LC5200

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Technical content

48102.002

Description

LC5200 series is an off-line LED driver IC which includes both a main controller integrated circuit (MIC) and a power MOSFET. Its high voltage capability allows direct connection to a wide range of supply voltages ranging from 25 to 400 V (recommended). The LC5200 uses constant current mode to drive LEDs. The package is a standard 8-pin DIP, with pin 7 removed for greater creepage distance from the supply pin. Features and Benefits ▪ Supply voltage, VBB, 450 V maximum, 25 to 400 V recommended; Note: lowest voltage can vary depending on LED loads ▪ Output current I O(max) options: ▫ 0.5 A, LC5205D ▫ 1.0 A, LC5210D ▪ Constant current control circuit: ▫ Fixed off-time PWM constant current control, off-time adjustable by external components ▫ Externally adjustable output current by input voltage to REF pin ▪ Output current dimming by external PWM signal; low signal to TOFF pin shuts off output current, and PWM signal input to that pin enables dimming ▪ Undervoltage lockout protection (UVLO) ▪ Overcurrent protection (OCP); latched in response to the short-to-GND condition ▪ Thermal Shutdown protection (TSD); protects IC from damage due to excess temperature, auto-restart when temperature drops below threshold Not to scale Package: 7-pin DIP Gate Driver LogicCurrent Control Regulator UVLO TSD VBB OUT SenGND Reg Toff Ref MIC OCP Functional Block Diagram

Allegro MicroSystems, Inc.

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Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series Recommended Operating Conditions Characteristic Symbol Conditions Min. Typ. Max. Unit Supply Voltage V BB Lowest voltage can vary depending on LED loads 25 – 400 V Average Output Current I O LC5205D – – 0.4 A LC5210D – – 0.8 A REF Input Voltage V REF In normal operation – – 0.5 V Case Temperature T C Measured at center of case, TJ < 150°C – – 105 °C Absolute Maximum Ratings at TA = 25°C Characteristic Symbol Notes Rating Units Supply Voltage V BB 450 V Output Breakdown Voltage V O 450 V Output Current I O LC5205D, tw ≥ 1 μs 0.5 A LC5210D, tw ≥ 1 μs 1.0 A REF Pin Input Voltage V REF –0.3 to VREG + 0.3 V SENSE Pin Voltage V RS tw ≥ 1 μs± 2 V Allowable Power Dissipation P D On Sanken evaluation PCB; affected by applica- tion PCB layout 1.73 W Junction Temperature T J 150 ºC Operating Ambient Temperature T A –40 to 105 ºC Storage Temperature T stg –40 to 150 ºC Selection Guide Part Number Output Current, IO(max) (A) LC5205D 0.5 LC5210D 1.0 All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature of 25°C, un- less oth er wise stated. Terminal List Table Name Number Function Reg 1 Regulator output pin for powering external components. Connect 0.1 μF bypass capacitor between this pin and GND. Toff 2 For self-oscillation operation, connect external capacitor and resistor to set off-time. For externally-controlled PWM operation, input PWM adjustment signal. Ref 3 Reference voltage input pin, for output peak current. Sen 4 Connect external resistor for PWM peak current control and OCP. OUT 5 Internally connected to the MOSFET drain, output connection to LED load. VBB 6 Supply voltage pin; internally connected to the voltage regulator to power the internal circuits. – 7 No connection; pin removed to increase creepage distance from VBB pin. GND 8 Device ground pin. Pin-out Diagram GND (Removed) VBB OUT Reg Toff Ref Sen

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series 0.5 1.5 0 25 50 75 100 125 150 Ambient Temperature, TA (°C) PD = 1.73 W RθJA = 72°C/W Maximum Allowable Power Dissipation PD (W) Power Dissipation versus Ambient Temperature ELECTRICAL CHARACTERISTICS Valid at TA = 25°C and VBB = 140 V, unless otherwise noted Characteristics Symbol Test Conditions Min. Typ. Max. Unit Supply Voltage Input Current IBB Normal operation – 2 – mA IBBS At output off – 0.6 1 mA MOSFET Breakdown Voltage V DSS ID = 1 mA 450 – – V MOSFET On-Voltage V DS(on) ID = 0.5 A, LC5205 – 3 – V ID = 1.0 A, LC5210 – 2.5 – V MOSFET Diode Forward Voltage V F ID = 0.5 A, LC5205 – 0.85 – V ID = 1.0 A, LC5210 – 0.9 – V REG Pin Output Voltage V REG IREG = 0 mA 11.5 12 12.5 V REG Pin Maximum Output Current I REG VREG = 11.5 V – – 2 mA Maximum PWM Operating Frequency f clk PWM frequency – – 200 kHz REF Pin Input Voltage V REF 0–1 V REF Pin Input Current I REF – ±10 – μA SENSE Pin Voltage V RS VREF – 0.03 VREF VREF + 0.03 V SENSE Pin Current I RS – ±10 – μA OCP Threshold Voltage V OCP Measured at SENSE pin – 3 – V PWM Off-Time T POFF RTOFF = 560 kΩ, CTOFF = 220 pF – 21 – μs UVLO On Threshold Voltage V UVLO(on) For VBB –1 3– V UVLO Off Threshold Voltage V UVLO(off) For VBB –1 4– V TSD Threshold Temperature T TSD Main controller IC (MIC) temperature – 150 – °C TSD Hysteresis Temperature T TSDhys –5 5– ° C Switching Time tr ID = 0.4 A – 20 – ns tf ID = 0.4 A – 50 – ns

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series Functional Description Regulator The LC5200 series provides 12 V output voltage, generated from the supply voltage on the VBB pin, which is used to power internal circuits and external components. When the gate capaci- tance charging of the MOSFET occurs, it generates a current surge, which results in ripple voltage. This could affect operation, therefore, connect a 0.1 μF ceramic capacitor at the REG pin to stabilize operation. Current Control Current control is done by a fixed off-time PWM topology. The output current level can be set by the input voltage on the REF pin, and voltage across the current sense resistor at the SENSE pin. In addition, the fixed off-time can be adjusted by the values selected for the external capacitor and resistor at the TOFF pin. UVLO (Undervoltage Lock Out) This prevents the device from malfunctioning by shutting down the output circuit when the internal supply voltage becomes lower than the ULVO threshold voltage, V UVLO . In addition, the UVLO circuit is used for the power-on reset function of overcurrent protection (OCP). TSD (Thermal Shutdown) When the main control chip (MIC) temperature exceeds the TSD threshold temperature, TTSD , the device shuts off the output (sys- tem logic continues to operate), in order to avoid abnormal tem- perature increase. When the temperature drops by the hysteresis amount, TTSDhys , or if the supply voltage is recycled, the device returns to normal operation. Note: The primary source of heating is the MOSFET, and there is a delay while the heat spreads to the MIC and is sensed. Therefore, a rapid temperature increase of the MOSFET may damage the device. OCP (Overcurrent Protection) When the SENSE pin input voltage reaches the OCP threshold, V OCP , it shuts off the output and shifts into latch mode. In order to release from latch mode, cycle the device power supply. Note: OCP is for protecting the device from excess current. OCP may not work at an LED-short condition because the coil may suppress current increase. Internal Switching Logic The device turns the MOSFET gate driver circuit on or off based on the status of the current control sensing circuit and the protec- tion circuits. Gate-Driver Operation This comprises the MOSFET gate driver circuit. The two device versions in the LC5200 series are distinguished from each other by the MOSFET current rating. Select the current rating that best matches the application circuit.

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series

Application Information

Typical Application Example A typical application circuit is shown in figure 1. The values of the external components are shown in the adjacent table. Component Value Setting LED LED current should not exceed the LC5200 device current ratings. Set the total voltage drop across the LED string to be less than VBB; otherwise, the LED string turns off. As a general design rule, the PWM off-time should be longer if there is a small drop in voltage across the LED string, and it should be shorter if there is a high drop in voltage across the LED string. For the LC5205D, a 9 to 30 V drop across the LED string is recom- mended for proper operation. LC5200 VBB OUT SenGND Reg Toff Ref ROf f COf f C1 RS LEDDiCO L Line Filt erInput Referenced Typical Application Components Symbol Components Values / Ratings Descriptions C0 Electrolytic capacitor ≈100 μF / 450 V Main supply source voltage rectifying capacitor Note: ≤ 1 μF can be used C1 Capacitor 0.1 μF / 25 V The internal regulator output capacitor COff Capacitor 100 pF / 25 V PWM off-time adjusting capacitor Di Diode RL3A High voltage, ultrafast rectifying, current recirculation diode L Coil 1 mH / 1 A PWMing choke coil LED LEDs ――― LED load R1 Resistor 680 k Ω / 1/8 W Reference pin voltage setup resistor R2 Resistor 20 k Ω / 1/8 W Reference pin voltage setup resistor ROff Resistor 620 k Ω / 1/8 W PWM off-time adjusting resistor RS Resistor 1.0 Ω / 1 W Output current sensing resistor Figure 1. Typical application circuit

Worcester, Massachusetts 01615-0036 U.S.A. the output current has. In general, 0.5 to 20 mH is recommended. damage to the LEDs or the device. age, choose a proper value of capacitance for the output power. ing, however, a large value of capacitance causes slow startup. PWM off-time curves based on various values of Coff and Roff. ues: Roff = 560 kΩ and Coff = 220 pF. Figure 2. Affect of various values for capacitor COFF and resistor ROFF on PWM off-time

Worcester, Massachusetts 01615-0036 U.S.A. PWM current control works as shown in figure 3.

• PWM On Period. During MOSFET on-time, the current runs through the I ON path (shown in red in figure 3, panel A).
• MOSFET Turn Off. During on-time, the current increases as the red waveform in panel B, and when it reaches the VSENSE threshold voltage, the MOSFET turns off.
• PWM Off Period. During MOSFET off-time, the back EMF occurs on the coil and the energy which is charged on the coil during the on-time is deenergized by the current I OFF running through the path in blue of panel A.
• MOSFET Turn On. After the fixed off-time, which is set by the external capacitor and resistor at the Toff pin, the MOSFET turns on again, and repeats the above operations. Figure 4 shows the current control circuit and figure 5 shows the timing diagram of that circuit. When the MOSFET turns on, both the load current and V Sen, across the sensing resistor RS, increase. Comp2 compares VSen and VRef and its output is inverted at VSen > VRef (see point A in figure 5). This resets the latter RS latch and it results in turning off the MOSFET after the signal goes through several logic circuits. At the same time, C off at the Toff pin is dis- charged by the internal MOS switch, and when the Comp1 invert- ing input (linked to the T off pin) voltage becomes lower than 2 V , Comp1 output is inverted and it sets the RS latch. This turns off the MOS switch and initiates the charging process of Coff by Roff. Coff voltage (Toff pin) increases by it and when its voltage reaches

3 V , Comp1 output becomes high and it turns on the MOSFET

turn on edge, for securing proper PWM operation. Figure 3. Output current control circuit Figure 4. Current Control Circuit Figure 5. Current Control Circuit Timing Chart

Worcester, Massachusetts 01615-0036 U.S.A.

• Internal PWM Control. The LC5200 series provides fixed off- time PWM current control operation, allowing implementation of an LED constant-current control circuit with only a small quantity of external components. The output current is calculated by the formula below: I O = VREF / RS Based on this formula, there are two methods of LED current control available: ▫ Analog control, varying the REF pin voltage as shown in figure 6, panel A) ▫ PWM integrated control, inputting external PWM signal through a low pass filter (LPF) and connecting the output to the REF pin (figure 6, panel B) In either method, the TOFF pin voltage is used to turn the MOSFET on or off, therefore, the circuit in figure 6, panel C also works to adjust the output current by the external signal. In this application, when the external small signal MOSFET turns on, LC5200 stops an output pulse.
• External PWM Control. In this method of control, the LC5200 allows direct on/off control of the MOSFET, for synchroniz- ing PWM operation among LED arrays or for other reasons. With this method, a pull-up shunt is connected from the REF pin to the regulator output as shown figure 7. The capacitor and resistor are removed from the TOFF pin, and instead the PWM signal is input to the TOFF pin. Note that for this method, the internal peak current control is disabled; therefore, it requires an external current control circuit for constant current opera- tion. However, overcurrent protection is still in active to protect the LC5200 and LEDs from excessive current. The TOFF pin threshold has hysteresis characteristics: from < 2 V to MOSFET off, and from > 3 V to MOSFET on. Therefore, use 5 V CMOS compatible input for the control. LC5200 SENSEGND REG TOFF REF LC5200 SENSEGND REG TOFF REF LC5200 SENSEGND REG TOFF REF ROFF R1 R2COFF ROFF R1 R2COFF ROFF RLPF CLPF COFFRS RS RS PWM LPF PWM MOSFET z100 Hz

Figure 6. Implementations of internal PWM control Figure 7. Implementation of external PWM control

Worcester, Massachusetts 01615-0036 U.S.A. current during phase off period. series REF pin function. Figure 8 shows the application circuit. waveform, which means the power factor is improved. Figure 8. Power factor improvement circuit Figure 9. Power factor improvement operating waveforms: 100 VAC, 5 white LEDs in series, average LED current 0.5 A; black trace: AC input current IAC after 2 kHz low pass filter = 500 mA/ div.; red trace: IAC after 2 kHz low pass filter = 200 mA/ div.

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series Thermal Design MOSFET On Voltage versus Drain Current 100 150 0 0.5 1 1.5 2 ΔT[͠] PD[W] ΔTj-c=60×PD ΔTj-a=72×PD 0.5 1.5 VDS[V] ID[A] LC5205 LC5210

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Pre cau tions must be taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage

• Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress.
• Coat the back surface of the product and both surfaces of the insulating plate to improve heat transfer between the product and the heatsink.
• Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product.
• Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials SC102 Dow Corning Toray Silicone Co., Ltd. Heatsink Mounting Method
• Torque When Tightening Mounting Screws. Thermal resistance increases when tightening torque is low, and radiation effects are decreased. When the torque is too high, the screw can strip, the heatsink can be deformed, and distortion can arise in the product frame. To avoid these problems, observe the recommended tightening torques for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7 to 9 kgf•cm).
• Diameter of Heatsink Hole: < 4 mm. The de fl ection of the press mold when making the hole may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. Soldering
• When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 350±5°C 3 s
• Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge
• When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the equipment should be grounded.
• When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products.
• The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil.

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series DKS xyz {|}~ Package Drawing, DIP-7 (DIP-8) Dimensions in MM Terminal treatment: Ni plating and solder plating (Pb-free) Marking Position Contents Indication ① The last digit of the year 0 to 9 ② The Month 1 to 9,O,N,D ③ The Week 1 to 3 ④ Sanken Registration Number alphanumeric characters Appearance: The body shall be clean and shall not bear any stain, rust or flaw. Marking: The type number and lot number shall be clearly marked by laser so that cannot be erased easily.

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series Packing Specifications Minimum type of packing: Stick Capacity:50pcs per stick Direction of parts insertion Packing style Stick Packing 1 (Inner box) Capacity:50 Sticks per box Dimensions in millimeters Dimensions in millimetersDimensions in millimeters 50 pcs Plugs with tab Plugs without tab Stick Packing 2 (Outer Box) Capacity:4 inner boxes per outer box (Maximum quantity of Products:10,000 pcs.)

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series Cautions and Warnings Terminal connection To avoid malfunction, terminals of this IC should not be left open. Operation of the protection circuit (OCP,TSD) This product has two protection circuits (OCP and TSD). These protection circuits work by detecting excessive applied to the driver. Therefore, these function are not able to protect if the power exceeds the tolerance of the driver. Handling When static electricity is a problem, care should be taken to properly control the room humidity, especially in the winter when static electricity is most troublesome. IC Care should be taken with device leads and with assembly sequence to avoid applying static charges to IC leads. PC board pins should be shorted together to keep them at the same potential to avoid this kind of trouble. Cautions for Storage Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (approximately 40% to 75%) and avoid storage locations that experience extreme changes in temperature or humidity. Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and neither Sanken nor Allegro can assume any responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. When using the products herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the user’s responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken or Allegro sales representative to discuss and obtain written confirmation of your spec ifications. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. Anti radioactive ray design is not considered for the products listed herein.

Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 U.S.A. 48102.002 LED DriversLC5200 Series The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im- prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this publication is current before placing any order. When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products at a certain rate is in ev i ta ble. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus (home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aero space equipment) is not supported. When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your spec i fi ca tions. The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equip- ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Anti radioactive ray design is not considered for the products listed herein. Copyright © 2009 Allegro MicroSystems, Inc. This datasheet is based on Sanken datasheet SSE-23014