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Document overview
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Technical content
Features
HG-CVR algorithm technology No external sense resistor 2.8% accuracy of RSOC Accurate RSOC of aging battery Automatic convergence of error Adjustment for the parasitic impedance around the battery Simple and Quick Setup Low power consumption 3μA Operational mode Precision Voltage measurement ±7.5mV Precision Timer ±3.5% Alerts for Low RSOC and / or Low Voltage Temperature compensation Sense Thermistor input Via I2C Detect Battery insertion I2C Interface (up to 400 kHz supported)
Applications
Wireless Handsets Smartphones / PDA devices MP3 players Digital cameras Portable Game Players USB-related devices www.onsemi.com
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 22 of this data sheet WDFN8 3x4, 0.65P Pb-Free, Halogen Free type WLCSP9, 1.60x1.76 Pb-Free, Halogen Free type * I2C Bus is a trademark of Philips Corporation.
Table 1. Pin Function 1 1B TEST I Connect this pin to VSS. 2 1A V SS - Connect this pin to the battery’s negative () pin. 3 3A V DD - Connect this pin to the battery’s positive (+) pin. This pin indicates alarm by low output(open drain). Pull-up must be done externally. Alarm conditions are specified by registers (0x13 or 0x14). Connect this pin to VSS when not in use. Power supply output for thermistor. This pin goes HIGH during temperature read operation. Resistance value of TSW (for thermistor pull-up) must be the same value as the thermistor. 7 1C SDA I/O I2C Data pin (open drain). Pull-up must be done externally. 8 2C SCL I/O I2C Clock pin (open drain). Pull-up must be done externally.
- 2B NC - Connect this pin to VSS.
Note 1: TSW and TSENSE must be disconnected as figure 1 when not in use.
Table 2. Absolute Maximum Ratings at Ta = 25C, VSS = 0V Table 3. Allowable Operating Conditions at Ta = 40 to +85C, VSS = 0V damage may occur and reliability may be affected. Operating Ranges limits may affect device reliability.
Table 4. Electrical Characteristics at Ta = 40 to +85C, VSS = 0V Note 2: Once VDD voltage exceeds over the VRR, this LSI will release RESET status. And the LSI goes into Sleep mode TINIT after it. Note 3: Consumption current is a value in the range of 20C to +70C. indicated by the Electrical Characteristics if operated under different conditions.
Table 5. I2C Slave Characteristics at Ta = 40 to +85C, VSS = 0V Figure 5. I2C Timing Diagram
www.onsemi.com I2C Communication Protocol Communication protocol type : I C Frequency : Supported up to 400kHz IC address [Slave Address] : 0x16 (It becomes "0001011X" when you write a binary, because the slave address is 7 bits. [X]=Rd/Wr.) Bus Protocols S : Start Condition Sr : Repeated Start Condition Rd : Read (bit value of 1) Wr : Write (bit value of 0) A : ACK (bit value of 0) N : NACK (bit value of 1) P : Stop Condition CRC-8 : Slave Address to Last Data (CRC-8-ATM : ex.3778mV : 0x16, 0x09, 0x17, 0xC2, 0x0E 0x86) : Master-to-Slave : Slave-to-Master … : Continuation of protocol Read Word Protocol S Slave Address Wr A Command Code A … Sr Slave Address Rd A Data Byte Low A Data Byte High … A CRC-8 N P * When you do not read CRC-8, there is not the reliability of data. CRC-8-ATM ex : (5 bytes) 0x16, 0x09, 0x17, 0xC2, 0x0E 0x86 Write Word Protocol S Slave Address Wr A Command Code A … Data Byte Low A Data Byte High A CRC-8 A P * When you do not add CRC-8, the Written data (Data byte Low/High) become invalid. CRC-8-ATM ex : (4 bytes) 0x16, 0x09, 0x55, 0xAA 0x3B
Figure 6. I To wake up from Sleep mode, and to start I2C communication, Host side must set SDA low prior to the I2C communication. SDA, as above timing chart. This “Wake up condition” is invalid for the following two cases. after STOP condition (below case). communication. If Operational mode is set, it is possible to start I2C communication without this “Wake up operation”. its operation mode before the other Device starts I2C communication.
Table 6. Function of Registers Note 4: See “Power-on Reset / Battery Insertion Detection” and figure 16.
The LSI contains a data file co mprised of two battery profiles. Table 8. Register Number of the Parameter (0x1A) contains rises than this value. Set to Zero to disable. Figure 14. Figure 14. Alarm Low RSOC calculation and tracking of RSOC during charge and discharge. measured in the previous Operational mode. Figure 15. Alarm Low Cell Voltage temperature into the Cell Temperature register. The LSI contains a data file comprised of two battery profiles. number ordered. This file can be loaded in the field if required. Table 8. Battery profile vs register
04 UR18650ZY (Panasonic) 0x0001
www.onsemi.com HG-CVR Hybrid Gauging by Current-Voltage tracking with internal Resistance HG-CVR is ON Semiconductor’s unique method which is used to calculate accurate RSOC. HG-CVR first measures battery voltage and temperature. Precis e reference voltage is essential for accurate voltage measurement. LC709203F has accurate internal reference voltage circuit with little temperature dependency. It also uses the measured battery voltage and internal impedance and Open Circuit Voltage (OCV) of a battery for the current measurement. OCV is battery voltage without load current. The measured battery voltage is separated into OCV and varied voltage by load current. The varied voltage is the product of load current and internal impedance. Then the current is determined by the following formulas. Where V(VARIED) i s varied voltage by load current, V(MEASURED) is measured voltage, R(INTERNAL) is internal impedance of a battery. Detailed information about the internal impedance and OCV is installed in the LSI. The internal impedance is affected by rema ining capacity, load-current, temperature, and more. Then the LSI has the information as look up table. HG-CVR accumulates battery coulomb using the information of the current and a steady period by a high accuracy internal timer. The remaining capacity of a battery is calculated with the accumulated coulomb. How to identify Aging By repeating discharge/charge, in ternal impedance of a battery will gradually increase, and the Full Charge Capacity (FCC) will decrease. In coulomb countin g method RSOC is generally calculated using the FCC and the Remaining Capacity (RM). Then the decreased FCC must be preliminarily measured with learning cycle. But HG-CVR can measure the RSOC of deteriorated battery without learning cycle. The internal battery impedance that HG-CVR uses to calculate the current correlates highly with FCC. The correlation is based on battery chemistry. The RSOC that this LSI reports using the correlation is not affected by aging. Figure 22-24 show RSOC measuremen t result of a battery with decreased FCC due to its aging. The shown RSOC is based on the decreased FCC even with a battery with 80% FCC after executing 300 times of discharge/charge. Automatic Convergence of the Error A problem of coulomb counting method is the fact that the error is accumulated over time - This error must be corrected. The general gauges using coulomb counting method must find an opportunity to correct it. This LSI with HG-CVR has the feature that the error of RSOC converges, doesn’t emit without such an opportunity. The error constantly converges in the value estimated from the Open Circuit Voltage. Figure 25 shows the convergent characteristic from the initialize error. Also, coulomb counting met hod cannot detect accurate residual change because the amount of the current from self-discharge is too small but HG-CVR is capable to deal with such detection by using the voltage information. Simple and Quick Setup In general, it is necessary to obtain multiple parameters for a fuel gauge and it takes a lot of resource and additional development time of the users. One of the unique features of LC709203F is very small number of parameters to be prepared by the beginning of battery measurement – the minimum amount of parameter which users may make is one because Adjustment pack application register has to have one. Such simple and quick start-up is realized by having multiple profile data in the LSI to suppor t various types of batteries. Please contact your local sales o ffice to learn more information on how to measure a battery that cannot use already-prepared profile data. Low Power Consumption Low power consumption of 3 A is realized in the Operation mode. This LSI monitors charge/discharge condition of a battery and changes the sampling rate accordi ng to its change of current. Power consumption reduction w ithout deteriorating its RSOC accuracy was enabled by utilizing this method. Power-on Reset / Battery Insertion Detection When this LSI detects battery insertion, it starts Power-on reset automatically. Once the battery voltage exceeds over the V RR, it will release RESET status and will complete LSI initialization within T INIT to enter into Operational mode. All registers are initialized after Power-on reset. Then I2C communication can be started. LC709203FXE-0xMH sets itself into Sleep mode automatically after T ATS from the end of initialization. Therefore set to operational mode manual ly after it enters into Sleep mode. LC709203FQH-0xTWG doesn’t set itself into Sleep mode automatically. Figure 16. This LSI will also execute system reset automatically if a battery voltage exceeds under the V RR during operation. V(VARIED) = V(MEASURED)OCV (1) I = (2) V(VARIED) R(INTERNAL) RSOC = 100% (3) RM FCC
Figure 25. Convergent characteristic from the initialize error
www.onsemi.com PACKAGE DIMENSIONS unit : mm CASE 509AF ISSUE C A = Assembly Location Y = Year WW = Work Week = Pb-Free Package *This information is generic. Please refer to device data sheet for actual part marking. may or may not be present. GENERIC MARKING DIAGRAM* XXXXX XXXXX AYWW (Note: Microdot may be in either location) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL AS THE LEADS. A B E D BOTTOM VIEW b e 0.10 B 0.05 AC C NOTE 3 0.10 C PIN ONE REFERENCE TOP VIEW2X 0.10 C A (A3) 0.08 C 0.10 C C SEATING PLANESIDE VIEW L8X DIM MIN MAX MILLIMETERS A A1 0.00 0.05 b 0.20 0.30 D 3.00 BSC D2 1.70 1.90 E 4.00 BSC E2 2.30 2.50 e 0.65 BSC L 0.45 0.55 0.701.96 0.35 0.65 PITCH 2.56 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. RECOMMENDED DIMENSIONS: MILLIMETERS DETAIL A L ALTERNATE CONSTRUCTIONS L DETAIL B DETAIL A NOTE 4 e/2 SOLDERING FOOTPRINT* DETAIL B MOLD CMPDEXPOSED Cu ALTERNATE CONSTRUCTIONS A3 0.20 REF
0.10 B AC
4.30 WDFN8 3x4, 0.65P
www.onsemi.com PACKAGE DIMENSIONS unit : mm WLCSP9, 1.60x1.76 CASE 567JH ISSUE B SEATING PLANE 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE SPHERICAL CROWNS OF THE SOLDER BALLS.2X DIM A MIN MAX −−− MILLIMETERS D 1.60 BSC E b 0.20 0.30 e 0.50 BSC 0.51 E D A B PIN A1 REFERENCE A0.05 BC 0.03 C 0.08 C 9X b 123 C B A
0.10 C A
C 0.09 0.19
1.76 BSC
0.50 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*
0.05 C2X
e RECOMMENDED PACKAGE OUTLINE e PITCH 0.50 PITCH BACKCOAT
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