LDP24A STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
April 2000 - Ed: 4B 1/5 AG (Plastic) Symbol Parameter Value Unit VPP Peak pulse load dump overvoltage See note 1 Tamb = 85°C 100 V P Power dissipation on infinite heatsink T amb = 100°C 5 W IFSM Non repetitive surge peak forward current. Tjinitial = 25°C t p=1 0m s 500 A Tstg Storage temperature range. - 65 to + 175 °C Tj Maximum operating temperature 175 °C TL Maximum lead temperature for soldering during 10 sec at 4 mm from case. 230 °C ABSOLUTE RATINGS (limiting values)
DESCRIPTION
Transient voltage suppressor diodes especially useful in protecting integrated circuits, MOS, hy- brids and other overvoltages sensitive semicon- ductors and components. /B6e TRANSIENT VOLTAGE SUPPRESSOR DIODE ESPECIALLY DESIGNED FOR LOAD DUMP PROTECTION /B6e COMPLIANT WITH MAIN STANDARDS SUCH AS: ISO / DTR 7637
FEATURES
Symbol Parameter Value Unit R th(j-a) Junction ambient thermal resistance on infinite heatsink Llead=1 0m m 15 °C/W THERMAL RESISTANCES Note 1:For surges greater than the maximum values, the diode will present a short-circuit Anode - Cathode. ® LDP24A LOAD DUMP TRANSIENT PROTECTION
I IF V F VVCL VBR V RM IPP IRM V Symbol Parameter VRM Stand-off voltage. VBR Breakdown voltage. VCL Clamping voltage. IPP Peak pulse current. α T Temperature coefficient of VBR . C Capacitance IRM Leakage current at VRM VF Peak forward voltage drop (IFM = 10A) VF = 0.9 Volt Typ.
ELECTRICAL CHARACTERISTICS
Symbol Test Conditions Min. Typ. Max. Unit Ipp Pulse duration: 300ms 30 A IRM TL = 25°C TL = 85°C VRM =2 4V VRM =2 4V 300 µA µA VBR TL = 25°C I R = 1mA 25 32 V VCL TL = 85°C see table1 40 V α T 10 10 -4/°C C F = 1MHz V R = 0V 8000 pF LOAD DUMP TEST GENERATOR CIRCUIT (SCHAFFNER NSG 506 C). Issued from ISO / DTR 7637. Impulse N°5 Vs (V) 86.5 Vbat (V) 13.5 Ri (Ω ) 2 t (ms) 200 (*) tr (ms) <10 Number 5 60s between each pulse (*) Generator setting Table 1 U(V) t Vbat 90% Vs 10% t tr offset 10% / 13.5V Open circuit (voltage curve) (Pulse test n°5)
1 2 5 10 20 50 1000.1 0.2 0.5 1.0 2.0 5.0 10.0 tp(ms) Ppp(kW) Fig. 1:Peak pulse power versus exponential pulse duration (Tj initial=85°C). 1 2 5 10 20 50 10010 100 200 tp(ms) Ipp(A) Fig. 2 :Peak pulse current versus exponential pulse duration (Tj initial=85°C). 0 25 50 75 100 125 150 175 2000.0 0.2 0.4 0.6 0.8 1.0 1.2 Tj (°C) Ppp[Tj] / Ppp [Tj initial=85°C] Fig. 3:Relative variation of peak pulse power versus junction temperature. 0 25 50 75 100 125 150 1750 Tamb(°C) P(W) Rth(j-a)=Rth(j-l) Rth(j-a)=50°C/W Fig. 4:Continous power dissipation versus ambient temperature. 1E-2 1E-1 1E+0 1E+1 1E+2 1E+30.1 1.0 10.0 100.0 tp(s) Zth(j-a)(°C/W) Lleads=10mm Fig. 5:Variation of thermal impedance junction to ambient versus pulse duration (printed circuit board FR4, e(Cu)=35µm, SCu=1cm 2). 100 200 VFM(V) IFM(A) Tj=125°C Tj=25°C Fig. 6 :Peak forward voltage drop versus peak forward current (typical values).
VR(V) C(nF) F=1MHz Vosc=30mV Fig. 8:Junction capacitance versus reverse applied voltage. 10 20 50 100100 200 500 1000 2000 5000 tp(ms) IFSM(A) , I²t(A²s) Tj initial=25°C IFSM I²t Fig. 7:Non repetitive surge peak forward current versus sinusoidal pulse duration and correspond- ing value of I 2t. LDP 24 A Load Dump Protection Stand Off Voltage AG Case ORDER CODE
AG (Plastic) REF. DIMENSIONS NOTESMillimeters Inches Min. Max. Min. Max. A 9 0.354 1- The lead is not controlled within zone L1. 2- The minimum axial length within which the device may be placed bent at right angles is 0.79" (20 mm). B 20 0.787 ∅ C 8 0.315 ∅ D 1.35 1.45 0.053 0.057 L1 1.27 0.050 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2000 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com Type Marking Package Weight Base qty Delivery mode LDP24A LDP24A AG 2.16g 100 Ammopack LDP24ARL LDP24A AG 2.16g 1000 Tape & Reel /B6e Resin meets UL94-V0