LCDA12C-8_05 SEMTECH | Alldatasheet
Document overview
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Technical content
Features
Circuit Diagram Schematic & PIN Configuration Revision 02/18/05 The LCDAxxC-8 has been specifically designed to protect sensitive components which are connected to data and transmission lines from over voltages caused by electrostatic discharge (ESD), electrical fast tran- sients (EFT), and lightning. The low capacitance array configuration of the LCDAxxC-8 allows the user to protect eight high-speed data or I/O lines. They may be used on systems operating from 5 to 15 Volts. The high surge capability (500W, tp=8/20µs) makes the LCDAxxC-8 suitable for telecommunications systems operating in harsh tran- sient environments. The low inductance construction minimizes voltage overshoot during high current surges. The features of the LCDAxxC-8 are ideal for protecting multi-protocol transceivers in WAN applications such as Frame Relay systems, routers, and switches.
Applications
Mechanical Characteristics Multi-Mode Transceiver Protection WAN Equipment: CSU/DSU Multiplexers Routers ISP Equipment Customer Premise Equipment Protection for any of the following interfaces: RS-232 (V.28) RS-449 (V.11/V.10) Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 0.5kV, 12A (8/20µs) Protects eight I/O lines Low capacitance for high-speed interfaces High surge capability Low clamping voltage Solid-state silicon avalanche technology JEDEC SO-16 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tape and Reel per EIA 481 SO-16 (Top View) Pin 1 Pin 16
Description
2 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LCDA12C-8 and LCDA15C-8 Absolute Maximum Rating
Electrical Characteristics
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3 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS LCDA12C-8 and LCDA15C-8 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Clamping Voltage vs. Peak Pulse Current 100 110 0 5 10 15 20 25 30 Time (µs) Percent of IPP e-t td = I PP /2 Wa v e f o r m Parameters: tr = 8µs td = 20µs Pulse Waveform 100 110 0 25 50 75 100 125 150 175 Ambient Temperature - T A (oC) % of Rated Power or IPP 0.01 0.1 0.1 1 10 100 1000 Pulse Duration - tp (µs) Peak Pulse Power - Ppk (kW) 0 5 10 15 20 25 Peak Pulse Current - I PP (A) Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs LCDA15C-8 LCDA12C-8 02468 1 0 1 2 1 4 Reverse Voltage - VR (V) Capacitance - Cj (pF) f = 1MHz 02468 1 0 1 2 Reverse Voltage - VR (V) Capacitance - Cj (pF) f = 1MHz LCDA12C-8 Capacitance vs. Reverse Voltage LCDA15C-8 Capacitance vs. Reverse Voltage
4 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LCDA12C-8 and LCDA15C-8 Device Connection Options for Protection of Eight High-Speed Data Lines The LCDAxxC-8 may be configured to protect up to eight I/O lines operating between 5 and 15V. It may be used to protect the most popular serial data interface standard lines making it ideal for use in equipment utilizing multi-mode transceivers. The LCDAxxC-8 is symmetrical so the data lines may be connected at pins 1-8 or 9-16. Pins 9-16 or 1-8 are connected to ground as shown. For best results, these pins should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Multi-Mode Transceiver Protection The LCDAxxC-8 may be used to protect multi-mode transceiver I/O lines with external connections. The LCDAxxC-8 adds a maximum loading capacitance of 15pF with a working voltage of 12V or 15V. This allows the transceiver to safely operate in all modes without clipping or degradation of the signal. With proper design and layout, the transceiver port can be protected to >15kV (HBM per IEC 61000-4-2). Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: z Place the LCDAxxC-8 near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the LCDAxxC-8 and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Device Connection Applications Information Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
5 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS LCDA12C-8 and LCDA15C-8 Land Pattern - SO-16 Outline Drawing - SO-16 bxN 2X N/2 TIPS SEATING aaa C E/22X A D bbb C A-B D ccc C PLANE N SEE DETAIL A SIDE VIEW A e B e/2 D C 0.25 DETAIL A c L (L1) 01 GAGE PLANE h h H 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -B- CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES: 2. -A- -H- REFERENCE JEDEC STD MS-012, VARIATION AC.4. .050 BSC .236 BSC .010 .150 .386 .154 .390 .012 - 0.25
1.27 BSC
6.00 BSC
3.90 9.90 .157 .394 3.80 9.80 .020 0.31 4.00 10.00 0.51 (.041) .004 .008 .028 .016 .007 .049 .004 .053 8° 0° 0.20 0.10 - 8° 0.40 0.17 1.25 0.10 .041 .010 .069 .065 .010 1.35 (1.04) 0.72 1.04 0.25 - 1.75 1.65 0.25 D DIM N ccc aaa bbb MIN MILLIMETERS DIMENSIONS e L h E b c NOM INCHES MIN A MAX MAX NOM E THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: REFERENCE IPC-SM-782A, RLP NO. 304A.2. .291 .087 .024 .118 (.205) INCHES DIMENSIONS Z P Y X DIM C G MILLIMETERS .050 (5.20) 7.40 2.20 0.60 3.00 1.27 ZG Y P (C) X
6 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LCDA12C-8 and LCDA15C-8 Contact Information Semtech Corporation Protection Products Division
200 Flynn Road, Camarillo, CA 93012
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