LCMC

LCMC AVX | Alldatasheet

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Technical content

Multi-Layer Ceramic Chip Inductors LCMC Series

APPLICATIONS

• High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication

FEATURES

• For high frequency applications
• Standard EIA sizes 0201 (0603), 0402 (1005), 0603 (1608)
• Lead-free RoHS compliant parts
• Tight tolerance in physical dimensions
• Surface mounting applicability (Supports reflow soldering condition)
• Tight Inductance Tolerance, Excellent Q and Guaranteed SRF range
• High product quality and outstanding reliability. (Ceramic integrated structure)
• Operating temperature -55ºC to +125ºC LC Family LC = Chip Inductor MC Series MC = Multi-Layer 0402 Size 0201 0402 0603 K Tolerance G = 2% H = 3% J = 5% K = 10% B = 0.1nH C = 0.2nH S = 0.3nH R Packaging R = 7" Reel 101 Inductance 3N9 = 3.9nH 39N = 39nH R39 = 390nH G Style G = Standard T Termination T = Sn Plating A Special A = Standard HOW TO ORDER DIMENSIONS AVAILABLE INDUCTANCE VALUE AND TOLERANCE A W L T mm (inches) Size L W T A Min Max Size Code Available Inductance Standard Tolerance av ailable Inductance Ranges Tolerance upon request LCMC0201 0.3nH - 100nH 4.3nH - 6.2nH B=±0.1nH, H=±3% 6.8nH - 27nH J=±5% H=±3% 33nH - 100nH J=±5% – LCMC0402 0.6nH - 270nH 6.8 nH - 82 nH J= ±5% G= ±2%, H =±3% 100 nH - 270 nH J= ±5% –

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 0201 L, Q SelfZ DC Rated Packing Ordering Inductance Q Measuring Resonance Resistance Current Amount of Code (nH) Available Tolerance Min. Frequency Frequency (Ω) (mA) 7" Reel 6N8 6.8 ±5%, ±3% 5 100 3,500 6,800 0.50 0.34 150 7N5 7.5 ±5%, ±3% 5 100 3,300 6,000 0.53 0.36 150 8N2 8.2 ±5%, ±3% 5 100 3,200 5,800 0.55 0.38 150 9N1 9.1 ±5%, ±3% 5 100 3,000 5,000 0.62 0.38 150 10N 10 ±5%, ±3% 5 100 2,800 4,860 0.65 0.40 150 12N 12 ±5%, ±3% 5 100 2,400 4,520 0.70 0.50 100 15N 15 ±5%, ±3% 5 100 2,200 4,820 0.80 0.60 100 18N 18 ±5%, ±3% 5 100 2,200 3,000 0.90 0.85 100 22N 22 ±5%, ±3% 5 100 1,800 2,950 1.20 0.86 100 27N 27 ±5%, ±3% 4 100 1,800 2,610 1.80 0.88 50 33N 33 ±5% 4 100 1,700 2,210 2.10 1.05 50 39N 39 ±5% 4 100 1,500 1,860 2.40 1.18 50 47N 47 ±5% 4 100 1,300 1,800 2.80 1.74 100 56N 56 ±5% 4 100 1,100 1,600 3.00 1.85 80 68N 68 ±5% 4 100 1,100 1,500 2.66 2.30 80 82N 82 ±5% 4 100 1,000 1,400 3.37 2.60 70 R10 100 ±5% 4 100 900 1,200 3.74 3.00 60

ELECTRICAL CHARACTERISTICS

Tolerance: B = ±0.1nH, C = ±0.2nH, S = ±0.3nH, G = ±2%, H = ±3%, J = ±5%, K = ±10% Measuring Equipment: HP4287+16196C Measuring Temperature: 25 ± 3ºC Operating Temperature: -55ºC to +125ºC

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 0201 Ordering Typical Inductance (nH) Typical Q 39N 39.0 38.2 42.3 45.6 – – – 6 12 13 13 – – – 47N 47.0 44.0 47.0 49.0 – – – 6 11 12 11 – – – 56N 56.0 54.0 61.0 66.0 – – – 6 11 11 10 – – – 68N 68.0 66.0 76.0 82.0 – – – 6 11 11 10 – – – 82N 82.0 80.0 97.0 108.0 – – – 6 11 10 8 – – – R10 100.0 103.0 138.0 164.0 – – – 6 10 9 6 – – – L, Q VS. FREQUENCY CHARACTERISTICS Tolerance: B = ±0.1nH, C = ±0.2nH, S = ±0.3nH, G = ±2%, H = ±3%, J = ±5%, K = ±10% Measuring Equipment: HP4287+16196C Measuring Temperature: 25 ± 3ºC Operating Temperature: -55ºC to +125ºC

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series

0201 L VS FREQUENCY

10 100 1,000 10,000 Inductance (nH) Frequency (MHz)

0201 Q VS FREQUENCY

10 100 1,000 10,000 Q Frequency (MHz )

0201 Z VS FREQUENCY

10,000 1,000 100 10 100 1,000 10,000 Impedence (ohm) Frequency (MHz )

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 0402 L, Q SelfZ DC Rated Packing Ordering Inductance Q Measuring Resonance Resistance Current Amount of Code (nH) Available Tolerance Min. Frequency Frequency (Ω) (mA) 7" Reel 6N8 6.8 ±5%, ±3%, ±2% 8 100 3900 5430 0.25 0.14 300 10,000 7N5 7.5 ±5%, ±3%, ±2% 8 100 3700 5000 0.28 0.16 300 8N2 8.2 ±5%, ±3%, ±2% 8 100 3500 4660 0.28 0.17 300 9N1 9.1 ±5%, ±3%, ±2% 8 100 3400 4400 0.30 0.22 300 10N 10 ±5%, ±3%, ±2% 8 100 3200 4120 0.31 0.24 300 12N 12 ±5%, ±3%, ±2% 8 100 2600 3820 0.45 0.30 300 15N 15 ±5%, ±3%, ±2% 8 100 2300 3350 0.55 0.38 300 18N 18 ±5%, ±3%, ±2% 8 100 2000 2970 0.65 0.37 300 22N 22 ±5% ±3%,, ±2% 8 100 1600 2640 0.70 0.45 300 27N 27 ±5%, ±3%, ±2% 8 100 1400 2370 0.80 0.49 300 33N 33 ±5%, ±3%, ±2% 8 100 1200 2040 0.90 0.63 200 39N 39 ±5%, ±3%, ±2% 8 100 1100 1800 1.00 0.70 200 47N 47 ±5%, ±3%, ±2% 8 100 900 1660 1.10 0.82 200 56N 56 ±5%, ±3%, ±2% 8 100 750 1560 1.10 0.84 200 68N 68 ±5%, ±3%, ±2% 8 100 750 1330 1.20 0.99 180 82N 82 ±5%, ±3%, ±2% 8 100 600 1160 1.30 1.09 150 R10 100 ±5% 8 100 600 1020 1.60 1.19 150 R12 120 ±5% 8 100 600 860 1.60 1.31 150 R15 150 ±5% 8 100 550 800 2.40 1.58 140 R18 180 ±5% 8 100 500 810 3.70 2.97 130 R22 220 ±5% 8 100 450 700 4.20 3.29 120 R27 270 ±5% 8 100 400 600 4.80 3.92 110 Tolerance: B = ±0.1nH, C = ±0.2nH, S = ±0.3nH, G = ±2%, H = ±3%, J = ±5%, K = ±10% Measuring Equipment: HP4287+16196C Measuring Temperature: 25 ± 3ºC Operating Temperature: -55ºC to +125ºC

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 0402 Ordering Typical Inductance (nH) Typical Q 39N 39.0 40.2 45.9 49.1 – – – 11 20 22 22 – – – 47N 47.0 49.1 57.2 61.7 – – – 11 20 21 21 – – – 56N 56.0 59.2 71.8 79.3 – – – 11 19 19 18 – – – 68N 68.0 74.7 99.4 116.3 – – – 11 18 17 15 – – – 82N 82.0 94.7 140.8 179.5 – – – 11 18 15 12 – – – R10 100.0 117.6 193.7 269.9 – – – 11 17 12 9 – – – R12 120.0 159.8 450.4 – – – – 11 16 7 – – – – L, Q VS. FREQUENCY CHARACTERISTICS

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series

0402 L VS FREQUENCY

Inductance (nH) Frequency (MHz) 100 1,000 10,000 15N R10 33N 56N

0402 Q VS FREQUENCY

Frequency (MHz) 100 1,000 10,000 Q 56N 15N R10 33N

0402 Z VS FREQUENCY

Frequency (MHz) 100 1,000 10,000 100 1000 10,000 Impedance (ohm) 56N 15N R10 33N

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 0603 L, Q SelfZ DC Rated Packing Ordering Inductance Q Measuring Resonance Resistance Current Amount of Code (nH) Available Tolerance Min. Frequency Frequency (Ω) (mA) 7" Reel 6N8 6.8 ±5%, ±2% 10 100 4000 5470 0.25 0.11 600 8N2 8.2 ±5%, ±2% 10 100 3500 4460 0.28 0.14 600 10N 10 ±5%, ±2% 12 100 3200 4360 0.30 0.15 600 12N 12 ±5%, ±2% 12 100 2600 3480 0.35 0.17 600 15N 15 ±5%, ±2% 12 100 2300 3310 0.40 0.19 600 18N 18 ±5%, ±2% 12 100 2000 3080 0.45 0.21 600 22N 22 ±5%, ±2% 12 100 1600 2670 0.50 0.29 600 4,000 27N 27 ±5%, ±2% 12 100 1400 2270 0.55 0.27 600 33N 33 ±5%, ±2% 12 100 1200 1970 0.60 0.36 600 39N 39 ±5%, ±2% 12 100 1100 1830 0.65 0.37 500 47N 47 ±5%, ±2% 12 100 900 1670 0.70 0.47 500 56N 56 ±5%, ±2% 12 100 900 1530 0.75 0.46 500 68N 68 ±5%, ±2% 12 100 700 1360 0.85 0.51 400 82N 82 ±5%, ±2% 12 100 600 1290 0.95 0.57 300 R10 100 ±5%, ±2% 12 100 600 1090 1.00 0.69 300 R12 120 ±5%, ±2% 8 50 500 1030 1.20 0.74 300 R15 150 ±5%, ±2% 8 50 500 820 1.20 0.78 300 R18 180 ±5%, ±2% 8 50 400 690 1.30 0.92 300 R22 220 ±5%, ±2% 8 50 400 630 1.50 1.19 300 R24 240 ±5%, ±2% 8 50 400 600 1.70 1.20 200 R27 270 ±5%, ±2% 8 50 400 520 1.90 1.30 150 R33R 330 ±5%, ±2% 8 50 350 450 2.10 1.50 150 R39 390 ±5%, ±2% 8 50 350 400 2.30 1.80 150 R47 470 ±5%, ±2% 8 50 300 360 2.60 2.04 150 Tolerance: B = ±0.1nH, C = ±0.2nH, S = ±0.3nH, G = ±2%, H = ±3%, J = ±5%, K = ±10% Measuring Equipment: HP4291B+16192A Measuring Temperature: 25 ± 3ºC Operating Temperature: -40ºC to +125ºC

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 0603 Ordering Typical Inductance (nH) Typical Q 33N 33.0 34.9 38.8 40.9 – – – 18 39 43 43 – – – 39N 39.0 41.3 47.7 51.2 – – – 19 36 39 37 – – – 47N 47.0 50.0 58.9 64.0 – – – 17 34 36 34 – – – 56N 56.0 62.0 77.7 87.5 – – – 19 35 34 31 – – – 68N 68.0 76.8 103.2 121.7 – – – 18 33 29 25 – – – 82N 82.0 96.5 145.3 187.2 – – – 19 32 25 20 – – – R10 100.0 123.7 222.4 343.5 – – – 18 30 19 12 – – – R12 120.0 156.0 355.0 – – – – 19 28 14 – – – – R24 240.0 16 L, Q VS. FREQUENCY CHARACTERISTICS

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series

0603 L VS FREQUENCY

Inductance (nH) Frequency (MHz) 100 1,000 10,000 15N R22 33N 56N

0603 Q VS FREQUENCY

Frequency (MHz) 100 1,000 10,000 Q 56N 15N R22 33N

0603 Z VS FREQUENCY

Frequency (MHz) 100 1,000 10,000 100 1000 10,000 Impedance (ohm) 56N 15N R22 33N

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series TEST CONDITION AND REQUIREMENTS No. Item Test Condition Requirements 1 Inductance a. Temperature: 25 ± 3ºC Within specified tolerance. b. Relative Humidity: 45 to 75%RH 2 Q Value a. Temperature: 25 ± 3ºC In accordance with b. Relative Humidity: 45 to 75%RH electrical specification. 3 DC Resistance a. Temperature: 25 ± 3 ºC In accordance with b. Relative Humidity: 45 to 75%RH electrical specification. c. Measuring equipment: HP 4338. 4 Appearance Inductors shall be visually inspected fo r visible evidence of defect. In accordance with spe cification.

5 Dimension Dimension shall be measured with caliper or micrometer In accordance with dimension

specification.

6 Solderability Immerse a test sample into a methanol solution containing More than 75% of the

resin and immerse into molten solder of terminal ele ctrode part shall 230 ± 5 ºC for 5 ± 1 second. be covered with fresh solder. 7 Bending Strength Solder the chip to test jig then a pply a force in the direction 1. No mechanical damag e shown in below. The soldering shall be done with th e reflow shall be observed. method and shall be conducted with care so that the soldering 2. Rdc-value: to meet the is uniform and free of defects such as heat shock. i nitial Spec. 8 Resistance to Immerse a test sample into a methanol solution containing No visible damage. Soldering Heat resin, preheat it at 120 to 150 ºC for 1 minute and immerse Inductance variation withi n 10%. into molten solder of 270 ± 5 ºC for 10 ± 1 second so that both Q variation within 2 0%. terminal electrodes are completely submerged. 9 Thermal Shock Solder a test sample to printed circui t board, and conduct No visible damage. 5 cycles of test under the conditions shown as belo w. Inductance variation within 10%. 0201 & 0402 operating temp. range: -55~125ºC Q varia tion within 20%. 0603 operating temp. range: -40~85ºC Cycle: Maximum operating temp. (30 ± 3min) Minimum operating temp. (30 ± 3min) 10 High Humidity Keep a test sample in an atmosphere with a temperature of 40 ± 2ºC, No visible damage. State Life Test 90~95%RH for 500 ± 12 hours. After t he removal from test chamber, Inductance variation w ithin 10%. 2 to 3 hours of recovery under standard condition, and measurement Q variation within 20%. shall be made after 24 ± 2 hrs. of recovery under s tandard condition. 11 High Humidity Solder a test sample to printed circ uit board then keep the test No visible damage. Load Life Test sample in an atmosphere with a temper ature of 40 ± 2 ºC , 90~95%RH Inductance variation within 10%. for 500 ± 12 hours while supplying the rated curren t. After the removal Q variation within 20%. from test chamber, 2 to 3 hours of recovery under s tandard condition, and measurement shall be made after 24 ± 2 hrs. of recovery under standard condition. 12 High Temperature Keep a test sample in an atmospher e with a temperature of 85 ± 2 ºC No visible damage. State Life Test for 500 ± 12 hours. After the remova l from test chamber, 2 to 3 hours Inductance variat ion within 10%. of recovery under standard condition, and measurement shall be Q variation within 20%. made after 24 ± 2 hrs. of recovery under standard c ondition. 13 High Temperature Solder a test sample to printed c ircuit board then keep the test No visible damage. Load sample in an atmosphere with a temperature of 8 5 ± 2ºC for Inductance variation within 10%. 500 ± 12 hours while supplying the rated current. A fter the removal Q variation within 20%. from test chamber, 2 to 3 hours of recovery under s tandard condition, and measurement shall be made after 24 ± 2 hrs. of recovery under standard condition. Supports (Ø5) Solder 45±2mm 45±2mm Press Jig Test PC Board Sample 20 Press R230 Amplitude 2mm within 3min c. Measuring equipment and fixture: (0603) HP 4291+16192A (0402) HP 4287+16193A (0201) HP 4287+16196C c. Measuring equipment and fixture: (0603) HP 4291+16192A (0402) HP 4287+16193A (0201) HP 4287+16196C Mounting Samples

MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series 165° to 180° Peeling Force Top Tape Base Tape PACKAGING SPECIFICATIONS Paper tape specification (0201/0402/0603) Product Size Code Symbol 0201 0402 0603 Size Tolerance Size Tolerance Size Tolerance Tape Width G T max. D mm (inches) Reel Specifications Cardboard 1.10 (0.043) Max. 1.5 +0.1-0.0 Top Tape 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) 1.75±0.05 (0.069±0.002)

10 Pitches

Tolerence on Tape ±0.2 (±0.008) P F W A B 21±0.80 50 Min (1.969 Min) FULL RADIUS D T G Peel strength of top cover tape The peel speed shall be about 300 mm/min. The peel strength of top cover tape shall be between 0.1 to 1.0N. mm (inches)

0201: 15,000 pieces / reel 0402: 10,000 pieces / reel 0603: 4,000 pieces / reel The contents of a box 0201: 5 reels / box 0402: 5 reels / box 0603: 5 reels / box Marking The following item shall be marked on the reel. a. Manufactures parts number. b. Manufacturing date code. c. Manufacturer name. d. Manufactures lot number. e. Quantity. CAUTIONS Storage The chip inductor shall be packaged in carrier tapes. To keep storage place temperature from +5 to 35ºC, humidity from 45 to 70% RH. The storage atmosphere must be free of gas containi ng sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be affected. The solderability is assured for 12 months from our final inspection date if the above storage condition is followed. Handling Chip inductor should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placemen t. Tape and reeled packages are suitable for automatic pick and placement machine. Recommended pad dimensions Soldering Profile for SMT Process with SnPb Solder Paste The rate of preheat should not exceed 4ºC/sec. and a target of 2ºC/sec. is preferred. Ceramic chip components should be preheated to within 100 to 130ºC of the solderin g. Soldering Profile for SMT Process with Lead Free Solder Paste The rate of preheat should not exceed 4ºC/sec. and a target of 2ºC/sec. is preferred. Ceramic chip components should be preheated to within 100 to 130ºC of the solderin g. Soldering 220°C to 230°C 5 ~ 10 sec. Gradual Natural CoolingPreheating over 1 minover 1 min Time (sec.) Over 200°C, within 40 sec. 120 sec max Temperature (°C ) 300 200 250 Soldering 240°C to 260°C 5 ~ 10 sec. Gradual Natural CoolingPreheating over 1 minover 1 min Time (sec.) Over 200°C, within 90 sec. 120 sec max Temperature (°C ) 300 200 250 c a b Soldering resist SMD Inductor Land Pattern Size (EIA) L x W a b c mm (inches) MultiZLayer High Frequency Ceramic Chip Inductors LCMC Series