LC03-6 SEMTECH | Alldatasheet
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1 www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS LC03-6 Low Capacitance TVS for High-Speed Data Interfaces 2000 watts peak pulse power (t p = 8/20µs) Transient protection for high-speed data lines to Bellcore 1089 (Intra-Building) 100A (2/10µs) ITU K.20 I PP=40A (5/310µs) IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 100A (8/20µs) Protects two lines in common and differential mode Low capacitance for high-speed interfaces Low clamping and operating voltage Integrated structure saves board space and increases reliability Solid-state silicon avalanche technology Description Features Circuit Diagram Schematic & PIN Configuration Revision 01/18/2008
Applications
Mechanical Characteristics The LC03-6 transient voltage suppressor is designed to protect components which are connected to high speed telecommunication lines from voltage surges caused by lightning, electrostatic discharge (ESD), cable discharge events (CDE), and electrical fast transients (EFT). TVS diodes are ideal for use as board level protection of sensitive semiconductor components. The LC03-6 combines a TVS diode with a rectifier bridge to provide transient protection in both common and differential mode with a single device. The capacitance of the device is minimized (< 25pF) to ensure correct signal transmission on high speed lines . The LC03-6 meets the short-haul (intra-building) transient immunity requirements of Bellcore 1089 for telecommunications applications. The SO-8 surface mount package allows flexibility in the design of crowded PC boards. SO-8 (Top View) JEDEC SO-8 package RoHS/WEEE Compliant UL 497B listed Molding compound flammability rating: UL 94V-0 Marking : Part number, date code Packaging : Tube or Tape and Reel per EIA 481 T1/E1 Line Cards T3/E3 and DS3 Interfaces STS-1 Interfaces ISDN S/T-Interfaces ISDN U-Interfaces 10/100 Ethernet Pin 1 and 8 Pin 4 and 5 Ground Pin 2, 3, 6, and 7
2 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Absolute Maximum Rating
Electrical Characteristics
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3 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Clamping Voltage vs. Peak Pulse Current 100 110 0 5 10 15 20 25 30 Time (µs) Percent of IPP e-t td = I PP /2 Wa v e f o r m Parameters: tr = 8µs td = 20µs Pulse Waveform Normalized Capacitance vs. Reverse Voltage 100 110 0 25 50 75 100 125 150 175 Ambient Temperature - T A (oC) % of Rated Power or IPP 0 1 02 03 04 05 06 07 08 09 0 1 0 0 1 1 0 Peak Pulse Current - I PP (A) Clamping Voltage - VC (V) Line-To-Line Line-To-Ground Wa v e f o r m Param eters: tr = 8µs td = 20µs 0.1 100 0.1 1 10 100 1000 Pulse Duration - tp (µs) Peak Pulse Power - Ppk (kW) Forward Voltage vs. Forward Current 0 1 02 03 04 05 06 07 08 09 0 1 0 0 1 1 0 Forward Current - I F (A) Forward Voltage - VF (V) Wa v e f o r m Param eters: tr = 8µs td = 20µs 0.2 0.4 0.6 0.8 1.2 1.4 0123456 Reverse Voltage - V R (V) CJ(VR) / CJ(VR=0) f = 1MHz
4 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Insertion Loss S21 - I/O to I/O Typical Characteristics Insertion Loss S21 - I/O to Gnd START . 030 MHz 3 STOP 000 . 000 000 MHz CH1 S21 LOG 6 dB / REF 0 dB 1: -3.03 dB
642 MHz
2: -7.11 dB
900 MHz
3: -23.03 dB
1.8 GHz
4: -6.17 dB
2.5 GHz
-6 dB -12 dB -18 dB -24 dB -30 dB -36 dB GHz 100 MHz GHz MHz MHz -42 dB -48 dB START . 030 MHz 3 STOP 000 . 000 000 MHz CH1 S21 LOG 6 dB / REF 0 dB 1: -3.03 dB
910 MHz
2: -2.84 dB 3: -20.79 dB 4: -2.97 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB GHz 100 MHz GHz MHz MHz -42 dB -48 dB
5 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Device Connection Options for Protection of Two High-Speed Data Lines The LC03-6 is designed to protect two high-speed data lines (one differential pair) from transient over-voltages which result from lightning and ESD. The device can be configured to protect in differential (Line-to-Line) and common (Line-to-Ground) mode. Data line inputs/ outputs are connected at pins 1 to 8, and 4 to 5 as shown. Pins 2, 3, 6, and 7 are connected to ground. These pins should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic induc- tance. In applications where high common mode voltages are present, differential protection is achieved by leaving pins 2, 3, 6, and 7 not connected. T1/E1 Linecard Protection (Intra-Building) A typical T1/E1 linecard protection circuit is shown below. The LC03-6 is connected between Tip and Ring on the transmit and receive line pairs. It provides protection to metallic and common mode lightning surges per Bellcore 1089. This design takes advan- tage of the isolation of the transformer to suppress common mode surges. To complete the protection circuit, the RClamp3304N (or RClamp0504N for 5V supplies) is employed as the IC side protection ele- ment. This device helps prevent the transceiver from latching up by providing fine clamping of transients that are coupled through the transformer. For further information, reference Semtech application note AN97-10. T3/E3 and STS-1 Protection The LC03-6 can also be used to protect T3/E3 and STS-1 interfaces. The data lines from the BNC inter- face are run through the LC03-6 (i.e. enters at pin 1 and exits at pin 8) with the ground connection made at the other side of the device (pins 4 and 5). The center pins (2, 3, 6, and 7) are not connected. In this configu- ration, the LC03-6 adds less than 12pF of capacitance to each line and provides surge protection to 100A (tp=8/20µs). Connection for Differential (Line-to-Line) and Common Mode Protection (Line-to-Ground) Connection for Differential Protection (Line-to-Line) Applications Information Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
6 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 T1 Line Card Protection (Short-Haul Applications) T3/E3 and STS-1 Protection Typical Applications RClamp3304N LC03-6 LC03-6 DS3, T3, E3, or STS-1
7 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Typical Applications (Continued) ISDN U-Interface Secondary Protection ISDN S-Interface Protection LC03-6 LC03-6
8 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Typical Applications (Continued) High Speed Driver/Receiver Protection 10/100 Ethernet Protection
9 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Applications Information - SPICE Model LC03-6 Spice Model sretemaraPecipS6-30CL retemaraPt inU) SVT(1D) DRCL(2D SIp mA0 2-E0.13 1-E89.3 VBt loV9 .70 42 JVt loV6 .04 6.0 SRm hO2 01.08 40.0 VBIp mA3 -E13 -E1 OJCd araF9 -e4.32 1-E0.8 TTc es9 -E145.29 -E145.2 M- -7 00.02 20.0 N- -1 .11 .1 GEV e1 1.11 1.1 0.7 nH
10 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Outline Drawing - SO-8 Land Pattern - SO-8 bxN 2X N/2 TIPS SEATING aaa C E/22X N A D bbb C A-B D ccc C e/2 SEE DETAIL A SIDE VIEW A B C De DETAIL A c L (L1) 01 0.25 GAGE PLANE h h H PLANE 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -B- CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES: 2. -A- -H- REFERENCE JEDEC STD MS-012, VARIATION AA.4. .050 BSC .236 BSC .010 .150 .189 .154 .193 .012 - 0.25
1.27 BSC
6.00 BSC
3.90 4.90 .157 .197 3.80 4.80 .020 0.31 4.00 5.00 0.51 (.041) .004 .008 .028 .016 .007 .049 .004 .053 8° 0° 0.20 0.10 - 8° 0.40 0.17 1.25 0.10 .041 .010 .069 .065 .010 1.35 (1.04) 0.72 1.04 0.25 - 1.75 1.65 0.25 N bbb aaa ccc A b D E L h e c DIM MIN MILLIMETERS NOM DIMENSIONS INCHES MIN MAX MAX NOM E (.205) (5.20) ZG Y P (C) 3.00.118 1.27.050 0.60.024 2.20.087 7.40.291 X INCHES DIMENSIONS Z P Y X DIM C G MILLIMETERS THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: REFERENCE IPC-SM-782A, RLP NO. 300A.2.
11 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS LC03-6 Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 traP rebmuN hsiniFdaeL repytQ leeR eziSleeR BT.6-30CLb PnS0 05h cnI7 TBT.6-30CLe erfbP0 05h cnI7