LICA3T183M3FC4AA

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Ceramic Capacitor Products www.avx.com Version 9.4

C0G (NP0) Dielectric U Dielectric X8R Dielectric X7R Dielectric X7S Dielectric X5R Dielectric Y5V Dielectric MLCC Tin/Lead Termination (LD Series) MLCC Low Profile UltraThin Ceramic Capacitors Automotive MLCC APS for COTS+ Applications MLCC with FLEXITERM® FLEXISAFE MLC Chips Capacitor Array Low Inductance Capacitors High Voltage MLC Chips MIL-PRF-55681/Chips Ceramic Chip Capacitors Table of Contents

Commercial Surface Mount Chips EXAMPLE: 08055A101JAT2A 0805 Size (L" x W") 0201 0402 0603 0805 1206 1210 1812 1825 2220 2225 Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V D = 35V 5 = 50V 1 = 100V 2 = 200V 7 = 500V A Dielectric A = NP0(C0G) C = X7R D = X5R F = X8R G = Y5V U = U Series W = X6S Z = X7S 101 Capacitance 2 Sig. Fig + No. of Zeros Examples: 100 = 10 pF 101 = 100 pF 102 = 1000 pF 223 = 22000 pF 224 = 220000 pF 105 = 1µF 106 = 10µF 107 = 100µF For values below 10 pF, use “R” in place of Decimal point, e.g., 9.1 pF = 9R1. Tolerance B = ±.10 pF C = ±.25 pF D = ±.50 pF F = ±1% (≥ 10 pF) G = ±2% (≥ 10 pF) J = ±5% K = ±10% M = ±20% Z = +80%, -20% P = +100%, -0% A Failure Rate A = N/A 4 = Automotive T Terminations T = Plated Ni and Sn 7 = Gold Plated U = Conductive Expoxy for Hybrid

Applications

Z = FLEXITERM X = FLEXITERM® with 5% min lead (X7R & X8R only) Contact Factory For 1 = Pd/Ag Term Packaging Available 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk Contact Factory For Multiples A Special Code A = Std. High Voltage MLC Chips EXAMPLE: 1808AA271KA11A Contact Factory for Special Voltages * B, C & D tolerance for ≤10 pF values. Standard Tape and Reel material (Paper/Embossed) depends upon chip size and thickness. See individual part tables for tape material type for each capacitance value. 1808 AVX Style 0805 1206 1210 1808 1812 1825 2220 2225 3640 A Voltage C = 600V/630V A = 1000V S = 1500V G = 2000V W = 2500V H = 3000V J = 4000V K = 5000V A Temperature Coefficient A = C0G C = X7R 271 Capacitance Code (2 significant digits + no. of zeros) Examples: K Capacitance Tolerance A Failure Rate A=Not Applicable Packaging/ Marking 1 = 7" Reel 3 = 13" Reel 9 = Bulk A Special Code A = Standard 10 pF = 100 100 pF = 101 1,000 pF = 102 22,000 pF = 223 220,000 pF = 224 1 µF = 105 C0G: J = ±5% K = ±10% M = ±20% X7R: K = ±10% M = ±20% Z = +80%, -20% F = 63V * = 75V E = 150V V = 250V 9 = 300V X = 350V 8 = 400V NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. For Tin/Lead Terminations, please refer to LD Series NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. For Tin/Lead Terminations, please refer to LD Series Termination 1= Pd/Ag T = Plated Ni and Sn B = 5% Min Pb Z = FLEXITERM X = FLEXITERM® with 5% min lead (X7R only)

EXAMPLE: W2A43C103MAT2A Low Inductance Capacitors (LICC) EXAMPLE: 0612ZD105MAT2A Interdigitated Capacitors (IDC) EXAMPLE: W3L16D225MAT3A Low Inductance Decoupling Capacitor Arrays (LICA) EXAMPLE: LICA3T183M3FC4AA 0612 Size 0306 0508 0612 LD16 LD17 LD18 Z Voltage 6 = 6.3V Z = 10V Y = 16V 3 = 25V 5 = 50V D Dielectric C = X7R D = X5R 105 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance K = ±10% M = ±20% A Failure Rate A = N/A T Terminations T = Plated Ni and Sn B = 5% min lead Packaging Available 2 = 7" Reel 4 = 13" Reel A Thickness See Page 64 for Codes W Style W = RoHS L = SnPb Case Size 2 = 0508 3 = 0612 L Low Inductance ESL = 50pH ESL = 60pH Number of Terminals 1 = 8 Terminals Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V D Dielectric C = X7R D = X5R 225 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance M = ±20 T Termination T = Plated Ni and Sn B = 5% min Lead Packaging Available 1=7" Reel 3=13" Reel A Thickness Max. Thickness mm (in.) A=0.95 (0.037) S=0.55 (0.022) A Failure Rate A = N/A LICA Style Size Voltage 5V = 9 10V = Z 25V = 3 T Dielectric D = X5R T = T55T S = High K T55T 102 Cap/Section (EIA Code) 102 = 1000 pF 103 = 10 nF 104 = 100 nF M Capacitance Tolerance M = ±20% P = GMV Height Code 6 = 0.500mm 3 = 0.650mm 1 = 0.875mm 5 = 1.100mm 7 = 1.600mm F Termination F = C4 Solder Balls- 97Pb/3Sn H = C4 Solder Balls–Low ESR P = Cr-Cu-Au N = Cr-Ni-Au X = None C Reel Packaging M = 7" Reel R = 13" Reel 6 = 2"x2" Waffle Pack 8 = 2"x2" Black Waffle Pack 7 = 2"x2" Waffle Pack w/ termination facing up A = 2"x2" Black Waffle Pack w/ termination facing up C = 4"x4" Waffle Pack w/ clear lid A Inspection Code A = Standard B = Established Reliability Testing A Code Face A = Bar B = No Bar C = Dot, S55S Dielectrics D = Triangle # of Caps/Part 1 = one 2 = two 4 = four W Style W = RoHS L = SnPb Case Size 1 = 0405 2 = 0508 3 = 0612 A Array Number of Caps Voltage Z = 10V Y = 16V 3 = 25V 5 = 50V 1 = 100V C Dielectric A = NP0 C = X7R D = X5R 103 Capacitance Code (In pF)

2 Sig Digits +

M Capacitance Tolerance J = ±5% K = ±10% M = ±20% Packaging & Quantity Code 2A = 7" Reel (4000) 4A = 13" Reel (10000) 2F = 7" Reel (1000) T Termination Code T = Plated Ni and Sn Z = FLEXITERM B = 5% min lead X = FLEXITERM with 5% min lead A Failure Rate A = Commercial 4 = Automotive NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Typical Capacitance Change Envelope: 0 ± 30 ppm/°C % /H9004 Capacitance +0.5 -0.5 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 Temperature °C Temperature Coefficient Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 20 40 60 80 Temperature °C Insulation Resistance vs Temperature 100 Impedance, /H9024 10 100 1000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 1000 pF - C0G (NP0) 1.0 0.1 1206 0805 1812 1210 Impedance, /H9024 10 100 1000 Frequency, MHz Variation of Impedance with Ceramic Formulation Impedance vs. Frequency 1000 pF - C0G (NP0) vs X7R 0805 0.10 0.01 1.00 X7R NPO 10.00 % /H9004 Capacitance 1KHz 10 KHz 100 KHz 1 MHz 10 MHz Frequency /H9004 Capacitance vs. Frequency Impedance, /H90241,000 10,000 100 1 10 100 1000 Frequency, MHz Variation of Impedance with Cap Value Impedance vs. Frequency 0805 - C0G (NP0) 10 pF vs. 100 pF vs. 1000 pF 10 pF 100 pF 1000 pF 1.0 0.1 10.0 100,000 C0G (NP0) Dielectric General Specifications C0G (NP0) is the most popular formulation of the “temperature-compensating,” EIA Class I ceramic materials. Modern C0G (NP0) formulations contain neodymium, samarium and other rare earth oxides. C0G (NP0) ceramics offer one of the most stable capacitor dielectrics available. Capacitance change with temperature is 0 ±30ppm/°C which is less than ±0.3% /H9004C from -55°C to +125°C. Capacitance drift or hysteresis for C0G (NP0) ceramics is negligible at less than ±0.05% versus up to ±2% for films. Typical capacitance change with life is less than ±0.1% for C0G (NP0), one-fifth that shown by most other dielectrics. C0G (NP0) formulations show no aging characteristics. 0805 Size (L" x W") Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 50V = 5 100V = 1 200V = 2 500V = 7 A Dielectric C0G (NP0) = A 101 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros J Capacitance Tolerance B = ±.10 pF (<10pF) C = ±.25 pF (<10pF) D = ±.50 pF (<10pF) F = ±1% ( ≥ 10 pF) G = ±2% ( ≥ 10 pF) J= ± 5 % K = ±10% A Failure Rate A = Not Applicable T Terminations T = Plated Ni and Sn 7 = Gold Plated Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk Contact Factory For Multiples A Special Code A = Std. Product PART NUMBER (see page 2 for complete part number explanation) Contact Factory For 1 = Pd/Ag Term NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values.

C0G (NP0) Dielectric Specifications and Test Methods Parameter/Test NP0 Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF Q <30 pF: Q≥ 400+20 x Cap Value 1.0 kHz ± 10% for cap > 1000 pF ≥30 pF: Q≥ 1000 Voltage: 1.0Vrms ± .2V Insulation Resistance 100,000MΩ or 1000MΩ - µF, Charge device with rated voltage for whichever is less 60 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Appearance No defects Deflection: 2mm Capacitance Test Time: 30 seconds Resistance to Variation ±5% or ±.5 pF, whichever is greater Flexure Q Meets Initial Values (As Above)Stresses Insulation ≥ Initial Value x 0.3Resistance Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC with fresh solder for 5.0 ± 0.5 seconds Appearance No defects, <25% leaching of either end terminal Capacitance Variation ≤ ±2.5% or ±.25 pF, whichever is greater Dip device in eutectic solder at 260ºC for 60 Q Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2Resistance to hours before measuring electrical properties.Solder Heat Insulation Meets Initial Values (As Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±2.5% or ±.25 pF, whichever is greater Step 2: R oom Temp ≤ 3 minutes Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutesThermal Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutesResistance Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after Strength 24 hours at room temperature Appearance No visual defects Capacitance Variation ≤ ±3.0% or ± .3 pF, whichever is greater Charge device with twice rated voltage in ≥ 30 pF: Q ≥ 350 test chamber set at 125ºC ± 2ºC Load Life Q ≥10 pF, <30 pF: Q ≥ 275 +5C/2 for 1000 hours (+48, -0).(C=Nominal Cap) <10 pF: Q ≥ 200 +10C Insulation ≥ Initial Value x 0.3 (See Above) Remove from test chamber and stabilize at Resistance room temperature for 24 hours Dielectric Meets Initial Values (As Above) before measuring. Strength Appearance No visual defects Capacitance Variation ≤ ±5.0% or ± .5 pF, whichever is greater Store in a test chamber set at 85ºC ± 2ºC/ ≥ 30 pF: Q ≥ 350 85% ± 5% relative humidity for 1000 hours Load Q ≥10 pF, <30 pF: Q ≥ 275 +5C/2 (+48, -0) with rated voltage applied. Humidity <10 pF: Q ≥ 200 +10C Insulation ≥ Initial Value x 0.3 (See Above) Remove from chamber and stabilize at Resistance room temperature for 24 ± 2 hours Dielectric Meets Initial Values (As Above) before measuring. Strength 1mm/sec 90 mm

C0G (NP0) Dielectric Capacitance Range Letter ACEGJK M NP QXYZ PAPER EMBOSSED SIZE 0201 0402 0603 0805 1206 Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed WVDC 25 50 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500 Cap 0.5 A C C C G G G G J J J J J J J J J J J (pF) 1.0 A C C C G G G G J J J J J J J J J J J 1 . 2A C C CGGGG J J JJ J J J J J J J

1.5 A A C C C G G G G J J J J J J J J J J J

1.8 A A C C C G G G G J J J J J J J J J J J

2.2 A A C C C G G G G J J J J J J J J J J J

2.7 A A C C C G G G G J J J J J J J J J J J

3.3 A A C C C G G G G J J J J J J J J J J J

3.9 A A C C C G G G G J J J J J J J J J J J

4.7 A A C C C G G G G J J J J J J J J J J J

5.6 A A C C C G G G G J J J J J J J J J J J

6.8 A A C C C G G G G J J J J J J J J J J J

8.2 A A C C C G G G G J J J J J J J J J J J

10 A A C C C G G G G J J J J J J J J J J J

12 A A C C C G G G G J J J J J J J J J J J

15 A A C C C G G G G J J J J J J J J J J J

18 A A C C C G G G G J J J J J J J J J J J

22 A A C C C G G G G J J J J J J J J J J J

27 A A C C C G G G G J J J J J J J J J J J

33 A A C C C G G G G J J J J J J J J J J J

3 9A C C CGGGG J J JJ J J J J J J J 4 7A C C CGGGG J J JJ J J J J J J J 5 6A C C CGGGG J J JJ J J J J J J J 6 8A C C CGGGG J J JJ J J J J J J J 8 2A C C CGGGG J J JJ J J J J J J J 1 0 0A C C CGGGG J J JJ J J J J J J J

120 C C C G G G G J J J J J J J J J J J

150 C C C G G G G J J J J J J J J J J J

180 C C C G G G G J J J J J J J J J J J

220 C C C G G G G J J J J J J J J J J M

270 C C C G G G G J J J J M J J J J J M

330 C C C G G G G J J J J M J J J J J M

390 C C C G G G J J J J M J J J J J M

470 C C C G G G J J J J M J J J J J M

560 G G G J J J J M J J J J J M

680 G G G J J J J J J J J J P

820 G G G J J J J J J J J M

1000 G G G J J J J J J J J Q

1200 JJJ JJ J J Q

1500 JJJ JJ J M Q

1800 JJJ JJ M M

2200 JJN JJ M P

2700 JJN JJ M P

3300 JJ JJ M P

3900 JJ JJ M P

4700 JJ JJ M P

5600 JJ M

Cap 0.010 MM (µF) 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.068 0.082 0.1 WVDC 25 50 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500 SIZE 0201 0402 0603 0805 1206 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t PREFERRED SIZES ARE SHADED

C0G (NP0) Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 1210 1812 1825 2220 2225 Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 50 100 200 Cap 0.5 (pF) 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 J 12 J 15 J 18 J 22 J 27 J 33 J 39 J 47 J 56 J 68 J 82 J 100 J 120 J 150 J 180 J 220 J 270 J 330 J 390 M 470 M

560 J J J J M

680 J J J J M

820 J J J J M

1000 J J J J M K K K K M M M M M M P

1200 J J J M M K K K K M M M M M M P

1500 J J J M M K K K K M M M M M M P

1800 J J J M K K K K M M M M M M P

2200 J J J Q K K K K P M M M M M P

2700 J J J Q K K K P Q M M M M M P

3300 J J J K K K P Q M M M X M M P

3900 J J M K K K P Q M M M X M M P

4700 J J M K K K P Q M M M X X X M M P

5600 J J K K M P X M M M X X X M M P

6800 J J K K M X M M M X X X M M P

8200 J J K M M M M X X X M M P

Cap 0.010 J J K M M M M X X X M M P (µF) 0.012 J J K M M M X X X M M P

0.015 M M M M X X X M M Y

0.018 M M P M X X X M M Y

0.022 M M P X X M Y Y

0.027 M M P X X P Y Y

0.033 M M P X X P

0.039 M M P Y P

0.047 M M P Y P

0.068 M M P

0.082 M M Q

0.1 Q WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 50 100 200 SIZE 1210 1812 1825 2220 2225 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED

RF/Microwave C0G (NP0) Capacitors (RoHS) Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors A B D DE C A B C A B D DE C A B D DE C GENERAL INFORMATION “U” Series capacitors are C0G (NP0) chip capacitors spe - cially designed for “Ultra” low ESR for applications in the communications market. Max ESR and effective capacitance are met on each value producing lot to lot uniformity. Sizes available are EIA chip sizes 0603, 0805, and 1210. Size A B C D E

ELECTRICAL CHARACTERISTICS

Capacitance Values and Tolerances: Size 0402 - 0.2 pF to 22 pF @ 1 MHz Size 0603 - 1.0 pF to 100 pF @ 1 MHz Size 0805 - 1.6 pF to 160 pF @ 1 MHz Size 1210 - 2.4 pF to 1000 pF @ 1 MHz Temperature Coefficient of Capacitance (TC): 0±30 ppm/°C (-55° to +125°C) Insulation Resistance (IR): 1012 Ω min. @ 25°C and rated WVDC 1011 Ω min. @ 125°C and rated WVDC Working Voltage (WVDC): Size Working Voltage 0402 - 50, 25 WVDC 0603 - 200, 100, 50 WVDC 0805 - 200, 100 WVDC 1210 - 200, 100 WVDC Dielectric Working Voltage (DWV): 250% of rated WVDC Equivalent Series Resistance Typical (ESR): 0402 - See Performance Curve, page 9 0603 - See Performance Curve, page 9 0805 - See Performance Curve, page 9 1210 - See Performance Curve, page 9 Marking: Laser marking EIA J marking standard (except 0603) (capacitance code and tolerance upon request). MILITARY SPECIFICATIONS Meets or exceeds the requirements of MIL-C-55681 0805 Case Size 0402 0603 0805 1210 Voltage Code 3 = 25V 5 = 50V 1 = 100V 2 = 200V U Dielectric = Ultra Low ESR 100 Capacitance J Capacitance Tolerance Code B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% A Failure Rate Code A = Not Appli- cable T Termination T= Plated Ni and Sn Packaging Code A Special Code A = Standard HOW TO ORDER EIA Capacitance Code in pF. First two digits = significant figures or “R” for decimal place. Third digit = number of zeros or after “R” significant figures. 2 = 7" Reel 4 = 13" Reel 9 = Bulk DIMENSIONS: inches (millimeters) 0402 0603 0805 1210 inches (mm) NOTE: Contact factory for availability of Termination and Toler- ance Options for Specific Part Numbers. RoHS COMPLIANT Pb: Free

RF/Microwave C0G (NP0) Capacitors (RoHS) Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors 3.9 pF 4.7 pF 5.1 pF 6.8 pF 10.0 pF 15.0 pF 0.1 0.01 0 500 1000 1500 2000 2500 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 0603 “U” SERIES 10 pF 15 pF 3.3 pF 0.1 0.01 0 500 1000 1500 2000 2500 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 0402 “U” SERIES 10.0 pF 100 pF 0.1 0.01 0 500 1000 1500 2000 2500 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 0805 “U” SERIES 10 pF 100 pF 300 pF 0.1 0.01 0 500 1000 1500 2000 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 1210 “U” SERIES CAPACITANCE RANGE ULTRA LOW ESR, “U” SERIES ESR Measured on the Boonton 34A Available Size Cap (pF) Tolerance 0402 0603 0805 1210

0.2 B,C 50V N/A N/A N/A

0.3 0.4

0.5 B,C

0.6 B,C,D

0.7 0.8

0.9 B,C,D

Cap (pF) Tolerance 0402 0603 0805 1210

1.0 B,C,D 50V 200V 200V 200V

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6

6.2 B,C,D

6.8 B,C,J,K,M

Cap (pF) Tolerance 0402 0603 0805 1210

7.5 B,C,J,K,M 50V 200V 200V 200V

8.2

9.1 B,C,J,K,M

10 F ,G,J,K,M

33 N/A

Cap (pF) Tolerance 0402 0603 0805 1210

100 F ,G,J,K,M N/A 100V 200V 200V

130 N/A 200V

180 N/A

1000 F ,G,J,K,M

/H17009 /H17009 /H17009 /H17009 /H17009 /H17009/H17009/H17009/H17009 /H17009/H17009/H17009/H17009 /H17009 /H17009/H17009 /H17009/H17009 /H17009 /H17009 /H17009 /H17009 /H17009 /H17009 /H17009 /H17009 /H17009 RoHS COMPLIANT Pb: Free

RF/Microwave C0G (NP0) Capacitors Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors TYPICAL SERIES RESONANT FREQUENCY “U” SERIES CHIP 1210 0805 0603 0402 1.0 0.11.0 10 100 1000 Capacitance (pF) Frequency (GHz)

RF/Microwave C0G (NP0) Capacitors (Sn/Pb) Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors GENERAL INFORMATION “U” Series capacitors are C0G (NP0) chip capacitors specially designed for “Ultra” low ESR for applications in the commu- nications market. Max ESR and effective capacitance are met on each value producing lot to lot uniformity. Sizes available are EIA chip sizes 0603, 0805, and 1210. Size A B C D E Capacitance Values and Tolerances: Size 0402 - 0.2 pF to 22 pF @ 1 MHz Size 0603 - 1.0 pF to 100 pF @ 1 MHz Size 0805 - 1.6 pF to 160 pF @ 1 MHz Size 1210 - 2.4 pF to 1000 pF @ 1 MHz Temperature Coefficient of Capacitance (TC): 0±30 ppm/°C (-55° to +125°C) Insulation Resistance (IR): 1012 Ω min. @ 25°C and rated WVDC 1011 Ω min. @ 125°C and rated WVDC Working Voltage (WVDC): Size Working Voltage 0402 - 50, 25 WVDC 0603 - 200, 100, 50 WVDC 0805 - 200, 100 WVDC 1210 - 200, 100 WVDC Dielectric Working Voltage (DWV): 250% of rated WVDC Equivalent Series Resistance Typical (ESR): 0402 - See Performance Curve, page 12 0603 - See Performance Curve, page 12 0805 - See Performance Curve, page 12 1210 - See Performance Curve, page 12 Marking: Laser marking EIA J marking standard (except 0603) (capacitance code and tolerance upon request). MILITARY SPECIFICATIONS Meets or exceeds the requirements of MIL-C-55681 A B D DE C A B C A B D DE C A B D DE C LD05 Case Size LD02 = 0402 LD03 = 0603 LD05 = 0805 LD10 = 1210 Voltage Code 3 = 25V 5 = 50V 1 = 100V 2 = 200V U Dielectric = Ultra Low ESR 100 Capacitance J Capacitance Tolerance Code B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% A Failure Rate Code A = Not Applica- ble B Termination B = 5% min lead Packaging Code 2 = 7" Reel 4 = 13" Reel 9 = Bulk A Special Code A = Standard HOW TO ORDER EIA Capacitance Code in pF. First two digits = significant figures or “R” for decimal place. Third digit = number of zeros or after “R” significant figures. DIMENSIONS: inches (millimeters) 0402 0603 0805 1210 inches (mm)

ULTRA LOW ESR, “U” SERIES 3.9 pF 4.7 pF 5.1 pF 6.8 pF 10.0 pF 15.0 pF 0.1 0.01 0 500 1000 1500 2000 2500 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 0603 “U” SERIES 10 pF 15 pF 3.3 pF 0.1 0.01 0 500 1000 1500 2000 2500 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 0402 “U” SERIES 10.0 pF 100 pF 0.1 0.01 0 500 1000 1500 2000 2500 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 0805 “U” SERIES 10 pF 100 pF 300 pF 0.1 0.01 0 500 1000 1500 2000 Frequency (MHz) ESR (ohms) TYPICAL ESR vs. FREQUENCY 1210 “U” SERIES ESR Measured on the Boonton 34A /H17009 /H17009 /H17009 /H17009 /H17009/H17009/H17009/H17009 RF/Microwave C0G (NP0) Capacitors (Sn/Pb) Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors CAPACITANCE RANGE Available Size Cap (pF) Tolerance LD02 LD03 LD05 LD10 0.3 0.4 0.7 0.8 Cap (pF) Tolerance LD02 LD03 LD05 LD10 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 Cap (pF) Tolerance LD02 LD03 LD05 LD10 8.2 Cap (pF) Tolerance LD02 LD03 LD05 LD10 /H17009 /H17009 /H17009 /H17009/H17009/H17009/H17009 /H17009/H17009/H17009/H17009 /H17009/H17009/H17009 /H17009 /H17009/H17009/H17009/H17009/H17009 /H17009 /H17009 /H17009 /H17009 /H17009 /H17009 /H17009

“U” SERIES KITS Designer Kits Communication Kits “U” Series 0402 0603 Kit 4000 UZ Cap. Cap. Value Tolerance Value Tolerance pF pF 1.0 6.8 1.2 7.5 B (±0.1pF) 1.5 8.2 1.8 10.0 2.0 12.0 2.7 18.0 3.0 22.0 J (±5%) 3.3 27.0 3.9 33.0 4.7 39.0 5.6 47.0 *25 each of 24 values *25 each of 15 values Kit 5000 UZ Cap. Cap. Value Tolerance Value Tolerance pF pF 0.5 4.7 1.8 B (±0.1pF) 8.2 2.2 10.0 3.6 0805 *25 each of 30 values Kit 3000 UZ Cap. Cap. Value Tolerance Value Tolerance pF pF 1.0 15.0 1.5 18.0 2.2 22.0 2.4 24.0 2.7 27.0 3.0 33.0 3.9 39.0 J (±5%) 4.7 47.0 5.6 56.0 7.5 68.0 8.2 82.0 9.1 100.0 10.0 J (±5%) 130.0 12.0 160.0 1210 *25 each of 30 values Kit 3500 UZ Cap. Cap. Value Tolerance Value Tolerance pF pF 2.2 36.0 2.7 39.0 4.7 47.0 6.8 56.0 8.2 68.0 9.1 82.0 10.0 100.0 J (±5%) 13.0 120.0 15.0 130.0 18.0 J (±5%) 240.0 20.0 300.0 24.0 390.0 27.0 470.0 30.0 680.0

25V = 3 50V = 5 F Dielectric X8R = F 104 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros e.g. 10µF = 106 K Capacitance Tolerance J = ± 5% K = ±10% M = ± 20% Failure Rate 4 = Automotive A = Not Applicable T Terminations T = Plated Ni and Sn Z = FLEXITERM® U = Conductive Epoxy for Hybrid apps Packaging 2 = 7" Reel 4 = 13" Reel A Special Code A = Std. Product X8R Dielectric General Specifications AVX have developed a range of multilayer ceramic capacitors designed for use in applications up to 150ºC. These capacitors are manufactured with an X8R dielectric material which has a capacitance variation of ±15% between -55ºC and +150ºC. The need for X8R performance has been driven by customer requirements for parts that operate at elevated temperatures. They provide a highly reliable capacitor with low loss and stable capacitance over temperature. They are ideal for automotive under the hood sensors, measure while drilling and log while drilling. Typical applications include wire line logging tools such as gamma ray receivers, acoustic transceivers and micro-resistivity tools. They can also be used as bulk capacitors for high temperature camera modules. X8R capacitors are available as standard and Automotive AEC-Q200 qualified parts. Optional termination systems, tin, FLEXITERM ® and conductive epoxy for hybrid applications are available. Providing this series with our FLEXITERM ® termination system provides further advantage to customers by way of enhanced resistance to both, temperature cycling and mechanical damage. PART NUMBER (see page 2 for complete part number explanation) NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED SIZE 0603 0805 1206 WVDC 25V 50V 25V 50V 25V 50V

271 Cap 270 G G

331 (pF) 330 G G J J 471 470 G G J J 681 680 G G J J 102 1000 G G J J J J 152 1500 G G J J J J 182 1800 G G J J J J 222 2200 G G J J J J 272 2700 G G J J J J 332 3300 G G J J J J 392 3900 G G J J J J 472 4700 G G J J J J 562 5600 G G J J J J 682 6800 G G J J J J 822 8200 G G J J J J 103 Cap 0.01 G G J J J J 123 (µF) 0.012 G G J J J J 153 0.015 G G J J J J 183 0.018 G G J J J J 223 0.022 G G J J J J 273 0.027 G G J J J J 333 0.033 G G J J J J 393 0.039 G G J J J J 473 0.047 G G J J J J 563 0.056 G N N M M 683 0.068 G N N M M 823 0.082 N N M M 104 0.1 N N M M 124 0.12 N N M M 154 0.15 N N M M 184 0.18 N M M 224 0.22 N M M 274 0.27 MM 334 0.33 MM 394 0.39 M 474 0.47 M 684 0.68 824 0.82 105 1 WVDC 25V 50V 25V 50V 25V 50V SIZE 0603 0805 1206 = AEC-Q200 Qualified

APPLICATIONS FOR X8R CAPACITORS  All market sectors with a 150°C requirement  Automotive on engine applications  Oil exploration applications  Hybrid automotive applications – Battery control – Inverter / converter circuits – Motor control applications – Water pump  Hybrid commercial applications – Emergency circuits – Sensors – Temperature regulation ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS  Samples  Technical Articles  Application Engineering  Application Support ADVANTAGES OF X8R MLC CAPACITORS  Capacitance variation of ±15% between –55°C and +150°C  Qualified to the highest automotive AEC-Q200 standards  Excellent reliability compared to other capacitor technologies  RoHS compliant  Low ESR / ESL compared to other technologies  Tin solder finish  FLEXITERM ® available  Hybrid available  50V range available X8R Dielectric -25.00 -20.00 -15.00 -10.00 -5.00 0.00 5.00 -60 -40 -20 0 20 40 60 X7R included for comparison 80 100 120 140 160 Temperature (°C) % Cap change 0805, 50V, X8R Typical Temperature Coefficient

X7R formulations are called “temperature stable” ceramics and fall into EIA Class II materials. X7R is the most popular of these intermediate dielectric constant materials. Its tempera- ture variation of capacitance is within ±15% from -55°C to +125°C. This capacitance change is non-linear. Capacitance for X7R varies under the influence of electrical operating conditions such as voltage and frequency. X7R dielectric chip usage covers the broad spectrum of industrial applications where known changes in capacitance due to applied voltages are acceptable. PART NUMBER (see page 2 for complete part number explanation) % Cap Change -60 -40 -20 0 20 40 60 80 100 120 140 Temperature °C X7R Dielectric Typical Temperature Coefficient -10 -15 -20 -25 % /H9004 Capacitance +10 +20 +30 -10 -20 -30 1KHz 10 KHz 100 KHz 1 MHz 10 MHz Frequency /H9004 Capacitance vs. Frequency Insulation Resistance (Ohm-Farads) 1,000 10,000 100 00 20 12040 60 80 Temperature °C Insulation Resistance vs Temperature 100 Impedance, /H9024 10 100 1000 Frequency, MHz Variation of Impedance with Cap Value Impedance vs. Frequency 1,000 pF vs. 10,000 pF - X7R 0805 0.10 0.01 1.00 1,000 pF 10,000 pF 10.00 Impedance, /H9024 11 0 100 1,000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 100,000 pF - X7R 0.1 .01 1.0 1206 0805 1210 Impedance, /H9024 11 0 100 1,000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 10,000 pF - X7R 0.1 .01 1.0 1206 0805 1210 0805 Size (L" x W") Voltage 4V = 4 6.3V = 6 10V = Z 16V = Y 25V = 3 50V = 5 100V = 1 200V = 2 500V = 7 C Dielectric X7R = C 103 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance J = ± 5%* K = ±10% M = ± 20% *≤1µF only Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk Contact Factory For Multiples A Special Code A = Std. Product T Terminations T = Plated Ni and Sn 7 = Gold Plated* Z= FLEXITERM ®** A Failure Rate A = Not Applicable *Optional termination **See FLEXITERM® X7R section NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values.

Specifications and Test Methods Parameter/Test X7R Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber Capacitance Within specified tolerance ≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10% Dissipation Factor ≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V ≤ 3.5% for 16V DC rating For Cap > 10 µF, 0.5Vrms @ 120Hz ≤ 5.0% for ≤ 10V DC rating Insulation Resistance 100,000MΩ or 1000MΩ - µF, Charge device with rated voltage for whichever is less 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Appearance No defects Deflection: 2mm Capacitance Test Time: 30 seconds Resistance to Variation ≤ ±12% Flexure Dissipation Meets Initial Values (As Above)Stresses Factor Insulation ≥ Initial Value x 0.3Resistance Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC with fresh solder for 5.0 ± 0.5 seconds Appearance No defects, <25% leaching of either end terminal Capacitance Variation ≤ ±7.5% Dip device in eutectic solder at 260ºC for 60Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2Resistance to Factor hours before measuring electrical properties.Solder Heat Insulation Meets Initial Values (As Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: R oom Temp ≤ 3 minutes Dissipation Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutesThermal FactorShock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutesResistance Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after Strength 24 ± 2 hours at room temperature Appearance No visual defects Capacitance Variation ≤ ±12.5% Dissipation ≤ Initial Value x 2.0 (See Above)Load Life Factor Insulation ≥ Initial Value x 0.3 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Capacitance Variation ≤ ±12.5% Load Dissipation ≤ Initial Value x 2.0 (See Above)Humidity Factor Insulation ≥ Initial Value x 0.3 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Charge device with 1.5 rated voltage (≤ 10V) in test chamber set at 125ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. 1mm/sec 90 mm

PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed WVDC 10 16 25 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500 Cap 100 A A A (pF) 150 A A A

220 A A A C

3 3 0 AAA C G G G JJJJJJ K 4 7 0 AA C G G G JJJJJJ K 6 8 0 AA C G G G JJJJJJ K

1000 A A C G G G JJJJJJ K

1500 A C G G JJJJJJ JJJJJJ M

2200 A C G G JJJJJJ JJJJJJ M

3300 A C C G G JJJJJJ JJJJJJ M

4700 A C C G G JJJJJJ JJJJJJ M

6800 A C C G G JJJJJJ JJJJJJP

Cap 0.010 A C C G G JJJJJJ JJJJJJP (µF 0.015 C G G JJJJJJ JJJJJ M

0.022 C G G JJJJJN JJJJJ M

0.033 G G JJJJN JJJJJ M

0.047 G G G JJJJN JJJJJ M

0.068 G G G JJJJN JJJJJP

0.10 C GGGG JJJJN JJJJ M P

0.15 G G J J J N N JJJJQ

0.22 G G J* J J N N N JJJJQ

0.33 NNNNN J JMPQ

0.47 J* N N N N N M M M P Q

0.68 NNN MMQQQ

1.0 J* J* N N N M M Q Q Q

1.5 PQQ

2.2 J* P* Q Q Q

3.3

10 P* Q* Q*

22 Q* 100 WVDC 10 16 25 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500 SIZE 0201 0402 0603 0805 1206 Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED *Optional Specifications – Contact factory

Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED PREFERRED SIZES ARE SHADED SIZE 1210 1812 1825 2220 2225 Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100 Cap 100 (pF) 150 220 330 470 680 1000

1500 JJJJJJ M

2200 JJJJJJ M

3300 JJJJJJ M

4700 JJJJJJ M

6800 JJJJJJ M

Cap 0.010 JJJJJJ M KKKKM M XXXMP (µF 0.015 JJJJJJP K K K P M M XXX M P

0.022 JJJJJJQ K K K P M M XXX M P

0.033 JJJJJJQ K K KX M M XXX M P

0.047 JJJJJJ K K KZ M M XXX M P

0.068 JJJJJ M K K KZ M M XXX M P

0.10 JJJJJ M K K KZ M M XXX M P

0.15 JJJJ M Z K K P M M XXX M P

0.22 JJJJPZ K K P M M XXX M P

0.33 JJJJQ K M X M M XXX M P

0.47 MMMMQ K P MM X X XMP

0.68 M M P X X M Q M P X X M P

1 . 0 N N P X ZM XM P X X M P 1 . 5 NNZZZ ZZ M XX MX 2 . 2 XXZZZ ZZ XX M 3 . 3 XXZZ Z XZ 4 . 7 XXZZ Z XZ

10 Z Z Z* Z

22 Z* Z* Z

WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100 SIZE 1210 1812 1825 2220 2225 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t *Optional Specifications – Contact factory

X7S formulations are called “temperature stable” ceramics and fall into EIA Class II materials. Its temperature variation of capacitance is within ±22% from –55°C to +125°C. This capacitance change is non-linear. Capacitance for X7S varies under the influence of electrical operating conditions such as voltage and frequency. X7S dielectric chip usage covers the broad spectrum of industrial applications where known changes in capacitance due to applied voltages are acceptable. X7S Dielectric General Specifications PART NUMBER (see page 2 for complete part number explanation) GENERAL DESCRIPTION TYPICAL ELECTRICAL CHARACTERISTICS 1206 Size (L" x W") Z Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V Z Dielectric Z = X7S 105 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance K = ±10% M = ±20% A Failure Rate A = N/A T Terminations T = Plated Ni and Sn Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. A Special Code A = Std. Product % /H9004 Capacitance +10 +20 +30 -10 -20 -30 1KHz 10 KHz 100 KHz 1 MHz 10 MHz Frequency /H9004 Capacitance vs. Frequency Insulation Resistance (Ohm-Farads) 1,000 10,000 100 00 20 12040 60 80 Temperature °C Insulation Resistance vs Temperature 100 Impedance, /H9024 10 100 1000 Frequency, MHz Variation of Impedance with Cap Value Impedance vs. Frequency 1,000 pF vs. 10,000 pF - X7S 0805 0.10 0.01 1.00 1,000 pF 10,000 pF 10.00 Impedance, /H9024 11 0 100 1,000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 100,000 pF - X7S 0.1 .01 1.0 1206 0805 1210 Impedance, /H9024 11 0 100 1,000 Frequency, MHz Variation of Impedance with Chip Size Impedance vs. Frequency 10,000 pF - X7S 0.1 .01 1.0 1206 0805 1210 -10 -15 -20 -25 -60 -40 -20 0 20 40 Temperature (°C) % Cap Change 60 80 100 120 140 X7S Dielectric Typical Temperature Coefficient NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

Specifications and Test Methods Parameter/Test X7S Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber Capacitance Within specified tolerance ≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10% Dissipation Factor ≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V ≤ 3.5% for 16V DC rating For Cap > 10 µF, 0.5Vrms @ 120Hz ≤ 5.0% for ≤ 10V DC rating Insulation Resistance 100,000MΩ or 1000MΩ - µF, Charge device with rated voltage for whichever is less 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Appearance No defects Deflection: 2mm Capacitance Test Time: 30 seconds Resistance to Variation ≤ ±12% Flexure Dissipation Meets Initial Values (As Above)Stresses Factor Insulation ≥ Initial Value x 0.3Resistance Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC with fresh solder for 5.0 ± 0.5 seconds Appearance No defects, <25% leaching of either end terminal Capacitance Variation ≤ ±7.5% Dip device in eutectic solder at 260ºC for 60Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2Resistance to Factor hours before measuring electrical properties.Solder Heat Insulation Meets Initial Values (As Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: R oom Temp ≤ 3 minutes Dissipation Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutesThermal FactorShock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutesResistance Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after Strength 24 ± 2 hours at room temperature Appearance No visual defects Capacitance Variation ≤ ±12.5% Dissipation ≤ Initial Value x 2.0 (See Above)Load Life Factor Insulation ≥ Initial Value x 0.3 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Capacitance Variation ≤ ±12.5% Load Dissipation ≤ Initial Value x 2.0 (See Above)Humidity Factor Insulation ≥ Initial Value x 0.3 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Charge device with 1.5 rated voltage (≤ 10V) in test chamber set at 125ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. 1mm/sec 90 mm

PREFERRED SIZES ARE SHADED SIZE 0402 0603 0805 1206 1210 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed WVDC 6.3 6.3 25 4 6.3 10 6.3 Cap 100 (pF) 150 220 330 470 680 1000 1500 2200 3300 4700 6800 Cap 0.010 (µF 0.015 0.022 0.033 C 0.047 C 0.068 C 0.10 C 0.15 0.22 G 0.33 G 0.47 G 0.68 G 1.0 G

1.5 N Q

2.2 N Q

3.3 N Q

4.7 N Q Q

WVDC 6.3 6.3 25 4 6.3 10 6.3 SIZE 0402 0603 0805 1206 1210 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED

 General Purpose Dielectric for Ceramic Capacitors  EIA Class II Dielectric  Temperature variation of capacitance is within ±15% from -55°C to +85°C  Well suited for decoupling and filtering applications  Available in High Capacitance values (up to 100µF) X5R Dielectric General Specifications PART NUMBER (see page 2 for complete part number explanation) GENERAL DESCRIPTION % /H9004 Capacitance -60 -40 -20 0 +20 +40 +60 +80 Temperature °C Temperature Coefficient -10 -15 -20 TYPICAL ELECTRICAL CHARACTERISTICS Insulation Resistance (Ohm-Farads) 1,000 10,000 100 Insulation Resistance vs Temperature 0 20 12040 60 80 Temperature °C 100 1210 Size (L" x W") Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V D = 35V 5 = 50V D Dielectric D = X5R 107 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance K = ±10% M = ±20% A Failure Rate A = N/A T Terminations T = Plated Ni and Sn Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk A Special Code A = Std. NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values.

Specifications and Test Methods Parameter/Test X5R Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +85ºC Temperature Cycle Chamber Capacitance Within specified tolerance ≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10% Dissipation Factor ≤ 3.0% for 25V DC rating Voltage: 1.0Vrms ± .2V ≤ 12.5% Max. for 16V DC rating and lower For Cap > 10 µF, 0.5Vrms @ 120Hz Contact Factory for DF by PN Insulation Resistance 10,000MΩ or 500MΩ - µF, Charge device with rated voltage for whichever is less 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Appearance No defects Deflection: 2mm Capacitance Test Time: 30 seconds Resistance to Variation ≤ ±12% Flexure Dissipation Meets Initial Values (As Above)Stresses Factor Insulation ≥ Initial Value x 0.3Resistance Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC with fresh solder for 5.0 ± 0.5 seconds Appearance No defects, <25% leaching of either end terminal Capacitance Variation ≤ ±7.5% Dip device in eutectic solder at 260ºC for 60Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2Resistance to Factor hours before measuring electrical properties.Solder Heat Insulation Meets Initial Values (As Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: R oom Temp ≤ 3 minutes Dissipation Meets Initial Values (As Above) Step 3: +85ºC ± 2º 30 ± 3 minutesThermal FactorShock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutesResistance Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after Strength 24 ± 2 hours at room temperature Appearance No visual defects Capacitance Variation ≤ ±12.5% Dissipation ≤ Initial Value x 2.0 (See Above)Load Life Factor Insulation ≥ Initial Value x 0.3 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Capacitance Variation ≤ ±12.5% Load Dissipation ≤ Initial Value x 2.0 (See Above)Humidity Factor Insulation ≥ Initial Value x 0.3 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Charge device with 1.5X rated voltage in test chamber set at 85ºC ± 2ºC for 1000 hours (+48, -0). Note: Contact factory for *optional specification part numbers that are tested at < 1.5X rated voltage. Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. 1mm/sec 90 mm

PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 1210 1812 Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Reflow Only Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed All Embossed Cap 100 A (pF) 150 A

220 A C

330 A C

470 A C

680 A C

1000 A A C

1500 A C

2200 A A C

3300 A C

4700 A C G

6800 A C G

Cap 0.010 A C G (µF) 0.015 C G G G

0.022 A * CC GGG N

0.033 C G G G N

0.047 A * CC GGG N

0.068 C G G N

0.10 A * CCC G G N N

0.15 GN N

0.22 A * A* C* GG NN Q

0.33 G G N

0.47 C * C* GN Q Q X

0.68 G N

1.0 C * C* C* GGGJ * NN P * Q Q XXX

1.5

2.2 C * C* G* G* J* J* NNN QQ ZX

3.3 J * J* J* J* NN QQ

4.7 E * J* J* J* NN N * N * QQQQ QZ

10 K J * N* N* N** QQQ Q * XZ Z * Z

47 *Q * Z*

100 Z* Z*

SIZE 0201 0402 0603 0805 1206 1210 1812 = Under Development = *Optional Specifications – Contact factory L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t NOTE: Contact factory for non-specified capacitance values Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED

Y5V formulations are for general-purpose use in a limited temperature range. They have a wide temperature characteristic of +22% –82% capacitance change over the operating temperature range of –30°C to +85°C. These characteristics make Y5V ideal for decoupling applications within limited temperature range. 0805 Size (L" x W") Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 50V = 5 G Dielectric Y5V = G 104 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros Z Capacitance Tolerance Z = +80 –20% A Failure Rate A = Not Applicable T Terminations T = Plated Ni and Sn Packaging 2 = 7" Reel 4 = 13" Reel A Special Code A = Std. Product PART NUMBER (see page 2 for complete part number explanation) % /H9004 Capacitance +20 +10 -55 -35 -15 +5 +25 +45 +65 +85 +105 +125 Temperature °C Temperature Coefficient -60 -50 -40 -30 -20 -10 -70 -80 /H9004 c/c (%) +20 +40 % DC Bias Voltage Capacitance Change vs. DC Bias Voltage -60 -40 -20 -100 -80 20 40 60 80 100 Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 +20 +30 +40 +60 +50 +70 +80 +90 Temperature °C Insulation Resistance vs. Temperature |Z| (Ohms) 10,000 1,000 10,000 Frequency (Hz) 0.1 /H9262F - 0603 Impedance vs. Frequency 100 0.01 0.1 100,000 1,000,000 10,000,000 |Z| (Ohms) 1,000 10,000 Frequency (Hz) 0.22 /H9262F - 0805 Impedance vs. Frequency 100 0.01 0.1 100,000 1,000,000 10,000,000 |Z| (Ohms) 1,000 10,000 Frequency (Hz) 1 /H9262F - 1206 Impedance vs. Frequency 100 0.01 0.1 100,000 1,000,000 10,000,000

Specifications and Test Methods Parameter/Test Y5V Specification Limits Measuring Conditions Operating Temperature Range -30ºC to +85ºC Temperature Cycle Chamber Capacitance Within specified tolerance ≤ 5.0% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10% Dissipation Factor ≤ 7.0% for 25V DC rating Voltage: 1.0Vrms ± .2V ≤ 9.0% for 16V DC rating For Cap > 10 µF, 0.5Vrms @ 120Hz ≤ 12.5% for ≤ 10V DC rating Insulation Resistance 10,000MΩ or 500MΩ - µF, Charge device with rated voltage for whichever is less 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Appearance No defects Deflection: 2mm Capacitance Test Time: 30 seconds Resistance to Variation ≤ ±30% Flexure Dissipation Meets Initial Values (As Above)Stresses Factor Insulation ≥ Initial Value x 0.1Resistance Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC with fresh solder for 5.0 ± 0.5 seconds Appearance No defects, <25% leaching of either end terminal Capacitance Variation ≤ ±20% Dip device in eutectic solder at 260ºC for 60Dissipation Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2Resistance to Factor hours before measuring electrical properties.Solder Heat Insulation Meets Initial Values (As Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Step 1: -30ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±20% Step 2: Room Temp ≤ 3 minutes Dissipation Meets Initial Values (As Above) Step 3: +85ºC ± 2º 30 ± 3 minutesThermal FactorShock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutesResistance Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after Strength 24 ±2 hours at room temperature Appearance No visual defects Capacitance Variation ≤ ±30% Dissipation ≤ Initial Value x 1.5 (See Above)Load Life Factor Insulation ≥ Initial Value x 0.1 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Appearance No visual defects Capacitance Variation ≤ ±30% Load Dissipation ≤ Initial Value x 1.5 (See above)Humidity Factor Insulation ≥ Initial Value x 0.1 (See Above)Resistance Dielectric Meets Initial Values (As Above)Strength Charge device with twice rated voltage in test chamber set at 85ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. 1mm/sec 90 mm

PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 1210 Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed WVDC 6.3 10 6 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 Cap 820 (pF) 1000 A 2200 A 4700 A Cap 0.010 A A (µF) 0.022 A

0.047 A C

0.10 C C G G K

0.22 G 0.33 G

0.47 C G G

1.0 C C G G N N N M M M N

2.2 C N

4.7 NP N N

10.0 NQ Q X Q Q

22.0 QX 47.0 WVDC 6.3 10 6 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 SIZE 0201 0402 0603 0805 1206 1210 Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t

MLCC Tin/Lead Termination “B” General Specifications AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages a full range of values that we are currently offering in this special “B” termination. Please contact the factory if you require additional information on our MLCC Tin/Lead Termination “B” products. NP0 Refer to page 4 for Electrical Graphs X7R Refer to page 16 for Electrical Graphs X7S Refer to page 20 for Electrical Graphs X5R Refer to page 23 for Electrical Graphs Y5V Refer to page 26 for Electrical Graphs LD05 Size LD02 - 0402 LD03 - 0603 LD04 - 0504* LD05 - 0805 LD06 - 1206 LD10 - 1210 LD12 - 1812 LD13 - 1825 LD14 - 2225 LD20 - 2220 Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 35V = D 50V = 5 100V = 1 200V = 2 500V = 7 A Dielectric C0G (NP0) = A X7R = C X5R = D X8R = F 101 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros J Capacitance Tolerance B = ±.10 pF (<10pF) C = ±.25 pF (<10pF) D = ±.50 pF (<10pF) F = ±1% ( ≥ 10 pF) G = ±2% ( ≥ 10 pF) J= ± 5 % K = ±10% M = ±20% A Failure Rate A = Not Applicable Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk Contact Factory For Multiples A Special Code A = Std. Product PART NUMBER (see page 2 for complete part number explanation) *LD04 has the same CV ranges as LD03. NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values. See FLEXITERM® section for CV options Terminations B = 5% min lead X = FLEXITERM with 5% min lead X7R only

MLCC Tin/Lead Termination “B” Capacitance Range (NP0 Dielectric) PREFERRED SIZES ARE SHADED Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED SIZE LD02 LD03 LD05 LD06 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500 Cap 0.5 C C C G G G G J J J J J J J J J J J (pF) 1.0 C C C G G G G J J J J J J J J J J J

1.2 C C C G G G G J J J J J J J J J J J

1.5 C C C G G G G J J J J J J J J J J J

1.8 C C C G G G G J J J J J J J J J J J

2.2 C C C G G G G J J J J J J J J J J J

2.7 C C C G G G G J J J J J J J J J J J

3.3 C C C G G G G J J J J J J J J J J J

3.9 C C C G G G G J J J J J J J J J J J

4.7 C C C G G G G J J J J J J J J J J J

5.6 C C C G G G G J J J J J J J J J J J

6.8 C C C G G G G J J J J J J J J J J J

8.2 C C C G G G G J J J J J J J J J J J

10 C C C G G G G J J J J J J J J J J J

12 C C C G G G G J J J J J J J J J J J

15 C C C G G G G J J J J J J J J J J J

18 C C C G G G G J J J J J J J J J J J

22 C C C G G G G J J J J J J J J J J J

27 C C C G G G G J J J J J J J J J J J

33 C C C G G G G J J J J J J J J J J J

39 C C C G G G G J J J J J J J J J J J

47 C C C G G G G J J J J J J J J J J J

56 C C C G G G G J J J J J J J J J J J

68 C C C G G G G J J J J J J J J J J J

82 C C C G G G G J J J J J J J J J J J

100 C C C G G G G J J J J J J J J J J J

3 9 0 C C CGG G JJ JJ M JJJJ J M 4 7 0 C C CGG G JJ JJ M JJJJ J M

1200 JJ J JJJJ Q

1500 JJ J JJJM Q

1800 JJ J JJ M M

2200 JJN JJ MP

2700 JJN JJ MP

3300 JJ JJ MP

3900 JJ JJ MP

4700 JJ JJ MP

Cap 0.010 MM (µF) 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.068 0.082 0.1 WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500 SIZE LD02 LD03 LD05 LD06 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t

MLCC Tin/Lead Termination “B” Capacitance Range (NP0 Dielectric) PREFERRED SIZES ARE SHADED SIZE LD10 LD12 LD13 LD14 Soldering Reflow Only Reflow Only Reflow Only Reflow Only Packaging Paper/Embossed All Embossed All Embossed All Embossed WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 Cap 0.5 (pF) 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 J 12 J 15 J 18 J 22 J 27 J 33 J 39 J 47 J 56 J 68 J 82 J 100 J 120 J 150 J 180 J 220 J 270 J 330 J 390 M 470 M

3300 J J J K K K P Q M M M M M P

3900 J J M K K K P Q M M M M M P

4700 J J M K K K P Q M M M M M P

5600 J J K K M P X M M M M M P

6800 J J K K M X M M M M M P

8200 J J K M M M M M M P

Cap 0.010 J J K M M M M M M P (µF) 0.012 J J K M M M M M P

0.015 M M M M M M Y

0.018 M M P M M M Y

0.022 M M P M Y Y

0.027 M M P P Y Y

0.033 M M P P

0.039 M M P P

0.047 M M P P

0.1 Q WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 SIZE LD10 LD12 LD13 LD14 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED

MLCC Tin/Lead Termination “B” Capacitance Range (X8R Dielectric) Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED SIZE LD03 LD05 LD06 WVDC 25V 50V 25V 50V 25V 50V 331 (pF) 330 G G J J 471 470 G G J J 681 680 G G J J 102 1000 G G J J J J 152 1500 G G J J J J 182 1800 G G J J J J 222 2200 G G J J J J 272 2700 G G J J J J 332 3300 G G J J J J 392 3900 G G J J J J 472 4700 G G J J J J 562 5600 G G J J J J 682 6800 G G J J J J 822 8200 G G J J J J 103 Cap 0.01 G G J J J J 123 (µF) 0.012 G G J J J J 153 0.015 G G J J J J 183 0.018 G G J J J J 223 0.022 G G J J J J 273 0.027 G G J J J J 333 0.033 G G J J J J 393 0.039 G G J J J J 473 0.047 G G J J J J 563 0.056 G N N M M 683 0.068 G N N M M 823 0.082 N N M M 104 0.1 N N M M 124 0.12 N N M M 154 0.15 N N M M 184 0.18 N M M 224 0.22 N M M 274 0.27 MM 334 0.33 MM 394 0.39 M 474 0.47 M 684 0.68 824 0.82 105 1 WVDC 25V 50V 25V 50V 25V 50V SIZE LD03 LD05 LD06

PREFERRED SIZES ARE SHADED SIZE LD02 LD03 LD05 LD06 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500 Cap 100 (pF) 150 220 C

330 C G G G J J J J J J K

470 C G G G J J J J J J K

680 C G G G J J J J J J K

1000 C G G G J J J J J J K

1500 C G G J J J J J J J J J J J J M

2200 C G G J J J J J J J J J J J J M

3300 C C G G J J J J J J J J J J J J M

4700 C C G G J J J J J J J J J J J J M

6800 C C G G J J J J J J J J J J J J P

Cap 0.010 C G G J J J J J J J J J J J J P (µF 0.015 C G G J J J J J J J J J J J M

0.022 C G G J J J J J N J J J J J M

0.033 G G J J J J N J J J J J M

0.047 G G G J J J J N J J J J J M

0.068 G G G J J J J N J J J J J P

0.10 C* G G G G J J J J N J J J J M P

0.15 G G J J J N N J J J J Q

0.22 G G J J N N N J J J J Q

0.33 NNN NN JJ M P Q

0.68 NNN M M Q QQ

1.0 J* J* N N N* M M Q Q Q

1.5 PQ Q

3.3 22 Q* 100 WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500 SIZE LD02 LD03 LD05 LD06 Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED = Under Development MLCC Tin/Lead Termination “B” Capacitance Range (X7R Dielectric)

MLCC Tin/Lead Termination “B” Capacitance Range (X7R Dielectric) Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED PREFERRED SIZES ARE SHADED SIZE LD10 LD12 LD13 LD20 LD14 Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100 Cap 100 (pF) 150 220 330 470 680 1000 Cap 0.010 JJJJJJ M KKKKM M XXXMP (µF 0.015 JJJJJJP K K K P M M XXX M P 1 . 0 N N P X ZM XM P X X M P 1 . 5 NNZZZ ZZ M XX MX 2 . 2 XXZZZ ZZ XX M 3 . 3 XXZZ Z XZ 4 . 7 XXZZ Z XZ 1 0 ZZZ Z

22 Z Z Z

WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100 SIZE LD10 LD12 LD13 LD20 LD14 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t

MLCC Tin/Lead Termination “B” Capacitance Range (X5R Dielectric) PREFERRED SIZES ARE SHADED SIZE LD02 LD03 LD05 LD06 LD10 LD12 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed Cap 100 (pF) 150 220 C 330 C 470 C 680 C 1000 C 1500 C 2200 C 3300 C

4700 C G

6800 C G

Cap 0.010 C G (µF) 0.015 C G G G

0.022 C C G G G N

0.047 C C G G G N

0.10 C C C G G N N

0.15 G N N

0.22 C* G G N N Q

0.47 C* C* G N Q Q X

1.0 C* C* C* G G G J* N N P* Q Q X X X

1.5

2.2 C* C* G* G* J* J* N N N Q Q Z X

3.3 J* J* J* J* N N Q Q

4.7 E* J* J* J* N N N* N* Q Q Q Q Q Z

10 K* J* N* N* N* * Q Q Q Q* X Z Z Z

47 Q* Z*

SIZE LD02 LD03 LD05 LD06 LD10 LD12 L/H17010 /H17010 /H17010 /H17010 W /H17010/H17010 /H17010 /H17010 T t Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED = Under Development = *Optional Specifications – Contact factory NOTE: Contact factory for non-specified capacitance values

NOTE: Contact factory for availability of tolerance options for specific part numbers. AVX introduces the LT series comprising a range of low profile products in our X5R and X7R dielectric. X5R is a Class II dielectric with temperature varation of capacitance within ±15% from –55°C to +85°C. Offerings include 0201, 0402, 0603, 0805 1206, and 1210 packages in compact, low profile designs. The LT series is ideal for decoupling and filtering applications where height clearance is limited. AVX is also expanding the low profile products in our X7R dielectric. X7R is a Class II dielectric with temperature variation of capacitance within ±15% from -55ºC to +125ºC. Please contact the factory for availability of any additional values not listed. MLCC Low Profile General Specifications PART NUMBER (see page 2 for complete part number explanation) GENERAL DESCRIPTION LT05 Size LT01 - 0201 LT02 - 0402 LT03 - 0603 LT05 - 0805 LT06 - 1206 LT10 - 1210 Z Voltage 4V = 4 6.3V = 6 10V = Z 16V = Y 25V = 3 D Dielectric X5R = D X7R = C 475 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros K Capacitance Tolerance K = ±10% M = ±20% A Failure Rate A = Not Applicable T Terminations T = Plated Ni and Sn Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk Contact Factory For Multiples S Special Code See table below Letter J Z Q C S X W PAPER SIZE LT01 LT02 LT03 LT05 LT06 LT10 WVDC 4 4 6.3 10 16 4 6.3 16 25 6.3 10 16 25 10 16 25 16 25 Cap 104 0.10 Z Q S (µF) 0.22 X 0.47 XX 105 1.0 C S S X X X 1.5

2.2 S S X X

4 . 7 SX SX W W W 106 10 X/W X X W W WVDC 4 4 6.3 10 16 4 6.3 16 25 6.3 10 16 25 10 16 25 16 25 SIZE LT01 LT02 LT03 LT05 LT06 LT10 EMBOSSED = X7R

UltraThin Ceramic Capacitors UT023D103MAT2C The Ultrathin (UT) series of ceramic capacitors is a new product offering from AVX. The UT series was designed to meet the stringent thickness requirements of our customers. AVX developed a new termination process (FCT - Fine Copper Termination) that provides unbeatable flatness and repeatability. The series includes products < 0.35mm in height and is targeted for applications such as Smart cards, Memory modules, High Density SIM cards, Mobile phones, MP3 players, and embedded solutions. HOW TO ORDER UT Style Ultra Thin Case Size 0402 Rated Voltage 25V D Temperature Characteristic X5R 103 Coded Cap 0.01µF M Cap Tolerance ± 20% A Termination Style Commercial T Termination 100% Sn Packaging 7" Reel = 15,000 pcs 13" Reel = 50,000 pcs C Thickness 0.30mm max LW T B L PART DIMENSIONS mm (inches) PERFORMANCE CHARACTERISTICS RECOMMENDED SOLDER PAD DIMENSIONS mm (inches) 0.50 (0.020) 0.50 (0.020) 0.60 (0.024) 1.70 (0.067) Top View BL L End View Side View WL BL T Capacitance Value 0.01µF Capacitance Tolerance ±20% Dissipation Factor Range 3.0% Operating Temperature -55°C to +85°C Temperature Coefficient ±15% Rated Voltage 25V Insulation Resistance at 25ºC and Rated Voltage 100,000 Mohms Test Frequency 1 Vrms @ 1 KHz % /H9004 Capacitance -10 -15 -20 -80 -60 Temperature Coefficient Temperature ºC -40 -20 0 20 40 60 80 100

AVX Corporation has supported the Automotive Industry requirements for Multilayer Ceramic Capacitors consistently for more than 10 years. Products have been developed and tested specifically for automotive applications and all manufacturing facilities are QS9000 and VDA 6.4 approved. As part of our sustained investment in capacity and state of the art technology, we are now transitioning from the established Pd/Ag electrode system to a Base Metal Electrode system (BME). AVX is using AECQ200 as the qualification vehicle for this transition. A detailed qualification package is available on request and contains results on a range of part numbers including:  X7R dielectric components containing BME electrode and copper terminations with a Ni/Sn plated overcoat.  X7R dielectric components, BME electrode with epoxy finish for conductive glue mounting.  X7R dielectric components BME electrode and soft terminations with a Ni/Sn plated overcoat.  NP0 dielectric components containing Pd/Ag electrode and silver termina- tion with a Ni/Sn plated overcoat. Automotive MLCC Automotive HOW TO ORDER 0805 Size 0402 0603 0805 1206 1210 1812 Voltage 10V = Z 16V = Y 25V = 3 50V = 5 100V = 1 200V = 2 500V = 7 Packaging 2 = 7" Reel 4 = 13" Reel A Dielectric NP0 = A X7R = C X8R = F 104 Capacitance Code (In pF)

2 Significant

e.g. 10µF = 106 K Capacitance Tolerance F = ±1% (≥10pF)* G = ±2% (≥10pF)* J = ±5% (≤1µF) K = ±10% M = ±20% *NPO only Failure Rate 4 = Automotive A Special Code A = Std. Product Commercial Automotive Administrative Standard Part Numbers. Specific Automotive Part Number. Used to control No restriction on who purchases these parts. supply of product to Automotive customers. Design Minimum ceramic thickness of 0.020" Minimum Ceramic thickness of 0.029" (0.74mm) on all X7R product. Dicing Side & End Margins = 0.003" min Side & End Margins = 0.004" min Cover Layers = 0.005" min Lot Qualification As per EIA RS469 Increased sample plan – (Destructive Physical stricter criteria. Analysis - DPA) Visual/Cosmetic Quality Standard process and inspection 100% inspection Application Robustness Standard sampling for accelerated Increased sampling for accelerated wave solder on wave solder on X7R dielectrics X7R and NP0 followed by lot by lot reliability testing. COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON All Tests have Accept/Reject Criteria 0/1 T Terminations T = Plated Ni and Sn Z = FLEXITERM® U = Conductive Epoxy **X7R & X8R only NOTE: Contact factory for non-specified capacitance values. 0402 case size available in T termination only. Contact factory for availability of Tolerance Options for Specific Part Numbers.

25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V 100 10pF G G G J J J J J J J J 120 12 G G G J J J J J J J J 150 15 G G G J J J J J J J J 180 18 G G G J J J J J J J 220 22 G G G J J J J J J J 270 27 G G G J J J J J J J 330 33 G G G J J J J J J J 390 39 G G G J J J J J J J 470 47 G G G J J J J J J J 510 51 G G G J J J J J J J 560 56 G G G J J J J J J J 680 68 G G G J J J J J J J 820 82 G G G J J J J J J J 101 100 G G G J J J J J J J 121 120 G G G J J J J J J J 151 150 G G G J J J J J J J 181 180 G G G J J J J J J J 221 220 G G G J J J J J J J 271 270 G G G J J J J J J J 331 330 G G G J J J J J J J 391 390 G G J J J J J J J 471 470 G G J J J J J J J 561 560 J J J J J J J 681 680 J J J J J J J 821 820 J J J J J J J 102 1000 J J J J J J J J J J J 122 1200 J J J J J J M M 152 1500 J M M M J J M M 182 1800 J M M M J J M M 222 2200 J M M M J J M M 272 2700 J M Q J J M 332 3300 J M Q J J P K K 392 3900 JJ P K K 472 4700 JJ P K K 103 10nF 25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V 0603 0805 1206 1210 1812 Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED = Under Development

Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED 0402 0603 0805 1206 1210 1812 2220 16V 25V 50V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V 221 Cap .22 271 (nF) .27 331 .33 391 .39 471 .47 561 .56 681 .68 821 .82 1 0 2 1 GGGGG JJJJJJJJJJJK K KKKK 1 8 2 1 . 8 GGGG JJJJJJJJJJJK K KKKK 2 2 2 2 . 2 GGGG JJJJJJJJJJJK K KKKK 3 3 2 3 . 3 GGGG JJJJJJJJJJJK K KKKK 4 7 2 4 . 7 GGGG JJJJJJJJJJJK K KKKK 1 0 3 1 0 GGGG JJJJJJJJJJJK K KKKK 1 2 3 1 2 G G G JJJ M JJJJJ K K KKKK 1 5 3 1 5 G G G JJJ M JJJJJ K K KKKK 1 8 3 1 8 G G G JJJ M JJJJJ K K KKKK 2 2 3 2 2 G G G JJJ M JJJJJ K K KKKK 2 7 3 2 7 G G G JJJ M JJJJJ K K KKKK 3 3 3 3 3 G G G JJJ M JJJJJ K K KKKK 4 7 3 4 7 GGG J J JM J J JMJ KKKKKK 5 6 3 5 6 G G G JJJ M JJJ M J K K K M K K 6 8 3 6 8 G G G JJJ M JJJ M J K K K M K K 8 2 3 8 2 G G G JJJ M JJJ M J K K K M K K 104 100 G G G J J M M J J J M J K K K M K K 124 120 J J M J J M M K K K P K K 154 150 M N M J J M M K K K P K K 224 220 M N M J M M Q M M M P M M 334 330 N N M J M P Q P P P Q X X 474 470 N N M M M P Q P P P Q X X 684 680 N N M Q Q Q P P Q X X X

105 Cap 1 N N M Q Q Q P Q Q X X X

155 (µF) 1.5 Q Q PQZZXX 225 2.2 Q Q XZZZZZ 335 3.3 XZZ Z 475 4.7 XZZ Z 106 10 Z 226 22 Z 16V 25V 50V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V 0402 0603 0805 1206 1210 1812 2220 = Under Development

Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED SIZE 0603 0805 1206 WVDC 25V 50V 25V 50V 25V 50V 331 (pF) 330 G G J J 471 470 G G J J 681 680 G G J J 102 1000 G G J J J J 152 1500 G G J J J J 182 1800 G G J J J J 222 2200 G G J J J J 272 2700 G G J J J J 332 3300 G G J J J J 392 3900 G G J J J J 472 4700 G G J J J J 562 5600 G G J J J J 682 6800 G G J J J J 822 8200 G G J J J J 103 Cap 0.01 G G J J J J 123 (µF) 0.012 G G J J J J 153 0.015 G G J J J J 183 0.018 G G J J J J 223 0.022 G G J J J J 273 0.027 G G J J J J 333 0.033 G G J J J J 393 0.039 G G J J J J 473 0.047 G G J J J J 563 0.056 G N N M M 683 0.068 G N N M M 823 0.082 N N M M 104 0.1 N N M M 124 0.12 N N M M 154 0.15 N N M M 184 0.18 N M M 224 0.22 N M M 274 0.27 MM 334 0.33 MM 394 0.39 M 474 0.47 M 684 0.68 824 0.82 105 1 WVDC 25V 50V 25V 50V 25V 50V SIZE 0603 0805 1206 = AEC-Q200 Qualified

APS for COTS+ Applications GENERAL DESCRIPTION As part of our continuing support to high reliability customers, AVX has launched an Automotive Plus Series of parts (APS) qualified and manufactured in accordance with automotive AEC-Q200 standard. Each production batch is qual- ity tested to an enhanced requirement and shipped with a certificate of conformance. On a quarterly basis a reliability package is issued to all APS customers. A detailed qualification package is available on request and contains results on a range of part numbers including:  X7R dielectric components containing BME electrode and copper terminations with a Ni/Sn plated overcoat.  X7R dielectric components BME electrode and soft terminations with a Ni/Sn plated overcoat (FLEXITERM ®).  X7R for Hybrid applications.  NP0 dielectric components containing Pd/Ag electrode and silver termination with a Ni/Sn plated overcoat. We are also able to support customers who require an AEC-Q200 grade component finished with Tin/Lead. HOW TO ORDER AP03 Size AP03=0603 AP05=0805 AP06=1206 AP10=1210 AP12=1812 Voltage 16V = Y 25V = 3 50V = 5 100V = 1 200V = 2 500V = 7 Packaging 2 = 7" Reel 4 = 13" Reel A Dielectric NP0 = A X7R = C 104 Capacitance Code (In pF)

2 Significant Digits +

e.g. 10µF = 106 K Capacitance Tolerance J = ±5% K = ±10% M = ±20% Q Failure Rate Q = APS A Special Code A = Std. Product T Terminations T = Plated Ni and Sn Z = FLEXITERM ® U = Conductive Epoxy B = 5% min lead X = FLEXITERM ® with 5% min lead Z, U, X for X7R only RoHS compliant NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

NP0 Automotive Plus Series / APS Capacitance Range AEC-Q200 qualified TS 16949, ISO 9001 certified 0603 0805 1206 1210 1812 25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V 100 10pF G G G J J J J J J J J 120 12 G G G J J J J J J J J 150 15 G G G J J J J J J J J 180 18 G G G J J J J J J J 220 22 G G G J J J J J J J 270 27 G G G J J J J J J J 330 33 G G G J J J J J J J 390 39 G G G J J J J J J J 470 47 G G G J J J J J J J 510 51 G G G J J J J J J J 560 56 G G G J J J J J J J 680 68 G G G J J J J J J J 820 82 G G G J J J J J J J 101 100 G G G J J J J J J J 121 120 G G G J J J J J J J 151 150 G G G J J J J J J J 181 180 G G G J J J J J J J 221 220 G G G J J J J J J J 271 270 G G G J J J J J J J 331 330 G G G J J J J J J J 391 390 G G J J J J J J J 471 470 G G J J J J J J J 561 560 J J J J J J J 681 680 J J J J J J J 821 820 J J J J J J J 102 1000 J J J J J J J J J J J 122 1200 J J J J J M M 152 1500 J M M J J M M 182 1800 J M M J J M M 222 2200 J M M J J M M 272 2700 J M Q J J M 332 3300 J M Q J J P K K 392 3900 JJ P K K 472 4700 JJ P K K 103 10nF 25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V 50V 100V 0603 0805 1206 1210 1812 Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED

X7R Automotive Plus Series / APS Capacitance Range AEC-Q200 qualified TS 16949, ISO 9001 certified Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED = Under Development 0603 0805 1206 1210 1812 2220 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V

102 Cap 1 GGGGG JJJJJJJJJJJ KKKKKK

182 (nF) 1.8 GGGG JJJJJJJJJJJ KKKKKK 2 2 2 2 . 2 GGGG JJJJJJJJJJJ KKKKKK 3 3 2 3 . 3 GGGG JJJJJJJJJJJ KKKKKK 4 7 2 4 . 7 GGGG JJJJJJJJJJJ KKKKKK 1 0 3 1 0 GGGG JJJJJJJJJJJ KKKKKK 1 2 3 1 2 GGG J J JM J J J J J KKKKKK 1 5 3 1 5 GGG J J JM J J J J J KKKKKK 1 8 3 1 8 GGG J J JM J J J J J KKKKKK 2 2 3 2 2 GGG J J JM J J J J J KKKKKK 2 7 3 2 7 GGG J J JM J J J J J KKKKKK 3 3 3 3 3 GGG J J JM J J J J J KKKKKK 4 7 3 4 7 GGG J J JM J J JMJ KKKKKK 5 6 3 5 6 G G G JJJ M JJJ M J K K K M K K 6 8 3 6 8 G G G JJJ M JJJ M J K K K M K K 8 2 3 8 2 G G G JJJ M JJJ M J K K K M K K 104 100 G G G J J M M J J J M J K K K M K K 124 120 J J M J J M M K K K P K K 154 150 M N M J J M M K K K P K K 224 220 M N M J M M Q M M M P M M 334 330 N N M J M P Q P P P Q X X 474 470 N N M M M P Q P P P Q X X 684 680 N N M Q Q Q P P Q X X X 1 5 5 ( µ F ) 1 . 5 Q Q PQZZXX 2 2 5 2 . 2 Q Q XZZZZZ 335 3.3 XZZ Z 475 4.7 XZZ Z 106 10 Z 226 22 Z 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V 0603 0805 1206 1210 1812 2220

With increased requirements from the automotive industry for additional component robustness, AVX recognized the need to produce a MLCC with enhanced mechanical strength. It was noted that many components may be subject to severe flexing and vibration when used in various under the hood automotive and other harsh environment applications. To satisfy the requirement for enhanced mechanical strength, AVX had to find a way of ensuring electrical integrity is maintained whilst external forces are being applied to the component. It was found that the structure of the termination needed to be flexible and after much research and development, AVX launched FLEXITERM ®. FLEXITERM ® is designed to enhance the mechanical flexure and temperature cycling performance of a standard ceramic capacitor with an X7R dielectric. The industry standard for flexure is 2mm minimum. Using FLEXITERM ®, AVX provides up to 5mm of flexure without internal cracks. Beyond 5mm, the capacitor will generally fail “open”. As well as for automotive applications FLEXITERM ® will provide Design Engineers with a satisfactory solution when designing PCB’s which may be subject to high levels of board flexure. MLCC with FLEXITERM® General Specifications High Flexure Stress Circuit Boards  e.g. Depanelization: Components near edges of board. Variable Temperature Applications  Soft termination offers improved reliability per- formance in applications where there is tem- perature variation.  e.g. All kind of engine sensors: Direct connection to battery rail. Automotive Applications  Improved reliability.  Excellent mechanical performance and thermo mechanical performance. PRODUCT ADVANTAGES  High mechanical performance able to withstand, 5mm bend test guaranteed.  Increased temperature cycling performance, 3000 cycles and beyond.  Flexible termination system.  Reduction in circuit board flex failures.  Base metal electrode system.  Automotive or commercial grade products available. HOW TO ORDER 0805 Style 0603 0805 1206 1210 1812 2220 Voltage 6 = 6.3V Z = 10V Y = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V Packaging 2 = 7" reel 4 = 13" reel C Dielectric C = X7R F = X8R 104 Capacitance Code (In pF) e.g., 104 = 100nF K Capacitance Tolerance J = ±5%* K = ±10% M = ±20% *≤1µF only A Special Code A = Std. Product Z Terminations Z = FLEXITERM® For FLEXITERM® with Tin/Lead termination see AVX LD Series A Failure Rate A=Commercial 4 = Automotive NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.

MLCC with FLEXITERM® Specifications and Test Methods PERFORMANCE TESTING BOARD BEND TEST PROCEDURE According to AEC-Q200 BEND TESTPLATE CONTROL PANEL CONNECTOR DIGITAL CALIPER MOUNTING ASSEMBLY LOADING KNIFE CONTROL PANEL BOARD BEND TEST RESULTS AEC-Q200 Vrs AVX FLEXITERM® Bend Test 0603 NPO X7R X7R soft term 1206 Substrate Bend (mm) Substrate Bend (mm) Substrate Bend (mm)Substrate Bend (mm) NPO X7R X7R soft term 0805 NPO X7R X7R soft term 1210 NPO X7R X7R soft term TEMPERATURE CYCLE TEST PROCEDURE 1 hour 12mins +1250 C +250 C -550 C AVX ENHANCED SOFT TERMINATION BEND TEST PROCEDURE Bend Test The capacitor is soldered to the printed circuit board as shown and is bent up to 10mm at 1mm per second: Typical bend test results are shown below: Style Conventional Termination FLEXITERM 0603 >2mm >5mm 0805 >2mm >5mm 1206 >2mm >5mm AEC-Q200 Qualification:  Created by the Automotive Electronics Council  Specification defining stress test qualification for passive components Testing: Key tests used to compare soft termination to AEC-Q200 qualification:  Bend Test  Temperature Cycle Test Test Procedure as per AEC-Q200: The test is conducted to determine the resistance of the component when it is exposed to extremes of alternating high and low temperatures.  Sample lot size quantity 77 pieces  TC chamber cycle from -55ºC to +125ºC for 1000 cycles  Interim electrical measurements at 250, 500, 1000 cycles  Measure parameter capacitance dissipation factor, insulation resistance Test Procedure as per AEC-Q200: Sample size: 20 components Span: 90mm Minimum deflection spec: 2 mm  Components soldered onto FR4 PCB (Figure 1)  Board connected electrically to the test equipment (Figure 2) Fig 1 - PCB layout with electrical connections Fig 2 - Board Bend test equipment Test Temperature Profile (1 cycle) TABLE SUMMARY  The board is placed on 2 supports 90mm apart (capacitor side down)  The row of capacitors is aligned with the load stressing knife  The load is applied and the deflection where the part starts to crack is recorded (Note: Equipment detects the start of the crack using a highly sensitive current detection circuit)  The maximum deflection capability is 10mm Max. = 10mm Max. = 10mm 90mm

% Failure 0 500 1000 1500 0603 2000 2500 3000 % Failure 0 500 1000 1500 1206 2000 2500 3000 % Failure 0 500 1000 1500 0805 2000 2500 3000 % Failure 0 500 1000 1500 1210 2000 Soft Term - No Defects up to 3000 cycles 2500 3000 BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS AEC-Q200 specification states 1000 cycles compared to AVX 3000 temperature cycles. MLCC with FLEXITERM® Specifications and Test Methods FLEXITERM® TEST SUMMARY WITHOUT SOFT TERMINATION WITH SOFT TERMINATION Major fear is of latent board flex failures. Far superior mechanical performance. Generally open failure mode beyond 5mm flexure.  Qualified to AEC-Q200 test/specification with the exception of using AVX 3000 temperature cycles (up to +150°C bend test guaranteed greater than 5mm).  FLEXITERM ® provides improved performance compared to standard termination systems.  Board bend test improvement by a factor of 2 to 4 times.  Temperature Cycling: – 0% Failure up to 3000 cycles – No ESR change up to 3000 cycles

MLCC with FLEXITERM® X8R Dielectric Capacitance Range Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED SIZE 0603 0805 1206 WVDC 25V 50V 25V 50V 25V 50V 331 (pF) 330 G G J J 471 470 G G J J 681 680 G G J J 102 1000 G G J J J J 152 1500 G G J J J J 182 1800 G G J J J J 222 2200 G G J J J J 272 2700 G G J J J J 332 3300 G G J J J J 392 3900 G G J J J J 472 4700 G G J J J J 562 5600 G G J J J J 682 6800 G G J J J J 822 8200 G G J J J J 103 Cap 0.01 G G J J J J 123 (µF) 0.012 G G J J J J 153 0.015 G G J J J J 183 0.018 G G J J J J 223 0.022 G G J J J J 273 0.027 G G J J J J 333 0.033 G G J J J J 393 0.039 G G J J J J 473 0.047 G G J J J J 563 0.056 G N N M M 683 0.068 G N N M M 823 0.082 N N M M 104 0.1 N N M M 124 0.12 N N M M 154 0.15 N N M M 184 0.18 N M M 224 0.22 N M M 274 0.27 MM 334 0.33 MM 394 0.39 M 474 0.47 M 684 0.68 824 0.82 105 1 WVDC 25V 50V 25V 50V 25V 50V SIZE 0603 0805 1206 = AEC-Q200 Qualified

MLCC with FLEXITERM® X7R Dielectric Capacitance Range 0603 0805 1206 1210 1812 2220 16V 25V 50V 100V 200V 10V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 16V 25V 50V 100V 25V 50V 100V 101 121 151 181 221

271 J J J J J J

333 J J J J J J J M J J J J J K

5 6 3 JJ J JJJJN JJJM JK K K M KK K K 6 8 3 JJ J JJJJN JJJM JK K K M KK K K 8 2 3 JJ J JJJJN JJJPJK K K M KK K K 1 0 4 JJ J JJJJN JJJQ JK K KP KK K K XX X

124 J J J N N J J P Q K K K Q K K K K

1 5 4 MMNNN J JP Q KKK QK KKMX XX

184 M M N N N J M P Q M M M Q K K K M

224 M M N N N J M P Q M M M Q M M M X X X X

274 N N N N N J M P Q P P P Q M M M X

334 N N N N N J M P Q P P P Q M M M X X X X

394 N N N N N M M P Q P P P Q X X X X

474 N N N N N M M P Q P P P Q X X X X X X X

564 N N N M Q Q Q P Q Q Q X X X Z

684 N N N M Q Q Q P X X X X X X Z X X X

824 N N N M Q Q Q P Z Z Z X X X Z

105 N N N M Q Q Q P Z Z Z X X X Z X X X

155 QQ PZZZ ZZX X X

185 QQ ZZZZ ZZ

225 QQ ZZZZ ZZXX X

335 ZZZ Z Z

475 ZZZ Z Z

16V 25V 50V 100V 200V 10V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 16V 25V 50V 100V 25V 50V 100V 0603 0805 1206 1210 1812 2220 Letter A C E G J K M N P Q X Y Z PAPER EMBOSSED

For Ultra Safety Critical Applications AVX have developed a range of components specifically for safety critical applications. Utilizing the award-winning FLEXITERM™ layer in conjunction with the cascade design previously used for high voltage MLCCs, a range of ceramic capacitors is now available for customers who require components designed with an industry leading set of safety features. The FLEXITERM™ layer protects the component from any damage to the ceramic resulting from mechanical stress during PCB assembly or use with end customers. Board flexure type mechanical damage accounts for the majority of MLCC failures. The addition of the cascade structure protects the component from low insulation resistance failure resulting from other common causes for failure; thermal stress damage, repetitive strike ESD damage and placement damage. With the inclusion of the cascade design structure to complement the FLEXITERM™ layer, the FLEXISAFE range of capacitors has unbeatable safety features. FS03 Size FS03 = 0603 FS05 = 0805 FS06 = 1206 FS10 = 1210 Voltage 16V = Y 25V = 3 50V = 5 100V = 1 C Dielectric X7R = C 104 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros e.g. 10µF =106 K Capacitance Tolerance J = ±5% K = ±10% M = ±20% HOW TO ORDER Q Failure Rate A = Commercial 4 = Automotive Q = APS Z Terminations Z = FLEXITERMTM X = FLEXITERMTM with 5% min lead Packaging 2 = 7" Reel 4 = 13" Reel A Special Code A = Std. Product FLEXISAFE X7R RANGE Capacitance 0603 0805 1206 1210 Code nF 16 25 50 100 16 25 50 16 25 50 16 25 50 102 1 182 1.8 222 2.2 332 3.3 472 4.7 103 10 123 12 153 15 183 18 223 22 273 27 333 33 473 47 563 56 683 68 823 82 104 100 124 120 154 150 224 220 334 330 474 470 Qualified In Qualification

Capacitor Array (IPC) AVX capacitor arrays offer designers the opportunity to lower placement costs, increase assembly line output through lower component count per board and to reduce real estate requirements. Reduced Costs Placement costs are greatly reduced by effectively placing one device instead of four or two. This results in increased throughput and translates into savings on machine time. Inventory levels are lowered and further savings are made on solder materials, etc. Space Saving Space savings can be quite dramatic when compared to the use of discrete chip capacitors. As an example, the 0508 4-element array offers a space reduction of >40% vs. 4 x 0402 discrete capacitors and of >70% vs. 4 x 0603 discrete capacitors. (This calculation is dependent on the spacing of the discrete components.) Increased Throughput Assuming that there are 220 passive components placed in a mobile phone: A reduction in the passive count to 200 (by replacing discrete components with arrays) results in an increase in throughput of approximately 9%. A reduction of 40 placements increases throughput by 18%. For high volume users of cap arrays using the very latest placement equipment capable of placing 10 components per second, the increase in throughput can be very significant and can have the overall effect of reducing the number of place- ment machines required to mount components: If 120 million 2-element arrays or 40 million 4-element arrays were placed in a year, the requirement for placement equipment would be reduced by one machine. During a 20Hr operational day a machine places 720K components. Over a working year of 167 days the machine can place approximately 120 million. If 2-element arrays are mounted instead of discrete components, then the number of placements is reduced by a factor of two and in the scenario where 120 million 2-element arrays are placed there is a saving of one pick and place machine. Smaller volume users can also benefit from replacing discrete components with arrays. The total number of place- ments is reduced thus creating spare capacity on placement machines. This in turn generates the opportunity to increase overall production output without further investment in new equipment. W2A (0508) Capacitor Arrays The 0508 4-element capacitor array gives a PCB space saving of over 40% vs four 0402 discretes and over 70% vs four 0603 discrete capacitors. W3A (0612) Capacitor Arrays The 0612 4-element capacitor array gives a PCB space saving of over 50% vs four 0603 discretes and over 70% vs four 0805 discrete capacitors. AREA = 7.0mm2 (0.276 in2) AREA = 3.95mm 2 (0.156 in2) 5.0 (0.197) 1.4 (0.055) 1.0 (0.039) 2.1 (0.083) 1.88 (0.074) 4 pcs 0402 Capacitors = 1 pc 0508 Array AREA = 13.8mm2 (0.543 in2) AREA = 6.4mm 2 (0.252 in2) 6.0 (0.236) 2.3 (0.091) 1.5 (0.059) 3.2 (0.126) 2.0 (0.079) 4 pcs 0603 Capacitors = 1 pc 0612 Array BENEFITS OF USING CAPACITOR ARRAYS

Capacitor Array (IPC) GENERAL DESCRIPTION AVX is the market leader in the development and manufacture of capacitor arrays. The smallest array option available from AVX, the 0405 2-element device, has been an enormous success in the Telecommunications market. The array family of products also includes the 0612 4-element device as well as 0508 2-element and 4-element series, all of which have received widespread acceptance in the marketplace. AVX capacitor arrays are available in X5R, X7R and NP0 (C0G) ceramic dielectrics to cover a broad range of capacitance values. Voltage ratings from 6.3 Volts up to 100 Volts are offered. AVX also now offers a range of automotive capacitor arrays qualified to AEC-Q200 (see separate table). Key markets for capacitor arrays are Mobile and Cordless Phones, Digital Set Top Boxes, Computer Motherboards and Peripherals as well as Automotive applications, RF Modems, Networking Products, etc. HOW TO ORDER W Style W = RoHS L = SnPb Case Size 1 = 0405 2 = 0508 3 = 0612 5 = 0306 A Array Number of Caps Voltage 6 = 6V Z = 10V Y = 16V 3 = 25V 5 = 50V 1 = 100V C Dielectric A = NP0 C = X7R D = X5R 103 Capacitance Code M Capacitance Tolerance J = ±5% K = ±10% M = ±20% Packaging & Quantity Code 2A = 7" Reel (4000) 4A = 13" Reel (10000) 2F = 7" Reel (1000) A Failure Rate A = Commercial 4 = Automotive T Termination Code T = Plated Ni and Sn Z = FLEXITERM® B = 5% min lead X = FLEXITERM ® with 5% min lead 0405 - 2 Element 0508 - 2 Element 0508 - 4 Element 0612 - 4 Element AVX Capacitor Array - W2A41A*K S21 Magnitude -40 -35 -30 -25 -20 -15 -10 0.01 0.1 1 10 Frequency (GHz) S21 mag. (dB) 5pF 10pF 15pF 22pF 33pF 39pF 68pF NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. RoHS compliant

# Elements 2 2 4 4 Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed WVDC 16 25 50 16 25 50 100 16 25 50 100 16 25 50 100 1R0 Cap 1.0 1R2 (pF) 1.2 1R5 1.5 1R8 1.8 2R2 2.2 2R7 2.7 3R3 3.3 3R9 3.9 4R7 4.7 5R6 5.6 6R8 6.8 8R2 8.2 100 10 120 12 150 15 180 18 220 22 270 27 330 33 390 39 470 47 560 56 680 68 820 82 101 100 121 120 151 150 181 180 221 220 271 270 331 330 391 390 471 470 561 560 681 680 821 820 102 1000 122 1200 152 1500 182 1800 222 2200 272 2700 332 3300 392 3900 472 4700 562 5600 682 6800 822 8200 Capacitor Array Capacitance Range – NP0/C0G

SIZE 0306 0405050805080612 # Elements 4 2 2 4 4 Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed WVDC 6 10 16 25 6 10 16 25 50 6 10 16 25 50 100 6 10 16 25 50 100 6 10 16 25 50 100

101 Cap 100

121 (µF) 120 151 150 181 180 221 220 271 270 331 330 391 390 471 470 561 560 681 680 821 820 102 1000 122 1200 152 1500 182 1800 222 2200 272 2700 332 3300 392 3900 472 4700 562 5600 682 6800 822 8200 103 Cap 0.010 123 (µF) 0.012 153 0.015 183 0.018 223 0.022 273 0.027 333 0.033 393 0.039 473 0.047 563 0.056 683 0.068 823 0.082 104 0.10 124 0.12 154 0.15 184 0.18 224 0.22 274 0.27 334 0.33 474 0.47 564 0.56 684 0.68 824 0.82 105 1.0 125 1.2 155 1.5 185 1.8 225 2.2 335 3.3 475 4.7 106 10 226 22 476 47 107 100 Capacitor Array Capacitance Range – X7R/X5R = Currently available X7R = Currently available X5R = Under development X7R, contact factory for advance samples = Under development X5R, contact factory for advance samples

Automotive Capacitor Array (IPC) 0508 - 4 Element 0612 - 4 Element As the market leader in the development and manufacture of capacitor arrays AVX is pleased to offer a range of AEC-Q200 qualified arrays to compliment our product offering to the Automotive industry. Both the AVX 0612 and 0508 4-element capacitor array styles are qualified to the AEC-Q200 automotive specifications. AEC-Q200 is the Automotive Industry qualification standard and a detailed qualification package is available on request. All AVX automotive capacitor array production facilities are certified to ISO/TS 16949:2002. *Contact factory for availability by part number for K = ±10% and J = ±5% tolerance. HOW TO ORDER W Style W = RoHS L = SnPb Case Size 1 = 0405 2 = 0508 3 = 0612 A Array Number of Caps Y Voltage Z = 10V Y = 16V 3 = 25V 5 = 50V 1 = 100V C Dielectric A = NP0 C = X7R F = X8R 104 Capacitance Code (In pF) Significant Digits + Number of Zeros e.g. 10µF=106 K Capacitance Tolerance *J = ±5% *K = ±10% M = ±20% Failure Rate 4 = Automotive Packaging & Quantity Code 2A = 7" Reel (4000) 4A = 13" Reel (10000) 2F = 7" Reel (1000)RoHS compliant T Terminations T = Plated Ni and Sn Z = FLEXITERM ®** B = 5% min lead X = FLEXITERM ® with 5% min lead SIZE 0508 0508 0612 0405 No. of Elements 244 2 WVDC 10 16 25 50 100 16 25 50 100 10 16 25 50 100 16 121 (pF) 120 151 150 181 180 221 220 271 270 331 330 391 390 471 470 561 560 681 680 821 820 102 1000 122 1200 152 1500 182 1800 222 2200 272 2700 332 3300 392 3900 472 4700 562 5600 682 6800 822 8200 103 Cap 0.010 123 (µF) 0.012 153 0.015 183 0.018 223 0.022 273 0.027 333 0.033 393 0.039 473 0.047 563 0.056 683 0.068 823 0.082 104 0.10 124 0.12 154 0.15 224 0.22 SIZE 0405 0508 0508 0612 No. of Elements 2 24 4 WVDC 50 50 16 25 50 100 16 25 50 100 1R0 Cap 1.0 1R2 (pF) 1.2 1R5 1.5 1R8 1.8 2R2 2.2 2R7 2.7 3R3 3.3 3R9 3.9 4R7 4.7 5R6 5.6 6R8 6.8 8R2 8.2 100 10 120 12 150 15 180 18 220 22 270 27 330 33 390 39 470 47 560 56 680 68 820 82 101 100 121 120 151 150 181 180 221 220 271 270 331 330 391 390 471 470 561 560 681 680 821 820 102 1000 122 1200 152 1500 182 1800 222 2200 272 2700 332 3300 392 3900 472 4700 562 5600 682 6800 822 8200 X7R X8RNP0/C0G = X7R = Under development = X8R = Under development = NPO/COG

Multi-Value Capacitor Array (IPC) GENERAL DESCRIPTION A recent addition to the array product range is the Multi- Value Capacitor Array. These devices combine two different capacitance values in standard ‘Cap Array’ packages and are available with a maximum ratio between the two capacitance values of 100:1. The multi-value array is currently available in the 0405 and 0508 2-element styles and also in the 0612 4-element style. Whereas to date AVX capacitor arrays have been suited to applications where multiple capacitors of the same value are used, the multi-value array introduces a new flexibility to the range. The multi-value array can replace discrete capacitors of different values and can be used for broadband decoupling applications. The 0508 x 2 element multi-value array would be particularly recommended in this application. Another application is filtering the 900/1800 or 1900MHz noise in mobile phones. The 0405 2-element, low capacitance value NP0, (C0G) device would be suited to this application, in view of the space saving requirements of mobile phone manufacturers. ADVANTAGES OF THE MULTI-VALUE CAPACITOR ARRAYS Enhanced Performance Due to Reduced Parasitic Inductance When connected in parallel, not only do discrete capacitors of different values give the desired self-resonance, but an additional unwanted parallel resonance also results. This parallel resonance is induced between each capacitor’s self- resonant frequencies and produces a peak in impedance response. For decoupling and bypassing applications this peak will result in a frequency band of reduced decoupling and in filtering applications reduced attenuation. The multi-value capacitor array, combining capacitors in one unit, virtually eliminates the problematic parallel resonance, by minimizing parasitic inductance between the capacitors, thus enhancing the broadband decoupling/filtering performance of the part. Reduced ESR An advantage of connecting two capacitors in parallel is a significant reduction in ESR. However, as stated above, using discrete components brings with it the unwanted side effect of parallel resonance. The multi-value cap array is an excellent alternative as not only does it perform the same function as parallel capacitors but also it reduces the uncertainty of the frequency response. 100101 1000 Frequency (MHz) 0.2 0.4 0.6 0.8 Impedance (Ohms) 2xDiscrete Caps (0603) Multi Value Cap (0508) Cap (Min/Max) NP0 X5R/X7R 0612 4-element 100/471 221/104 0508 2-element 100/471 221/104 0405 2-element 100/101 101/103  Max. ratio between the two cap values is 1:100.  The voltage of the higher capacitance value dictates the voltage of the multi-value part.  Only combinations of values within a specific dielectric range are possible. IMPEDANCE VS FREQUENCY W Style Case Size 1 = 0405 2 = 0508 3 = 0612 A Array Number of Caps A Failure Rate Y Voltage Z = 10V Y = 16V 3 = 25V 5 = 50V 1 = 100V C Dielectric A = NP0 C = X7R D = X5R 102M 1st Value Capacitance Code (In pF) 2 Sig. Digits + No. of Zeros 104M 2nd Value Capacitance Tolerance K = ±10% M = ±20% Packaging & Quantity Code 2A = 7" Reel (4000) 4A = 13" Reel (10000) 2F = 7" Reel (1000) HOW TO ORDER (Multi-Value Capacitor Array - IPC) NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. RoHS compliant T Terminations T = Plated Ni and Sn Z = FLEXITERM ®** B = 5% min lead X = FLEXITERM ® with 5% min lead

A B C D E LBL BW C/L OF CHIP CL T W P S S 0405 - 2 Element PAD LAYOUT A B C D E LBL BW C/L OF CHIP CL T W P S S 0508 - 2 Element PAD LAYOUT 0508 - 4 Element PAD LAYOUT A B C D E L BL BW C/L OF CHIP CL T W X X P S S 0612 - 4 Element PAD LAYOUT A B C D E L BL BW C/L OF CHIP CL T W X X P S S PART & PAD LAYOUT DIMENSIONS millimeters (inches) +0.25 -0.08 +0.010 -0.003

The signal integrity characteristics of a Power Delivery Network (PDN) are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking lower and upper voltage limits around low operating voltages. These power system challenges are coming from mainstream designs with operating frequencies of 300MHz or greater, modest ICs with power demand of 15 watts or more, and operating voltages below 3 volts. The classic PDN topology is comprised of a series of capacitor stages. Figure 1 is an example of this architecture with multiple capacitor stages. An ideal capacitor can transfer all its stored energy to a load instantly. A real capacitor has parasitics that prevent instantaneous transfer of a capacitor’s stored energy. The true nature of a capacitor can be modeled as an RLC equivalent circuit. For most simulation purposes, it is possible to model the characteristics of a real capacitor with one capacitor, one resistor, and one inductor. The RLC values in this model are commonly referred to as equivalent series capacitance (ESC), equivalent series resistance (ESR), and equivalent series inductance (ESL). The ESL of a capacitor determines the speed of energy transfer to a load. The lower the ESL of a capacitor, the faster that energy can be transferred to a load. Historically, there has been a tradeoff between energy storage (capacitance) and inductance (speed of energy delivery). Low ESL devices typically have low capacitance. Likewise, higher capacitance devices typically have higher ESLs. This tradeoff between ESL (speed of energy delivery) and capacitance (energy storage) drives the PDN design topology that places the fastest low ESL capacitors as close to the load as possible. Low Inductance MLCCs are found on semiconductor packages and on boards as close as possible to the load. LOW INDUCTANCE CHIP CAPACITORS The key physical characteristic determining equivalent series inductance (ESL) of a capacitor is the size of the current loop it creates. The smaller the current loop, the lower the ESL. A standard surface mount MLCC is rectangular in shape with electrical terminations on its shorter sides. A Low Inductance Chip Capacitor (LICC) sometimes referred to as Reverse Geometry Capacitor (RGC) has its terminations on the longer side of its rectangular shape. When the distance between terminations is reduced, the size of the current loop is reduced. Since the size of the current loop is the primary driver of inductance, an 0306 with a smaller current loop has significantly lower ESL then an 0603. The reduction in ESL varies by EIA size, however, ESL is typically reduced 60% or more with an LICC versus a standard MLCC. INTERDIGITATED CAPACITORS The size of a current loop has the greatest impact on the ESL characteristics of a surface mount capacitor. There is a secondary method for decreasing the ESL of a capacitor. This secondary method uses adjacent opposing current loops to reduce ESL. The InterDigitated Capacitor (IDC) utilizes both primary and secondary methods of reducing inductance. The IDC architecture shrinks the distance between terminations to minimize the current loop size, then further reduces inductance by creating adjacent opposing current loops. An IDC is one single capacitor with an internal structure that has been optimized for low ESL. Similar to standard MLCC versus LICCs, the reduction in ESL varies by EIA case size. Typically, for the same EIA size, an IDC delivers an ESL that is at least 80% lower than an MLCC. VR Slowest Capacitors Fastest Capacitors Low Inductance Decoupling Capacitors Semiconductor Product Bulk Board-Level Package-Level Die-Level Figure 1 Classic Power Delivery Network (PDN) Architecture

LAND GRID ARRAY (LGA) CAPACITORS Land Grid Array (LGA) capacitors are based on the first Low ESL MLCC technology created to specifically address the design needs of current day Power Delivery Networks (PDNs). This is the 3rd low inductance capacitor technology developed by AVX. LGA technology provides engineers with new options. The LGA internal structure and manufacturing technology eliminates the historic need for a device to be physically small to create small current loops to minimize inductance. The first family of LGA products are 2 terminal devices. A 2 terminal 0306 LGA delivers ESL performance that is equal to or better than an 0306 8 terminal IDC. The 2 terminal 0805 LGA delivers ESL performance that approaches the 0508 8 terminal IDC. New designs that would have used 8 terminal IDCs are moving to 2 terminal LGAs because the layout is easier for a 2 terminal device and manufacturing yield is better for a 2 terminal LGA versus an 8 terminal IDC. LGA technology is also used in a 4 terminal family of products that AVX is sampling and will formerly introduce in 2008. Beyond 2008, there are new multi-terminal LGA product families that will provide even more attractive options for PDN designers. LOW INDUCTANCE CHIP ARRAYS (LICA®) The LICA® product family is the result of a joint development effort between AVX and IBM to develop a high performance MLCC family of decoupling capacitors. LICA was introduced in the 1980s and remains the leading choice of designers in high performance semiconductor packages and high reliability board level decoupling applications. LICA ® products are used in 99.999% uptime semiconductor package applications on both ceramic and organic substrates. The C4 solder ball termination option is the perfect compliment to flip-chip packaging technology. Mainframe class CPUs, ultimate performance multi-chip modules, and communications systems that must have the reliability of 5 9’s use LICA LICA® products with either Sn/Pb or Pb-free solder balls are used for decoupling in high reliability military and aerospace applications. These LICA ® devices are used for decoupling of large pin count FPGAs, ASICs, CPUs, and other high power ICs with low operating voltages. When high reliability decoupling applications require the very lowest ESL capacitors, LICA ® products are the best option. Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL). 470 nF 0306 Impedance Comparison 0.001 0.01 0.1 1 10 100 1000 Frequency (MHz) Impedance (ohms) 0306 2T-LGA

0306 LICC

0603 MLCC

The key physical characteristic determining equivalent series inductance (ESL) of a capacitor is the size of the current loop it creates. The smaller the current loop, the lower the ESL. A standard surface mount MLCC is rectangular in shape with electrical terminations on its shorter sides. A Low Inductance Chip Capacitor (LICC) sometimes referred to as Reverse Geometry Capacitor (RGC) has its terminations on the longer sides of its rectangular shape. The image on the right shows the termination differences between an MLCC and an LICC. When the distance between terminations is reduced, the size of the current loop is reduced. Since the size of the current loop is the primary driver of inductance, an 0306 with a smaller current loop has significantly lower ESL then an 0603. The reduction in ESL varies by EIA size, however, ESL is typically reduced 60% or more with an LICC versus a standard MLCC. AVX LICC products are available with a lead-free finish of plated Nickel/Tin. Low Inductance Capacitors (RoHS) 0612/0508/0306/0204 LICC (Low Inductance Chip Capacitors) HOW TO ORDER MLCC LICC 0.001 0.01 0.1 1 10 100 1000 Frequency (MHz) Impedance (Ohms) LICC_0612 MLCC_1206 0.001 0.01 0.1 1 10 100 1000 Frequency (MHz) Impedance (Ohms) LICC_0508 MLCC_0805 0612 Size 0204 0306 0508 0612 Z Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V 5 = 50V D Dielectric C = X7R D = X5R W = X6S Z = X7S 105 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance K = ±10% M = ±20% A Failure Rate A = N/A T Terminations T = Plated Ni and Sn Packaging Available 2 = 7" Reel 4 = 13" Reel Thickness Thickness mm (in) 0.35 (0.014) 0.56 (0.022) 0.61 (0.024) 0.76 (0.030) 1.02 (0.040) 1.27 (0.050) TYPICAL IMPEDANCE CHARACTERISTICS PERFORMANCE CHARACTERISTICS Capacitance Tolerances K = ±10%; M = ±20% Operation X7R = -55°C to +125°C Temperature Range X5R = -55°C to +85°C X7S = -55°C to +125°C Temperature Coefficient X7R, X5R = ±15%; X7S = ±22% Voltage Ratings 4, 6.3, 10, 16, 25 VDC Dissipation Factor 4V, 6.3V = 6.5% max; 10V = 5.0% max; 16V = 3.5% max; 25V = 3.0% max Insulation Resistance 100,000MΩ min, or 1,000MΩ per (@+25°C, RVDC) µF min.,whichever is less NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Low Inductance Capacitors (RoHS) 0612/0508/0306/0204 LICC (Low Inductance Chip Capacitors) SIZE 0204 0306 0508 0612 Packaging Embossed Embossed Embossed WVDC 4 6.3 10 16 4 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 CAP 0.001 (µF) 0.0022 0.0047 0.010 0.015 0.022 0.047 0.068 0.10 0.15 0.22 0.47 0.68 1.0 1.5 2.2 3.3 4.7 0306 Code Thickness A 0.61 (0.024) 0508 Code Thickness S 0.56 (0.022) V 0.76 (0.030) A 1.02 (0.040) 0612 Code Thickness S 0.56 (0.022) V 0.76 (0.030) W 1.02 (0.040) A 1.27 (0.050) Solid = X7R = X5R = X7S mm (in.) 0204 Code Thickness C 0.35 (0.014) = X6S mm (in.) mm (in.) mm (in.) PHYSICAL DIMENSIONS AND PAD LAYOUT W t T L LW t PHYSICAL CHIP DIMENSIONS mm (in) “A”CC “B” PAD LAYOUT DIMENSIONS mm (in) ABC 0204 T - See Range Chart for Thickness and Codes

The key physical characteristic determining equivalent series inductance (ESL) of a capacitor is the size of the current loop it creates. The smaller the current loop, the lower the ESL. A standard surface mount MLCC is rectangular in shape with electrical terminations on its shorter sides. A Low Inductance Chip Capacitor (LICC) sometimes referred to as Reverse Geometry Capacitor (RGC) has its terminations on the longer sides of its rectangular shape. The image on the right shows the termination differences between an MLCC and an LICC. When the distance between terminations is reduced, the size of the current loop is reduced. Since the size of the current loop is the primary driver of inductance, an 0306 with a smaller current loop has significantly lower ESL then an 0603. The reduction in ESL varies by EIA size, however, ESL is typically reduced 60% or more with an LICC versus a standard MLCC. AVX LICC products are available with a lead termination for high reliability military and aerospace applications that must avoid tin whisker reliability issues. Low Inductance Capacitors (SnPb) 0612/0508/0306/0204 Tin Lead Termination “B” HOW TO ORDER MLCC LICC LD18 Size LD15 = 0204 LD16 = 0306 LD17 = 0508 LD18 = 0612 Z Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V 5 = 50V D Dielectric C = X7R D = X5R W = X6S 105 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance K = ±10% M = ±20% A Failure Rate A = N/A B Terminations B = 5% min lead Packaging Available 2 = 7" Reel 4 = 13" Reel Thickness Thickness mm (in) 0.35 (0.014) 0.56 (0.022) 0.61 (0.024) 0.76 (0.030) 1.02 (0.040) 1.27 (0.050) NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. PERFORMANCE CHARACTERISTICS Capacitance Tolerances K = ±10%; M = ±20% Operation X7R = -55°C to +125°C Temperature Range X5R = -55°C to +85°C X7S = -55°C to +125°C Temperature Coefficient X7R, X5R = ±15%; X7S = ±22% Voltage Ratings 4, 6.3, 10, 16, 25 VDC Dissipation Factor 4V, 6.3V = 6.5% max; 10V = 5.0% max; 16V = 3.5% max; 25V = 3.0% max Insulation Resistance 100,000MΩ min, or 1,000MΩ per (@+25°C, RVDC) µF min.,whichever is less 0.001 0.01 0.1 1 10 100 1000 Frequency (MHz) Impedance (Ohms) LICC_0612 MLCC_1206 0.001 0.01 0.1 1 10 100 1000 Frequency (MHz) Impedance (Ohms) LICC_0508 MLCC_0805 TYPICAL IMPEDANCE CHARACTERISTICS

PREFERRED SIZES ARE SHADED SIZE LD15 LD16 LD17 LD18 Soldering Reflow Only Reflow Only Reflow/Wave Packaging All Paper All Paper Paper/Embossed WVDC 4 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 Cap 1000 A A A A S S S S V S S S S V (pF) 2200 A A A A S S S S V S S S S V

4700 A A A A S S S S V S S S S V

Cap 0.010 A A A A S S S S V S S S S V (µF) 0.015 A A A A S S S S V S S S S W

0.022 A A A A S S S S V S S S S W

0.047 A A A S S S V A S S S S W

0.068 A A A S S S A A S S S V W

0.10 C C A A A S S V A A S S S V W

0.15 A A S S V S S S W W

0.22 A A S S A S S V

0.47 V V A S S V

0.68 A A V V W

1.0 A A V V A

1.5 A W W

2.2 AA 3.3 A 4.7 WVDC 4 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 SIZE 0204 0306 0508 0612 Low Inductance Capacitors (SnPb) 0612/0508/0306/0204 Tin Lead Termination “B” PHYSICAL DIMENSIONS AND PAD LAYOUT W t T L LW t PHYSICAL CHIP DIMENSIONS mm (in) “A”CC “B” PAD LAYOUT DIMENSIONS mm (in) ABC 0204 T - See Range Chart for Thickness and Codes LD16 - 0306 Code Thickness A 0.61 (0.024) LD17 - 0508 Code Thickness S 0.56 (0.022) V 0.76 (0.030) A 1.02 (0.040) LD18 - 0612 Code Thickness S 0.56 (0.022) V 0.76 (0.030) W 1.02 (0.040) A 1.27 (0.050) Solid = X7R = X5R = X7S mm (in.) LD15 - 0204 Code Thickness C 0.35 (0.014) = X6S mm (in.) mm (in.) mm (in.)

Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. IDCs are typically used on packages of semiconductor products with power levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and ASSP devices produced on 0.13µ, 90nm, 65nm, and 45nm processes. IDC devices are used on both ceramic and organic package substrates. These low ESL surface mount capacitors can be placed on the bottom side or the top side of a package substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of packages under a heat spreader. IDCs are used for board level decoupling of systems with speeds of 300MHz or greater. Low ESL IDCs free up valuable board space by reducing the number of capacitors required versus standard MLCCs. There are additional benefits to reducing the number of capacitors beyond saving board space including higher reliability from a reduction in the number of components and lower placement costs based on the need for fewer capacitors. The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is the second family of Low Inductance MLCC products created by AVX. IDCs are a cost effective alternative to AVX’s first generation low ESL family for high-reliability applications known as LICA (Low Inductance Chip Array). AVX IDC products are available with a lead-free finish of plated Nickel/Tin. HOW TO ORDER + – + – + – + – 0.001 1 10 100 1000 Frequency (MHz) Impedance (Ohms) 0.01 0.1 LICC_0612 IDC_0612 MLCC_1206 PERFORMANCE CHARACTERISTICS Capacitance Tolerance ±20% Preferred Operation X7R = -55°C to +125°C Temperature Range X5R = -55°C to +85°C X7S = -55°C to +125°C Temperature Coefficient ±15% (0VDC) Voltage Ratings 4, 6.3, 10, 16 VDC Dissipation Factor 4V, 6.3V = 6.5% max; 10V = 5.0% max; 16V = 3.5% max Insulation Resistance 100,000MΩ min, or 1,000MΩ per (@+25°C, RVDC) µF min.,whichever is less Dielectric Strength No problems observed after 2.5 x RVDC for 5 seconds at 50mA max current CTE (ppm/C) 12.0 Thermal Conductivity 4-5W/M K Terminations Plated Nickel and SolderAvailable Max. Thickness 0.037" (0.95mm) W Style IDC Case Size 2 = 0508 3 = 0612 L Low Inductance Number of Terminals 1 = 8 Terminals Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V D Dielectric C = X7R D = X5R Z = X7S 225 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance M = ±20% T Termination T = Plated Ni and Sn Packaging Available 1=7" Reel 3=13" Reel A Thickness Max. Thickness mm (in.) A=0.95 (0.037) S=0.55 (0.022) A Failure Rate A = N/A 0612 0508 IDC Low Inductance Capacitors (RoHS) 0612/0508 IDC (InterDigitated Capacitors) NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. TYPICAL IMPEDANCE

IDC Low Inductance Capacitors (RoHS) 0612/0508 IDC (InterDigitated Capacitors) SIZE Thin 0508 0508 Thin 0612 0612 WVDC 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 Cap (µF) 0.01 0.033 0.047 0.068 0.10 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 = X7R = X5R = X7S Consult factory for additional requirements 0612 PAD LAYOUT DIMENSIONS ABCDE 0508 ABCDE L W BW BL P -0.003 PHYSICAL CHIP DIMENSIONS millimeters (inches) +0.25 -0.08 L W BW BL P -0.003 0508 +0.25 -0.08 +0.006 -0.004 +0.15 -0.10 0612 PHYSICAL DIMENSIONS AND PAD LAYOUT A B C D E W BL BW T L P

+ – + – + – + – 0.001 1 10 100 1000 Frequency (MHz) Impedance (Ohms) 0.01 0.1 LICC_0612 IDC_0612 MLCC_1206 PERFORMANCE CHARACTERISTICS Capacitance Tolerance ±20% Preferred Operation X7R = -55°C to +125°C Temperature Range X5R = -55°C to +85°C X7S = -55°C to +125°C Temperature Coefficient ±15% (0VDC) Voltage Ratings 4, 6.3, 10, 16 VDC Dissipation Factor 4V, 6.3V = 6.5% max; 10V = 5.0% max; 16V = 3.5% max Insulation Resistance 100,000MΩ min, or 1,000MΩ per (@+25°C, RVDC) µF min.,whichever is less Dielectric Strength No problems observed after 2.5 x RVDC for 5 seconds at 50mA max current CTE (ppm/C) 12.0 Thermal Conductivity 4-5W/M K Terminations Plated Nickel and 5% min. LeadAvailable Max. Thickness 0.037" (0.95mm) L Style IDC Case Size 2 = 0508 3 = 0612 L Low Inductance Number of Terminals 1 = 8 Terminals Voltage 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V D Dielectric C = X7R D = X5R Z = X7S 225 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance M = ±20% B Termination B = 5% min. Lead Packaging Available 1=7" Reel 3=13" Reel A Thickness Max. Thickness mm (in.) A=0.95 (0.037) S=0.55 (0.022) A Failure Rate A = N/A 0612 0508 IDC Low Inductance Capacitors (SnPb) 0612/0508 IDC with Sn/Pb Termination GENERAL DESCRIPTION Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array of capacitors in parallel determines the response time of a Power Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC devices are available in versions with a maximum height of 0.95mm or 0.55mm. IDCs are typically used on packages of semiconductor products with power levels of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and ASSP devices produced on 0.13µ, 90nm, 65nm, and 45nm processes. IDC devices are used on both ceramic and organic package substrates. These low ESL surface mount capacitors can be placed on the bottom side or the top side of a package substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of packages under a heat spreader. IDCs are used for board level decoupling of systems with speeds of 300MHz or greater. Low ESL IDCs free up valuable board space by reducing the number of capacitors required versus standard MLCCs. There are additional benefits to reducing the number of capacitors beyond saving board space including higher reliability from a reduction in the number of components and lower placement costs based on the need for fewer capacitors. The Inter-Digitated Capacitor (IDC) technology was developed by AVX. This is the second family of Low Inductance MLCC products created by AVX. IDCs are a cost effective alternative to AVX’s first generation low ESL family for high-reliability applications known as LICA (Low Inductance Chip Array). AVX IDC products are available with a lead termination for high reliability military and aerospace applications that must avoid tin whisker reliability issues. NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. TYPICAL IMPEDANCE

IDC Low Inductance Capacitors (SnPb) 0612/0508 IDC with Sn/Pb Termination 0612 PAD LAYOUT DIMENSIONS ABCDE 0508 ABCDE L W BW BL P -0.003 PHYSICAL CHIP DIMENSIONS millimeters (inches) +0.25 -0.08 L W BW BL P -0.003 0508 +0.25 -0.08 0612 PHYSICAL DIMENSIONS AND PAD LAYOUT A B C D E W BL BW T L P SIZE Thin 0508 0508 Thin 0612 0612 WVDC 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 Cap (µF) 0.01 0.033 0.047 0.068 0.10 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 = X7R = X5R = X7S Consult factory for additional requirements

LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The in- novative LGA technology sets a new standard for low inductance MLCC performance. Electronic Productsawarded its 2006 Product of the Year Award to the LGA Decoupling capacitor. Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal IDC low inductance MLCC with a number of advantages including:  Simplified layout of 2 large solder pads compared to 8 small pads for IDCs  Opportunity to reduce PCB or substrate contribution to system ESL by using multi- ple parallel vias in solder pads  Advanced FCT manufacturing process used to create uniformly flat terminations on the capacitor that resist “tombstoning”  Better solder joint reliability  Microprocessors/CPUs  Graphics Processors/GPUs  Chipsets  FPGAs  ASICs Board Level Device Decoupling  Frequencies of 300 MHz or more  ICs drawing 15W or more  Low voltages  High speed buses 0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC 0.001 0.01 0.1 1 10 100 1000 Frequency (MHz) Impedance (Ω)

LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Series L W T BW BL PART DIMENSIONS mm (inches) RECOMMENDED SOLDER PAD DIMENSIONS mm (inches) PL G PW1 Series PL PW1 G HOW TO ORDER LG Style Case Size 1 = 0204 2 = 0306 C = 0805 Number of Terminals Working Voltage 4 = 4V 6 = 6.3V Z = 10V Z Temperature Characteristic C = X7R D = X5R Z = X7S W = X6S 104 Coded Cap M Cap Tolerance M = 20% A Termination Style A = “U” Land T Termination 100% Sn* *Contact factory for other termination finishes Packaging Tape & Reel 2 = 7" Reel 4 = 13" Reel S Thickness S = 0.55mm max Number of Capacitors SIZE LG12 (0204) LG22 (0306) LGC2 (0805) Temp. Char. X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W) Cap (µF) 0.010 (103) 0.022 (223) 0.047 (473) 0.100 (104) 0.220 (224) 0.330 (334) 0.470 (474) 1.000 (105) 2.200 (225) = X7R = X5R = X7S = X6S T L BL BW LW BL Standard Geometry LGA LGC2 Top View Side 1 Side 2 T L BL W BW L BL Reverse Geometry LGA LG12, LG22 Top View Side 1 Side 2 Please contact AVX for values

LICA® arrays utilize up to four separate capacitor sections in one ceramic body (see Configurations and Capacitance Options). These designs exhibit a number of technical advancements: Low Inductance features– Low resistance platinum electrodes in a low aspect ratio pattern Double electrode pickup and perpendicular current paths C4 “flip-chip” technology for minimal interconnect inductance HOW TO ORDER SOLDER BALL AND PAD DIMENSIONS "W" = ±.06mm 0.925 ±0.03mm 0.925 ±0.03mm Vertical and Horizontal Pitch=0.4 ±.02mm 0.8 ±.03 (2 pics) 0.6 ±.100mm L = ±.06mm Code Face to Denote Orientation (Optional) "Hb" ±.06 "Ht" = (Hb +.096 ±.02mm typ) C4 Ball diameter: .164 ±.03mm Code Width Length Height (Body Height) (W) (L) Body (H b) 1 1.600mm 1.850mm 0.875mm 3 1.600mm 1.850mm 0.650mm 5 1.600mm 1.850mm 1.100mm 6 1.600mm 1.850mm 0.500mm 7 1.600mm 1.850mm 1.600mm TERMINATION OPTIONS SOLDER BALLS T55T/S55S Units Co Nanofarads 1.45 x Co Nanofarads 0.7 x Co Nanofarads

15 Percent

20 Milliohms

0.2 Ohms

300 Megaohms

500 Volts

8.5 ppm/°C 25-100°

30 Pico-Henries

-55° to 125°C Low Inductance Capacitors LICA® (Low Inductance Decoupling Capacitor Arrays) TABLE 1 Typical Parameters Capacitance, 25°C Capacitance, 55°C Capacitance, 85°C Dissipation Factor 25° ESR (Nominal) DC Resistance IR (Minimum @25°) (Design Dependent) Dielectric Breakdown, Min Thermal Coefficient of Expansion Inductance: (Design Dependent) (Nominal) Frequency of Operation Ambient Temp Range “Centrality”* *NOTE: The C4 pattern will be within 0.1mm of the center of the LICA body, in both axes. Pin A1 is the lower left hand ball. TERMINATION OPTION R OR N LICA Style Size Voltage 5V = 9 10V = Z 25V = 3 T Dielectric D = X5R T = T55T S = High K T55T 102 Cap/Section (EIA Code) 102 = 1000 pF 103 = 10 nF 104 = 100 nF M Capacitance Tolerance M = ±20% P = GMV Height Code 6 = 0.500mm 3 = 0.650mm 1 = 0.875mm 5 = 1.100mm 7 = 1.600mm F Termination F = C4 Solder Balls- 97Pb/3Sn H = C4 Solder Balls Low ESR G = Lead Free SAC R = Cr-Cu-Au N = Cr-Ni-Au V = Eutectic Lead- Tin Bump- 37%Pb/63%Sn X = None C Reel Packaging M = 7" Reel R = 13" Reel 6 = 2"x2" Waffle Pack 8 = 2"x2" Black Waffle Pack 7 = 2"x2" Waffle Pack w/ termination facing up A = 2"x2" Black Waffle Pack w/ termination facing up C = 4"x4" Waffle Pack w/ clear lid A Inspection Code A = Standard B = COTS+ X = MIL-PRF-123 A Code Face A = Bar B = No Bar C = Dot, S55S Dielectrics D = Triangle # of Caps/Part 1 = one 2 = two 4 = four NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. TERMINATION OPTION F, H, G OR V

-14 -28 -42 -56 -70 3 30 300 3000 linear1.sch1.DB[S21] Freq (MHz) Maximum +45% 60°C 85°C25°C 50°C Capacitance Change LICA T55T/S55S CERAMIC Maximum -30% DB CAP CA D C B A B1D1 CAP 1 B2D2 CAP 2 C1 A1 C2 A2 D1 C1 B1 A1 D2 C2 B2 A2 B1D1 CAP 1 B2D2 CAP 2 C1 A1 C2 A2 B3D3 CAP 3 B4D4 CAP 4 C3 A3 C4 A4 D1 C1 B1 A1 D2 C2 B2 A2 D3 C3 B3 A3 D4 C4 B4 A4 CONFIGURATIONLICA COMMON PART NUMBER LIST TEMPERATURE VS CAPACITANCE CHANGE Sprocket Holes: 1.55mm, 4mm pitch Wells for LICA® part, C4 side down 1.75mm x 2.01mm x 1.27mm deep on 4mm centers 0.64mm Push Holes Code Face to Denote Orientation (Typical) 76 pieces/foot1.75mm WAFFLE PACK OPTIONS FOR LICA® FLUOROWARE® H20-080 Option "C" 400 pcs. per 4" x 4" package Option "6" 100 pcs. per 2" x 2" package Code Face to Denote Orientation Code Face to Denote Orientation Note: Standard configuration is Termination side down LICA® PACKAGING SCHEME “M” AND “R” 8mm conductive plastic tape on reel: “M”=7" reel max. qty. 3,000, “R”=13" reel max. qty. 8,000 Schematic Code Face Schematic Code Face Schematic Code Face Part Number Voltage Thickness (mm) Capacitors per Package LICA3T193M3FC4AA 25 0.650 4 LICA3T153P3FC4AA 25 0.650 4 LICA3T134M1FC1AA 25 0.875 1 LICA3T104P1FC1AA 25 0.875 1 LICA3T333M1FC4AA 25 0.875 4 LICA3T263P3FC4AA 25 0.650 4 LICA3T244M5FC1AA 25 1.100 1 LICA3T194P5FC1AA 25 1.100 1 LICA3T394M7FC1AB 25 1.600 1 LICA3T314P7FC1AB 25 1.600 1 Extended Range LICAZT623M3FC4AB 10 0.650 4 LICA3T104M3FC1A 25 0.650 1 LICA3T803P3FC1A 25 0.650 1 LICA3T423M3FC2A 25 0.650 2 LICA3T333P3FC2A 25 0.650 2 LICA3S253M3FC4A 25 0.650 4 LICAZD753M3FC4AD 10 0.650 4 LICAZD504M3FC1AB 10 0.650 1 LICAZD604M7FC1AB 10 1.600 1 LICA3D193M3FC4AB 25 0.650 4 Low Inductance Capacitors LICA® (Low Inductance Decoupling Capacitor Arrays) TYPICAL S21 FOR LICA AT SINGLE VIA

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations. Contact factory for availability of Termination and Tolerance options for Specific Part Numbers. High Voltage MLC Chips For 600V to 5000V Application HOW TO ORDER DIMENSIONS millimeters (inches) SIZE 0805 1206 1210* 1808* 1812* 1825* 2220* 2225* 3640* High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. AVX special high voltage MLC chip capacitors meet these performance characteristics and are designed for applications such as snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/dc blocking. These high voltage chip designs exhibit low ESRs at high frequencies. Larger physical sizes than normally encountered chips are used to make high voltage MLC chip products. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing. *Reflow Soldering Only W L T t 1808 AVX Style 0805 1206 1210 1808 1812 1825 2220 2225 3640 A Voltage 600V/630V = C 1000V = A 1500V = S 2000V = G 2500V = W 3000V = H 4000V = J 5000V = K A Temperature Coefficient C0G = A X7R = C 271 Capacitance Code (2 significant digits + no. of zeros) Examples: 10 pF = 100 100 pF = 101 1,000 pF = 102 22,000 pF = 223 220,000 pF = 224 1 µF =105 K Capacitance Tolerance C0G:J = ±5% K = ±10% M = ±20% X7R:K = ±10% M = ±20% Z = +80%, -20% A Test Level A = Standard Termination* 1 = Pd/Ag T = Plated Ni and Sn (RoHS Compliant) Packaging 1 = 7" Reel 3 = 13" Reel 9 = Bulk A Special Code A = Standard *Note: Terminations with 5% minimum lead (Pb) is available, see pages 75 and 76 for LD style. NEW 630V RANGE

For 600V to 5000V Applications VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225 3640 600/630 min. 10pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF min. — 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF1500 max. — 270 pF 680 pF 820 pF 1800 pF 4700 pF 4700 pF 5600 pF 0.010 µF min. — 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF2000 max. — 120 pF 270 pF 330 pF 1000 pF 1800 pF 2200 pF 2700 pF 6800 pF min. — — — 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF2500 max. — — — 180 pF 470 pF 1200 pF 1500 pF 1800 pF 3900 pF min. — — — 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF3000 max. — — — 120 pF 330 pF 820 pF 1000 pF 1200 pF 2700 pF min. — — — 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF4000 max. — — — 47 pF 150 pF 330 pF 470 pF 560 pF 1200 pF min. — — — — — — 10 pF 10 pF 10 pF5000 max. — — — — — — 220 pF 270 pF 820 pF HIGH VOLTAGE C0G CAPACITANCE VALUES VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225 3640 Development 6800 pF 0.015 µF 0.056 µF 0.056 µF 0.068 µF Development 3900 pF 3900 pF 8200 pF 0.027 µF 0.027 µF 0.033 µF min. — — — 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF2500 max. — — — 1800 pF 3300 pF 6800 pF 8200 pF 0.010 µF 0.022 µF Development 2200 pF 5600 pF 0.015 µF 0.018 µF 0.022 µF min. — — — 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF3000 max. — — — 1500 pF 2200 pF 4700 pF 4700 µF 6800 pF 0.018 µF Development 1800 pF 4700 pF 0.012 µF 0.012 µF 0.015 µF HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES X7R Dielectric Performance Characteristics Capacitance Range 10 pF to 0.047 µF (25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz) Capacitance Tolerances ±5%, ±10%, ±20% Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz) Operating Temperature Range -55°C to +125°C Temperature Characteristic 0 ±30 ppm/°C (0 VDC) Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C) Insulation Resistance (+25°C, at 500 VDC) 100K M Ω min. or 1000 MΩ - µF min., whichever is less Insulation Resistance (+125°C, at 500 VDC) 10K M Ω min. or 100 MΩ - µF min., whichever is less Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current C0G Dielectric Performance Characteristics Capacitance Range 10 pF to 0.56 µF (25°C, 1.0 ±0.2 Vrms at 1kHz) Capacitance Tolerances ±10%; ±20%; +80%, -20% Dissipation Factor 2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz) Operating Temperature Range -55°C to +125°C Temperature Characteristic ±15% (0 VDC) Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C) Insulation Resistance (+25°C, at 500 VDC) 100K M Ω min. or 1000 MΩ - µF min., whichever is less Insulation Resistance (+125°C, at 500 VDC) 10K M Ω min. or 100 MΩ - µF min., whichever is less Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations. Contact factory for availability of Termination and Tolerance options for Specific Part Numbers. * Reflow soldering only. High Voltage MLC Chips Tin/Lead Termination “B” For 600V to 5000V Application HOW TO ORDER AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages, a full range of values that we are offering in this “B” termination. Larger physical sizes than normally encountered chips are used to make high voltage MLC chip product. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing. W L T t A Temperature Coefficient C0G = A X7R = C 271 Capacitance Code (2 significant digits + no. of zeros) Examples: 10 pF = 100 100 pF = 101 1,000 pF = 102 22,000 pF = 223 220,000 pF = 224 1 µF =105 K Capacitance Tolerance C0G: J = ±5% K = ±10% M = ±20% X7R: K = ±10% M = ±20% Z = +80%, -20% A Test Level A = Standard B Termination B = 5% Min Pb Packaging 1 = 7" Reel 3 = 13" Reel 9 = Bulk A Special Code A = Standard A Voltage 600V/630V = C 1000V = A 1500V = S 2000V = G 2500V = W 3000V = H 4000V = J 5000V = K NEW 630V RANGE LD08 AVX Style LD05 - 0805 LD06 - 1206 LD10 - 1210 LD08 - 1808 LD12 - 1812 LD13 - 1825 LD20 - 2220 LD14 - 2225 LD40 - 3640 DIMENSIONS millimeters (inches) SIZE LD05 (0805) LD06 (1206) LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD25* (2225) LD40* (3640)

Tin/Lead Termination “B” For 600V to 5000V Application X7R Dielectric Performance Characteristics C0G Dielectric Performance Characteristics Capacitance Range 10 pF to 0.047 µF (25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz) Capacitance Tolerances ±5%, ±10%, ±20% Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz) Operating Temperature Range -55°C to +125°C Temperature Characteristic 0 ±30 ppm/°C (0 VDC) Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C) Insulation Resistance (+25°C, at 500 VDC) 100K M Ω min. or 1000 MΩ - µF min., whichever is less Insulation Resistance (+125°C, at 500 VDC) 10K M Ω min. or 100 MΩ - µF min., whichever is less Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current Capacitance Range 10 pF to 0.56 µF (25°C, 1.0 ±0.2 Vrms at 1kHz) Capacitance Tolerances ±10%; ±20%; +80%, -20% Dissipation Factor 2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz) Operating Temperature Range -55°C to +125°C Temperature Characteristic ±15% (0 VDC) Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C) Insulation Resistance (+25°C, at 500 VDC) 100K M Ω min. or 1000 MΩ - µF min., whichever is less Insulation Resistance (+125°C, at 500 VDC) 10K M Ω min. or 100 MΩ - µF min., whichever is less Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640) 600/630 min. 10pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF min. — 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF1500 max. — 270 pF 680 pF 820 pF 1800 pF 4700 pF 4700 pF 5600 pF 0.010 µF min. — 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF2000 max. — 120 pF 270 pF 330 pF 1000 pF 1800 pF 2200 pF 2700 pF 6800 pF min. — — — 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF2500 max. — — — 180 pF 470 pF 1200 pF 1500 pF 1800 pF 3900 pF min. — — — 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF3000 max. — — — 120 pF 330 pF 820 pF 1000 pF 1200 pF 2700 pF min. — — — 10 pF 10 pF 10 pF 10 pF 10 pF 100 pF4000 max. — — — 47 pF 150 pF 330 pF 470 pF 560 pF 1200 pF min. — — — — — — 10 pF 10 pF 10 pF5000 max. — — — — — — 220 pF 270 pF 820 pF HIGH VOLTAGE C0G CAPACITANCE VALUES VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640) Development 6800 pF 0.015 µF 0.056 µF 0.056 µF 0.068 µF Development 3900 pF 3900 pF 8200 pF 0.027 µF 0.027 µF 0.033 µF min. — — — 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF2500 max. — — — 1800 pF 3300 pF 6800 pF 8200 pF 0.010 µF 0.022 µF Development 2200 pF 5600 pF 0.015 µF 0.018 µF 0.022 µF min. — — — 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF3000 max. — — — 1500 pF 2200 pF 4700 pF 4700 µF 6800 pF 0.018 µF Development 1800 pF 4700 pF 0.012 µF 0.012 µF 0.015 µF HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES

T W L D t MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example CDR01 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance Rated Voltage Capacitance Tolerance Termination Finish Failure Rate MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05, CDR06 Voltage Temperature Limits: BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with rated voltage from -55°C to +125°C BX = ±15% without voltage; +15 –25% with rated voltage from -55°C to +125°C Capacitance: Two digit figures followed by multiplier (number of zeros to be added) e.g., 101 = 100 pF Rated Voltage: A = 50V, B = 100V Capacitance Tolerance:J ± 5%, K ± 10%, M ± 20% Termination Finish: M = Palladium Silver U = Base Metallization/Barrier N = Silver Nickel Gold Metal/Solder Coated* S = Solder-coated W = Base Metallization/Barrier Metal/Tinned (Tin or Tin/ Lead Alloy) *Solder shall have a melting point of 200°C or less. Failure Rate Level:M = 1.0%, P = .1%, R = .01%, S = .001% Packaging: Bulk is standard packaging. Tape and reel per RS481 is available upon request. CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06* Per AVX Length (L) Width (W) Thickness (T) D Termination Band (t) *For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Military Part Number Identification CDR01 thru CDR06 CDR01 thru CDR06 to MIL-PRF-55681 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation in pF tolerance temperature limits AVX Style 0805/CDR01 CDR01BP100B--- 10 J,K BP 100 CDR01BP120B--- 12 J BP 100 CDR01BP150B--- 15 J,K BP 100 CDR01BP180B--- 18 J BP 100 CDR01BP220B--- 22 J,K BP 100 CDR01BP270B--- 27 J BP 100 CDR01BP330B--- 33 J,K BP 100 CDR01BP390B--- 39 J BP 100 CDR01BP470B--- 47 J,K BP 100 CDR01BP560B--- 56 J BP 100 CDR01BP680B--- 68 J,K BP 100 CDR01BP820B--- 82 J BP 100 CDR01BP101B--- 100 J,K BP 100 CDR01B--121B--- 120 J,K BP ,BX 100 CDR01B--151B--- 150 J,K BP ,BX 100 CDR01B--181B--- 180 J,K BP ,BX 100 CDR01BX221B--- 220 K,M BX 100 CDR01BX271B--- 270 K BX 100 CDR01BX331B--- 330 K,M BX 100 CDR01BX391B--- 390 K BX 100 CDR01BX471B--- 470 K,M BX 100 CDR01BX561B--- 560 K BX 100 CDR01BX681B--- 680 K,M BX 100 CDR01BX821B--- 820 K BX 100 CDR01BX102B--- 1000 K,M BX 100 CDR01BX122B--- 1200 K BX 100 CDR01BX152B--- 1500 K,M BX 100 CDR01BX182B--- 1800 K BX 100 CDR01BX222B--- 2200 K,M BX 100 CDR01BX272B--- 2700 K BX 100 CDR01BX332B--- 3300 K,M BX 100 CDR01BX392A--- 3900 K BX 50 CDR01BX472A--- 4700 K,M BX 50 AVX Style 1805/CDR02 CDR02BP221B--- 220 J,K BP 100 CDR02BP271B--- 270 J BP 100 CDR02BX392B--- 3900 K BX 100 CDR02BX472B--- 4700 K,M BX 100 CDR02BX562B--- 5600 K BX 100 CDR02BX682B--- 6800 K,M BX 100 CDR02BX822B--- 8200 K BX 100 CDR02BX103B--- 10,000 K,M BX 100 CDR02BX123A--- 12,000 K BX 50 CDR02BX153A--- 15,000 K,M BX 50 CDR02BX183A--- 18,000 K BX 50 CDR02BX223A--- 22,000 K,M BX 50 Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation in pF tolerance temperature limits AVX Style 1808/CDR03 CDR03BP331B--- 330 J,K BP 100 CDR03BP391B--- 390 J BP 100 CDR03BP471B--- 470 J,K BP 100 CDR03BP561B--- 560 J BP 100 CDR03BP681B--- 680 J,K BP 100 CDR03BP821B-- 820 J BP 100 CDR03BP102B--- 1000 J,K BP 100 CDR03BX123B-- 12,000 K BX 100 CDR03BX153B--- 15,000 K,M BX 100 CDR03BX183B--- 18,000 K BX 100 CDR03BX223B--- 22,000 K,M BX 100 CDR03BX273B--- 27,000 K BX 100 CDR03BX333B--- 33,000 K,M BX 100 CDR03BX393A--- 39,000 K BX 50 CDR03BX473A--- 47,000 K,M BX 50 CDR03BX563A--- 56,000 K BX 50 CDR03BX683A--- 68,000 K,M BX 50 AVX Style 1812/CDR04 CDR04BP122B--- 1200 J BP 100 CDR04BP152B--- 1500 J,K BP 100 CDR04BP182B--- 1800 J BP 100 CDR04BP222B--- 2200 J,K BP 100 CDR04BP272B--- 2700 J BP 100 CDR04BP332B--- 3300 J,K BP 100 CDR04BX393B--- 39,000 K BX 100 CDR04BX473B--- 47,000 K,M BX 100 CDR04BX563B--- 56,000 K BX 100 CDR04BX823A--- 82,000 K BX 50 CDR04BX104A--- 100,000 K,M BX 50 CDR04BX124A--- 120,000 K BX 50 CDR04BX154A--- 150,000 K,M BX 50 CDR04BX184A--- 180,000 K BX 50 AVX Style 1825/CDR05 CDR05BP392B--- 3900 J,K BP 100 CDR05BP472B--- 4700 J,K BP 100 CDR05BP562B--- 5600 J,K BP 100 CDR05BX683B--- 68,000 K,M BX 100 CDR05BX823B--- 82,000 K BX 100 CDR05BX104B--- 100,000 K,M BX 100 CDR05BX124B--- 120,000 K BX 100 CDR05BX154B--- 150,000 K,M BX 100 CDR05BX224A--- 220,000 K,M BX 50 CDR05BX274A--- 270,000 K BX 50 CDR05BX334A--- 330,000 K,M BX 50 AVX Style 2225/CDR06 CDR06BP682B--- 6800 J,K BP 100 CDR06BP822B--- 8200 J,K BP 100 CDR06BP103B--- 10,000 J,K BP 100 CDR06BX394A--- 390,000 K BX 50 CDR06BX474A--- 470,000 K,M BX 50 Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance

T W L D t MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example (example) CDR31 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance Rated Voltage Capacitance Tolerance Termination Finish Failure Rate MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35 Voltage Temperature Limits: BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with rated voltage from -55°C to +125°C BX = ±15% without voltage; +15 –25% with rated voltage from -55°C to +125°C Capacitance: Two digit figures followed by multiplier (number of zeros to be added) e.g., 101 = 100 pF Rated Voltage: A = 50V, B = 100V Capacitance Tolerance:B ± .10 pF, C ± .25 pF, D ± .5 M ± 20% Termination Finish: M = Palladium Silver U = Base Metallization/Barrier N = Silver Nickel Gold Metal/Solder Coated* S = Solder-coated W = Base Metallization/Barrier Y = 100% Tin Metal/Tinned (Tin or Tin/ Lead Alloy) *Solder shall have a melting point of 200°C or less. Failure Rate Level:M = 1.0%, P = .1%, R = .01%, S = .001% Packaging: Bulk is standard packaging. Tape and reel per RS481 is available upon request. Per MIL-PRF-55681 AVX Length (L) Width (W) Thickness (T) D Termination Band (t) (Metric Sizes) Style (mm) (mm) Max. (mm) Min. (mm) Max. (mm) Min. (mm) NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers. CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35

Military Part Number Identification CDR31 CDR31 to MIL-PRF-55681/7 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation 1/ in pF tolerance temperature limits AVX Style 0805/CDR31 (BP) CDR31BP1R0B--- 1.0 B,C BP 100 CDR31BP1R1B--- 1.1 B,C BP 100 CDR31BP1R2B--- 1.2 B,C BP 100 CDR31BP1R3B--- 1.3 B,C BP 100 CDR31BP1R5B--- 1.5 B,C BP 100 CDR31BP1R6B--- 1.6 B,C BP 100 CDR31BP1R8B--- 1.8 B,C BP 100 CDR31BP2R0B--- 2.0 B,C BP 100 CDR31BP2R2B--- 2.2 B,C BP 100 CDR31BP2R4B--- 2.4 B,C BP 100 CDR31BP2R7B--- 2.7 B,C,D BP 100 CDR31BP3R0B--- 3.0 B,C,D BP 100 CDR31BP3R3B--- 3.3 B,C,D BP 100 CDR31BP3R6B--- 3.6 B,C,D BP 100 CDR31BP3R9B--- 3.9 B,C,D BP 100 CDR31BP4R3B--- 4.3 B,C,D BP 100 CDR31BP4R7B--- 4.7 B,C,D BP 100 CDR31BP5R1B--- 5.1 B,C,D BP 100 CDR31BP5R6B--- 5.6 B,C,D BP 100 CDR31BP6R2B--- 6.2 B,C,D BP 100 CDR31BP6R8B--- 6.8 B,C,D BP 100 CDR31BP7R5B--- 7.5 B,C,D BP 100 CDR31BP8R2B--- 8.2 B,C,D BP 100 CDR31BP9R1B--- 9.1 B,C,D BP 100 CDR31BP100B--- 10 F,J,K BP 100 CDR31BP110B--- 11 F,J,K BP 100 CDR31BP120B--- 12 F,J,K BP 100 CDR31BP130B--- 13 F,J,K BP 100 CDR31BP150B--- 15 F,J,K BP 100 CDR31BP160B--- 16 F,J,K BP 100 CDR31BP180B--- 18 F,J,K BP 100 CDR31BP200B--- 20 F,J,K BP 100 CDR31BP220B--- 22 F,J,K BP 100 CDR31BP240B--- 24 F,J,K BP 100 CDR31BP270B--- 27 F,J,K BP 100 CDR31BP300B--- 30 F,J,K BP 100 CDR31BP330B--- 33 F,J,K BP 100 CDR31BP360B--- 36 F,J,K BP 100 CDR31BP390B--- 39 F,J,K BP 100 CDR31BP430B--- 43 F,J,K BP 100 CDR31BP470B--- 47 F,J,K BP 100 CDR31BP510B--- 51 F,J,K BP 100 CDR31BP560B--- 56 F,J,K BP 100 CDR31BP620B--- 62 F,J,K BP 100 CDR31BP680B--- 68 F,J,K BP 100 CDR31BP750B--- 75 F,J,K BP 100 CDR31BP820B--- 82 F,J,K BP 100 CDR31BP910B--- 91 F,J,K BP 100 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation 1/ in pF tolerance temperature limits AVX Style 0805/CDR31 (BP) cont’d CDR31BP101B--- 100 F,J,K BP 100 CDR31BP111B--- 110 F,J,K BP 100 CDR31BP121B--- 120 F,J,K BP 100 CDR31BP131B--- 130 F,J,K BP 100 CDR31BP151B--- 150 F,J,K BP 100 CDR31BP161B--- 160 F,J,K BP 100 CDR31BP181B--- 180 F,J,K BP 100 CDR31BP201B--- 200 F,J,K BP 100 CDR31BP221B--- 220 F,J,K BP 100 CDR31BP241B--- 240 F,J,K BP 100 CDR31BP271B--- 270 F,J,K BP 100 CDR31BP301B--- 300 F,J,K BP 100 CDR31BP331B--- 330 F,J,K BP 100 CDR31BP361B--- 360 F,J,K BP 100 CDR31BP391B--- 390 F,J,K BP 100 CDR31BP431B--- 430 F,J,K BP 100 CDR31BP471B--- 470 F,J,K BP 100 CDR31BP511A--- 510 F,J,K BP 50 CDR31BP561A--- 560 F,J,K BP 50 CDR31BP621A--- 620 F,J,K BP 50 CDR31BP681A--- 680 F,J,K BP 50 AVX Style 0805/CDR31 (BX) CDR31BX471B--- 470 K,M BX 100 CDR31BX561B--- 560 K,M BX 100 CDR31BX681B--- 680 K,M BX 100 CDR31BX821B--- 820 K,M BX 100 CDR31BX102B--- 1,000 K,M BX 100 CDR31BX122B--- 1,200 K,M BX 100 CDR31BX152B--- 1,500 K,M BX 100 CDR31BX182B--- 1,800 K,M BX 100 CDR31BX222B--- 2,200 K,M BX 100 CDR31BX272B--- 2,700 K,M BX 100 CDR31BX332B--- 3,300 K,M BX 100 CDR31BX392B--- 3,900 K,M BX 100 CDR31BX472B--- 4,700 K,M BX 100 CDR31BX562A--- 5,600 K,M BX 50 CDR31BX682A--- 6,800 K,M BX 50 CDR31BX822A--- 8,200 K,M BX 50 CDR31BX103A--- 10,000 K,M BX 50 CDR31BX123A--- 12,000 K,M BX 50 CDR31BX153A--- 15,000 K,M BX 50 CDR31BX183A--- 18,000 K,M BX 50 1/ The complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level. Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance

Military Part Number Identification CDR32 CDR32 to MIL-PRF-55681/8 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation 1/ in pF tolerance temperature limits AVX Style 1206/CDR32 (BP) CDR32BP1R0B--- 1.0 B,C BP 100 CDR32BP1R1B--- 1.1 B,C BP 100 CDR32BP1R2B--- 1.2 B,C BP 100 CDR32BP1R3B--- 1.3 B,C BP 100 CDR32BP1R5B--- 1.5 B,C BP 100 CDR32BP1R6B--- 1.6 B,C BP 100 CDR32BP1R8B--- 1.8 B,C BP 100 CDR32BP2R0B--- 2.0 B,C BP 100 CDR32BP2R2B--- 2.2 B,C BP 100 CDR32BP2R4B--- 2.4 B,C BP 100 CDR32BP2R7B--- 2.7 B,C,D BP 100 CDR32BP3R0B--- 3.0 B,C,D BP 100 CDR32BP3R3B--- 3.3 B,C,D BP 100 CDR32BP3R6B--- 3.6 B,C,D BP 100 CDR32BP3R9B--- 3.9 B,C,D BP 100 CDR32BP4R3B--- 4.3 B,C,D BP 100 CDR32BP4R7B--- 4.7 B,C,D BP 100 CDR32BP5R1B--- 5.1 B,C,D BP 100 CDR32BP5R6B--- 5.6 B,C,D BP 100 CDR32BP6R2B--- 6.2 B,C,D BP 100 CDR32BP6R8B--- 6.8 B,C,D BP 100 CDR32BP7R5B--- 7.5 B,C,D BP 100 CDR32BP8R2B--- 8.2 B,C,D BP 100 CDR32BP9R1B--- 9.1 B,C,D BP 100 CDR32BP100B--- 10 F,J,K BP 100 CDR32BP110B--- 11 F,J,K BP 100 CDR32BP120B--- 12 F,J,K BP 100 CDR32BP130B--- 13 F,J,K BP 100 CDR32BP150B--- 15 F,J,K BP 100 CDR32BP160B--- 16 F,J,K BP 100 CDR32BP180B--- 18 F,J,K BP 100 CDR32BP200B--- 20 F,J,K BP 100 CDR32BP220B--- 22 F,J,K BP 100 CDR32BP240B--- 24 F,J,K BP 100 CDR32BP270B--- 27 F,J,K BP 100 CDR32BP300B--- 30 F,J,K BP 100 CDR32BP330B--- 33 F,J,K BP 100 CDR32BP360B--- 36 F,J,K BP 100 CDR32BP390B--- 39 F,J,K BP 100 CDR32BP430B--- 43 F,J,K BP 100 CDR32BP470B--- 47 F,J,K BP 100 CDR32BP510B--- 51 F,J,K BP 100 CDR32BP560B--- 56 F,J,K BP 100 CDR32BP620B--- 62 F,J,K BP 100 CDR32BP680B--- 68 F,J,K BP 100 CDR32BP750B--- 75 F,J,K BP 100 CDR32BP820B--- 82 F,J,K BP 100 CDR32BP910B--- 91 F,J,K BP 100 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation 1/ in pF tolerance temperature limits AVX Style 1206/CDR32 (BP) cont’d CDR32BP101B--- 100 F,J,K BP 100 CDR32BP111B--- 110 F,J,K BP 100 CDR32BP121B--- 120 F,J,K BP 100 CDR32BP131B--- 130 F,J,K BP 100 CDR32BP151B--- 150 F,J,K BP 100 CDR32BP161B--- 160 F,J,K BP 100 CDR32BP181B--- 180 F,J,K BP 100 CDR32BP201B--- 200 F,J,K BP 100 CDR32BP221B--- 220 F,J,K BP 100 CDR32BP241B--- 240 F,J,K BP 100 CDR32BP271B--- 270 F,J,K BP 100 CDR32BP301B--- 300 F,J,K BP 100 CDR32BP331B--- 330 F,J,K BP 100 CDR32BP361B--- 360 F,J,K BP 100 CDR32BP391B--- 390 F,J,K BP 100 CDR32BP431B--- 430 F,J,K BP 100 CDR32BP471B--- 470 F,J,K BP 100 CDR32BP511B--- 510 F,J,K BP 100 CDR32BP561B--- 560 F,J,K BP 100 CDR32BP621B--- 620 F,J,K BP 100 CDR32BP681B--- 680 F,J,K BP 100 CDR32BP751B--- 750 F,J,K BP 100 CDR32BP821B--- 820 F,J,K BP 100 CDR32BP911B--- 910 F,J,K BP 100 CDR32BP102B--- 1,000 F,J,K BP 100 CDR32BP112A--- 1,100 F,J,K BP 50 CDR32BP122A--- 1,200 F,J,K BP 50 CDR32BP132A--- 1,300 F,J,K BP 50 CDR32BP152A--- 1,500 F,J,K BP 50 CDR32BP162A--- 1,600 F,J,K BP 50 CDR32BP182A--- 1,800 F,J,K BP 50 CDR32BP202A--- 2,000 F,J,K BP 50 CDR32BP222A--- 2,200 F,J,K BP 50 AVX Style 1206/CDR32 (BX) CDR32BX472B--- 4,700 K,M BX 100 CDR32BX562B--- 5,600 K,M BX 100 CDR32BX682B--- 6,800 K,M BX 100 CDR32BX822B--- 8,200 K,M BX 100 CDR32BX103B--- 10,000 K,M BX 100 CDR32BX123B--- 12,000 K,M BX 100 CDR32BX153B--- 15,000 K,M BX 100 CDR32BX183A--- 18,000 K,M BX 50 CDR32BX223A--- 22,000 K,M BX 50 CDR32BX273A--- 27,000 K,M BX 50 CDR32BX333A--- 33,000 K,M BX 50 CDR32BX393A--- 39,000 K,M BX 50 1/ The complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level. Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance

Military Part Number Identification CDR33/34/35 CDR33/34/35 to MIL-PRF-55681/9/10/11 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation 1/ in pF tolerance temperature limits AVX Style 1210/CDR33 (BP) CDR33BP102B--- 1,000 F,J,K BP 100 CDR33BP112B--- 1,100 F,J,K BP 100 CDR33BP122B--- 1,200 F,J,K BP 100 CDR33BP132B--- 1,300 F,J,K BP 100 CDR33BP152B--- 1,500 F,J,K BP 100 CDR33BP162B--- 1,600 F,J,K BP 100 CDR33BP182B--- 1,800 F,J,K BP 100 CDR33BP202B--- 2,000 F,J,K BP 100 CDR33BP222B--- 2,200 F,J,K BP 100 CDR33BP242A--- 2,400 F,J,K BP 50 CDR33BP272A--- 2,700 F,J,K BP 50 CDR33BP302A--- 3,000 F,J,K BP 50 CDR33BP332A--- 3,300 F,J,K BP 50 AVX Style 1210/CDR33 (BX) CDR33BX153B--- 15,000 K,M BX 100 CDR33BX183B--- 18,000 K,M BX 100 CDR33BX223B--- 22,000 K,M BX 100 CDR33BX273B--- 27,000 K,M BX 100 CDR33BX393A--- 39,000 K,M BX 50 CDR33BX473A--- 47,000 K,M BX 50 CDR33BX563A--- 56,000 K,M BX 50 CDR33BX683A--- 68,000 K,M BX 50 CDR33BX823A--- 82,000 K,M BX 50 CDR33BX104A--- 100,000 K,M BX 50 AVX Style 1812/CDR34 (BP) CDR34BP222B--- 2,200 F,J,K BP 100 CDR34BP242B--- 2,400 F,J,K BP 100 CDR34BP272B--- 2,700 F,J,K BP 100 CDR34BP302B--- 3,000 F,J,K BP 100 CDR34BP332B--- 3,300 F,J,K BP 100 CDR34BP362B--- 3,600 F,J,K BP 100 CDR34BP392B--- 3,900 F,J,K BP 100 CDR34BP432B--- 4,300 F,J,K BP 100 CDR34BP472B--- 4,700 F,J,K BP 100 CDR34BP512A--- 5,100 F,J,K BP 50 CDR34BP562A--- 5,600 F,J,K BP 50 CDR34BP622A--- 6,200 F,J,K BP 50 CDR34BP682A--- 6,800 F,J,K BP 50 CDR34BP752A--- 7,500 F,J,K BP 50 CDR34BP822A--- 8,200 F,J,K BP 50 CDR34BP912A--- 9,100 F,J,K BP 50 CDR34BP103A--- 10,000 F,J,K BP 50 Military Rated temperature WVDC Type Capacitance Capacitance and voltage- Designation 1/ in pF tolerance temperature limits AVX Style 1812/CDR34 (BX) CDR34BX273B--- 27,000 K,M BX 100 CDR34BX333B--- 33,000 K,M BX 100 CDR34BX393B--- 39,000 K,M BX 100 CDR34BX473B--- 47,000 K,M BX 100 CDR34BX563B--- 56,000 K,M BX 100 CDR34BX104A--- 100,000 K,M BX 50 CDR34BX124A--- 120,000 K,M BX 50 CDR34BX154A--- 150,000 K,M BX 50 CDR34BX184A--- 180,000 K,M BX 50 AVX Style 1825/CDR35 (BP) CDR35BP472B--- 4,700 F,J,K BP 100 CDR35BP512B--- 5,100 F,J,K BP 100 CDR35BP562B--- 5,600 F,J,K BP 100 CDR35BP622B--- 6,200 F,J,K BP 100 CDR35BP682B--- 6,800 F,J,K BP 100 CDR35BP752B--- 7,500 F,J,K BP 100 CDR35BP822B--- 8,200 F,J,K BP 100 CDR35BP912B--- 9,100 F,J,K BP 100 CDR35BP103B--- 10,000 F,J,K BP 100 CDR35BP113A--- 11,000 F,J,K BP 50 CDR35BP123A--- 12,000 F,J,K BP 50 CDR35BP133A--- 13,000 F,J,K BP 50 CDR35BP153A--- 15,000 F,J,K BP 50 CDR35BP163A--- 16,000 F,J,K BP 50 CDR35BP183A--- 18,000 F,J,K BP 50 CDR35BP203A--- 20,000 F,J,K BP 50 CDR35BP223A--- 22,000 F,J,K BP 50 AVX Style 1825/CDR35 (BX) CDR35BX563B--- 56,000 K,M BX 100 CDR35BX683B--- 68,000 K,M BX 100 CDR35BX823B--- 82,000 K,M BX 100 CDR35BX104B--- 100,000 K,M BX 100 CDR35BX124B--- 120,000 K,M BX 100 CDR35BX154B--- 150,000 K,M BX 100 CDR35BX184A--- 180,000 K,M BX 50 CDR35BX224A--- 220,000 K,M BX 50 CDR35BX274A--- 270,000 K,M BX 50 CDR35BX334A--- 330,000 K,M BX 50 CDR35BX394A--- 390,000 K,M BX 50 CDR35BX474A--- 470,000 K,M BX 50 1/ The complete part number will include additional symbols to indicate capacitance tolerance, termination and failure rate level. Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance Add appropriate failure rate Add appropriate termination finish Capacitance Tolerance

Packaging of Chip Components Automatic Insertion Packaging TAPE & REEL QUANTITIES All tape and reel specifications are in compliance with RS481. 8mm 12mm Paper or Embossed Carrier 0612, 0508, 0805, 1206, 1210 Embossed Only 1812, 18251808 2220, 2225 Paper Only 0201, 0306, 0402, 0603 Qty. per Reel/7" Reel 2,000, 3,000 or 4,000, 10,000, 15,000 3,000 500, 1,000 Contact factory for exact quantity Contact factory for exact quantity Qty. per Reel/13" Reel 5,000, 10,000, 50,000 10,000 4,000 Contact factory for exact quantity REEL DIMENSIONS Tape A B* C D* N W1 W2 W3Size (1) 7.90 Min. 8mm 14.4 (0.311) (0.567) 10.9 Max. 330 1.5 20.2 50.0 (0.429) 12mm 18.4 (0.469) (0.724) 15.4 Max. (0.607) Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision. 13.0 +0.50-0.20 8.40 +1.5 -0.0 12.4 +2.0 -0.0

Tape Size B 1 D1 E2 FP 1 RT 2 WA 0 B0 K0 See Note 5 See Note 2 Embossed Carrier Configuration 8 & 12mm Tape Only P2D0 T TOP COVER TAPE DEFORMATION BETWEEN EMBOSSMENTS CENTER LINES OF CAVITY MAX. CAVITY SIZE - SEE NOTE 1 D

1 FOR COMPONENTS

2.00 mm x 1.20 mm AND LARGER (0.079 x 0.047)

10 PITCHES CUMULATIVE

±0.2mm (±0.008) B F EMBOSSMENT User Direction of Feed W T1S1 B1 IS FOR TAPE READER REFERENCE ONLY INCLUDING DRAFT CONCENTRIC AROUND B0 8 & 12mm Embossed Tape Metric Dimensions Will Govern CONSTANT DIMENSIONS VARIABLE DIMENSIONS NOTES: 1. The cavity defined by A0, B0, and K0 shall be configured to provide the following: Surround the component with sufficient clearance such that: a) the component does not protrude beyond the sealing plane of the cover tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the cover tape has been removed. c) rotation of the component is limited to 20º maximum (see Sketches D & E). d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F). 2. Tape with or without components shall pass around radius “R” without damage. 3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes. Refer to EIA-556. 4. B 1 dimension is a reference dimension for tape feeder clearance only. 5. If P1 = 2.0mm, the tape may not properly index in all tape feeders. Tape Size D 0 EP 0 P2 S1 Min. T Max. T 1 12mm Max. 0.50mm (0.020) Maximum 0.50mm (0.020) Maximum Top View, Sketch "F" Component Lateral Movements 1.50 +0.10-0.0 Chip Orientation

E2 Min. F W A 0 B0 TSee Note 4 Paper Carrier Configuration 8 & 12mm Tape Only P2D0T TOP COVER TAPE BOTTOM COVER TAPE CENTER LINES OF CAVITY CAVITY SIZE SEE NOTE 1 ±0.20mm (±0.008) F G User Direction of Feed W T1 A0 8 & 12mm Paper Tape Metric Dimensions Will Govern CONSTANT DIMENSIONS Tape Size D 0 EP 0 P2 T1 G. Min. R Min. 12mm Max. Min. Min. VARIABLE DIMENSIONS 1.10mm (0.043) Max. for Paper Base Tape and 1.60mm (0.063) Max. for Non-Paper Base Compositions NOTES: 1. The cavity defined by A0, B0, and T shall be configured to provide sufficient clearance surrounding the component so that: a) the component does not protrude beyond either surface of the carrier tape; b) the component can be removed from the cavity in a vertical direction without mechanical restriction after the top cover tape has been removed; c) rotation of the component is limited to 20º maximum (see Sketches A & B); d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch C). 2. Tape with or without components shall pass around radius “R” without damage. 3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556. 4. If P 1 = 2.0mm, the tape may not properly index in all tape feeders. 0.50mm (0.020) Maximum 0.50mm (0.020) Maximum Top View, Sketch "C" Component Lateral 1.50 +0.10-0.0 8.00 +0.30 -0.10 8.00 +0.30 -0.10 Bar Code Labeling Standard AVX bar code labeling is available and follows latest version of EIA-556

Part Size 0402 0603 0805 1206 BENEFITS BULK FEEDER  Easier handling  Smaller packaging volume (1/20 of T/R packaging)  Easier inventory control  Flexibility  Recyclable CASE DIMENSIONS Shutter Slider Attachment Base 110mm 12mm 36mm Case Cassette Gate Shooter Chips Expanded Drawing Mounter Head

I. Capacitance (farads) English: C = .224 K A TD Metric: C = .0884 K A TD II. Energy stored in capacitors (Joules, watt - sec) E = 1⁄2 CV2 III. Linear charge of a capacitor (Amperes) I = C dV dt IV. Total Impedance of a capacitor (ohms) Z = R2 S + (XC - XL )2 V. Capacitive Reactance (ohms) xc = 1 2 π fC VI. Inductive Reactance (ohms) xL = 2 π fL VII. Phase Angles: Ideal Capacitors: Current leads voltage 90° Ideal Inductors: Current lags voltage 90° Ideal Resistors: Current in phase with voltage VIII. Dissipation Factor (%) Xc IX. Power Factor (%) P .F. = Sine /H9254(loss angle) = Cos f (phase angle) P .F. = (when less than 10%) = DF X. Quality Factor (dimensionless) Q = Cotan /H9254(loss angle) = 1 D.F. XI. Equivalent Series Resistance (ohms) XII. Power Loss (watts) Power Loss = (2 π fCV2) (D.F.) XIII. KVA (Kilowatts) KVA = 2 π fCV2 x 10-3 XIV. Temperature Characteristic (ppm/°C) T.C. = Ct – C25 x 106 C25 (Tt – 25) XV. Cap Drift (%) C.D. = C1 – C2 x 100 XVI. Reliability of Ceramic Capacitors L0 = Vt XT t Y Lt (Vo )( To XVII. Capacitors in Series (current the same) Any Number: 1 = 1 + 1 --- 1 CT C1 C2 CN C1 C2 Two: CT = C1 + C2 XVIII. Capacitors in Parallel (voltage the same) CT = C1 + C2 --- + CN XIX. Aging Rate A.R. = %D C/decade of time XX. Decibels db = 20 log V1 /H20881 Pico X 10 -12 Nano X 10 -9 Micro X 10 -6 Milli X 10 -3 Deci X 10 -1 Deca X 10 +1 Kilo X 10 +3 Mega X 10 +6 Giga X 10 +9 Tera X 10 +12 K = Dielectric Constant f = frequency L t = Test life A = Area L = Inductance V t = Test voltage TD = Dielectric thickness /H9254= Loss angle V o = Operating voltage V = Voltage f = Phase angle T t = Test temperature t = time X & Y = exponent effect of voltage and temp. T o = Operating temperature Rs = Series Resistance L o = Operating life METRIC PREFIXES SYMBOLS Basic Capacitor Formulas

Formulations – Multilayer ceramic capacitors are available in both Class 1 and Class 2 formulations. Temperature compensating formulation are Class 1 and temperature stable and general application formulations are classified as Class 2. Class 1 – Class 1 capacitors or temperature compensating capacitors are usually made from mixtures of titanates where barium titanate is normally not a major part of the mix. They have predictable temperature coefficients and in general, do not have an aging characteristic. Thus they are the most stable capacitor available. The most popular Class 1 multilayer ceramic capacitors are C0G (NP0) temperature compensating capacitors (negative-positive 0 ppm/°C). Class 2 – EIA Class 2 capacitors typically are based on the chemistry of barium titanate and provide a wide range of capacitance values and temperature stability. The most commonly used Class 2 dielectrics are X7R and Y5V. The X7R provides intermediate capacitance values which vary only ±15% over the temperature range of -55°C to 125°C. It finds applications where stability over a wide temperature range is required. The Y5V provides the highest capacitance values and is used in applications where limited temperature changes are expected. The capacitance value for Y5V can vary from 22% to -82% over the -30°C to 85°C temperature range. All Class 2 capacitors vary in capacitance value under the influence of temperature, operating voltage (both AC and DC), and frequency. For additional information on performance changes with operating conditions, consult AVX’s software, SpiCap. Basic Construction – A multilayer ceramic (MLC) capacitor is a monolithic block of ceramic containing two sets of offset, interleaved planar electrodes that extend to two opposite surfaces of the ceramic dielectric. This simple structure requires a considerable amount of sophistication, both in material and manufacture, to produce it in the quality and quantities needed in today’s electronic equipment. Ceramic Layer Electrode Terminated Edge Terminated Edge End Terminations Margin Electrodes Multilayer Ceramic Capacitor Figure 1

Effects of Mechanical Stress – High “K” dielectric ceramic capacitors exhibit some low level piezoelectric reactions under mechanical stress. As a general statement, the piezo- electric output is higher, the higher the dielectric constant of the ceramic. It is desirable to investigate this effect before using high “K” dielectrics as coupling capacitors in extremely low level applications. Reliability – Historically ceramic capacitors have been one of the most reliable types of capacitors in use today. The approximate formula for the reliability of a ceramic capacitor is: Lo = Vt X Tt Y Lt Vo To where Lo = operating life Tt = test temperature and Lt = test life To = operating temperature Vt = test voltage in °C Vo = operating voltage X,Y = see text Historically for ceramic capacitors exponent X has been considered as 3. The exponent Y for temperature effects typically tends to run about 8. A capacitor is a component which is capable of storing electrical energy. It consists of two conductive plates (elec- trodes) separated by insulating material which is called the dielectric. A typical formula for determining capacitance is: C = .224 KA t C = capacitance (picofarads) K = dielectric constant (Vacuum = 1) A = area in square inches t = separation between the plates in inches (thickness of dielectric) .224 = conversion constant (.0884 for metric system in cm) Capacitance – The standard unit of capacitance is the farad. A capacitor has a capacitance of 1 farad when 1 coulomb charges it to 1 volt. One farad is a very large unit and most capacitors have values in the micro (10 -6), nano (10-9) or pico (10-12) farad level. Dielectric Constant – In the formula for capacitance given above the dielectric constant of a vacuum is arbitrarily chosen as the number 1. Dielectric constants of other materials are then compared to the dielectric constant of a vacuum. Dielectric Thickness – Capacitance is indirectly proportional to the separation between electrodes. Lower voltage require- ments mean thinner dielectrics and greater capacitance per volume. Area – Capacitance is directly proportional to the area of the electrodes. Since the other variables in the equation are usually set by the performance desired, area is the easiest parameter to modify to obtain a specific capacitance within a material group. Energy Stored – The energy which can be stored in a capacitor is given by the formula: E = 1⁄2CV2 E = energy in joules (watts-sec) V = applied voltage C = capacitance in farads Potential Change – A capacitor is a reactive component which reacts against a change in potential across it. This is shown by the equation for the linear charge of a capacitor: Iideal = C dV dt where I = Current C = Capacitance dV/dt = Slope of voltage transition across capacitor Thus an infinite current would be required to instantly change the potential across a capacitor. The amount of current a capacitor can “sink” is determined by the above equation. Equivalent Circuit – A capacitor, as a practical device, exhibits not only capacitance but also resistance and inductance. A simplified schematic for the equivalent circuit is: C = Capacitance L = Inductance R s = Series Resistance Rp = Parallel Resistance Reactance – Since the insulation resistance (Rp) is nor- mally very high, the total impedance of a capacitor is: Z = R 2 S + (XC - XL )2 where Z = Total Impedance Rs = Series Resistance XC = Capacitive Reactance = 1 2 π fC XL = Inductive Reactance = 2 π fL The variation of a capacitor’s impedance with frequency determines its effectiveness in many applications. Phase Angle – Power Factor and Dissipation Factor are often confused since they are both measures of the loss in a capacitor under AC application and are often almost identical in value. In a “perfect” capacitor the current in the capacitor will lead the voltage by 90°. /H20849/H20849/H20849/H20849 General Description R L R C P S /H20881

In practice the current leads the voltage by some other phase angle due to the series resistance RS. The complement of this angle is called the loss angle and: Power Factor (P .F.) = Cos f or Sine /H9254 Dissipation Factor (D.F.) = tan /H9254 for small values of /H9254the tan and sine are essentially equal which has led to the common interchangeability of the two terms in the industry. Equivalent Series Resistance – The term E.S.R. or Equivalent Series Resistance combines all losses both series and parallel in a capacitor at a given frequency so that the equivalent circuit is reduced to a simple R-C series connection. Dissipation Factor – The DF/PF of a capacitor tells what percent of the apparent power input will turn to heat in the capacitor. The watts loss are: Watts loss= (2 π fCV2 ) (D.F.) Very low values of dissipation factor are expressed as their reciprocal for convenience. These are called the “Q” or Quality factor of capacitors. Parasitic Inductance – The parasitic inductance of capacitors is becoming more and more important in the decoupling of today’s high speed digital systems. The relationship between the inductance and the ripple voltage induced on the DC voltage line can be seen from the simple inductance equation: V = L di dt The seen in current microprocessors can be as high as 0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic inductance can cause a voltage spike of 30mV. While this does not sound very drastic, with the Vcc for microprocessors decreasing at the current rate, this can be a fairly large percentage. Another important, often overlooked, reason for knowing the parasitic inductance is the calculation of the resonant frequency. This can be important for high frequency, by- pass capacitors, as the resonant point will give the most signal attenuation. The resonant frequency is calculated from the simple equation: f res = 1 2/H9266LC Insulation Resistance – Insulation Resistance is the resistance measured across the terminals of a capacitor and consists principally of the parallel resistance R P shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the I.R. decreases and hence the product (C x IR or RC) is often specified in ohm farads or more commonly megohm-microfarads. Leakage current is determined by dividing the rated voltage by IR (Ohm’s Law). Dielectric Strength – Dielectric Strength is an expression of the ability of a material to withstand an electrical stress. Although dielectric strength is ordinarily expressed in volts, it is actually dependent on the thickness of the dielectric and thus is also more generically a function of volts/mil. Dielectric Absorption – A capacitor does not discharge instantaneously upon application of a short circuit, but drains gradually after the capacitance proper has been discharged. It is common practice to measure the dielectric absorption by determining the “reappearing voltage” which appears across a capacitor at some point in time after it has been fully discharged under short circuit conditions. Corona – Corona is the ionization of air or other vapors which causes them to conduct current. It is especially prevalent in high voltage units but can occur with low voltages as well where high voltage gradients occur. The energy discharged degrades the performance of the capacitor and can in time cause catastrophic failures. di dt /H9254 I (Ideal) I (Actual) Phase Angle Loss Angle V IRs f E.S.R. C /H20881

Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is:  Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this.  Pad overlap 0.5mm beneath component.  Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering. Case Size D1 D2 D3 D4 D5 REFLOW SOLDERING WAVE SOLDERING Component Spacing For wave soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of solder to penetrate properly into small spaces). This is less important for reflow soldering but sufficient space must be allowed to enable rework should it be required. Preheat & Soldering The rate of preheat should not exceed 4°C/second to prevent thermal shock. A better maximum figure is about 2°C/second. For capacitors size 1206 and below, with a maximum thickness of 1.25mm, it is generally permissible to allow a temperature differential from preheat to soldering of 150°C. In all other cases this differential should not exceed 100°C. For further specific application or process advice, please consult AVX. Cleaning Care should be taken to ensure that the capacitors are thoroughly cleaned of flux residues especially the space beneath the capacitor. Such residues may otherwise become conductive and effectively offer a low resistance bypass to the capacitor. Ultrasonic cleaning is permissible, the recommended conditions being 8 Watts/litre at 20-45 kHz, with a process cycle of 2 minutes vapor rinse, 2 minutes immersion in the ultrasonic solvent bath and finally 2 minutes vapor rinse. Case Size D1 D2 D3 D4 D5 Dimensions in millimeters (inches) ≥1mm (0.04) ≥1.5mm (0.06) ≥1mm (0.04) Component Pad Design

Recommended Soldering Profiles Recommended Reflow Profiles Time / secs Component Temperature / ºC 100 125 150 175 200 225 250 275 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420 Pb Free Recommended Pb Free Max with care Sn Pb Recommended REFLOW SOLDER PROFILES AVX RoHS compliant products utilize termination finishes (e.g.Sn or SnAg) that are compatible with all Pb-Free soldering systems and are fully reverse compatible with SnPb soldering systems. A recommended SnPb profile is shown for comparison; for Pb-Free soldering, IPC/JEDECJ- STD-020C may be referenced. The upper line in the chart shows the maximum envelope to which products are qualified (typically 3x reflow cycles at 260ºC max). The center line gives the recommended profile for optimum wettability and soldering in Pb-Free Systems. 125 175 225 275 0 50 100 150 200 250 300 350 400 Preheat Reflow Cool Down PreheatPreheat WaveWave Cool DownCool Down Component Temperature / ºC Time / seconds Recommended Soldering Profiles WAVE SOLDER PROFILES For wave solder, there is no change in the recommended wave profile; all standard Pb-Free (SnCu/SnCuAg) systems operate at the same 260ºC max recommended for SnPb systems. Preheat: This is more important for wave solder; a higher temperature preheat will reduce the thermal shock to SMD parts that are immersed (please consult individual product data sheets for SMD parts that are suited to wave solder). SMD parts should ideally be heated from the bottom-Side prior to wave. PTH (Pin through hole) parts on the topside should not be separately heated. Wave: 250ºC – 260ºC recommended for optimum solderability. Cool Down: As with reflow solder, cool down should not be forced and 6ºC/sec is recommended. Any air knives at the end of the 2nd wave should be heated. Preheat: The pre-heat stabilizes the part and reduces the temperature differential prior to reflow. The initial ramp to 125ºC may be rapid, but from that point (2-3)ºC/sec is recommended to allow ceramic parts to heat uniformly and plastic encapsulated parts to stabilize through the glass transition temperature of the body (~ 180ºC). Reflow: In the reflow phase, the maximum recommended time > 230ºC is 40secs. Time at peak reflow is 10secs max.; optimum reflow is achieved at 250ºC, (see wetting balance chart opposite) but products are qualified to 260ºC max. Please reference individual product datasheets for maximum limits Cool Down: Cool down should not be forced and 6ºC/sec is recommended. A slow cool down will result in a finer grain structure of the reflow solder in the solder fillet. IMPORTANT NOTE: Typical Pb-Free reflow solders have a more dull and grainy appearance compared to traditional SnPb. Elevating the reflow temperature will not change this, but extending the cool down can help improve the visual appearance of the joint. -0.40 -0.30 -0.20 -0.10 0.00 0.10 0.20 0.30 0.40 200 210 220 230 240 250 260 270 Temperature of Solder [C] F [mN] SnPb - Sn60Pb40 Sn - Sn60Pb40 Sn-Sn3.5Ag0.7Cu Sn-Sn2.5Ag1Bi0.5Cu Sn-Sn0.7Cu Preheat Reflow Cool Down Preheat Wave Cool Down Wetting Force at 2nd Sec. (higher is better)

The components should be stored in their “as received packaging” where possible. If the components are removed from their original packaging then they should be stored in an airtight container (e.g. a heat sealed plastic bag) with desiccant (e.g. silica gel). Storage area temperature should be kept between +5 degrees C and +30 degrees C with humidity < 70% RH. Storage atmosphere must be free of gas containing sulfur and chlorine. Avoid exposing the product to saline moisture or to temperature changes that might result in the formation of condensation. To assure good solderability performance we recommend that the product be used within 6 months from our shipping date, but can be used for up to 12 months. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas. Solderability Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds. Leaching Terminations will resist leaching for at least the immersion times and conditions shown below. Lead-Free Wave Soldering The recommended peak temperature for lead-free wave soldering is 250°C-260°C for 3-5 seconds. The other parameters of the profile remains the same as above. The following should be noted by customers changing from lead based systems to the new lead free pastes. a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. General Surface mounting chip multilayer ceramic capacitors are designed for soldering to printed circuit boards or other substrates. The construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods. Handling Chip multilayer ceramic capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of tweezers or vacuum pick ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Taped and reeled components provides the ideal medium for direct presentation to the placement machine. Any mechanical shock should be minimized during handling chip multilayer ceramic capacitors. Preheat It is important to avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore required. The rate of preheat should not exceed 4°C/second and a target figure 2°C/second is recommended. Although an 80°C to 120°C temperature differential is preferred, recent developments allow a temperature differential between the component surface and the soldering temper-ature of 150°C (Maximum) for capacitors of 1210 size and below with a maximum thickness of 1.25mm. The user is cautioned that the risk of thermal shock increases as chip size or temperature differential increases. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder to give a good joint should be used. Excessive solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling Natural cooling in air is preferred, as this minimizes stresses within the soldered joint. When forced air cooling is used, cooling rate should not exceed 4°C/second. Quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above. Cleaning Flux residues may be hygroscopic or acidic and must be removed. AVX MLC capacitors are acceptable for use with all of the solvents described in the specifications MIL-STD- 202 and EIA-RS-198. Alcohol based solvents are acceptable and properly controlled water cleaning systems are also acceptable. Many other solvents have been proven successful, and most solvents that are acceptable to other components on circuit assemblies are equally acceptable for use with ceramic capacitors. T ermination Type Solder Solder Immersion Time Tin/Lead/Silver Temp. °C Seconds Nickel Barrier 60/40/0 260 ± 5 30 ± 1

Once SMP components are soldered to the board, any bending or flexure of the PCB applies stresses to the soldered joints of the components. For leaded devices, the stresses are absorbed by the compliancy of the metal leads and generally don’t result in problems unless the stress is large enough to fracture the soldered connection. Ceramic capacitors are more susceptible to such stress because they don’t have compliant leads and are brittle in nature. The most frequent failure mode is low DC resistance or short circuit. The second failure mode is significant loss of capacitance due to severing of contact between sets of the internal electrodes. Cracks caused by mechanical flexure are very easily identified and generally take one of the following two general forms: Mechanical cracks are often hidden underneath the termination and are difficult to see externally. However, if one end termination falls off during the removal process from PCB, this is one indication that the cause of failure was excessive mechanical stress due to board warping. Type A: Angled crack between bottom of device to top of solder joint. Type B: Fracture from top of device to bottom of device.

To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is located. Solder Tip Solder Tip Preferred Method - No Direct Part Contact Poor Method - Direct Contact with Part No Stress Relief for MLCs Routed Cut Line Relieves Stress on MLC COMMON CAUSES OF MECHANICAL CRACKING The most common source for mechanical stress is board depanelization equipment, such as manual breakapart, v- cutters and shear presses. Improperly aligned or dull cutters may cause torqueing of the PCB resulting in flex stresses being transmitted to components near the board edge. Another common source of flexural stress is contact during parametric testing when test points are probed. If the PCB is allowed to flex during the test cycle, nearby ceramic capacitors may be broken. A third common source is board to board connections at vertical connectors where cables or other PCBs are connected to the PCB. If the board is not supported during the plug/unplug cycle, it may flex and cause damage to nearby components. Special care should also be taken when handling large (>6" on a side) PCBs since they more easily flex or warp than smaller boards. REWORKING OF MLCs Thermal shock is common in MLCs that are manually attached or reworked with a soldering iron. AVX strongly recommends that any reworking of MLCs be done with hot air reflow rather than soldering irons. It is practically impossible to cause any thermal shock in ceramic capacitors when using hot air reflow. However direct contact by the soldering iron tip often causes thermal cracks that may fail at a later date. If rework by soldering iron is absolutely necessary, it is recommended that the wattage of the iron be less than 30 watts and the tip temperature be <300ºC. Rework should be performed by applying the solder iron tip to the pad and not directly contacting any part of the ceramic capacitor.

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