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Document overview
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- PDF pages: 9
Technical content
Features
- Designed for 2.3 to 3.6 V VCC Operation
- 5 V Tolerant − Interface Capability With 5 V TTL Logic
- Supports Live Insertion and Withdrawal
- IOFF Specification Guarantees High Impedance When VCC = 0 V
- LVTTL Compatible
- LVCMOS Compatible
- 24mA Balanced Output Sink and Source Capability
- Near Zero Static Supply Current in All Three Logic States (10 /C0109A) Substantially Reduces System Power Requirements
- Latchup Performance Exceeds 500 mA
- ESD Performance: ♦ Human Body Model >2000 V ♦ Machine Model >200 V
- NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MARKING DIAGRAMS See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
www.onsemi.com SOIC−20 WB DW SUFFIX CASE 751D LCX574 AWLYYWWG TSSOP−20 DT SUFFIX CASE 948E LCX 574 ALYW/C0071 /C0071 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or /C0071= Pb−Free Package (Note: Microdot may be in either location)
www.onsemi.com MAXIMUM RATINGS Symbol Parameter Value Condition Units VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C MSL Moisture Sensitivity Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Output in HIGH or LOW State. I O absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Units VCC Supply Voltage Operating Data Retention Only 2.0 1.5 3.3 3.3 3.6 3.6 V VI Input Voltage 0 5.5 V VO Output Voltage (HIGH or LOW State) (3−State) VCC 5.5 V IOH HIGH Level Output Current, VCC = 3.0 V − 3.6 V −24 mA IOL LOW Level Output Current, VCC = 3.0 V − 3.6 V 24 mA IOH HIGH Level Output Current, VCC = 2.7 V − 3.0 V −12 mA IOL LOW Level Output Current, VCC = 2.7 V − 3.0 V 12 mA TA Operating Free−Air Temperature −55 +125 °C /C0068t//C0068V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol Characteristic Condition Min Max Units VIH HIGH Level Input Voltage (Note 2) 2.7 V ≤ VCC ≤ 3.6 V 2.0 V VIL LOW Level Input Voltage (Note 2) 2.7 V ≤ VCC ≤ 3.6 V 0.8 V VOH HIGH Level Output Voltage 2.7 V ≤ VCC ≤ 3.6 V; IOH = −100 /C0109A VCC − 0.2 V VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.7 V ≤ VCC ≤ 3.6 V; IOL = 100 /C0109A 0.2 V VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL, VOUT = 0 to 5.5 V ±5 /C0109A IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 /C0109A IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 /C0109A ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND ±10 /C0109A /C0068ICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 /C0109A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. These values of V I are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 /C0087) Limits TA = −55°C to +125°C VCC = 3.0 V to 3.6 V VCC = 2.7 V Symbol Parameter Waveform Min Max Min Max Units fmax Clock Pulse Frequency 1 150 MHz tPLH tPHL Propagation Delay CP to On 1 1.5 1.5 8.5 8.5 1.5 1.5 9.5 9.5 ns tPZH tPZL Output Enable Time to HIGH and LOW Levels 2 1.5 1.5 8.5 8.5 1.5 1.5 9.5 9.5 ns tPHZ tPLZ Output Disable Time from HIGH and LOW Levels 2 1.5 1.5 6.5 6.5 1.5 1.5 7.0 7.0 ns ts Setup TIme, HIGH or LOW Dn to CP 1 2.5 2.5 ns th Hold TIme, HIGH or LOW Dn to CP 1 1.5 1.5 ns tw CP Pulse Width, HIGH or LOW 3 3.3 3.3 ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design.
- Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
Figure 3. AC Waveforms
www.onsemi.com OPEN PULSE GENERATOR RT DUT VCC RL CL 6 V GND Test Switch tPLH, tPHL Open tPZL, tPLZ 6 V Open Collector/Drain tPLH and tPHL 6 V tPZH, tPHZ GND CL = 50 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 /C0087 or equivalent RT = ZOUT of pulse generator (typically 50 /C0087) Figure 4. Test Circuit Device Package Shipping† MC74LCX574DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74LCX574DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74LCX574DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel NLV74LCX574DTR2G* TSSOP−20 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
www.onsemi.com PACKAGE DIMENSIONS B20X H10X C L 18X A1 A SEATING PLANE /C0113 h X 45/C0095 E D M0.25 MB M0.25 SA SBT e T B A DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 /C0113 0 7 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. /C0095/C0095 SOIC−20 WB CASE 751D−05 ISSUE G
www.onsemi.com PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C DIM A MIN MAX MIN MAX INCHES 6.60 0.260 MILLIMETERS B 4.30 4.50 0.169 0.177 C 1.20 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 /C0095/C0095/C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ 11 0 1120 PIN 1 IDENT A B −T− 0.100 (0.004) C D G H SECTION N−N K JJ 1 N N M F −W− SEATING PLANE −V− −U− SUM0.10 (0.004) V ST 20X REFK L L/22X SU0.15 (0.006) T DETAIL E 0.25 (0.010) DETAIL E 6.40 0.252 --- --- SU0.15 (0.006) T 7.06 16X 0.36 16X 1.26 0.65 DIMENSIONS: MILLIMETERS PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*
www.onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks, reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MC74LCX574/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative