LDECD3470JA5N00

LDECD3470JA5N00 KEMET | Alldatasheet

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Short guide to main applications Device Application Arcotronics SMD Film proposal Main Competitors SMD Film advantages TELECOM Mobile phone A/D converter LDB series Ceramic NP0 - Low Lock-up time - Narrow tolerance - No cracking PLL filtering Bluetooth ® PLL filtering LDB series Ceramic NP0 Modem DMT modulation / demodulation LDE / LDB series Ceramic NP0 Base station Filtering LDE / LDB series Ceramic X7R - High stability vs. frequency and temperature - High reliability - No cracking Line Card Input filtering LDE series Ceramic NP0 Splitter Filtering LDE series Ceramic X7R AUTOMOTIVE Wiper Noise suppression LDE series Ceramic X7R - High stability vs. frequency and temperature - High reliability - Low ESR - No cracking Driver information & car entertainment Filtering, timing, coupling and decoupling LDE series Ceramic X7R Tire pressure monitoring system Resonant circuit LDE series Ceramic X7R CONSUMER DC/DC converter Input / output filtering LDE series Ceramic X7R - High reliability - Low ESR - No cracking LCD Monitor Inverter unit LDE series Ceramic X7R - High stability vs. frequency and temperature - High reliability - No cracking DVD player Filtering LDB series Ceramic NP0 PDA Inverter unit LDB series Ceramic NP0 Hi-Fi systems Filtering LDE / LDB series Ceramic X7R Description: - Non-encapsulated construction - Stacked technology - Metallized PEN (PolyEthylene Naphtalate) in LDE series - Metallized PPS (PolyPhenylene Sulfide) in LDB series - RoHS 6 compliant (no hazardous materials) Features: - Excellent stability vs. temperature, frequency and time - Self-healing - High reliability - Low ESR (Equivalent Series Resistance) - Typical failure mode at the end of life: open circuit - No piezoelectric effect - No cracking - No VCC (Voltage Coefficient of Capacitance) SMD Film Capacitors are complementary to MLCCs for professional applications.

The part number is composed of 15 digits: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Digit 1 to 3 Series code. Digit 4 D.C. rated voltage: (VR) C = 50 VDC D = 63 VDC E = 100 VDC I = 250 VDC M = 400 VDC P = 630 VDC Q = 1000 VDC (new version) Digit 5 Size code (customized sizes available upon request) A B C D E F G H Digit 6 to 9 Capacitance value Digits 7 - 8 - 9 indicate the first three numbers of the capacitance value, digit 6 indicates the number of zeros that must be added to obtain the rated capacitance in pF. Digit 10 Capacitance tolerance Standard: K = ± 10 % M = ± 20 % (J = ±5% available upon request and review of project/application) Digit 11 Dielectric code A = PEN Digit 12 Version 5 = standard 0 = miniature A to Z = special Digit 13 Packaging N = taped A to Z = special Digit 14 Internal use Digit 15 0 (used in LDE RoHS 6 series only) Product packaging LDB series - RoHS 6 The part number is composed of 14 digits: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Digit 1 to 3 Series code. Digit 4 D.C. rated voltage: (VR) A = 16 VDC C = 50 VDC Digit 5 Size code 12.06 12.10 18.12 A B C Digit 6 to 9 Capacitance value Digits 7 - 8 - 9 indicate the first three numbers of the capacitance value, digit 6 indicates the number of zeros that must be added to obtain the rated capacitance in pF. Digit 10 Capacitance tolerance Digit 11 Dielectric code C = PPS Digit 12 Version 5 = standard A to Z = special Digit 13 Packaging N = taped A to Z = special Digit 14 Internal use Size code Carrier tape code Carrier tape dimensions Reel dimensions Packaging quantities (pcs per reel) [mm] [mm] [mm] W [mm] P [mm] T [μm] Ø [mm] [mm] [mm] 12.06 - 2.00 3.80 1.30 8 4 250 180 8 12 3000 12.10 - 3.00 3.80 2.10 8 4 250 180 8 12 2250 18.12 a 3.80 5.30 2.00 12 8 300 330 12 16 4000 b 3.90 5.20 2.60 3000 22.20 a 5.50 6.50 2.90 12 8 250 330 12 16 3000 b 3.80 2250 c 4.90 1750 28.24 a 6.60 7.90 3.80 16 8 300 330 16 20 2250 b 4.60 1750 c 5.50 1500 40.30 a 8.60 11.00 3.80 16 12 300 330 16 20 1500 b 4.60 1250 c 5.80 1000 50.40 a 10.90 13.50 3.80 24 12 250 330 24 28 1500 b 10.90 4.70 1250 c 11.00 5.90 1000 60.54 a 14.40 16.00 4.30 24 16 300 330 24 28 1000 b 5.10 300 750 c 5.80 300 750 In accordance with IEC 60286-3 Materials: - carrier tape: antistatic material - cover tape: polyester + polythene - reel: recyclable polystyrene All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1. SMD Film Capacitor (top view) Tape Reel

PEN and PPS dielectrics typical temperature graphs PEN Capacitance vs. temperature (f = 1 kHz) PPS Capacitance vs. temperature (f = 1 kHz) -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -60 -40 -20 0 20 40 60 80 100 120 140 $C/C [%] T [°C] Dissipation factor vs. temperature (f = 1 kHz) Dissipation factor vs. temperature (f = 1 kHz) Insulation resistance vs. temperature Insulation resistance vs. temperature

PEN and PPS dielectrics typical frequency graphs Note: measurements performed at T = 25 ± 5 °C PEN PPS Capacitance vs. frequency Capacitance vs. frequency Dissipation factor vs. frequency Dissipation factor vs. frequency Equivalent Series Resistance vs. frequency Equivalent Series Resistance vs. frequency PEN and PPS Impedance vs. frequency

cap.

50 VDC / 40 VAC 63 VDC / 40 VAC 100 VDC / 63 VAC 250 VDC / 120 VAC

cap.Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number 1500 pF 1500 pF 1800 pF 1800 pF 2200 pF 2200 pF 2700 pF 2700 pF 3300 pF 3300 pF 3900 pF 3900 pF 4700 pF 4700 pF 5600 pF 5600 pF 6800 pF 6800 pF 8200 pF 8200 pF 0.010 µF 0.010 µF 0.012 µF 0.012 µF 0.015 µF 0.015 µF 0.018 µF 0.018 µF 0.022 µF 0.022 µF 0.027 µF 0.027 µF 0.033 µF 12.06 3000 1.2 *LDECA2330 - A0 - - 0 12.06 3000 1.2 *LDEDA2330 - A0 - - 0 0.039 µF 0.039 µF 0.047 µF 0.047 µF LDE series - PEN dielectric RoHS 6 LOW VOLTAGE (capacitance range: 1000 pF to 0.047 µF) Standard and miniature versions * only K and M tolerances available Tolerance - Standard: K = ±10%; M = ±20%; (J = ±5% available upon request and review of project/application) Packaging - N = Taped; A to Z = Special; Internal use L (mm) 3.3 +0.3 - 0.1 3.3 +0.3 - 0.1 4.7 +0.3 P/N 5 th digit A B C D E F G H Lead Free

L (mm) 3.3 +0.3 - 0.1 4.7 +0.3 P/N 5 th digit B C D E F G H LDE series - PEN dielectric RoHS 6 LOW VOLTAGE (capacitance range: 0.056 µF to 4.7 µF) Standard and miniature versions Rated cap.

50 VDC / 40 VAC 63 VDC / 40 VAC 100 VDC / 63 VAC 250 VDC / 120 VAC Rated

cap.Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number 0.056 µF 0.056 µF 12.10 2250 1.7 LDECB2560 - A0 - - 0 12.10 2250 1.7 LDEDB2560 - A0 - - 0 0.068 µF 0.068 µF 12.10 2250 2.0 LDECB2680 - A0 - - 0 12.10 2250 2.0 LDEDB2680 - A0 - - 0 0.082 µF 0.082 µF 0.10 µF 0.10 µF 0.12 µF 0.12 µF 22.20 1750 4.4 LDEID3120 - A0 - - 0 0.18 µF 0.18 µF 28.24 1750 4.4 LDEIE3180 - A0 - - 0 0.22 µF 0.22 µF 28.24 1500 5.2 LDEIE3220 - A0 - - 0 0.39 µF 0.39 µF 22.20 2250 3.7 LDEED3390 - A0 - - 0 40.30 1000 5.0 LDEIF3390 - A0 - - 0 0.47 µF 0.47 µF 22.20 1750 4.4 LDEED3470 - A0 - - 0 40.30 1000 5.5 LDEIF3470 - A0 - - 0 0.56 µF 0.56 µF 40.30 1000 5.5 LDEIF3560 M A0 - - 0 0.68 µF 0.68 µF 50.40 1000 5.2 LDEIG3680 - A0 - - 0 0.82 µF 0.82 µF 1.0 µF 1.0 µF 1.2 µF 1.2 µF 40.30 1500 3.7 LDEEF4120 - A0 - - 0 60.54 750 5.4 LDEIH4120 - A0 - - 0 1.5 µF 1.5 µF 1.8 µF 1.8 µF 2.2 µF 2.2 µF 2.7 µF 2.7 µF 3.3 µF 3.3 µF 3.9 µF 3.9 µF 40.30 1000 5.5 LDECF4390 - A0 - - 0 40.30 1000 5.5 LDEDF4390 - A0 - - 0 4.7 µF 4.7 µF 50.40 1250 4.1 LDECG4470 - A0 - - 0 50.40 1250 4.1 LDEDG4470 - A0 - - 0 * only K and M tolerances available Lead Free Tolerance - Standard: K = ±10%; M = ±20%; (J = ±5% available upon request and review of project/application) Packaging - N = Taped; A to Z = Special; Internal use

LDE series - PEN dielectric RoHS 6 HIGH VOLTAGE (capacitance range: 1000 pF to 0.47 µF) Standard and miniature versions * only K and M tolerances available ** up to 230 VAC for maximum 30 minutes Rated cap.

400 VDC / 160 VAC ** 630 VDC / 200 VAC 1000 VDC / 250 VAC

cap.Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number 1000 pF 22.20 3000 1.9 LDEPD1100 - A5 - - 0 22.20 3000 1.9 LDEQD1100 - A5 - - 0 1000 pF 1200 pF 22.20 3000 2.0 LDEPD1120 - A5 - - 0 22.20 3000 2.0 LDEQD1120 - A5 - - 0 1200 pF 1500 pF 22.20 3000 2.3 LDEPD1150 - A5 - - 0 22.20 3000 2.3 LDEQD1150 - A5 - - 0 1500 pF 1800 pF 22.20 3000 2.5 LDEPD1180 - A5 - - 0 22.20 3000 2.5 LDEQD1180 - A5 - - 0 1800 pF 2200 pF 22.20 3000 2.0 LDEPD1220 - A5 - - 0 22.20 3000 2.0 LDEQD1220 - A5 - - 0 2200 pF 2700 pF 22.20 3000 2.3 LDEPD1270 - A5 - - 0 22.20 3000 2.3 LDEQD1270 - A5 - - 0 2700 pF 3300 pF 22.20 3000 2.6 LDEPD1330 - A5 - - 0 22.20 3000 2.6 LDEQD1330 - A5 - - 0 3300 pF 3900 pF 22.20 3000 1.9 LDEPD1390 - A5 - - 0 22.20 2250 3.0 LDEQD1390 - A5 - - 0 3900 pF 4700 pF 22.20 3000 2.0 LDEPD1470 - A5 - - 0 22.20 2250 3.4 LDEQD1470 - A5 - - 0 4700 pF 5600 pF 22.20 3000 2.0 LDEPD1560 - A5 - - 0 22.20 1750 3.9 LDEQD1560 - A5 - - 0 5600 pF 6800 pF 22.20 3000 2.3 LDEPD1680 - A5 - - 0 22.20 1750 4.4 LDEQD1680 - A5 - - 0 6800 pF 8200 pF 22.20 3000 2.6 LDEPD1820 - A5 - - 0 28.24 2250 2.9 LDEQE1820 - A5 - - 0 8200 pF 0.10 µF 40.30 1000 5.5 *LDEPF3100 - A0 - - 0 0.33 µF 50.40 1000 5.6 LDEMG3330 - A5 - - 0 0.33 µF 0.39 µF 60.54 1000 4.2 LDEMH3390 - A5 - - 0 0.39 µF 0.47 µF 60.54 750 4.8 LDEMH3470 - A5 - - 0 0.47 µF Lead Free Suitable for xDSL ITU compliant version available upon request Tolerance - Standard: K = ±10%; M = ±20%; (J = ±5% available upon request and review of project/application) Packaging - N = Taped; A to Z = Special; Internal use P/N 5th digit D E F G H

LDE series - PEN dieletric RoHS 6 - technical data Plates Aluminium layer deposited by evaporation under vacuum. Winding Non inductive - Stacked technology. Terminations Four layers: aluminium, brass, nickel, pure tin. Marking On packaging only. Climatic category 55 / 125 / 56 Electrical data Operating temperature range -55 to +125 °C Rated voltage (VR) 50 - 63 - 100 - 250 - 400 - 630 - 1000 VDC Category voltage (VC) VC = VR up to 105 °C. For temperatures between 105 and 125 °C a decreasing factor of 1.25% per degree °C has to be applied on the rated voltage (D.C. and A.C.) Size range 12.06 to 60.54 (customized sizes available upon request) Capacitance range 1000 pF to 4.7 μF Capacitance values E12 series Capacitance tolerances Standard: K = ± 10 % M = ± 20 %; (J = ±5% available upon request and review of project/application) Dissipation factor (tgδ) ≤ 0.8 % (T = 25 ± 5 °C; f = 1 kHz) Dielectric absorption 0.8% Insulation resistance ≥ 1 GΩ for C ≤ 0.33 μF ≥ 400 s for C > 0.33 μF Test conditions: T = 25 ± 5 °C; charging time: 1 min. Charging voltage: 10 V DC for VR < 100 VDC

100 VDC for VR ≥ 100 VDC

1.4 x VR (2 s; T = 25 ± 5 °C) for VR ≤ 630 VDC 1.5 x VR (2 s; T = 25 ± 5 °C) for VR = 1000 VDC Maximum dv / dt 100 V / μs for VR ≤ 630 VDC

300 V / μs for VR = 1000 VDC

(40°C/93% R.H.; 56 days) IR ≥ 50% of the limit value Endurance (125 °C; 2000 h; 1.25 x V IR ≥ 50% of the limit value Rapid change of temperature (1h at -55 °C;1h at +125 °C; 1000 cycles) │∆C/C│≤ 5% │∆tgδ│≤ 50 x 10-4 IR ≥ limit value No mechanical damage Reflow (as per reflow recommendations, see page 14) │∆C/C│≤ 3% │∆tgδ│≤ 50 x 10 IR ≥ limit value No mechanical damage Bending (1 to 6 mm deflection) │∆C/C│≤ 1% No visible damage on the terminations (pealing) neither on the body (cracking) Long term stability (2 years) │∆C/C│≤ 3% for sizes ≤ 22.20 │∆C/C│≤ 2% for sizes > 22.20 Reliability (REF MIL HDBK 217) Failure rate ≤ 1 Fit

1 Fit = 10

-9 failures / (components * hours) When a capacitor is used in A.C. applications at high frequency, the consequent internal heating may cause the risk of smoke or fire. This is due to the high current flowing through the capacitor’s Equivalent Series Resistance. The formula to calculate the maximum power [W] dissipated by the capacitor is the following: (N: number of significant harmonics) The formula to calculate the maximum power [W] that can be dissipated by the capacitor is the following: It must be: Pc max ≤ Pclim Please refer to the table and graph below for ∆Tlim and Rth values (Th: maximum ambient temperature surrounding the capacitor or hottest contact point - i.e. tracks - whichever is higher, in the worst operating conditions in °C) Hmax [mm] Rth [°C/W] 175 165 157 151 135 128 122 114 108 103 Size 40.30 50.40 60.54 Hmax [mm] Rth [°C/W] 93 88 84 75 70 66 58 55 52 Dissipation (A.C. applications) i N i= i i rms ii N δ δ i rms (f tgC f I (ftg C f VPc max max _max ** 2 * * 2 * )=

LDE series - PEN dielectric RoHS 6 MAxIMUM VRMS and IRMS vs. frequency (50 - 63 - 100 - 250 VDC rated voltage) (Sinusoidal wave form / Th* ≤ 85°C) Note: measurements performed in free air condition *Th: maximum ambient temperature surrounding the capacitor or hottest contact point - i.e. tracks - whichever is higher, in the worst operating conditions in °C

LDE series - PEN dielectric RoHS 6 MAxIMUM VRMS and IRMS vs. frequency (400 - 630 - 1000 VDC rated voltage) (Sinusoidal wave form / Th* ≤ 85°C) Note: measurements performed in free air condition *Th: maximum ambient temperature surrounding the capacitor or hottest contact point - i.e. tracks - whichever is higher, in the worst operating conditions in °C

16 VDC 50 VDC Rated

capacitanceSize code Pcs per reel Hmax [mm] Part number Size code Pcs per reel Hmax [mm] Part number 3300 pF 12.06 3000 1.1 LDBCA1330 - C5 - - 3300 pF 3900 pF 12.06 3000 1.1 LDBCA1390 - C5 - - 3900 pF 4700 pF 12.06 3000 1.1 LDBCA1470 - C5 - - 4700 pF 5600 pF 12.06 3000 1.1 LDBCA1560 - C5 - - 5600 pF 6800 pF 12.06 3000 1.1 LDBCA1680 - C5 - - 6800 pF 8200 pF 12.06 3000 1.1 LDBCA1820 - C5 - - 8200 pF 0.010 µF 12.06 3000 1.1 LDBCA2100 - C5 - - 0.010 µF LDB series - PPS dielectric RoHS 6 Tolerance - G = ±2%; J = ±5%; Packaging - N = Taped; A to Z = Special; Internal use ±2% Tolerance available Lead Free Standard version Size code 12.06 12.10 18.12 L (mm) 3.3 +0.3 - 0.1 3.3 +0.3 - 0.1 4.7 +0.3 - 0.2 P/N 5 th digit A B C

LDB series - PPS dielectric RoHS 6 - technical data Plates Aluminium layer deposited by evaporation under vacuum. Winding Non inductive - Stacked technology. Terminations Four layers: aluminium, brass, nickel, pure tin. Marking On packaging only. Climatic category 55 / 125 / 56 Electrical data Operating temperature range -55 to + 125 °C Rated voltage (VR) 16 - 50 VDC Category voltage (VC) VC = VR up to 105 °C. For temperatures between 105 and 125 °C a decreasing factor of 1.25 % per degree °C has to be applied on the D.C. rated voltage Size range 12.06 to 18.12 Capacitance range 3300 pF to 0.1 μF Capacitance values E12 series Capacitance tolerances ± 2 % (G); ± 5 % (J) Dissipation factor (tgδ) ≤ 0.6 % (T = 25 ± 5 °C; f = 1 kHz) Dielectric absorption 0.02% Insulation resistance ≥ 3 GΩ Test conditions: T = 25 ± 5 °C; charging time: 1 min. Charging voltage: 10 V DC for VR = 16 VDC

50 VDC for VR = 50 VDC

Surge voltage test 1.75 x VR (5 s; T = 25 ± 5 °C) Tests and performances Damp heat -4;IR ≥ 50% of the limit value Endurance (125 °C; 2000 h; 1.25 x V C) │∆C/C│≤ 3%;│∆tgδ│≤ 30 x 10-4;IR ≥ 50% of the limit value Rapid change of temperature (1h at -55 °C;1h at +125 °C; 1000 cycles) │∆C/C│≤ 3% │∆tgδ│≤ 50 x 10 IR ≥ limit value No mechanical damage Reflow (as per reflow recommendations, see page 14) -4 ; IR ≥ limit value No mechanical damage Bending (1 to 6 mm deflection) │∆C/C│≤ 1% No visible damage on the terminations (pealing) neither on the body (cracking) Long term stability (2 years) │∆C/C│≤ 1% Reliability (REF. MIL HDBK 217) Failure rate ≤ 1 Fit -9 failures / (components * hours)

Maximum preheating time: 180 s Minimum temperature: 150 °C Maximum temperature: 200 °C Maximum temperature on the component’s body (T max): Maximum time within Tmax and Tmax - 5 °C (∆T5): 30 s (Tmax ≤ 250 °C) 10 s (250 °C < Tmax ≤ 255 °C *) Maximum time over 217 °C (∆T217): 150 s Maximum temperature ramp rate: 3 °C / s (heating) 6 °C / s (cooling) Second reflow if two reflow processes are needed, be sure that, before the second reflow, the temperature on the capacitor’s surface is lower than 50 °C. * For LDB series this value is 260 °C. Landing areas and solder paste suggestions Size ** A [mm] B [mm] C [mm] D [mm] These new landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design. The preceding layout (2004 Catalogue) is therefore to be considered still valid, although not optimal for RoHS 6. Soldering recommendations and cautions Capacitor Hmax [mm] Capacitor volume [mm3] < 350 350 - 2000 > 2000 < 1.6 255 °C * 255 °C * 255 °C * 1.6 - 2.5 255 °C * 250 °C 245 °C > 2.5 250 °C 245 °C 245 °C in line with JEDEC STD 020D ed. June 2007 with some limitations Reflow recommendations Reflow temperature profile We suggest to use a Sn / Ag / Cu solder paste (suggested thickness: 0.10 ÷ 0.15 mm). If a NOT Lead Free solder paste is used, a minimum peak temperature of 210 °C on the component’s body is suggested. Linear profiles are also allowed (if in line with the reflow recommendations) ** For customized sizes, specific landing areas suggestions are available

Soldering recommendations and cautions Flux / Cleaning / Storage and Moisture Flux suggestions We suggest to use a no-clean flux with a halogen content lower than 0.1%. Storage and moisture recommendations Arcotronics SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life (temperature ≤ 40 °C / relative humidity ≤ 90%). After the MBB has been opened, components may stay in areas with controlled temperature and humidity (temperature ≤ 30 °C / relative humidity ≤ 60%) for 168 hours (rated voltage ≤ 100 V DC) or 696 hours (rated voltage > 100 VDC). For longer periods of time and / or higher temperature and / or higher relative humidity values, it is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, Arcotronics recommends to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not respected, components require a baking (minimum time: 48 hours at 55 ± 5 °C) before the reflow. Manual assembly recommendations If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the components. Our recommendations are the following (see Fig. 1): 1) when using tweezers, the components should be gripped across the two terminations (A); 2) avoid any contact with the two cutting surfaces (C); 3) a vacuum pen is recommended on the top and bottom surfaces (B). Manual soldering recommendations LDE and LDB series have been designed for Surface Mount Technology, pick & place machines and reflow soldering systems. Using a manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350 °C. Therefore please pay careful attention: - never touch the capacitor body with the sodering iron but rather touch the soldering iron and the end termination with the tin wire edge (see Fig. 2); - if the soldering iron is equipped with a temperature controller device: set the temperature to 250 ± 3 °C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 s); - if the soldering iron is NOT equipped with a temperature controller device: this is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is extremely important: 1) proceed as per Fig. 2; 2) as soon as the tin wire starts melting, move the soldering iron away as quickly as possible; 3) wait a few seconds and check that the soldering joint has been properly created; - if the soldering iron is equipped with a hot air flow device: set the hot air temperature to 250 ± 3 °C and do not send the hot air directly onto the capacitor plastic body. In this situation, the operator’s experience is very important; - in any case, avoid mass-mounting SMD Film Capacitors manually. Fig. 1 Fig. 2 Cleaning suggestions To clean the PCB assembly we suggest to use a suitable solvent like Isopropyl Alcohol, deionized water or neutral pH detergents. Solvents like Toluene, Xylene and Trichloroethylene should not be used.

In case of: Typical cause Typical solution no solder joint on one end termination landing area dimensions see landing areas suggestions, page 14 solder paste quality see solder paste suggestions, page 14 not-uniform solder paste thickness on the landing areas set the dispensing solder paste machine properly wrong position of the capacitor on the landing areas set the pick & place machine properly thermal profile parameters see reflow recommendations, page 14 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations no solder joint on both end terminations landing area dimensions see landing areas suggestions, page 14 solder paste quality see solder paste suggestions, page 14 no solder paste on the landing areas set the dispensing solder paste machine properly thermal profile parameters see reflow recommendations, page 14 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations oxidated end terminations see moisture recommendations, page 15 capacitor’s body mechanical deformation too long time over 217 °C see reflow recommendations, page 14 too long time within Tmax and Tmax - 5 °C see reflow recommendations, page 14 too high temperature ramp rate see reflow recommendations, page 14 capacitor damaged by a soldering iron see manual soldering recommendations, page 15 capacitance drop (up to 20%) too long time over 217 ° C see reflow recommendations, page 14 too long time within Tmax and Tmax - 5 °C see reflow recommendations, page 14 too high temperature ramp-up rate see reflow recommendations, page 14 capacitor damaged by a soldering iron see manual soldering recommendations, page 15 capacitance drop (over 20%) capacitor damaged by a soldering iron see manual soldering recommendations, page 15 Production process basic suggestions Note: small fissures on the capacitor’s cutting surface are actually slight detachments of two adjacent metallized film layers and have to be considered only as an aesthetic issue related to the SMD Film Capacitors’ manufacturing process and technology. Therefore, small fissures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics. Fissures do not influence in anyway SMD Film Capacitors’ reliability.