LM0605H LEIDITECH | Alldatasheet

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  1. Features 2. Applications 3. Dimensions A B C 1R0 E D 1322 4. Part Numbering 1. Carbonyl powder inductor. 2. Compact desi gn. 3. High current，low DCR ，high efficiency. 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb) & Halogen-Free and RoHS compliant. Note PC power system，incl. IMVP-6 DC/DC converter . LM 0605 H - 1R0 MG - D A B C D E F A: Series B: Dimension BxC C: Type Carbonyl Powder D: Inductance 1R0=1.00uH E: Inductance Tolerance M=±20% F: 印 D/C 印字:黑色 1R0 及 D/C 1322 (13 年,22 週期)(依實際生產日期而定). Pb-fre e Pb Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 8.4 2.5 3.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. Series A(mm) B(mm) C(mm) D(mm) E(mm) Halog en-free Halo gen LM0605H-Series(G)-D Rev 2.0 : www.leiditech.com 12.01.2019 1/9
  1. Specification Part Number Inductance L0 (uH)±20% @ 0 A I rms (A) Typ. I sat (A) Typ. DCR (mΩ) Typ.@25℃ DCR (mΩ) Max.@25℃ LM0605H-R40MG-D 0.40 23 31 3.1 3.7 LM0605H-R47MG-D 0.47 22 30 3.5 3.9 LM0605H-R56MG-D 0.56 20 27 3.6 4.2 LM0605H-R60MG-D 0.60 19 25 3.8 4.3 LM0605H-R68MG-D 0.68 18 24 4.0 4.5 LM0605H-R82MG-D 0.82 16.5 22 4.6 4.9 LM0605H-1R0MG-D 1.00 15 20 6.1 6.5 LM0605H-1R2MG-D 1.20 14 18 6.7 7.5 LM0605H-1R5MG-D 1.50 12 16.5 8.6 9.0 LM0605H-2R2MG-D 2.20 10 14 11.2 12.0 LM0605H-3R3MG-D 3.30 8 12 19 20.9 LM0605H-4R7MG-D 4.70 6.5 10 28 30.8 LM0605H-5R6MG-D 5.60 6.0 9.0 43.5 49 LM0605H-6R5MG-D 6.50 5.5 8.5 46 51.5 LM0605H-6R8MG-D 6.80 5.5 8.5 46 51.5 LM0605H-8R2MG-D 8.20 5.0 8.0 56 63 LM0605H-100MG-D 10.0 4.0 7.5 60 69 LM0605H-220MG-D 22.0 2.5 5.5 140 170 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δ T of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. Rev 2.0 : www.leiditech.com 12.01.2019 2/9 LM0605H-Series(G)-D
  1. Material List 7. Reliability and Test Condition Item Performance Test Condition Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1.-10~+40℃,50~60%RH (Product without taping) 2.-40~+125℃ (on board) Electrical Performance Test Inductance Refer to standard electrical characteristics list. HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. DCR CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △ L30%. Saturation DC Current (Isat) will cause L0 to drop △ L(%) Heat Rated Current (Irms) Approximately △ T40℃ Heat Rated Current (Irms) will cause the coi l temperature rise △ T(℃) without core loss. 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Life Test Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Load Humidity Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪ R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Moisture Resistance Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50 ℃ for 25hrs, measured at room t emperature after placing for 4 hrs. 2. Raise temperature to 65 ±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65 ±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦ 0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Vibration Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 NO Items Materials 1 Core Carbonyl Powder. 2 Wire Polyester Wire or equivalent.

3 Clip 100% Pb free solder(Ni+Sn---Plating)

5 Ink Halogen-free ketone

Rev 2.0 : www.leiditech.com 12.01.2019 3/9 LM0605H-Series(G)-D

Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. Item Performance Test Condition Shock Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Bending Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm <0805:40x100x0.8mm Bending depth: >=0805:1.2mm <0805:0.8mm duration of 10 sec. Solderability More than 95% of the terminal electrode should be covered with solder。 Preheat: 150℃,60sec.。 Solder: Sn96.5% Ag3% Cu0.5% Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec。 Depth: completely cover the termination Resistance to Soldering Heat Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Number of heat cycles: 1 Terminal Strength Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a force (>0805:1kg , <=0805:0.5kg)to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Temperature (°C) Time(s) Temperature ramp/immersion and emersion rate 260 ±5(solder temp) 10 ±1 25mm/s ±6 mm/s Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 Rev 2.0 : www.leiditech.com 12.01.2019 4/9 LM0605H-Series(G)-D

  1. Soldering and Mounting (1) Soldering (2) Solder re-flow: (3) Soldering Iron: Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧ Preheat circuit and products to 150℃ ‧ Never contact the ceramic with the iron tip ‧ Use a 20 watt soldering iron with tip diameter of 1.0mm ‧ 355℃ tip temperature (max) ‧ 1.0mm tip diameter (max) ‧ Limit soldering time to 4~5sec. Fig.2 SO LDERING COOLING NATURALPRE-HEATING with in 4~5s Gra dual cooling 150 TIME(sec.) Iron Soldering Ov er 60s Iron Soldering times: 1 times max. Reflow times: 3 times max. Fig.1 60~18 60~15 217 150 TIME ( sec.) 200 480s max PRE-H EATING Reflow Soldering SOLDERING NATURAL COOLING TP(26 0℃ / 10s max.) Rev 2.0 : www.leiditech.com 12.01.2019 5/9 LM0605H-Series(G)-D
  1. Packaging Information (1) Reel Dimension (2) Tape Dimension (3) Packaging Quantity (4) Tearing Off Force To p cover tape Ba se tape F C D 2.0∮0.5 EM BOSSED CARRIER B A COVE R TAPE Type A(mm) B(mm) C(mm) D(mm) LM 0605 Chip / Reel 800 Inner box 1600 Carton 6400 The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) t(mm) D(mm) Rev 2.0 : www.leiditech.com 12.01.2019 6/9 LM0605H-Series(G)-D
  1. Typical Performance Curves 0 6.2 12.4 18.6 24.8 31 DC CURRENT(A) 0.14 0.2 0.42 0.56 0.7 INDUCTANCE (uH) 100 TEMP. RISE(oC) LM0605H-R40 0 6 12 18 24 30 DC CURRENT(A) 0.2 0.6 0.8 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-R47 0 6.75 13.5 20.25 27 DC CURRENT(A) 0.2 0.6 0.8 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-R56 0 5 10 15 20 25 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-R60 0 5.5 11 16.5 22 DC CURRENT(A) 0.3 0.9 1.2 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-R68 0 5.5 11 16.5 22 DC CURRENT(A) 0.4 0.8 1.2 1.6 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-R82 0 5 10 15 20 DC CURRENT(A) 0.5 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-1R0 0 5 10 15 20 DC CURRENT(A) 0.5 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-1R2 0 4.5 9 13.5 18 DC CURRENT(A) 0.6 1.8 2.4 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-1R5 0 3.5 7 10.5 14 DC CURRENT(A) INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-2R2 0 3 6 9 12 DC CURRENT(A) 1.5 INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-3R3 0 2 4 6 8 10 DC CURRENT(A) INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-4R7 0 2.25 4.5 6.75 9 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE(oC) LM0605H-5R6 0 2.25 4.5 6.75 9 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE(oC) LM0605H-6R8 0 2 4 6 8 DC CURRENT(A) INDUCTANCE (uH) TEMP. RISE(oC) LM0605H-8R2 0 2 4 6 8 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE(oC) LM0605H-100 DC CURRENT(A) INDUCTANCE (uH) 120 160 200 TEMP. RISE(oC) LM0605H-220 Rev 2.0 : www.leiditech.com 12.01.2019 7/9 LM0605H-Series(G)-D
  1. Inductance vs. Frequency Curves 1 10 100 1000 FREQUENCY(KHz) 0.2 0.4 0.6 0.8 Inductance LM0605H-R40 1 10 100 1000 FREQUENCY(KHz) 0.18 0.36 0.54 0.72 0.9 Inductance LM0605H-R47 1 10 100 1000 FREQUENCY(KHz) 0.18 0.36 0.54 0.72 0.9 Inductance LM0605H-R56 1 10 100 1000 FREQUENCY(KHz) 0.2 0.4 0.6 0.8 Inductance LM0605H-R60 1 10 100 1000 FREQUENCY(KHz) 0.24 0.48 0.72 0.96 1.2 Inductance LM0605H-R68 1 10 100 1000 FREQUENCY(KHz) 0.32 0.64 0.96 1.28 1.6 Inductance LM0605H-R82 1 10 100 1000 FREQUENCY(KHz) 0.5 1.5 Inductance LM0605H-1R0 1 10 100 1000 FREQUENCY(KHz) 0.4 0.8 1.2 1.6 Inductance LM0605H-1R2 1 10 100 1000 FREQUENCY(KHz) 0.52 1.04 1.56 2.08 2.6 Inductance LM0605H-1R5 1 10 100 1000 FREQUENCY(KHz) 5Inductance LM0605H-2R2 1 10 100 1000 FREQUENCY(KHz) 5Inductance LM0605H-3R3 1 10 100 1000 FREQUENCY(KHz) 1.6 3.2 4.8 6.4 Inductance LM0605H-4R7 1 10 100 1000 FREQUENCY(KHz) 2.32 4.64 6.96 9.28 11.6Inductance LM0605H-5R6 1 10 100 1000 FREQUENCY(KHz) 2.32 4.64 6.96 9.28 11.6Inductance LM0605H-6R8 1 10 100 1000 FREQUENCY(KHz) 3.2 6.4 9.6 12.8 Inductance LM0605H-8R2 Rev 2.0 : www.leiditech.com 12.01.2019 8/9 LM0605H-Series(G)-D

FREQUENCY(KHz) 3.84 7.68 11.52 15.36 19.2 Inductance LM0605H-100 1 10 100 1000 FREQUENCY(KHz) 9.04 18.08 27.12 36.16 45.2 Inductance LM0605H-220 Shangh ai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev 2.0 : www.leiditech.com 12.01.2019 9/9 LM0605H-Series(G)-D