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www.ti.com SNOSC04D –MAY 1998–REVISED MARCH 2013 LF444QuadLowPowerJFETInputOperationalAmplifier Check forSamples: LF444 1FEATURES DESCRIPTION The LF444 quad low power operationalamplifier 23• ¼ Supply Currentofa LM148: 200 μA/Amplifier providesmany ofthesame AC characteristicsas the(max) industrystandardLM148 whilegreatlyimprovingthe• Low InputBias Current:50 pA (max) DC characteristicsof the LM148. The amplifierhas
- High Gain Bandwidth: 1 MHz thesame bandwidth,slewrate,and gain(10kΩ load) as the LM148 and onlydraws one fourththe supply• High Slew Rate:1 V/μs currentof the LM148. In additionthe wellmatched• Low Noise VoltageforLow Power 35 nV/√Hz highvoltageJFET inputdevicesoftheLF444 reduce
- Low InputNoise Current0.01pA/√Hz the inputbias and offsetcurrentsby a factorof 10,000 over the LM148. The LF444 alsohas a very• High InputImpedance: 1012Ω low equivalentinputnoisevoltagefora low power• High Gain:50k (min) amplifier. The LF444 ispincompatiblewiththeLM148 allowing an immediate 4 times reductionin power drainin many applications.The LF444 should be used wherever low power dissipationand good electrical characteristicsarethemajorconsiderations. SimplifiedSchematic Connection Diagram Figure1.1/4Quad Figure2.PDIP/SOIC Package Top View See Package Number NAK0014D, D0014A or NFF0014A These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2BI-FETisa trademarkofTexas Instruments. 3Allothertrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNOSC04D –MAY 1998–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1)(2)(3) LF444A LF444 SupplyVoltage ±22V ±18V DifferentialInputVoltage ±38V ±30V InputVoltageRange (4) ±19V ±15V OutputShortCircuitDuration(5) Continuous Continuous Packages Power Dissipation(6)(7) 900 mW 670 mW Tjmax 150°C 115°C θjA (Typical) 100°C/W 85°C/W LF444A/LF444 OperatingTemperatureRange See (8) ESD Tolerance(9) Ratingtobe determined StorageTemperatureRange −65°C ≤ TA ≤ 150°C SolderingInformation Dual-In-LinePackages (Soldering,10 sec.) 260°C SmallOutlinePackage Vapor Phase (60sec.) 215°C Infrared(15sec.) 220°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.Operatingratingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits.ElectricalCharacteristicsstateDC and AC electrical specificationsunderparticulartestconditionswhichensurespecificperformancelimits.Thisassumes thatthedeviceiswithinthe OperatingRatings.Specificationsarenotensuredforparameterswhere no limitisgiven,however,thetypicalvalueisa good indication ofdeviceperformance. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) RefertoRETS444X forLF444MD militaryspecifications. (4) Unlessotherwisespecifiedtheabsolutemaximum negativeinputvoltageisequaltothenegativepower supplyvoltage. (5) Any oftheamplifieroutputscan be shortedtogroundindefinitely,however,more thanone shouldnotbe simultaneouslyshortedas the maximum junctiontemperaturewillbe exceeded. (6) Foroperatingatelevatedtemperature,thesedevicesmust be deratedbased on a thermalresistanceofθjA. (7) Max. Power Dissipationisdefinedby thepackage characteristics.OperatingthepartneartheMax. Power Dissipationmay cause the parttooperateoutsideensuredlimits. (8) The LF444A isavailableinboththecommercialtemperaturerange0°C ≤ TA ≤ 70°C and themilitarytemperaturerange−55°C ≤ TA ≤ 125°C. The LF444 isavailableinthecommercialtemperaturerangeonly.The temperaturerangeisdesignatedby thepositionjust beforethepackage typeinthedevicenumber.A “C ”indicatesthecommercialtemperaturerangeand an “M ”indicatesthemilitary temperaturerange.The militarytemperaturerangeisavailablein“NAK ”package only. (9) Human body model,1.5kΩ inserieswith100 pF. DC ElectricalCharacteristics(1) Symbol Parameter Conditions LF444A LF444 Units Min Typ Max Min Typ Max VOS InputOffsetVoltage R S = 10k,TA = 25°C 2 5 3 10 mV 0°C ≤ TA ≤ +70°C 6.5 12 mV −55°C ≤ TA ≤ +125°C 8 mV ΔVOS /ΔT AverageTC ofInputOffset R S = 10 kΩ 10 10 μV/°CVoltage IOS InputOffsetCurrent VS = ±15V (1)(2) Tj= 25°C 5 25 5 50 pA Tj= 70°C 1.5 1.5 nA Tj= 125°C 10 nA IB InputBiasCurrent VS = ±15V (1)(2) Tj= 25°C 10 50 10 100 pA Tj= 70°C 3 3 nA Tj= 125°C 20 nA (1) Unlessotherwisespecifiedthespecificationsapplyoverthefulltemperaturerangeand forVS = ±20V fortheLF444A and forVS = ±15V fortheLF444.VOS ,IB,and IOS aremeasured atVCM = 0. (2) The inputbiascurrentsarejunctionleakagecurrentswhichapproximatelydoubleforevery10°C increaseinthejunctiontemperature, Tj.Due tolimitedproductiontesttime,theinputbiascurrentsmeasured arecorrelatedtojunctiontemperature.Innormaloperationthe junctiontemperaturerisesabove theambienttemperatureas a resultofinternalpower dissipation,PD .Tj= TA + θjAPD where θjA isthe thermalresistancefromjunctiontoambient.Use ofa heatsinkisrecommended ifinputbiascurrentistobe kepttoa minimum.
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www.ti.com SNOSC04D –MAY 1998–REVISED MARCH 2013 DC ElectricalCharacteristics(1)(continued) Symbol Parameter Conditions LF444A LF444 Units Min Typ Max Min Typ Max R IN InputResistance Tj= 25°C 1012 1012 Ω AVOL LargeSignalVoltageGain VS = ±15V,VO = ±10V 50 100 25 100 V/mV R L = 10 kΩ,TA = 25°C Over Temperature 25 15 V/mV VO OutputVoltageSwing VS = ±15V,R L = 10 kΩ ±12 ±13 ±12 ±13 V VCM InputCommon-Mode ±16 +18 ±11 +14 V VoltageRange −17 −12 V CMRR Common-Mode R S ≤ 10 kΩ 80 100 70 95 dB RejectionRatio PSRR SupplyVoltage See (3) 80 100 70 90 dB RejectionRatio IS SupplyCurrent 0.6 0.8 0.6 1.0 mA (3) Supplyvoltagerejectionratioismeasured forbothsupplymagnitudesincreasingordecreasingsimultaneouslyinaccordancewith common practicefrom±15V to±5V fortheLF444 and from±20V to±5V fortheLF444A. AC ElectricalCharacteristics(1) Symbol Parameter Conditions LF444A LF444 Units Min Typ Max Min Typ Max Amplifier-to-Amplifier −120 −120 dB Coupling SR Slew Rate VS = ±15V,TA = 25°C 1 1 V/μs GBW Gain-BandwidthProduct VS = ±15V,TA = 25°C 1 1 MHz en EquivalentInputNoiseVoltage TA = 25°C, R S = 100Ω, 35 35 nV/√Hz f= 1 kHz in EquivalentInputNoiseCurrent TA = 25°C, f= 1 kHz 0.01 0.01 pA/√Hz (1) Unlessotherwisespecifiedthespecificationsapplyoverthefulltemperaturerangeand forVS = ±20V fortheLF444A and forVS = ±15V fortheLF444.VOS ,IB,and IOS aremeasured atVCM = 0. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LF444
SNOSC04D –MAY 1998–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics InputBias Current InputBias Current Figure3. Figure4. PositiveCommon-Mode Supply Current InputVoltageLimit Figure5. Figure6. NegativeCommon-Mode InputVoltageLimit PositiveCurrentLimit Figure7. Figure8.
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www.ti.com SNOSC04D –MAY 1998–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) NegativeCurrentLimit Output VoltageSwing Figure9. Figure10. Output VoltageSwing Gain Bandwidth Figure11. Figure12. Bode Plot Slew Rate Figure13. Figure14. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LF444
SNOSC04D –MAY 1998–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) Distortion vs UndistortedOutput Frequency VoltageSwing Figure15. Figure16. Open Loop Common-Mode Frequency Response RejectionRatio Figure17. Figure18. Power Supply EquivalentInput RejectionRatio Noise Voltage Figure19. Figure20.
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www.ti.com SNOSC04D –MAY 1998–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) Open Loop VoltageGain Output Impedance Figure21. Figure22. InverterSettlingTime Figure23. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LF444
SNOSC04D –MAY 1998–REVISED MARCH 2013 www.ti.com Pulse Response R L = 10 kΩ,C L = 10 pF Small SignalInverting Large SignalInverting Figure24. Figure25. Small SignalNon-Inverting Large SignalNon-Inverting Figure26. Figure27.
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www.ti.com SNOSC04D –MAY 1998–REVISED MARCH 2013 APPLICATION HINTS Thisdeviceisa quad low power op amp withJFET inputdevices(BI-FET™ ).These JFETs have largereverse breakdown voltagesfromgatetosourceand draineliminatingtheneed forclamps acrosstheinputs.Therefore, largedifferentialinputvoltagescan easilybe accommodated withouta largeincreasein inputcurrent.The maximum differentialinputvoltageisindependentofthesupplyvoltages.However,neitheroftheinputvoltages shouldbe allowedtoexceed thenegativesupplyas thiswillcause largecurrentstoflowwhich can resultina destroyedunit. Exceeding the negativecommon-mode limiton eitherinputwillforcethe outputto a high state,potentially causinga reversalofphase totheoutput.Exceedingthenegativecommon-mode limiton bothinputswillforce the amplifieroutputto a highstate.In neithercase does a latchoccursinceraisingthe inputback withinthe common-mode rangeagainputstheinputstageand thustheamplifierina normaloperatingmode. Exceedingthepositivecommon-mode limiton a singleinputwillnotchange thephase oftheoutput;however,if bothinputsexceed thelimit,theoutputoftheamplifierwillbe forcedtoa highstate. The amplifierswilloperatewitha common-mode inputvoltageequaltothepositivesupply;however,thegain bandwidthand slewratemay be decreasedinthiscondition.When thenegativecommon-mode voltageswings towithin3V ofthenegativesupply,an increaseininputoffsetvoltagemay occur. Each amplifierisindividuallybiasedto allownormal circuitoperationwithpower suppliesof ±3.0V.Supply voltageslessthanthesemay degradethecommon-mode rejectionand restricttheoutputvoltageswing. The amplifierswilldrivea 10 kΩ loadresistanceto±10V overthefulltemperaturerange.Iftheamplifierisforced todriveheavierloadcurrents,however,an increaseininputoffsetvoltagemay occuron thenegativevoltage swingand finallyreachan activecurrentlimiton bothpositiveand negativeswings. Precautionsshouldbe takentoensurethatthepower supplyfortheintegratedcircuitneverbecomes reversedin polarityorthattheunitisnotinadvertentlyinstalledbackwardsina socketas an unlimitedcurrentsurgethrough theresultingforwarddiodewithintheIC couldcause fusingoftheinternalconductorsand resultina destroyed unit. As withmost amplifiers,careshouldbe takenwithleaddress,component placementand supplydecouplingin ordertoensurestability.For example,resistorsfromtheoutputtoan inputshouldbe placedwiththebody close to the inputto minimize“pick-up” and maximize the frequencyof the feedback pole by minimizingthe capacitancefromtheinputtoground. A feedbackpoleiscreatedwhen the feedbackaround any amplifierisresistive.The parallelresistanceand capacitancefromtheinputofthedevice(usuallytheinvertinginput)toAC groundsetthefrequencyofthepole. Inmany instancesthefrequencyofthispoleismuch greaterthantheexpected3 dB frequencyoftheclosed loopgainand consequentlythereisnegligibleeffecton stabilitymargin.However, ifthefeedbackpoleisless thanapproximately6 timestheexpected3 dB frequencya leadcapacitorshouldbe placedfromtheoutputtothe inputoftheop amp. The valueoftheadded capacitorshouldbe such thattheRC timeconstantofthiscapacitor and theresistanceitparallelsisgreaterthanorequaltotheoriginalfeedbackpoletimeconstant. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LF444
SNOSC04D –MAY 1998–REVISED MARCH 2013 www.ti.com TypicalApplication Figure28. pH Probe Amplifier/TemperatureCompensator *ForR2 = 50k,R4 = 330k ±1% ForR2 = 100k,R4 = 75k ±1% ForR2 = 200k,R4 = 56k ±1% Polystyrene *FilmresistortypeRN60C To calibrate,insertprobeinpH =7 solution.Setthe“TEMPERATURE ADJUST ”pot,R2, tocorrespondtothesolution temperature:fullclockwisefor0°C, and proportionatelyforintermediatetemperatures,usinga turns-countingdial. Then set“CALIBRATE ”potso outputreads7V. Typicalprobe= IngoldElectrodes#465-35 DetailedSchematic Figure29. 1/4Quad
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www.ti.com SNOSC04D –MAY 1998–REVISED MARCH 2013
REVISION HISTORY
Changes from RevisionC (March 2013)toRevisionD Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LF444
www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LF444ACN NRND PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LF444ACN LF444ACN/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LF444ACN LF444CM NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LF444CM LF444CM/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LF444CM LF444CMX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LF444CM LF444CN NRND PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LF444CN LF444CN/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN | Call TI Level-1-NA-UNLIM 0 to 70 LF444CN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 1-Nov-2013 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LF444CMX/NOPB SOIC D 14 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
www.ti.com N14A (Rev G)
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