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53014HK No.A2214-1/14 Semiconductor Components Industries, LLC, 2014 May, 2014 http://onsemi.com
ORDERING INFORMATION
See detailed ordering and shipping information on page 14 of this data sheet. LC717A10PJ Overview The LC717A10PJ is a high-performance and low-cost ca pacitance-digital-converter LSI for electrostatic capacitive touch sensor, especially focused on usability. It has 16 channels capacitance-sensor input. This makes it ideal for use in the products that need many switches. Since the calibration function and the judgment of ON/OFF are automatically performed in LSI internal, it can make development time more short. A detection result (ON/OFF) for each input can be read out by the serial interface (I2C compatible bus or SPI). Also, measurement value of each input can be read out as 8-bit digital data. Moreover, gain and other parameters can be adjusted using serial interface. Function Detection system: Differential capacitance detection (Mutual capacitance type) Input capacitance resolution: Can detect capacitance changes in the femto Farad order Measurement interval (16 differential inputs): 30ms (Typ) (at initial configuration), 6ms (Typ) (at minimum interval configuration) External components for measurement: Not required Interface: I2C * compatible bus or SPI selectable. Current consumption: 570A (Typ) (VDD = 2.8V), 1.3mA (Typ) (VDD = 5.5V) Supply voltage: 2.6V to 5.5V Detection operations: Switch Packages: SSOP30 Ordering number : EN*A2214 CMOS LSI Capacitance-Digital-Converter LSI for Electrostatic Capacitive Touch Sensors SSOP30(225mil) Advance Information This document contains information on a new product. Specifications and information herein are subject to change without notice. * I2C Bus is a trademark of Philips Corporation.
No.A2214-2/14 Specifications Absolute Maximum Ratings at Ta = +25C Parameter Symbol Ratings (V SS = 0V) Unit Remarks Supply voltage V DD -0.3 to +6.5 V Input voltage V IN -0.3 to VDD+0.3 V *1 Output voltage V OUT -0.3 to VDD+0.3 V *2 Power dissipation Pd max 160 mW Ta = +105C, Mounted on a substrate *3 Peak output current I OP ±8 mA Per a pin Duty ratio 50% *2 Total output current I OA ±40 mA LSI outputs total value Duty ratio 25% *2 *1) Apply to Cin0 to 15, Cref, CrefAdd, nRST, SCL, SDA, SA0, SA1, SCK, SI, nCS *2) Apply to Cdrv, SDA, SO, INTOUT *3) Single-layer glass epoxy board (76.1114.31.6t mm) Recommended Operating Conditions Parameter Symbol Conditions min typ max Unit Remarks Operating supply voltage V DD 2.6 5.5 V Supply ripple + noise Vpp ±20 mV *1 Operating temperature Topr -40 25 105 C *1) We recommend connecting large and small capacitance between VDD and VSS. In this case, the small capacitance is equal to or more than 0.1F, and layout nearby LSI. Electrical Characteristics at VSS = 0V, VDD = 2.6 to 5.5V, Ta -40 to +105C * Unless otherwise specified, the Cdrv drive frequency is fCDRV = 143kHz. * Not tested at low temperature before shipment. Parameter Symbol Conditions min typ max Unit Remarks Capacitance detection resolution N 8 bit Output noise RMS N RMS minimum gain setting ±1.0 LSB *1 *3 Input offset capacitance adjustment range CoffRANGE ±8.0 pF *1 *3 Input offset capacitance adjustment resolution CoffRESO 8 bit Cin offset drift Cin DRIFT minimum gain setting ±8 LSB *1 Cin detection sensitivity Cin SENSE minimum gain setting 0.052 0.108 LSB/fF *2 Cin pin leak current I Cin Cin = Hi-Z ±25 ±500 nA Cin allowable parasitic input capacitance CinSUB Cin against V SS 30 pF *1 *3 Cdrv drive frequency f CDRV 100 143 186 kHz VDD = 5V ±3%, 54.8kHz setting 50.4 59.45 68.5 kHz *1 nRST minimum pulse width t NRST 1 s Power-on reset time t POR 20 ms Power-on reset operation condition: Hold time tPOROP 10 ms *1 Power-on reset operation condition: Input voltage VPOROP 0.1 V *1 Power-on reset operation condition: Power supply rise rate tVDD 0V to V DD 1 V / m s * 1 Long interval time T IVAL 40 101 162 ms Continued to the next page. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recomme nded Operating Ranges limits mayaffect device reliability.
No.A2214-3/14 Continued from the previous page. Parameter Symbol Conditions min typ max Unit Remarks Pin input voltage V IH High input 0.8V DD V *4 VIL Low input 0.2V DD Pin output voltage V OH High output (IOH = +3mA) 0.8VDD V *5 VOL Low output (IOL = -3mA) 0.2VDD VOH V DD = 5V ±3%, High output (IOH = +3mA) 0.96VDD V *1 *5 VOL V DD = 5V ±3%, Low output (IOL = -3mA) 0.02VDD SDA pin output voltage V OL I2C SDA Low output (IOL = -3mA) 0.4 V Pin leak current I LEAK ±1 A *6 Current consumption I DD When initial setting and non-touch VDD = 2.8V 570 980 A *1 When initial setting and non-touch VDD = 5.5V 1.3 2.2 mA *1 Short interval mode ( short interval time is set to 5ms) VDD = 5.5V 4.2 6.5 mA ISTBY During Sleep process 0.1 70 A *1) Design guarantee values (not tested before shipment) *2) Measurements conducted using the test mode in the LSI *3) Ta = +25C *4) Apply to nRST, SCL, SDA, SA0, SA1, SCK, SI, nCS *5) Apply to Cdrv, SO, INTOUT *6) Apply to nRST, SCL, SDA, SA0, SA1, SCK, SI, nCS Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product per formance may not be indicated by the Electrical Characteristics if operated under different conditions.
No.A2214-4/14 I2C Compatible Bus Timing Characteristics at VSS = 0, VDD = 2.6 to 5.5V, Ta = -40 to +105C *Not tested at low temperature before shipment Parameter Symbol Pin Name Conditions min typ max Unit Remarks SCL clock frequency f SCL SCL 400 kHz START condition hold time t HD;STA SCL SDA 0.6 s SCL clock low period t LOW SCL 1.3 s SCL clock high period t HIGH SCL 0.6 s Repeated START condition setup time tSU;STA SCL SDA 0.6 s *1 Data hold time t HD;DAT SCL SDA 00 . 9 s Data setup time t SU;DAT SCL SDA 500 ns 100 ns *1 SDA, SCL rise/fall time t r / tf SCL SDA 300 ns *1 STOP condition setup time t SU;STO SCL SDA 0.6 s STOP-to-START bus release time tBUF SCL SDA 2.5 s 1.3 s *1 *1) Design guarantee values (not tested before shipment)
No.A2214-5/14 SPI Bus Timing Characteristics at VSS = 0, VDD = 2.6 to 5.5V, Ta = -40 to +105C *Not tested at low temperature before shipment Parameter Symbol Pin Name Conditions min typ max Unit Remarks SCK clock frequency f SCK SCK 5 MHz SCK clock Low time t LOW SCK 100 ns 90 ns *1 SCK clock High time t HIGH SCK 100 ns 90 ns *1 Input signal rise/fall time t r / tf nCS SCK SI 300 ns *1 nCS setup time t SU;NCS nCS SCK 200 ns 90 ns *1 SCK clock setup time t SU;SCK nCS SCK 100 ns 90 ns *1 Data setup time t SU;SI SCK SI 100 ns 20 ns *1 Data hold time t HD;SI SCK SI 100 ns 30 ns *1 nCS hold time t HD;NCS nCS SCK 200 ns 90 ns *1 SCK clock hold time t HD;SCK nCS SCK 700 ns 90 ns *1 nCS standby pulse width t CPH nCS 300 ns 90 ns *1 Output high impedance time from nCS tCHZ nCS SO 80 ns *1 Output data determination time t v SCK SO 100 ns 80 ns *1 Output data hold time t HD;SO SCK SO 100 ns 0 n s * 1 Output low impedance time from SCK clock tCLZ SCK SO 100 ns 0 n s * 1 *1) Design guarantee values (not tested before shipment)
No.A2214-6/14 Dynamic offset calibration function to correct Cin offset drift When measurement data at a certain channel are consecutively within the execution range of dynamic offset calibration (4 to touch threshold, or -128 to -4) for the period of time corresponding to a value, dynamic offset calibration is performed and the reference value at the channel is gradually corrected to 0. The figure below shows the operation when the measured value began to drift in the positive direction from the central value gradually. The examples of setting to 8 times the dynamic offset calibration carried count. CinX Threshold Execution Range of Dynamic Offset Calibration (Positive range) t 1234567800 = 0x01 Dynamic Offset Calibration Execution Count Number (Positive range) Measurement Time + Long Interval Time [ms] Dynamic OffCal Count Plus Register Measurement Timing Dynamic Offset Calibration Judgment points (They means measurement points where the LC717A10 judges whether to perform dynamic offset calibration All other measurement points other than the above Judgment points within the execution range of dynamic offset calibration
No.A2214-7/14 Power-on Reset (POR) When power is turned on, power-on reset is enabled inside the LSI and its state is released after a certain power-on reset time, tPOR. Power-on Reset operation condition; Power supply rise rate tVDD must be at least 1V/ms. Since INTOUT pin changes from “High” to “Low” at the same time as the released of power-on reset, it is possible to verify the timing of release of power-on reset externally. During power-on reset, Cin, Cref and CrefAdd are unknown. fig.1 I2C Compatible Bus Data Timing fig.2 I2C Compatible Bus Communication Formats Write format (data can be written into sequentially incremented addresses) START Slave Address Write=L Register Address (N)ACK ACK Data written to Register Address (N) ACK Data written to Register Address (N+1) ACK STOP Slave Slave Slave Slave fig.3 Read format (data can be read from sequentially incremented addresses) START Slave Address Write=L Register Address (N)ACK ACK Data read from Register Address (N)ACKRESTART Slave Address Read=H ACK Data read from Register Address (N+1) ACK Data read from Register Address (N+2) NACK STOP Slave Slave Slave Master Master Master fig.4 SDA SCL START condition tHD;STA tLOW tHIGH tr repeated START condition STOP condition 10% tf 90% 10% 10% 90% 90% tHD;DTA tSU;DTA 10% 10% 10% 90% tSU;STA 90% 90% tHD;STA 90% 10% 90% 10% 90% 10% tSU;STO tBUF START condition 90% POR (LSI internal signal) RELEASE tPOR VDD RESET tVDD INTOUT VPOROP Cin, Cref, CrefAdd UNKNOWN VALID tPOROP UNKNOWN UNKNOWN UNKNOWN RESET RELEASE tPOR VALID
No.A2214-8/14 I2C Compatible Bus Slave Address Selection of two kinds of addresses is possible through the SA0 and SA1 terminals. SA1 input SA0 input 7bit slave address Binary notation 8bit slave address Low Low 0x16 00101100b (Write) 0x2C 00101101b (Read) 0x2D Low High 0x17 00101110b (Write) 0x2E 00101111b (Read) 0x2F High Low 0x18 00110000b (Write) 0x30 00110001b (Read) 0x31 High High 0x19 00110010b (Write) 0x32 00110011b (Read) 0x33 SPI Data Timing (SPI Mode 0 / Mode 3) fig.5 SPI Communication Formats (Example of Mode 0) Write format (data can be written into sequentially incremented addresses with preserving nCS = L) nCS SCK SI SO 76543 2 10 Hi-Z Register Address(N) Data written to Register Address(N) Data written to Register Address(N+1) Write=L 76543 2 10 76543 2 10 fig.6 Read format (data can be read from sequentially incremented addresses with preserving nCS = L) Register Address(N) Data read from Register Address(N) Data read from Register Address(N+1) Read=H 76543 2 10 Hi-Z nCS SCK SI SO 76543210 76543210 fig.7 nCS SCK SI SO tSU;SI VALID Hi-Z tr tHD;SI tSU;SCK tSU;NCS tHIGH t LOW tf tCPH tHD;NCS tHD;SCK tCLZ tHD;SO tCHZ VALID tV
No.A2214-9/14 unit : mm SSOP30 (225 mil) CASE 565AZ ISSUE A SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (Unit: mm) 5.80 0.32 1.00 0.50 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. XXXXXXXXXX YMDDD
No.A2214-10/14 Pin Assignment Pin No. Pin Name Pin No. Pin Name
1 V DD 16 Cref
2 V SS 17 CrefAdd
3 Non Connect *1 18 Cdrv
4 Cin4 19 INTOUT
5 Cin5 20 SA1
6 Cin6 21 SCL/SCK
7 Cin7 22 SDA/SI
8 Cin8 23 SA0/SO
9 Cin9 24 nCS
10 Cin10 25 nRST
11 Cin11 26 Non Connect *1
12 Cin12 27 Cin0
13 Cin13 28 Cin1
14 Cin14 29 Cin2
15 Cin15 30 Cin3
*1) connect to GND when mounted Block Diagram Cin0 VDD VSS INTOUT Cin1 Cin2 Cin3 Cin4 Cin5 Cin6 Cin7 Cin8 Cin9 Cin10 Cin11 Cin12 Cin13 Cin14 Cin15 Cref CrefAdd Cdrv nRST nCS SCL/SCK SDA/SI SA0/SO SA1 MUX MUX 1st AMP A/D CONVERTER 2nd AMP CONTROL LOGIC I2C/SPI POR OSCILLATOR LC717A10PJ is capacitance-digital-converter LSI capable of detecting changes in capacitance in the order of femto Farads. It consists of an oscillation circuit that generates the system clock, a power-on reset circuit that resets the system when the power is turned on, a multiplexer that selects the input channels, a two-stage amplifier that detects the changes in the capacitance and outputs analog-amplitude values, a A/D converter that converts the analog-amplitude values into digital data, an I2C compatible bus or a SPI that enables serial communication with external devices and a control logic that controls the entire chip.
No.A2214-11/14 Pin Functions Pin Name I/O Pin Functions Pin Type Cin0 I/O Capacitance sensor input R AMP VDD VSS Buffer Cin1 I/O Capacitance sensor input Cin2 I/O Capacitance sensor input Cin3 I/O Capacitance sensor input Cin4 I/O Capacitance sensor input Cin5 I/O Capacitance sensor input Cin6 I/O Capacitance sensor input Cin7 I/O Capacitance sensor input Cin8 I/O Capacitance sensor input Cin9 I/O Capacitance sensor input Cin10 I/O Capacitance sensor input Cin11 I/O Capacitance sensor input Cin12 I/O Capacitance sensor input Cin13 I/O Capacitance sensor input Cin14 I/O Capacitance sensor input Cin15 I/O Capacitance sensor input Cref I/O Reference capacitance input CrefAdd I/O Reference capacitance input for addition Cdrv O Output for capacitance sensors drive VDD VSS Buffer INTOUT O Interrupt output SCL/SCK I Clock input (I2C) / Clock input (SPI) VDD VSS R nCS I Interface selection / Chip select inverting input (SPI) nRST I External reset signal inverting input SA1 I Slave address selection (I 2C) SDA/SI I/O Data input and output (I2C) / Data input (SPI) VDD VSS R Continued to the next page.
No.A2214-12/14 Continued from the previous page. Pin Name I/O Pin Functions Pin Type SA0/SO I/O Slave address selection (I2C) / Data output (SPI) VDD VSS R Buffer VDD Power supply (2.6V to 5.5V) *1 VSS Ground (Earth) *1 *2 *1) Inserting a high-valued capacitor and a low-valued capacitor in parallel between VDD and VSS is recommended. In this case, the small-valued capacitor should be at least 0.1F, and is mounted near the LSI. *2) When VSS terminal is not grounded in battery-powered mobile equipment, detection sensitivity may be degraded. Details of Pin Functions
- Cin0 to Cin15 These are the capacitance-sensor-input pins. These pins are used by connecting them to the touch switch pattern. Cin and the Cdrv wire patterns should be close to each other. By doing so, Cdrv and Cin patterns are capacitively coupled. Therefore, LSI can detect capacitance change near each pattern as 8bit digital data. However, if the shape of each pattern or the capacitively coupled value of Cdrv is not appropriate, it may not be able to detect the capacitance change correctly. In this LSI, there is a two-stage amplifier that detects the changes in the capacitance and outputs analog-amplitude values. Cin0 to Cin15 are connected to the inverting input of the 1st amplifier. During measurement process, channels other than the one being measured are all in “Low” condition. Leave the unused terminals open.
- Cref, CrefAdd These are the reference-capacitance-input pins. These are used by connecting to the wire pattern like Cin pins or are used by connecting any capacitance between this pin and Cdrv pin. In this LSI, there is a two-stage amplifier that detects the changes in the capacitance and outputs analog-amplitude values. Cref is connected to the non-inverting input of the 1st amplifier. Due to the parasitic capacitance generated in the wire connections of Cin pins and their patterns, as well as the one generated between the wire patterns of Cin and Cdrv pins, Cref may not detect capacitance change of each Cin pin accurately. In this case, connect an appropriate capacitance between Cref and Cdrv to detect capacitance change accurately. However, if the difference between the parasitic capacitance of each Cin pin is extremely large, it may not detect capacitance change of each Cin pin correctly. CrefAdd can be used as additional terminal for Cref. Leave the CrefAdd open if not in used.
- Cdrv It is the output pin for capacitance sensors drive. It outputs the pulse voltage which is needed to detect capacitance at Cin0 to Cin15. Cdrv and Cin wire patterns should be close to each other so that they are capacitively coupled.
- INTOUT It is the interrupt-output pin. It is used by connecting to a main microcomputer if necessary, and use as interrupt signal. (High Active) Leave the terminal open if not in used.
- SCL/SCK Clock input (I 2C) / Clock input (SPI) It is the clock input pin of the I2C compatible bus or the SPI depending on the mode of operation.
No.A2214-13/14
- nCS Interface selection / Chip-select-inverting input (SPI) Selection of I2C compatible bus mode or SPI mode is through this terminal. After initialization, the LSI is automatically in I2C compatible bus mode. To continually use I2C compatible bus mode, fix nCS pin to “High”. To switch to SPI mode after LSI initialization, change the nCS input “High” “Low”. The nCS pin is used as the chip-select-inverting input pin of SPI, and SPI mode is kept until LSI is again initialized.
- nRST It is the external-reset-signal-inverting-input pin. When nRST pin is “Low”, LSI is in reset state. Each pin (Cin0 to 15, Cref, CrefAdd) is “Hi-Z” during reset state.
- SDA/SI Data input and output (I2C) / Data input (SPI) It is the data input and output pin of the I2C compatible bus or the data input pin of the SPI depending on the mode of operation.
- SA0/SO Slave address selection (I2C) / Data output (SPI) It is the slave address selection pin of the I2C compatible bus or the data output pin of the SPI depending on the mode of operation.
- SA1 Slave address selection (I 2C) It is the slave address selection pin of the I2C compatible bus. When SPI mode, connect to the SA1 pin to GND.
PS No.A2214-14/14 Device Package Shipping (Qty / Packing) LC717A10PJ-AH SSOP30(225mil) (Pb-Free / Harogen Free) 1000 / Tape & Reel ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequentia l or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use a s components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and dis tributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personali n j u r yo r death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture oft h e part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.