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Document overview

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Technical content

  • 7.8 mm x 7.0 mm x 5.0 mm shielded drum core
  • Ferrite core material
  • Metalized core mounting utilizes board space
  • Inductance range from 0.82 µH to 470 µH
  • Current range from 0.368 A to 8.57 A
  • Frequency range up to 1 MHz

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant LDS0705 Shielded metalized drum core power inductors
  • Buck or Boost Inductor
  • Noise filtering and output filter chokes
  • Battery Power, DC-DC converters
  • Notebook and laptop power
  • Hand held devices
  • Media players SMD Device Environmental data Pb HALOGEN HFFREE Discontinued, Effective October 31, 2018 or until inventory is depeleted. No replacement available. DRA74-R possible alternate solution.

Shielded metalized drum core power inductors www.eaton.com/electronics Product specifications Part Number Rated OCL (1) Irms(2) Isat (3) DCR (Ω) K-factor Inductance µH (A) (A) @+20 °C (4) (µH) (Typical) (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 V, 0.0 Adc. (2) Irms: DC current for an approximate ∆T of 30 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. (3) Isat Amperes peak for approximately 15% rolloff (@+25 ° C) (4) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in µH), ∆(Peak to peak ripple current in Amps). (5) Part Number Definition: LDS0705-xxx-R LDS0705 = Product code and size; -xxx = Inductance value in uH; R = decimal point; If no R is present, last character equals number of zeros. M = Inductance tolerance +/- 20% -R suffix = RoHS compliant Marking: xxx = Inductance in uH. R = decimal point. If no R is present last character equals number of zeros. wwllyy = Date code, R = Revision level. Do n ot route traces or vias underneath the inductor RECOMMENDED PCB LAYOUT SCHEMATIC TOP VIEW XXX wwllyy R SIDE VIEWBOTTOM VIEW 7.0±0.2 7.8±0.2 5.0 Max. 7.0 3.0 2.0 2.0 Typ. Dimensions- mm Packaging information- mm Parts packaged on 13" Diameter reel, 1,000 parts per reel. Discontinued, Effective October 31, 2018 or until inventory is depeleted. No replacement available. DRA74-R possible alternate solution.

3www.eaton.com/electronics Technical Data 4142 Effective July 2017 LDS0705 Shielded metalized drum core power inductors Temperature rise vs. total loss Core loss vs Bp-p

1 MHz

0.0001 0.001 0.01 0.1 100 1 10 100 1000 Bp-p (mT) Core Loss (W) Inductance characteristics Tot al Loss (W) Temperature Rise (°C) OCL vs. Isat 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 120% 0% 20% 40% 60% 80% 100% 120% 140% 160% 180% 200% % of Isat % of OCL -40 Discontinued, Effective October 31, 2018 or until inventory is depeleted. No replacement available. DRA74-R possible alternate solution.

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4142 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4142 Effective July 2017 LDS0705 Shielded metalized drum core power inductors Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Discontinued, Effective October 31, 2018 or until inventory is depeleted. No replacement available. DRA74-R possible alternate solution.