LCX139

MC74LCX139 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

• Designed for 2.3 to 3.6 V VCC Operation
• 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
• LVTTL Compatible
• LVCMOS Compatible
• 24 mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current (10 A) Substantially Reduces System Power Requirements
• Latchup Performance Exceeds 500 mA
• ESD Performance: Human Body Model >2000 V Machine Model >200 V
• Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MARKING DIAGRAMS A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week SOIC−16 D SUFFIX CASE 751B LCX139 AWLYWW LCX 139 ALYW TSSOP−16 DT SUFFIX CASE 948F SOEIAJ−16 M SUFFIX CASE 966 74LCX139 ALYW See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.

ORDERING INFORMATION

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http://onsemi.com MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State. (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit VCC Supply Voltage Operating Data Retention Only 2.0 1.5 2.3 to 3.3 3.6 3.6 V VI Input Voltage 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 VCC V IOH HIGH Level Output Current V CC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 mA IOL LOW Level Output Current V CC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 mA TA Operating Free−Air Temperature −40 +85 °C t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V Device Package Shipping† MC74LCX138D SOIC−16 48 Units / Rail MC74LCX138DR2 SOIC−16 2500 Tape & Reel MC74LCX138DR2G SOIC−16 (Pb−Free)

2500 Tape & Reel

MC74LCX138DT TSSOP−16* 96 Units / Rail MC74LCX138DTR2 TSSOP−16* 2500 Tape & Reel MC74LCX138M SOEIAJ−16 48 Units / Rail MC74LCX138MEL SOEIAJ−16 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.

http://onsemi.com DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Characteristic Condition Min Max Unit VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 VIH g( ) 2.7 V ≤ VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 VIL g( ) 2.7 V ≤ VCC ≤ 3.6 V 0.8 VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 A VCC − 0.2 VOH g VCC = 2.3 V; IOH = −8 mA 1.7 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 A 0.2 VOL g VCC = 2.3 V; IOL = 8 mA 0.7 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 II Input Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5 A ICC Quiescent Supply Current 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 ACC y 2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±10 ICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 A 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Limits TA = −40°C to +85°C C L= 50 pF C L= 50 pF C L= 30pF Symbol Parameter Min Max Min Max Min Max Unit tPLH tPHL Propagation Delay A to Y 0.8 0.8 6.2 6.2 1.0 1.0 7.3 7.3 0.8 0.8 9.3 9.3 ns ns tPLH tPHL Propagation Delay E to Y 0.8 0.8 4.7 4.7 1.0 1.0 5.2 5.2 0.8 0.8 7.2 7.2 ns ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL ) or LOW−to−HIGH (tOSLH ); parameter guaranteed by design. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit C IN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF C OUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF C PD Power Dissipation Capacitance 10MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

http://onsemi.com PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 16 9 SEATING PLANE F JM R X 45 G

8 PLP−B−

−A− M0.25 (0.010) B S −T− D K C 16 PL SBM0.25 (0.010) A ST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE O ÇÇ ÇÇ DIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. SECTION N−N SEATING PLANE IDENT. PIN 1 1 8 16 9 DETAIL E J B C D A K H G ÉÉ ÉÉ DETAIL E F M L 2X L/2 −U− SU0.15 (0.006) T SU0.15 (0.006) T SUM0.10 (0.004) V ST 0.10 (0.004) −T− −V− −W− 0.25 (0.010) 16X REFK N N

http://onsemi.com PACKAGE DIMENSIONS SOEIAJ−16 M SUFFIX CASE 966−01 ISSUE O H E A 1 DIM MIN MAX MIN MAX INCHES --- 2.05 --- 0.081 MILLIMETERS 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.18 0.27 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 BSC 0.050 BSC 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0.70 0.90 0.028 0.035 --- 0.78 --- 0.031 A HE LE 10 0 10 LE Q 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M L DETAIL P VIEW P c A b e 16 9 D Z E A b c D E e L M Z

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