LF347N

LF347NE4 TI | Alldatasheet

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LF347, LF347B JFET-INPUT QUAD OPERATIONAL AMPLIFIERS SLOS013B – MARCH 1987 – REVISED AUGUST 1994 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Low Input Bias Current...5 0 p A T y p /C0068Low Input Noise Current 0.01 pA/√Hz Typ /C0068Low Total Harmonic Distortion /C0068Low Supply Current... 8 m A T y p /C0068Gain Bandwidth...3 MHz Typ /C0068High Slew Rate...1 3 V /µs Typ /C0068Pin Compatible With the LM348

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These devices are low-cost, high-speed, JFET-input operational amplifiers. They require low supply current yet maintain a large gain-bandwidth product and a fast slew rate. In addition, their matched high-voltage JFET inputs provide very low input bias and offset current. The LF347 and LF347B can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits. The LF347 and LF347B are characterized for operation from 0°C to 70°C. symbol (each amplifier) IN – IN + OUT AVAILABLE OPTIONS VIOmax PACKAGE TA VIOmax AT 25°C SMALL OUTLINE (D) PLASTIC DIP (N) 0°Ct o7 0°C 10 mV LF347D LF347N0°C to 70°C 5 mV LF347BD LF347BN The D packages are available taped and reeled. Add R suffix to the device type (e.g., LF347DR). absolute maximum ratings over operating free-air temperature range (unless otherwise noted) NOTE 1: Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage. Copyright  1994, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 1OUT 1IN – 1IN+ VCC+ 2IN+ 2IN– 2OUT 4OUT 4IN– 4IN + V CC – 3IN+ 3IN– 3OUT D OR N PACKAGE (TOP VIEW)

LF347, LF347B JFET-INPUT QUAD OPERATIONAL AMPLIFIERS SLOS013B – MARCH 1987 – REVISED AUGUST 1994

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR DERATE ABOVE T A TA = 70°C POWER RATING D N 608 mW 680 mW 7.6 mW/°C N/A 61°C N/A 608 mW 680 mW recommended operating conditions MIN MAX UNIT Supply voltage, VCC + 3.5 18 V Supply voltage, VCC – –3.5 –18 V electrical characteristics over operating free-air temperature range, VCC ± = ± 15 V (unless otherwise specified) PARAMETER TEST T † LF347 LF347B UNITPARAMETER CONDITIONS TA † MIN TYP MAX MIN TYP MAX UNIT VIO Input offset voltage VIC = 0, 25°C 5 10 3 5 mVVIO Input offset voltage IC , R S = 10 kΩ Full range 13 7 mV α VIO Average temperature coefficient of input offset voltage VIC = 0, R S = 10 kΩ 18 18 µV/°C IIO Inp t offset c rrent‡ VIC =0 25°C 25 100 25 100 pA IIO Input offset current‡ VIC = 0 70°C 4 4 nA IIB Inp t bias c rrent‡ VIC =0 25°C 50 200 50 200 pA IIB Input bias current‡ VIC = 0 70°C 8 8 nA VICR Common-mode input voltage range ± 11 –12 to ± 11 –12 to V VOM Maximum peak output voltage swingR L = 10 kΩ ± 12 ± 13.5 ± 12 ± 13.5 V AVD Large signal differential voltageVO = ± 10 V, 25°C 25 100 50 100 V/mVAVD Large-signal differential voltage O , R L = 2 kΩ Full range 15 25 V/mV ri Input resistance TA = 25°C 1012 1012 Ω CMRR Common-mode rejection ratio R S ≤ 2 kΩ 70 100 80 100 dB kSVR Supply-voltage rejection ratio See Note 2 70 100 80 100 dB ICC Supply current 8 11 8 11 mA † Full range is 0°C to 70°C. ‡ Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive. Pulse techniques must be used that will maintain the junction temperatures as close to the ambient temperature as possible. NOTE 2: Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously. operating characteristics, VCC ± = ± 15 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VO1 /VO2 Crosstalk attentuation f = 1 kHz 120 dB SR Slew rate 8 13 V/µs B1 Unity-gain bandwidth 3 MHz Vn Equivalent input noise voltage f = 1 kHz,R S = 20 Ω 18 nV/√Hz In Equivalent input noise current f = 1 kHz 0.01 pA/√Hz

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) LF347BD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347BDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347BDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347BDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347BDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347BDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347BN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LF347BNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LF347D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LF347N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LF347NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 Addendum-Page 1

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2011 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LF347BDR SOIC D 14 2500 333.2 345.9 28.6 LF347DR SOIC D 14 2500 333.2 345.9 28.6 PACKAGE MATERIALS INFORMATION www.ti.com 20-Aug-2011 Pack Materials-Page 2

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