LD052D101JAX2A

MLCC-LD AVX | Alldatasheet

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C0G (NP0) – General Specifications PART NUMBER (SEE PAGE 4 FOR COMPLETE PART NUMBER EXPLANATION) LD05 5 A J A 2 AB101 Size LD02 - 0402 LD03 - 0603 LD04 - 0504* LD05 - 0805 LD06 - 1206 LD10 - 1210 LD12 - 1812 LD13 - 1825 LD14 - 2225 LD20 - 2220 Dielectric C0G (NP0) = A X7R = C X5R = D X8R = F Capacitance Tolerance B = ±.10 pF (<10pF) C = ±.25 pF (<10pF) D = ±.50 pF (<10pF) F = ±1% (≥ 10 pF) G = ±2% (≥ 10 pF) J = ±5% K = ±10% M = ±20% Failure Rate A = Not Applicable Packaging 2 = 7" Reel 4 = 13" Reel Special Code A = Std. Product Terminations B = 5% min lead X = FLEXITERM® with 5% min lead X7R only Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 35V = D 50V = 5 100V = 1 200V = 2 500V = 7 AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages a full range of values that we are currently offering in this special “B” termination. Please contact the factory if you require additional information on our MLCC Tin/Lead Termination “B” products. Contact Factory For Multiples* *LD04 has the same CV ranges as LD03. NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values. See FLEXITERM® section for CV options Insulation Resistance (Ohm-Farads) 1,000 10,000 100 0 20 40 60 80 Temperature °C Insulation Resistance vs Temperature 100 112916 MLCC Tin/Lead Termination "B" (LD Series)

MLCC Tin/Lead Termination “B” Parameter/Test NP0 Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF 1.0 kHz ± 10% for cap > 1000 pF Voltage: 1.0Vrms ± .2VQ <30 pF: Q≥ 400+20 x Cap Value ≥30 pF: Q≥ 1000 Insulation Resistance 100,000MΩ or 1000MΩ - μF , whichever is less Charge device with rated voltage for 60 ± 5 secs @ room temp/humidity Dielectric Strength No breakdown or visual defects Charge device with 250% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Resistance to Flexure Stresses Appearance No defects Deflection: 2mm Test Time: 30 seconds Capacitance Variation ±5% or ±.5 pF, whichever is greater Q Meets Initial Values (As Above) Insulation Resistance ≥ Initial Value x 0.3 Solderability ≥ 95% of each terminal should be covered with fresh solder Dip device in eutectic solder at 230 ± 5ºC for 5.0 ± 0.5 seconds Resistance to Solder Heat Appearance No defects, <25% leaching of either end terminal Dip device in eutectic solder at 260ºC for 60 seconds. Store at room temperature for 24 ± 2 hours before measuring electrical properties. Capacitance Variation ≤ ±2.5% or ±.25 pF, whichever is greater Q Meets Initial Values (As Above) Insulation Resistance Meets Initial Values (As Above) Dielectric Strength Meets Initial Values (As Above) Thermal Shock Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±2.5% or ±.25 pF, whichever is greater Step 2: Room Temp ≤ 3 minutes Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes Insulation Resistance Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes Dielectric Strength Meets Initial Values (As Above) Repeat for 5 cycles and measure after 24 hours at room temperature Load Life Appearance No visual defects Charge device with twice rated voltage in test chamber set at 125ºC ± 2ºC for 1000 hours (+48, -0). Remove from test chamber and stabilize at room temperature for 24 hours before measuring. Capacitance Variation ≤ ±3.0% or ± .3 pF, whichever is greater Q ≥ 30 pF: Q≥ 350 ≥10 pF, <30 pF: Q≥ 275 +5C/2 <10 pF: Q≥ 200 +10C Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Load Humidity Appearance No visual defects Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±5.0% or ± .5 pF, whichever is greater Q ≥ 30 pF: Q≥ 350 ≥10 pF, <30 pF: Q≥ 275 +5C/2 <10 pF: Q≥ 200 +10C Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) 112916 Specifications and Test MethodsC0G (NP0) –

MLCC Tin/Lead Termination “B” SIZE LD02 LD03 LD05 LD06 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500 Cap 0.5 C C C G G G G J J J J J J J J J J J (pF) 1.0 C C C G G G G J J J J J J J J J J J

1.2 C C C G G G G J J J J J J J J J J J

1.5 C C C G G G G J J J J J J J J J J J

1.8 C C C G G G G J J J J J J J J J J J

2.2 C C C G G G G J J J J J J J J J J J

2.7 C C C G G G G J J J J J J J J J J J

3.3 C C C G G G G J J J J J J J J J J J

3.9 C C C G G G G J J J J J J J J J J J

4.7 C C C G G G G J J J J J J J J J J J

5.6 C C C G G G G J J J J J J J J J J J

6.8 C C C G G G G J J J J J J J J J J J

8.2 C C C G G G G J J J J J J J J J J J

10 C C C G G G G J J J J J J J J J J J

12 C C C G G G G J J J J J J J J J J J

15 C C C G G G G J J J J J J J J J J J

18 C C C G G G G J J J J J J J J J J J

22 C C C G G G G J J J J J J J J J J J

27 C C C G G G G J J J J J J J J J J J

33 C C C G G G G J J J J J J J J J J J

39 C C C G G G G J J J J J J J J J J J

47 C C C G G G G J J J J J J J J J J J

56 C C C G G G G J J J J J J J J J J J

68 C C C G G G G J J J J J J J J J J J

82 C C C G G G G J J J J J J J J J J J

100 C C C G G G G J J J J J J J J J J J

120 C C C G G G G J J J J J J J J J J J

150 C C C G G G G J J J J J J J J J J J

180 C C C G G G G J J J J J J J J J J J

220 C C C G G G G J J J J J J J J J J M

270 C C C G G G G J J J J M J J J J J M

330 C C C G G G G J J J J M J J J J J M

390 C C C G G G G J J J J M J J J J J M

470 C C C G G G J J J J M J J J J J M

560 G G G J J J J M J J J J J M

680 G G G J J J J J J J J J P

820 G G G J J J J J J J J M

1000 G G G J J J J J J J J Q

1200 G J J J J J J J Q

1500 J J J J J J M Q

1800 J J J J J M M

2200 J J N J J M P

2700 J J N J J M P

3300 J J J J M P

3900 J J J J M P

4700 J J J J M P

5600 J J M

6800 M M

8200 M M

Cap 0.010 M M (pF) 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.068 0.082 0.1 WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500 SIZE LD02 LD03 LD05 LD06 Letter A C E G J K M N P Q X Y Z Max. Thickness PAPER EMBOSSED PREFERRED SIZES ARE SHADED 112916 Capacitance RangeC0G (NP0) –

MLCC Tin/Lead Termination “B” SIZE LD10 LD12 LD13 LD14 Soldering Reflow Only Reflow Only Reflow Only Reflow Only Packaging Paper/Embossed All Embossed All Embossed All Embossed WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 Cap 0.5 (pF) 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 J 12 J 15 J 18 J 22 J 27 J 33 J 39 J 47 J 56 J 68 J 82 J 100 J 120 J 150 J 180 J 220 J 270 J 330 J 390 M 470 M

560 J J J J M

680 J J J J M

820 J J J J M

1000 J J J J M K K K K M M M M M M P

1200 J J J M M K K K K M M M M M M P

1500 J J J M M K K K K M M M M M M P

1800 J J J M K K K K M M M M M M P

2200 J J J Q K K K K P M M M M M P

2700 J J J Q K K K P Q M M M M M P

3300 J J J K K K P Q M M M M M P

3900 J J M K K K P Q M M M M M P

4700 J J M K K K P Q M M M M M P

5600 J J K K M P X M M M M M P

6800 J J K K M X M M M M M P

8200 J J K M M M M M M P

Cap 0.010 J J K M M M M M M P (pF) 0.012 J J K M M M M M P

0.015 M M M M M M Y

0.018 M M P M M M Y

0.022 M M P M Y Y

0.027 M M P P Y Y

0.033 M M P P

0.039 M M P P

0.047 M M P P

0.068 M M P

0.082 M M Q

0.1 Q WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 SIZE LD10 LD12 LD13 LD14 Letter A C E G J K M N P Q X Y Z Max. Thickness PAPER EMBOSSED PREFERRED SIZES ARE SHADED 112916 Capacitance RangeC0G (NP0) –

MLCC Tin/Lead Termination “B” PART NUMBER (SEE PAGE 4 FOR COMPLETE PART NUMBER EXPLANATION) LD05 5 F J A 2 AB101 Size LD02 - 0402 LD03 - 0603 LD04 - 0504* LD05 - 0805 LD06 - 1206 LD10 - 1210 LD12 - 1812 LD13 - 1825 LD14 - 2225 LD20 - 2220 Dielectric X8R = F Capacitance Tolerance B = ±.10 pF (<10pF) C = ±.25 pF (<10pF) D = ±.50 pF (<10pF) F = ±1% (≥ 10 pF) G = ±2% (≥ 10 pF) J = ±5% K = ±10% M = ±20% Failure Rate A = Not Applicable Packaging 2 = 7" Reel 4 = 13" Reel Special Code A = Std. Product Terminations B = 5% min lead X = FLEXITERM® with 5% min lead X7R only Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 35V = D 50V = 5 100V = 1 200V = 2 500V = 7 AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages a full range of values that we are currently offering in this special “B” termination. Please contact the factory if you require additional information on our MLCC Tin/Lead Termination “B” products. Contact Factory For Multiples* LD04 has the same CV ranges as LD03. NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values. See FLEXITERM® section for CV options 112916 General SpecificationsX8R –

MLCC Tin/Lead Termination “B” 112916 Parameter/Test X8R Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +150ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± .2VDissipation Factor ≤ 2.5% for ≥ 50V DC rating ≤ 3.5% for 25V DC and 16V DC rating Insulation Resistance 100,000MΩ or 1000MΩ - μF , whichever is less Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Dielectric Strength No breakdown or visual defects Charge device with 250% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Resistance to Flexure Stresses Appearance No defects Deflection: 2mm Test Time: 30 seconds Capacitance Variation ≤ ±12% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance ≥ Initial Value x 0.3 Solderability ≥ 95% of each terminal should be covered with fresh solder Dip device in eutectic solder at 230 ± 5ºC for 5.0 ± 0.5 seconds Resistance to Solder Heat Appearance No defects, <25% leaching of either end terminal Dip device in eutectic solder at 260ºC for 60 seconds. Store at room temperature for 24 ± 2 hours before measuring electrical properties. Capacitance Variation ≤ ±7.5% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance Meets Initial Values (As Above) Dielectric Strength Meets Initial Values (As Above) Thermal Shock Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes Dissipation Factor Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes Insulation Resistance Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes Dielectric Strength Meets Initial Values (As Above) Repeat for 5 cycles and measure after 24 ± 2 hours at room temperature Load Life Appearance No visual defects Charge device with 1.5 rated voltage (≤ 10V) in test chamber set at 150ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Load Humidity Appearance No visual defects Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Specifications and Test MethodsX8R –

MLCC Tin/Lead Termination “B” SIZE LD03 LD05 LD06 WVDC 25V 50V 25V 50V 25V 50V

271 Cap 270 G G

331 (pF) 330 G G J J 471 470 G G J J 681 680 G G J J 102 1000 G G J J J J 152 1500 G G J J J J 182 1800 G G J J J J 222 2200 G G J J J J 272 2700 G G J J J J 332 3300 G G J J J J 392 3900 G G J J J J 472 4700 G G J J J J 562 5600 G G J J J J 682 6800 G G J J J J

822 Cap 8200 G G J J J J

103 (μF) 0.01 G G J J J J 123 0.012 G G J J J J 153 0.015 G G J J J J 183 0.018 G G J J J J 223 0.022 G G J J J J 273 0.027 G G J J J J 333 0.033 G G J J J J 393 0.039 G G J J J J 473 0.047 G G J J J J 563 0.056 G N N M M 683 0.068 G N N M M 823 0.082 N N M M 104 0.1 N N M M 124 0.12 N N M M 154 0.15 N N M M 184 0.18 N M M 224 0.22 N M M 274 0.27 M M 334 0.33 M M 394 0.39 M 474 0.47 M 684 0.68 824 0.82 105 1 WVDC 25V 50V 25V 50V 25V 50V SIZE LD03 LD05 LD06 Letter A C E G J K M N P Q X Y Z Max. Thickness PAPER EMBOSSED Capacitance RangeX8R –

MLCC Tin/Lead Termination “B” PART NUMBER (SEE PAGE 4 FOR COMPLETE PART NUMBER EXPLANATION) LD05 5 C J A 2 AB101 Size LD03 - 0603 LD04 - 0504* LD05 - 0805 LD06 - 1206 LD10 - 1210 LD12 - 1812 LD13 - 1825 LD14 - 2225 LD20 - 2220 Dielectric X7R = C Capacitance Tolerance B = ±.10 pF (<10pF) C = ±.25 pF (<10pF) D = ±.50 pF (<10pF) F = ±1% (≥ 10 pF) G = ±2% (≥ 10 pF) J = ±5% K = ±10% M = ±20% Failure Rate A = Not Applicable Packaging 2 = 7" Reel 4 = 13" Reel Special Code A = Std. Product Terminations B = 5% min lead X = FLEXITERM® with 5% min lead X7R only Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 35V = D 50V = 5 100V = 1 200V = 2 500V = 7 AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages a full range of values that we are currently offering in this special “B” termination. Please contact the factory if you require additional information on our MLCC Tin/Lead Termination “B” products. Contact Factory For Multiples* *LD04 has the same CV ranges as LD03. NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values. See FLEXITERM® section for CV options 112916 General SpecificationsX7R –

MLCC Tin/Lead Termination “B” 112916 Parameter/Test X7R Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± .2VDissipation Factor ≤ 10% for ≥ 50V DC rating ≤ 12.5% for 25V DC rating ≤ 12.5% for 25V and 16V DC rating ≤ 12.5% for ≤ 10V DC rating Insulation Resistance 100,000MΩ or 1000MΩ - μF , whichever is less Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Dielectric Strength No breakdown or visual defects Charge device with 250% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Resistance to Flexure Stresses Appearance No defects Deflection: 2mm Test Time: 30 seconds Capacitance Variation ≤ ±12% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance ≥ Initial Value x 0.3 Solderability ≥ 95% of each terminal should be covered with fresh solder Dip device in eutectic solder at 230 ± 5ºC for 5.0 ± 0.5 seconds Resistance to Solder Heat Appearance No defects, <25% leaching of either end terminal Dip device in eutectic solder at 260ºC for 60 seconds. Store at room temperature for 24 ± 2 hours before measuring electrical properties. Capacitance Variation ≤ ±7.5% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance Meets Initial Values (As Above) Dielectric Strength Meets Initial Values (As Above) Thermal Shock Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes Dissipation Factor Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes Insulation Resistance Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes Dielectric Strength Meets Initial Values (As Above) Repeat for 5 cycles and measure after 24 ± 2 hours at room temperature Load Life Appearance No visual defects Charge device with 1.5 rated voltage (≤ 10V) in test chamber set at 125ºC ± 2ºC for 1000 hours (+48, -0) Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Load Humidity Appearance No visual defects Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Specifications and Test MethodsX7R –

MLCC Tin/Lead Termination “B” SIZE LD02 LD03 LD05 LD06 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500 Cap 100 (pF) 150 220 C

330 C G G G J J J J J J K

470 C G G G J J J J J J K

680 C G G G J J J J J J K

1000 C G G G J J J J J J K

1500 C G G J J J J J J J J J J J J M

2200 C G G J J J J J J J J J J J J M

3300 C C G G J J J J J J J J J J J J M

4700 C C G G J J J J J J J J J J J J M

6800 C C G G J J J J J J J J J J J J P

Cap 0.010 C C G G J J J J J J J J J J J J P (μF) 0.015 C G G J J J J J J J J J J J M

0.022 C G G J J J J J N J J J J J M

0.033 C G G J J J J N J J J J J M

0.047 G G G J J J J N J J J J J M

0.068 G G G J J J J N J J J J J P

0.10 C* G G G G J J J J N J J J J P P

0.15 G G J J J N N J J J J Q

0.22 G G J J N N N J J J J Q

0.33 N N N N N J J M P Q

0.47 J* N N N N N M M M P Q

0.68 N N N M M Q Q Q

1.0 J* J* N N N* M M Q Q Q

1.5 P Q Q

2.2 J* P* Q Q Q

3.3

10 P* P Q* Q* Q

22 Q* 100 WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500 SIZE LD02 LD03 LD05 LD06 Letter A C E G J K M N P Q X Y Z Max. Thickness PAPER EMBOSSED PREFERRED SIZES ARE SHADED = Under Development 112916 Capacitance RangeX7R –

MLCC Tin/Lead Termination “B” X7R – Capacitance Range SIZE LD10 LD12 LD13 LD20 LD14 Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100 Cap 100 (pF) 150 220 330 470 680 1000

1500 J J J J J J M

2200 J J J J J J M

3300 J J J J J J M

4700 J J J J J J M

6800 J J J J J J M

Cap 0.010 J J J J J J M K K K K M M X X X M P (μF) 0.015 J J J J J J P K K K P M M X X X M P

0.022 J J J J J J Q K K K P M M X X X M P

0.033 J J J J J J Q K K K X M M X X X M P

0.047 J J J J J J K K K Z M M X X X M P

0.068 J J J J J M K K K Z M M X X X M P

0.10 J J J J J M K K K Z M M X X X M P

0.15 J J J J M Z K K P M M X X X M P

0.22 J J J J P Z K K P M M X X X M P

0.33 J J J J Q K M X M M X X X M P

0.47 M M M M Q K P M M X X X M P

0.68 M M P X X M Q M P X X M P

1.0 N N P X Z M X M P X X M P

1.5 N N Z Z Z Z Z M X X M X

2.2 X X Z Z Z Z Z X X M

3.3 X X Z Z Z X Z

4.7 X X Z Z Z X Z

10 Z Z Z Z Z Z

22 Z Z Z

WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100 SIZE LD10 LD12 LD13 LD20 LD14 Letter A C E G J K M N P Q X Y Z Max. Thickness PAPER EMBOSSED PREFERRED SIZES ARE SHADED 112916

MLCC Tin/Lead Termination “B” PART NUMBER (SEE PAGE 4 FOR COMPLETE PART NUMBER EXPLANATION) TYPICAL ELECTRICAL CHARACTERISTICS LD05 5 D J A 2 AB101 Dielectric X5R = D Capacitance Tolerance B = ±.10 pF (<10pF) C = ±.25 pF (<10pF) D = ±.50 pF (<10pF) F = ±1% (≥ 10 pF) G = ±2% (≥ 10 pF) J = ±5% K = ±10% M = ±20% Failure Rate A = Not Applicable Packaging 2 = 7" Reel 4 = 13" Reel Special Code A = Std. Product Terminations B = 5% min lead X = FLEXITERM® with 5% min lead X7R only Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros Voltage 6.3V = 6 10V = Z 16V = Y 25V = 3 35V = D 50V = 5 100V = 1 200V = 2 500V = 7 AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages a full range of values that we are currently offering in this special “B” termination. Please contact the factory if you require additional information on our MLCC Tin/Lead Termination “B” products. Contact Factory For Multiples* *LD04 has the same CV ranges as LD03. NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers. Contact factory for non-specified capacitance values. See FLEXITERM® section for CV options Size LD02 - 0402 LD03 - 0603 LD04 - 0504* LD05 - 0805 LD06 - 1206 LD10 - 1210 LD12 - 1812 LD13 - 1825 LD14 - 2225 LD20 - 2220 % Capacitance -60 -40 -20 0 +20 +40 +60 +80 Temperature °C Temperature Coefficient -10 -15 -20 Insulation Resistance (Ohm-Farads) 1,000 10,000 100 Insulation Resistance vs Temperature 0 20 12040 60 80 Temperature °C 100 112916 General SpecificationsX5R –

MLCC Tin/Lead Termination “B” Parameter/Test X5R Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +85ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± .2V For Cap > 10 μF, 0.5Vrms @ 120HzDissipation Factor ≤ 2.5% for ≥ 50V DC rating ≤ 3.0% for 25V, 35V DC rating ≤ 12.5% Max. for 16V DC rating and lower Contact Factory for DF by PN Insulation Resistance 10,000MΩ or 500MΩ - μF , whichever is less Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Dielectric Strength No breakdown or visual defects Charge device with 250% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Resistance to Flexure Stresses Appearance No defects Deflection: 2mm Test Time: 30 seconds Capacitance Variation ≤ ±12% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance ≥ Initial Value x 0.3 Solderability ≥ 95% of each terminal should be covered with fresh solder Dip device in eutectic solder at 230 ± 5ºC for 5.0 ± 0.5 seconds Resistance to Solder Heat Appearance No defects, <25% leaching of either end terminal Dip device in eutectic solder at 260ºC for 60 seconds. Store at room temperature for 24 ± 2 hours before measuring electrical properties. Capacitance Variation ≤ ±7.5% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance Meets Initial Values (As Above) Dielectric Strength Meets Initial Values (As Above) Thermal Shock Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes Dissipation Factor Meets Initial Values (As Above) Step 3: +85ºC ± 2º 30 ± 3 minutes Insulation Resistance Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes Dielectric Strength Meets Initial Values (As Above) Repeat for 5 cycles and measure after 24 ± 2 hours at room temperature Load Life Appearance No visual defects Charge device with 1.5X rated voltage in test chamber set at 85ºC ± 2ºC for 1000 hours (+48, -0). Note: Contact factory for *optional specification part numbers that are tested at < 1.5X rated voltage. Remove from test chamber and stabilize at room temperature for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Load Humidity Appearance No visual defects Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) 112916 Specifications and Test MethodsX5R –

MLCC Tin/Lead Termination “B” SIZE LD02 LD03 LD05 LD06 LD10 LD12 Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed Cap 100 (pF) 150 220 C 330 C 470 C 680 C 1000 C 1500 C 2200 C 3300 C

4700 C G

6800 C G

Cap 0.010 C G (μF) 0.015 C G G G

0.022 C C G G G N

0.033 C G G G N

0.047 C C G G G N

0.068 C G G N

0.10 C C C G G N N

0.15 G N N

0.22 C* G G N N Q

0.33 G G N

0.47 C* C* G N Q Q X

0.68 G N

1.0 C* C* C* G G G J* N N P* Q Q X X X

1.5

2.2 C* G* G* J* J* N N N Q Q Z X

3.3 J* J* J* J* N N X X

4.7 J* J* J* N N N* N* X X X X Q Z

10 K* P P P X X X X X Z Z Z

22 P* X X X X Z Z Z Z

47 X Z*

100 Z* Z

SIZE LD02 LD03 LD05 LD06 LD10 LD12 Letter A C E G J K M N P Q X Y Z Max. Thickness PAPER EMBOSSED PREFERRED SIZES ARE SHADED *Optional Specifications – Contact factory NOTE: Contact factory for non-specified capacitance values 112916 Capacitance RangeX5R –