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Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 1 05139 LC0402FC3.3C - LC0402FC36C 200W LOW CAPACITANCE FLIP ChIP Tvs ARRAy

DEsCRIPTION

The LC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis- charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require- ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In ad- dition, the LC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.

FEATuREs

  • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
  • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
  • ESD Protection > 25 kilovolts
  • Available in Voltages Ranging from 3.3V to 36V
  • 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
  • Bidirectional and Monolithic Structure
  • Low Clamping Voltage
  • Low Capacitance
  • Low Leakage Current
  • Protection for 1 Line
  • RoHS Compliant
  • REACH Compliant MEChANICAL ChARACTERI sTIC s
  • Standard EIA Chip Size: 0402
  • Approximate Weight: 0.73 milligrams
  • Lead-Free Plating
  • Solder Reflow Temperature:
  • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
  • Flammability Rating UL 94V-0
  • 8mm Tape per EIA Standard 481
  • Top Contacts: Solder Bump 0.004” in Height (Nominal) APPLICATION s
  • SMART Phones
  • Portable Electronics
  • SMART Cards PIN CONFIG uRATION

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 2 05139 LC0402FC3.3C - LC0402FC36C TyPICAL DEvICE ChARACTERI sTIC s MAXIM uM RATING s @ 25°C unless Otherwise specified PARAMETER syMBOL vALuE uNITs Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 200 Watts Operating Temperature TA -55 to 150 °C Storage Temperature TSTG -55 to 150 °C ELECTRICAL C hARACTERI sTIC s PER LINE @ 25°C unless Otherwise specified PART NuMBER (Note 1) RATED sTAND-OFF vOLTAGE vWM vOLTs MINIM uM BREAKDOWN vOLTAGE @ 1mA v(BR) vOLTs MAXIM uM CLAMPING vOLTAGE (Fig. 2) @ IP = 1A vC vOLTs MAXIM uM CLAMPING vOLTAGE (Fig. 2) @ 8/20µs vC @ IPP MAXIM uM LEAKAGE CuRRENT (Note 2) @vWM ID µA TyPICAL CAPACITANCE @0v, 1Mhz C pF LC0402FC05C 5.9 6.0 11.0 13.0V @ 15A 10** 35 LC0402FC08C 8.0 8.5 13.2 18.0V @ 11A 1 32 LC0402FC24C 24.0 26.7 37.2 50.6V @ 4A 1 20 NOTE s 1. All devices are bidirectional. Electrical characteristics apply in both directions.

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 3 05139 LC0402FC3.3C - LC0402FC36C TyPICAL DEvICE ChARACTERI sTIC s FIG uRE 1 PEAK PuLsE POWER vs PuLsE TIME td - Pulse Duration - µs 200W, 8/20µs Waveform 0.1 1 10 100 1,000 10,000 PPP - Peak Pulse Power - Watts 100 1,000 10,000 Peak Pulse Power 8/20µs Average Power FIG uRE 3 POWER DERATING CuRvE TA - Ambient Temperature - °C 0 25 50 75 100 125 150 100 % Of Rated Power TEST WAVEFORM PARAMETERS t f = 8µs td = 20µs tf e-t Peak Value IPP td = t/(IPP/2) FIG uRE 2 PuLsE WAvE FORM t - Time - µs 0 5 10 15 20 25 30 IPP - Peak Pulse Current - % of IPP 100 120

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 4 05139 LC0402FC3.3C - LC0402FC36C TyPICAL DEvICE ChARACTERI sTIC s FIG uRE 4 OvERshOOT & CLAMPING vOLTAGE FOR LC0402FC05C EsD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) 5 volts per Division FIG uRE 5 TyPICAL CLAMPING vOLTAGE vs PEAK PuLsE CuRRENT LC0402FC05C IPP - Peak Pulse Current - Amps 0 5 10 15 20 vC - Clamping voltage - volts

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 5 05139 LC0402FC3.3C - LC0402FC36C sPICE MODEL FIG uRE 1 sPICE MODEL FOR I/O GND ABD ABD TABLE 1 - sPICE PARAMETER s PARAMETER uNIT ABD(Tvs) BV V See Table 2 IBV µA 1 Cjo pF See Table 2 IS A See Table 2 Vj V 0.6 M - 0.33 N - 1 RS - See Table 2 TT s 1E-8 EG eV 1.11 TABLE 2 - ABD sPECIFIC sPICE PARAMETER s PART N uMBER Bv(vOLTs) Cjo(pF) Is (AMP s) Rs(OhMs) LC0402FC3.3C 4.0 70 1E-11 0.20 LC0402FC05C 6.0 35 1E-11 0.16 LC0402FC08C 8.5 32 1E-13 0.33 LC0402FC12C 13.3 30 1E-13 0.51 LC0402FC15C 16.7 25 1E-13 0.53 LC0402FC24C 26.7 20 1E-13 0.63 LC0402FC36C 40.2 18 1E-13 0.73 ABD - Avalanche Breakdown Diode (TVS)

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 6 05139 LC0402FC3.3C - LC0402FC36C sOLDER REFLOW INFORMATION PRINTED CIRC uIT BOARD RECOMMENDATION s PARAMETER vALuE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C TP 30-60 seconds Ramp-up 15 seconds (Minimize) solder-Time 15-20 seconds Ramp-Down Ramp-Down solder Melt (Maximum Temp) Maximum solder Reflow (35-53°C Above Maximum solder Melt Temp) Ramp-up Preheat (stay Below Flux Activation Temp) Temperature - °C RECOMMENDED NON-sOLDER MAsK DEFINED PAD ILLusTRATION Non-solder Mask Defined Pad 0.275mm DIA. solder Mask Opening 0.325mm DIA. solder stencil Opening 0.330mm DIA. REquIREMENT s Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activa- tion temperature, component size, weight, surface area and plating.

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 7 05139 LC0402FC3.3C - LC0402FC36C

0402 PACKAGE INFORMATION

A 0.46 0.018 B 0.86 0.034 C 0.98 1.02 0.038 0.040 D 0.10 0.004 E 0.35 0.014 F 0.458 0.508 0.018 0.020 G 0.20 0.008 H 0.076 0.127 0.003 0.005 I 0.406 0.016 NOTEs 1. Controlling dimensions in inches. LAyOuT DIMEN sION s DIM MILLIMETER s INC hEs NOMINAL NOMINAL A 0.23 0.009 B 0.48 0.019 C 0.69 0.027 D 0.46 0.018 E 0.99 0.039 F 0.20 0.008 G 0.20 0.008 H 0.66 0.026 I 0.13 0.005 NOTEs 1. Controlling dimensions in inches. DIE C B A D H F E G SOLDER BUMP SOLDER PAD SOLDER PRINT DIAMETER 0.010” - 0.012” TOP A B C D E F H END I SIDE G I

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 8 05139 LC0402FC3.3C - LC0402FC36C TAPE AND REEL INFORMATION

10 Pitches Cumulative

Tolerance on tape ± 0.2 WF EP2 P0D P T User Direction of Feed Top Cover Tape sPECIFICATION s REEL DIA. TAPE WIDTh A0 B0 K0 D E F W P0 P2 P Tmax NOTEs 1. Dimensions in millimeters. 2. Top view of tape. Metal contacts are face down in tape package. 3. Orientation: preferred stencil - 0.1mm (0.004”). 4. Surface mount product is taped and reeled in accordance with EIA 481. 5. 8mm plastic tape: 7” Reels - 5,000 (pocket under hole skipped) or 10,000 pieces per reel. 6. Marking on Reel - part number, date code and lot number. TAPE & REEL ORIENTATION Single Die - 0402 Package outline, pad layout and tape specifications per document number 06001.R5 8/10.

ORDERING INFORMATION

(xx = voltage) LEADFREE suFFIX TAPE suFFIX qTy/REEL REEL sIZE TuBE qTy LC0402FCxxC -LF -T75-1 5,000 7” n/a LC0402FCxxC -LF -T710-1 10,000 7” n/a

Only One Name Means ProTek’Tion™ www.protekdevices.com05139.R8 2/11 Page 9 05139 LC0402FC3.3C - LC0402FC36C COMPAN y INFORMATION COMPANy PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), in- ductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. CONTACT us Corporate headquarters

2929 South Fair Lane

Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com Web www.protekdevices.com www.protekanalog.com