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Technical content

Features

 Accuracy of remaining battery power level measurement

  • ±3% (at an ambient operating temperature of 0°C to 50°C) Note: The accuracy above is the value of an experiment using the evaluation board.  Precision ±7.5mV/Cell Voltage Measurement  A current sensing resistor is unnecessary.  Alert function  Interface
  • I2C Interface (up to 400 kHz supported)  Low power consumption
  • Normal Mode : 15 μA
  • Sleep Mode : 0.1 μA  Corresponding battery
  • Model to be used depending on the material of the electrode of the battery pack + is different. LC709202F-01: ternary system LC709202F-02: nickelic acid CMOS LSI 1-Cell Li+ (lithium-ion) Battery Monitor IC 2.6 2.6 0.4 0.8 0.25 (0.035) SIDE VIEW SIDE VIEW BOTTOM VIEWTOP VIEW LASER MARKED INDEX 0.5 (0.55) (C0.116) (0.13) (0.125) VCT16(2.6X2.6) * I2C Bus is a trademark of Philips Corporation.

No.A2173-2/10  Ports

  • I2C communication pin 2 (SDA, SCL)
  • Battery temperature reading control pin 1 (TSW)
  • Analog voltage input pin for battery temperature 1 (TSENSE)
  • External alarm / Interrupt for Low-Battery warning 1 (ALARMB)
  • Reset pin 1 (RESB)
  • TEST pin 3 (TEST0, TEST1, TEST2)
  • Power supply pin 3 (VSS, VDD1, VDD2)  Package form
  • VCT16 (2.6×2.6) : Lead-free type Pin Assignment VCT16 (2.6×2.6) “Lead-free Type” Pin Function VCT16 Pin Name I/O Description 1 V SS - Connect to the - terminal of the battery.

2 RESB I Reset pin

3 V DD1 - Connect to the + terminal of the battery.

4 TEST0 I Test pin

*Connect to VSS. 5 ALARMB O Alert indication. An active low output used to indicate specified condition thresholds have been met. *When you do not use an alert function, please connect with VSS.

8 TEST1 O Set “OPEN”

9 TSW O Battery temperature reading control pin

*Set high when reading in the temperature, held low at other times.

10 TSENSE I Battery temperature analog voltage input pin

11 SDA I/O I2C data pin

12 SCL I/O I2C clock pin

13 V DD2 - + power pin for I2C-Bus communication pin(SDA,SCL)

16 TEST2 O Set “OPEN”

No.A2173-3/10 Block Diagram

No.A2173-4/10 Absolute Maximum Ratings at Ta=25°C, VSS=0V Parameter Symbol Pin/Remarks Conditions Specification Unit VDD[V] min typ max Maximum supply voltage VDD max V DD1, VDD2 -0.3 +6.5 V Input voltage V I (1) RESB, TSENSE -0.3 VDD1 +0.3 Output voltage V o (1) TSW -0.3 VDD1 +0.3 Vo (2) ALARMB -0.3 Input/output voltage V IO (1) SDA, SCL -0.3 +5.5 Allowable power dissipation Pd max VCT16 Ta=-40 to+85 °C 55 mW Operating ambient temperature Topr -40 +85 Storage ambient temperature Tstg -55 +125 Allowable Operating Conditions at Ta= -40 to +85°C, VSS=0V Parameter Symbol Pin/Remarks Conditions Specification unit VDD[V] min typ max Operating supply voltage VDD (1) V DD1 2.5 4.5 V High level input voltage VIH (1) TSENSE 2.5 to 4.5 0.70V DD1 V DD1 VIH (2) RESB 2.5 to 4.5 0.75V DD1 V DD1 Low level input voltage VIL (1) TSENSE 2.5 to 4.5 V SS 0.25V DD1 VIL (2) RESB 2.5 to 4.5 V SS 0.25V DD1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Oper ating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

No.A2173-5/10 Electrical Characteristics at Ta= -40 to +85°C, VSS=0V Parameter Symbol Pin/Remarks Conditions Specification Unit VDD[V] min typ max High level input current IIH (1) RESB V IN=VDD1 (including output transistor off leakage current) 2.5 to 4.5 1 μA IIH (2) SDA, SCL V IN=VDD2 VDD2=1.6V to 5.5V (including output transistor off leakage current) 2.5 to 4.5 1 Low level input current IIL (1) RESB V IN=VSS (including output transistor off leakage current) 2.5 to 4.5 -1 IIL (2) SDA, SCL V IN=VSS VDD2=1.6V to 5.5V (including output transistor off leakage current) 2.5 to 4.5 -1 High level output voltage VOH (1) TSW I OH=-0.4 mA 3.0 to 4.5 V DD-0.4 V VOH (2) I OH=-0.2 mA 2.5 to 4.5 V DD-0.4 Low level output voltage VOL (1) TSW, ALARMB, SDA, SCL IOL=3.0 mA 3.0 to 4.5 0.4 VOL (2) I OL=1.3 mA 2.5 to 4.5 0.4 Hysteresis voltage VHYS(1) RESB 2.5 to 4.5 0.1V DD1 VHYS(2) SDA, SCL 2.5 to 4.5 0.1V DD2 Pin capacitance CP All pins Pins other than the pin under test VIN=VSS Ta=25°C 2.5 to 4.5 10 pF Consumption current (Note 1) IDD (1) V DD1 Normal Mode 2.5 to 4.5 15 26 μA IDD (2) Auto Mode 2.5 to 4.5 2 to 15 4 to 26 IDD (3) Sleep Mode 2.5 to 4.5 0.1 5 Voltage measurement accuracy mV/cellVME (2) Ta= -20 °C to +70°C 2.5 to 4.5 -20 +20 Note 1: Consumption current is a value in the range of -20°C to +70°C

No.A2173-6/10 I2C Slave Characteristics at Ta=-40 to+85°C, VSS=0V Parameter Symbol Pin/Remarks Conditions Specification unit VDD[V] min max Clock frequency TSCL SCL 2.5 to 4.5 400 kHz Bus free time between STOP condition and START condition TBUF SCL, SDA See Fig. 1. 1.3 μs Hold time (repeated) START condition First clock pulse is generated after this interval THD:STA SCL, SDA See Fig. 1. 0.6 μs Repeated START condition setup time TSU:STA SCL, SDA See Fig. 1. 0.6 μs STOP condition setup time TSU:STO SCL, SDA See Fig. 1. 0.6 μs Data hold time THD:DAT SCL, SDA See Fig. 1. 0 0.9 μs Data setup time TSU:DAT SCL, SDA See Fig. 1. 100 ns Clock low period TLOW SCL 1.3 μs Clock high period THIGH SCL 0.6 μs Clock/data fall time TF SCL, SDA 20 + 0.1C B 300 ns Clock/data rise time TR SCL, SDA 20 + 0.1C B 300 ns Figure 1 I2C Timing t HD:STA t SU:STO tBUF t LOW t HD:DAT t HIGH t R t F t SU:DAT t SU:STA t HD:STA PS S P

No.A2173-8/10 Communication Protocol Communication protocol type: I2C Frequency: 400 kHz Address: 0x16 Bus Protocols : Start Condition : Repeated Start Condition : Read (bit value of 1) : Write (bit value of 0) : ACK (bit value of 0) : NACK (bit value of 1) : Stop Condition : Slave Address to Last Data (CRC-8-ATM: ex.3778mV : 0x16,0x09,0x17,0xC2,0x0E 0x86) : Master-to-Slave : Slave-to-Master : Continuation of protocol Read Word Protocol Write Word Protocol P S Sr Rd Wr A N P CRC-8 S Rd A Data Byte Low A Slave Address Wr A Command Code A Command Code A Data Byte High … A CRC-8 N P Sr Slave Address Data Byte Low A Data Byte High A CRC-8 SS l a v e A d d r e s s W r A A Access Slave Functions Command Code Range Unit Read Cell Temperature 0x08 0 to 65535 0.1°K (0.0 °C= 2732) Cell Voltage 0x09 0 to 65535 mV Current 0x0A -32768 to 32767 mA Adjustment Pack 8 0x0B 0 to 255 Value Remaining Capacity 0x0F 0 to 1000 mAh Relative State Of Charge 0x0D 0 to 100 % Full Charge Capacity 0x10 1000 mAh IC Version 0x11 0 to 65535 Version Adjustment Thermistor 0x12 0 to 255 Value Hot Start 0x13 bit 0 disable: 0 or enable: 1 Sleep Mode bit 1 Auto Mode bit 2 Alarm Low Battery 0x14 High : 0 to 250 20mV Low : 0 to 100 % Adjustment B 0x15 0 to 65535 B System Mode 0x16 bit 0to3 : data 0 Nomal Mode data 1 Sleep Mode data 2 Auto Mode bit 4to7 : data 0to 6 Auto deep Write Adjustment Pack 0 0x00 0 to 32767 Value Adjustment Pack 1 0x01 0 to 32767 Value Adjustment Pack 2 0x02 0 to 32767 Value Adjustment Pack 3 0x03 0 to 32767 Value Adjustment Pack 4 0x04 0 to 32767 Value Adjustment Pack 5 0x05 0 to 32767 Value Set Relative State Of Charge 0x08 High : 0xA5 - Low : 0 to 100 % Adjustment Pack 8 High : 0x5A - Low : 0 to 255 Value Adjustment Thermistor High : 0xAA - Low : 0 to 255 Value Hot Start High : 0x55 Low : bit 0 disable: 0 or enable: 1 Sleep Mode bit 1 Auto Mode bit 2 Initial Relative State Of Charge 0x09 0xAA55 - Alarm Low Battery 0x0A High : 0 to 250 20mV(activate under) Low : 0 to 100 % (activate under) Adjustment B 0x0B 0 to 65535 B Cell Temperature 0x0C 2532 to 3332 (I2C Write Mode) 0.1°K (0.0 = 2732) 0xAA55 (Thermistor Mode) -

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