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Document overview

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Technical content

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. DS-221852 2012/01/11 2016/03/24 B 7 LL054BT36 Page 1 List SMD Ultra Low Capacitance ESD Protection Array

Http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 4-Channel Ultra Low Capacitance ESD Protection Diodes Array - 5.0V

  • Suffix "-H" indicates Halogen-free parts, ex. 054 36-H.LL BT

Features

4 channels of ESD protection (ESD) IEC 61000-4-4 (EFT) 80A (5/50ns) IEC 61000-4-5 (Surge) (8/20us) Channel I/O to GND capacitance: 0.9pF(Max) Channel I/O to I/O capacitance: 0.45pF(Max) Low clamping voltage Low operating voltage Improved zener structure Optimized package for easy high speed data lines PCB layou RoHS compliant t Provide transient protection: IEC 61000-4-2 level 4 Document ID Issued Date Revised Date Revision Page.

Applications

USB 2.0 interface VGA interface Set-top box Flat panel Monitors / Tvs PC / Note book Formosa MS Mechanical data Epoxy:UL94-V0 rated flame retardant Case : Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Mounting Position : Any Molded plastic, SOT-363 Weight : Approximated 0.006 gram Symbol Ratings Unit Peak pulse power(8/20us) Operating junction temperature range Topr -55 to +125 Maximum ratings (at T =25 C unless otherwise noted)A o Storage temperature range Tstg ESD per IEC 61000-4-2(Air) ESD per IEC 61000-4-2(Contact) ΙPP W Peak pulse current (8/20us)IEC 61000-4-5 VESD PPP A kV 150 -55 to +150 Package outline SOT-363 .086(2.20) .070(1.80) .012(0.30) .004(0.10) .053(1.35) .045(1.15) .010(0.25) .003(0.08) .026(0.65)Typ. .012(0.30) Max. .043(1.10) .031(0.80) .016(0.40) .012(0.30) Dimensions in inches and (millimeters) LL054BT36 Electrical characteristics (at T =25 C unless otherwise noted)A o Parameter Conditions Symbol Reverse working voltage Negative clamping voltage Junction capacitance Between channel Reverse leakage current Reverse breakdown voltage I = 1mA, Any I/O pin to GNDBV VBR Min. Typ. Max. Unit VRWM 5.0 1.0 12.0 1.8 6.0 V V uA V V any I/O pin to GND V =5V,Any I/O pin to GNDRWM CJ1 CJ2 8.5 0.35 0.9 pF Positive clamping voltage I =1A, tp=8/20us,positive pulse; any I/O pin to GND PP I =1A, tp=8/20us,negative pulse; any I/O pin to GND PP V =0V, f=1MHz,between I/O pinsR Junction capacitance Between I/O and GND V =0V, f=1MHz,any I/O pin to GNDR Parameter 0.45 pF IR VC1 VC2 RθJΑ RθJC 670 370 o C/W o C/W Typical thermal resistance junction to ambient SMD Ultra Low Capacitance ESD Protection Array Typical thermal resistance junction to case DS-221852 2012/01/11 2016/03/24 B 7

Http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Rating and characteristic curves (LL054BT36) Fig.1 - Non-Repetitive Peak Pulse Power Peak Pulse Power, P (kW) PP Pulse Duration ,tp ( )us Fig. 2 - Power Derating Curve Ambient Temperature, T ( C)A ° % of Rated Power or Ipp 100 0 25 50 75 100 125 150 0 5 10 15 20 25 30 Time, t (us) Percent of Ipp, % Fig. 3 - Pulse Waveform waveform parameters tr=8us, td=20us 110 100 td=Ipp/2 e-t Clamping Voltage, Vc (Volts) Peak Pulse Current Ipp A,( ) Fig. 4 - I/O-GND Clamping Voltage vs. Peak Pulse Current Fig. 5 - Normalized Capacitance vs. Reverse Voltage CJ(VR)/CJ(VR=0),( pF) Reverse Voltage, VR (Volts) Fig. 6 - I/O-GND Insertion Loss vs. Frequency Insertion Loss,( dB) 0.1 1 10 100 1000 I/O-GND forward clamping voltage VC1 I/O-GND reverse clamping voltage VC2 tr=8us td=20us 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 2 3 4 5 f=1MHz Frequency (MHz) -12 -15 -18 -21 1 10 100 1000 Fig. 7 - Insertion Loss vs. Frequency S21,( dB) Frequency (MHz) -12 1 10 100 1000 10000 -3dB 2340MHz 0.1 0.01 DS-221852 2012/01/11 2016/03/24 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Suggested solder pad layout Pinning information Document ID Issued Date Revised Date Revision Page. Formosa MS Marking Type number Marking code LL054BT36 C96 Simplified outlinePin Configuration Circuit Diagram Dimensions in inches and (millimeters) SOT-363 0.024(0.60) 0.0165(0.42) 0.075(1.9) 0.025(0.65) 0.025(0.65) LL054BT36 1 2 6 5 I/O3 V I/O4REF I/O1 GND I/O2 SMD Ultra Low Capacitance ESD Protection Array DS-221852 2012/01/11 2016/03/24 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Formosa MSLL054BT36 SMD Ultra Low Capacitance ESD Protection Array E B d F W PA D D1D2 C T Item Tolerance SOT-363 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width P E B C d F T W P A D D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 2.36 2.40 1.20 C96 C96 DS-221852 2012/01/11 2016/03/24 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Formosa MS Profile Feature Soldering Condition Average ramp-up rate(T to T ) <3 /sec Preheat -Temperature Min(Tsmin) 150 -Temperature Max(Tsmax) 200 -Time(min to max)(t ) 60~120sec Tsmax to T -Ramp-upRate <3 /sec Time maintained above: -Temperature(T ) 217 -Time(t ) 60~260sec Peak Temperature(T ) 255 0/ 5 Time within 5 of actual Peak Temperature(t ) Ramp-down Rate <6 /sec Time 25 to Peak Temperature <6minutes LP s L L L P P o o o o o oo o o o C C C C C C- + C C C C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55% 25% 2.Reflow soldering of surface-mount devices oo CC Suggested thermal profiles for soldering processes Critical Zone TL to TP Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat t25 C to Peak o Time TL TP Ramp-down Temperature Reel packing SOT-363 3,000 4.0 30,000 183*123*183 178 382*257*387 240,000 9.50 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) LL054BT36 SMD Ultra Low Capacitance ESD Protection Array DS-221852 2012/01/11 2016/03/24 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Formosa MSLL054BT36 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Pressure Cooker 5. Temperature Cycling 6. Humidity 7. High Temperature Storage Life at 260 5 for 10 2sec. at 245 5 for 5 sec. 15P at T =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. at T =85 , RH=85% for 1000hrs. at 175 for 1000 hrs. ±C ± C CC C C O O O OO O O SIG A A V at T =125 C for 168 hrs.J O BR BR= V Min * 80% MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference High reliability test capabilities SMD Ultra Low Capacitance ESD Protection Array DS-221852 2012/01/11 2016/03/24 B 7