelswhen operatingwitha low volume setting.Any combination oftoneand volume settingsmay be used providedtheoutputleveldoes notexceed 1 Vrms,VCC =12V (0.8Vrms, VCC =9V).Atreducedgain(<−6 dB) theinputstagewilloverloadiftheinputlevelexceeds1.6Vrms,VCC =12V(1.1 Vrms,VCC =9V).As thereisvolume controlon theinputstages,theinputsmay be operatedwitha loweroverload marginthanwouldotherwisebe acceptable,allowinga possibleimprovementinsignaltonoiseratio.

6 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 ApplicationCircuit Copyright© 1995–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM1036

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com APPLICATIONS INFORMATION OBTAINING MODIFIED RESPONSE CURVES The LM1036 isa dualDC controlledbass,treble,balanceand volume integratedcircuitidealforstereoaudio systems. Inthevariousapplicationswhere theLM1036 can be used,theremay be requirementsforresponsesdifferentto thoseof the standardapplicationcircuitgiveninthe data sheet.Thisapplicationsectiondetailssome of the simple variationspossibleon the standardresponses,to assistthe choice of optimum characteristicsfor particularapplications. TONE CONTROLS Summarizingtherelationshipgiveninthedatasheet,basicallyforan increaseinthetreblecontrolrangeC t must be increased,and forincreasedbass rangeC b must be reduced. Figure14 shows thetypicaltoneresponseobtainedinthestandardapplicationcircuit.(Ct=0.01μF,C b=0.39μF). Response curvesaregivenforvariousamounts ofboostand cut. Figure14. Tone Characteristic(Gainvs Frequency) Figure15 and Figure16 show theeffectofchangingtheresponsedefiningcapacitorsC t and C b to2Ct,C b/2and 4C t,C b/4respectively,givingincreasedtonecontrolranges.The valuesofthebypass capacitorsmay become significantand affectthelowerfrequenciesinthebass responsecurves. Figure15. Tone Characteristic(Gainvs Frequency)

8 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 Figure16. Tone Characteristic(Gainvs Frequency) Figure17 shows the effectof changingC t and C b in the oppositedirectionto C t/2,2C b respectivelygiving reducedcontrolranges.The variousresultscorrespondingtothedifferentC t and C b valuesmay be mixed ifitis requiredto givea particularemphasis to,forexample,the bass control.The particularcase withC b/2,C t is illustratedinFigure18. RestrictionofTone ControlActionatHigh or Low Frequencies Itmay be desiredinsome applicationstoleveloffthetoneresponsesabove or below certainfrequenciesfor example toreducehighfrequencenoise. Thismay be achievedforthetrebleresponseby includinga resistorinserieswithC t.The trebleboostand cut willbe 3 dB lessthanthestandardcircuitwhen R=X C . A similareffectmay be obtainedforthebass responseby reducingthevalueoftheAC bypass capacitorson pins5 (channel1)and 16 (channel2).The internalresistanceatthesepinsis1.3kΩ and thebass boost/cutwill be approximately3 dB lesswithXC at thisvalue.An example of such modifiedresponsecurvesisshown in Figure19.The inputcouplingcapacitorsmay alsomodifythelowfrequencyresponse. Itwillbe seen fromFigure15 and Figure16 thatmodifyingC t and C b forgreatercontrolrangealsohas theeffect offlatteningthetonecontrolextremesand thismay be utilized,withorwithoutadditionalmodificationas outlined above,forthemost suitabletonecontrolrangeand responseshape. Other Advantages ofDC Controls The DC controlsmake theadditionofotherfeatureseasy toarrange.For example,thenegative-goingpeaks of theoutputamplifiersmay be detectedbelow a certainlevel,and used tobiasback thebass controlfroma high boostcondition,topreventoverloadingthespeakerwithlowfrequencycomponents. LOUDNESS CONTROL The loudnesscontrolisachievedthroughcontrolofthetonesectionsby thevoltageappliedtopin7;therefore, thetoneand loudnessfunctionsare notindependent.There isnormally1 dB more bass thantrebleboost(40 Hz–16 kHz) withloudnesscontrolinthe standardcircuit.Ifa greaterdifferenceisdesired,itisnecessaryto introducean offsetby means ofC t orC b orby changingthenominalcontrolvoltageranges. Figure20 shows thetypicalloudnesscurvesobtainedinthestandardapplicationcircuitatvariousvolume levels (Cb=0.39μF). Copyright© 1995–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM1036

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com Figure17.Tone Characteristic(Gainvs Frequency) Figure18.Tone Characteristic(Gainvs Frequency) Figure19.Tone Characteristic(Gainvs Frequency) Figure20.Loudness Compensated Volume Characteristic Figure21 and Figure22 illustratethe loudnesscharacteristicsobtainedwithC b changed to C b/2 and C b/4 respectively,C t beingkeptatthenominal0.01μF. These valuesnaturallymodifythebass toneresponseas in Figure15 and Figure16. Withpins7 (loudness)and 12 (volume)directlyconnected,loudnesscontrolstartsattypically−8 dB volume,with most ofthecontrolactioncompleteby −30 dB. Figure23 and Figure24 show theeffectofresistivelyoffsettingthevoltageappliedtopin7 towardsthecontrol referencevoltage(pin17).Because thecontrolinputsare highimpedance,thisiseasilydone and highvalue resistorsmay be used forminimaladditionalloading.Itispossibletoreducetherateofonsetofcontroltoextend theactiverangeto−50 dB volume controland below. The controlon pin7 may alsobe divideddown towardsground bringingthe controlactionon earlier.Thisis illustratedinFigure25, With a suitablelevelshiftingnetworkbetween pins12 and 7, the onsetof loudness controland itsrateofchange may be readilymodified.

10 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 Figure21.Loudness Compensated Volume Figure22.Loudness Compensated Volume Characteristic Characteristic Figure23.Loudness Compensated Volume Figure24.Loudness Compensated Volume Characteristic Characteristic Figure25.Loudness Compensated Volume Characteristic When adjustedformaximum boostintheusualapplicationcircuit,theLM1036 cannotgiveadditionalboostfrom theloudnesscontrolwithreducinggain.Ifitisrequired,some additionalboostcan be obtainedby restrictingthe tonecontrolrange and modifyingC t,C b,tocompensate.A circuitillustratingthisforthecase ofbass boostis shown inFigure26. The resultingresponsesare giveninFigure27 showing the continuingloudnesscontrol actionpossiblewithbass boostpreviouslyapplied. Copyright© 1995–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM1036

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com USE OF THE LM1036 ABOVE AUDIO FREQUENCIES The LM1036 has a basicresponsetypically1 dB down at250 kHz (tonecontrolsflat)and thereforeby scalingC b and C t, itispossibleto arrangeforoperationover a wide frequencyrange forpossibleuse in wide band equalizationapplications.As an example Figure28 shows the responsesobtainedcenteredon 10 kHz with C b=0.039μF and C t=0.001μF. Figure26. ModifiedApplicationCircuitforAdditionalBass Boost withLoudness Control Figure27.Loudness Compensated Volume Figure28.Tone Characteristic(Gainvs Frequency) Characteristic

12 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com SNAS525C –JAN 1995–REVISED APRIL 2013 SimplifiedSchematic Diagram (One Channel) *Connectionsreversed Copyright© 1995–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM1036

SNAS525C –JAN 1995–REVISED APRIL 2013 www.ti.com

REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page

14 SubmitDocumentationFeedback Copyright© 1995–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM1036

www.ti.com 16-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM1036M/NOPB LIFEBUY SOIC DW 20 36 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 70 LM1036M LM1036MX/NOPB LIFEBUY SOIC DW 20 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 70 LM1036M LM1036N/NOPB LIFEBUY PDIP NFH 20 18 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM1036N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 16-Oct-2015 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1036MX/NOPB SOIC DW 20 1000 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2

www.ti.com N20A (Rev G)

www.ti.com PACKAGE OUTLINE C TYP10.63 9.97

2.65 MAX

18X 1.27 20X 0.51 0.31 11.43 TYP0.33 0.10 0 - 8 0.3 0.1 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 13.0 12.6 B 7.6 7.4 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. 1 20

0.25 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.200

www.ti.com EXAMPLE BOARD LAYOUT (9.3)

0.07 MAX

0.07 MIN

20X (2) 20X (0.6) 18X (1.27) (R ) TYP 0.05 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC SYMM SYMM LAND PATTERN EXAMPLE SCALE:6X 10 11 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (9.3) 18X (1.27) 20X (0.6) 20X (2) 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 10 11 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated