LF2388B LITTELFUSE | Alldatasheet
Document overview
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Technical content
Features
Three floating high-side drivers in bootstrap operation to 600V 420mA source / 750mA sink output current capability Logic input 3.3V capability Internal deadtime of 315ns to protect MOSFETs Matched propagation delay time of 50ns maximum Outputs in phase with inputs Schmitt triggered logic inputs Cross conduction prevention logic Under Voltage Lockout (UVLO) for all channels Extended temperature range: -40°C to +125°C Space saving SOIC-20 package
Description
The LF2388B is a three-phase gate driver IC designed for high voltage three-phase applications, driving N-channel MOSFETs and IGBTs in a half-bridge configuration. The high voltage technology enables LF2388B high sides to switch to 600V in a bootstrap operation. LF2388B logic inputs are compatible with standard TTL and CMOS levels (down to 3.3V) to interface easily with controlling devices. The driver outputs feature high pulse current buffers designed for minimum driver cross conduction. LF2388B offers numerous protection functions. A shoot-through protection logic prevents both outputs being high with both inputs high (fault state), an undervoltage lockout for VCC shuts down all drivers through an internal fault control, and a UVLO for VBS shuts down the respective high side output. LF2388B is offered in SOIC 20 package and operates over the extended temperature range of -40 °C to +125 °C .
Ordering Information
Part# Package Pack / Qty Mark LF2388BTR SOIC-20 T&R / 1500 YYWW LF2388B LOT IDY
Applications
3-Phase Motor Inverter Driver White Goods - Air Conditioner, Washing Machine, Refrigerator Industrial Motor Inverter - Power Tools, Robotics General Purpose 3-Phase Inverter Year Year Week Week SOIC-20
3-Phase Half Bridge Gate Driver DS-LF2388B-R01 Typical Application VB1 VS1 HO1 VB2 VS2 HO2 VB3 VS3 HO3 LO1 LO3 LO2 LIN3 GND HIN3 LIN1 LIN2 HIN2 HIN1 VCC MCU 3-Phase BLDC Control VMOTOR M VCC
3-Phase Half Bridge Gate Driver DS-LF2388B-R01
1.1 Pin Diagrams
Top View: SOIC-20
1.2 Pin Descriptions
Pin# Pin Name Pin Type Pin Description 1, 3, 5 HIN1, HIN2, HIN3 Input Logic input for high-side gate driver output, in phase with HO. 2, 4, 6 LIN1, LIN2, LIN3 Input Logic input for low-side gate driver output, in phase with LO. 7, 13, 17 LO3, LO2, LO1 Output Low-side gate driver output 8, 14, 18 V S3 ,VS2 ,VS1 Power High-side floating supply return 9, 15, 19 HO3, HO2, HO1 Output High-side gate driver output 10, 16, 20 VB3 ,VB2 ,VB1 Power High-side floating supply
11 GND Power Low-side driver and logic return
12 VCC Power Low-side and logic fixed supply
1 Specifications
3-Phase Half Bridge Gate Driver DS-LF2388B-R01 Parameter Symbol Rating Unit Junction to ambient 0JA 85 oC/W
1.4 Thermal Characteristics
When mounted on a standard JEDEC 2-layer FR-4 board - JESD51-3 Parameter Symbol Min Max Unit High side floating supply voltage VB -0.3 +624 V High side floating supply offset voltage VS VB-24 VB+0.3 V High side floating output voltage VHO VS-0.3 VB+0.3 V Low side output voltage VLO -0.3 VCC+0.3 V Offset supply voltage transient dVS/dt -- 50 V/ns Low side fixed supply voltage VCC -0.3 +24 V Logic input voltage (HINx and LINx) VIN -0.3 5.5 V Package power dissipation PD -- 1.47 W Junction Operating Temperature TJ -- +150 oC Storage Temperature TSTG -55 +150 o C
1.3 Absolute Maximum Ratings
Unless otherwise specified all voltages are referenced to GND . All electrical ratings are at TA= 25 oC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
3-Phase Half Bridge Gate Driver DS-LF2388B-R01
1.5 Recommended Operating Conditions
Parameter Symbol Min Max Unit High side floating supply absolute voltage VB VS + 10 VS + 20 V High side floating supply offset voltage VS NOTE1 600 V High side floating output voltage VHO VS VB V Low side fixed supply voltage VCC 10 20 V Low side output voltage VLO 0 VCC V Logic input voltage (HINx and LINx) VIN 0 5 V Ambient temperature TA -40 125 °C Unless otherwise specified all voltages are referenced to GND NOTE1 High-side driver remains operational for VS transients down to -5V
3-Phase Half Bridge Gate Driver DS-LF2388B-R01 Parameter Symbol Conditions MIn Typ Max Unit Logic “1“ input voltage VIH NOTE2 2.4 -- -- V Logic “0 “ input voltage VIL -- -- 0.8 Logic input voltage hysteresis VIN(HYS) -- -- 0.9 -- High level output voltage, VBIAS - VO VOH IO = 2mA -- 0.2 0.5 Low level output voltage, VO VOL IO = 2mA -- 0.07 0.2 Offset supply leakage current ILK VB = VS = 600V -- -- 10 mA Quiescent VBS supply current IBSQ VIN = 0V or 5V -- 50 80 Operating VBS supply current IBSO fs = 20khz -- 400 -- Quiescent VCC supply current ICCQ VIN = 0V or 5V -- 230 330 Operating VCC supply current ICCO fs = 20khz -- 500 -- Logic “1” input bias current IIN+ VIN = 5V -- 25 80 Logic “0” input bias current IIN- VIN = 0V -- -- 2 Input pull-down resistance RIN -- -- 200 -- kW VCC , VBS UVLO off, positive going threshold VUV+ -- 7.1 8.5 9.9 VVCC , VBS UVLO enable, negative going threshold VUV- -- 6.7 8.1 9.5 UVLO hysteresis VUV(HYS) -- -- 0.4 -- Output high, short circuit pulsed current IO+ VO = 0V, t ≤ 10 ms 270 420 -- mA Output low, short circuit pulsed current IO- VO = 15V, t ≤ 10 ms 600 750 -- NOTE2 For optimal operation, it is recommended the input pulse (to HINx and LINx) MUST have a minimum amplitude of 2.4V with a minimum pulse width of 600ns. The VIN and IIN parameters are referenced to GND and are applicable to all six channels (HIN1,2,3 and LIN1,2,3). The VO and IO parameters are applicable to the outputs (HO1,2,3 and LO1,2,3 and are referenced to GND. VCC= VBS=15V, TA = 25 °C and VGND = 0V , unless otherwise specified.
1.6 DC Electrical Characteristics
3-Phase Half Bridge Gate Driver DS-LF2388B-R01 Parameter Symbol Conditions Min Typ Max Unit Turn-on propogation delay ton VS = 0V 70 120 170 ns Turn-off propogation delay toff VS = 0V 70 120 170 Turn-on rise time tr VS = 0V -- 45 75 Turn-off fall time tf -- 25 40 Propagation delay matching tDM -- -- -- 50 Deadtime tDT -- 200 315 430 Deadtime matching tDTM -- -- -- 50
1.7 AC Electrical Characteristics
VCC=VBS = 15V, CL = 1000pF, and TA = 25 °C , unless otherwise specified.
3-Phase Half Bridge Gate Driver DS-LF2388B-R01
2 Functional Description
2.1 Functional Block Diagram
R S UVLO HV Level ShiftPulse Gen Delay High Voltage Well VB1 VS1 Vcc HO1 LIN1 HIN1 VCC VCC LO1 GND U Phase Driver V Phase Driver W Phase Driver VB2 VS2 HO2 LO2 VB3 VS3 HO3 LO3 Input Noise Filters Shoot- through prevention Deadtime Schmitt Inputs HIN2 LIN2 LIN3 HIN3 UVLO 200k 200k 200k 200k 200k 200k
2.2 Timing Waveforms
Figure 1. Input-to-Output Delay Timing Figure 2. Deadtime Waveform Dagram
2.3 Application Information
capacitance and drive current of gate driver; 10Ω is used in this example. amplitude of 2.4V and a minimum pulse width of 600ns. capacitance and drive current of gate driver; 50Ω is used in this example. greater than system operating voltage. Figure 3. LF2388B in a 3 phase motor drive application.
3 Performance Data
Figure 4. Turn On Propagation delay vs Supply Voltage Figure 5. Turn On Propagation delay vs Temperature Figure 6. Turn Off Propagation delay vs Supply Voltage Figure 7. Turn Off Propagation delay vs Temperature Unless otherwise noted VCC= VBS =15V, TA = 25 °C, VGND = 0V and values are typical.
Figure 28. Offset Supply Leakage Current vs Temperature
3-Phase Half Bridge Gate Driver DS-LF2388B-R01 DeviceDevice Moisture Sensitivity Level (MSL) Moisture Sensitivity Level (MSL) ClassificationClassification LF2388B MSL3
4 Manufacturing Information
4.1 Moisture Sensitivity
This product is ESD SensitiveESD Sensitive, and should be handled according to the industry standard JESD-625JESD-625.
4.2 ESD Sensitivity
4.3 Reflow Profile
DeviceDevice Classification Classification Temperature(Tc)Temperature(Tc) Dwell Time (tp)Dwell Time (tp) Max Max Reflow CyclesReflow Cycles LF2388B 260oC 30 seconds 3 All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Littelfuse Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL)Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.IPC/JEDEC J-STD-033. Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.
3-Phase Half Bridge Gate Driver DS-LF2388B-R01
4.4 Board Wash
Littelfuse recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash param- eters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultra- sonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
3-Phase Half Bridge Gate Driver DS-LF2388B-R01
5 Package Dimensions: SOIC-20
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. Specification: DS-LF2388B_R01 ©Copyrigh t 2021, Littelfuse , Inc. All rights reserv ed. Printed in USA. 09 / 30 /2021 MIN 0.10 2.25 0.97 0.35 0.34 0.25 0.24 12.70 10.10 7.40 0.70 MILLIMETER NOM 2.30 1.02 0.37 0.25 12.80 10.30 7.50
1.27 BSC
1.40 REF
2.65 0.30 2.35 1.07 0.43 0.40 0.29 0.26 12.90 10.50 7.60 1.00 SYMBOL A b c D E e L θ A D b e EE1 B B c L L1 0.25 θ b c1 c Section B-B BASE MET AL PLA TING Pin 1 7.40 1.910.61 PCB Land Pattern e