LC03-3.3_08 SEMTECH | Alldatasheet

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1 www.semtech.com PROTECTION PRODUCTS LC03-3.3 Low Capacitance 3.3 Volt TVS for High Speed Interfaces ‹ 1800 watts peak pulse power (tp = 8/20µs) ‹ Transient protection for high-speed data lines to Bellcore 1089 (Intra-Building) 100A (2/10µs) ITU K.20 IPP=40A (5/310µs) IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 100A (8/20µs) ‹ Protects two lines in common and differential mode ‹ Low capacitance for high-speed interfaces ‹ Low operating voltage (3.3V) ‹ Low clamping voltage ‹ Integrated structure saves board space and increases reliability ‹ Solid-state EPD technology Description Features Circuit Diagram Schematic & PIN Configuration Revision 01/18/2008

Applications

Mechanical Characteristics SO-8 (Top View) The LC03-3.3 transient voltage suppressor is designed to protect components which are connected to high speed data and telecommunication lines from voltage surges caused by lightning, electrostatic discharge (ESD), and electrical fast transients (EFT). TVS diodes are ideal for use as board level protection of sensitive semiconductor components. The LC03- 3.3 combines a TVS diode with a rectifier bridge to provide transient protection in both common and differential mode with a single device. The LC03-3.3 utilizes Semtech’s EPD technology for superior electri- cal characteristics at 3.3 volts. The capacitance of the device is minimized to ensure correct signal transmis- sion on high speed lines. The LC03-3.3 meets the short-haul (intra-building) transient immunity requirements of Bellcore 1089 for telecommunications applications. ‹ JEDEC SO-8 package ‹ RoHS/WEEE Compliant ‹ Molding compound flammability rating: UL 94V-0 ‹ Marking : Part number, date code ‹ Packaging : Tube or Tape and Reel per EIA 481 ‹ Low Voltage Interfaces ‹ T3/E3 ‹ 10/100 Ethernet ‹ Set-Top Box ‹ ISDN Interfaces Pin 1 and 8 Pin 4 and 5 Pin 2, 3, 6, and 7 Ground

2 2008 Semtech Corp. www.semtech.com PRELIMINARYPROTECTION PRODUCTS LC03-3.3 Absolute Maximum Rating

Electrical Characteristics

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3 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS LC03-3.3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Clamping Voltage vs. Peak Pulse Current 100 110 0 5 10 15 20 25 30 Time (µs) Percent of IPP e td = IPP/2 Waveform Parameters: tr = 8µs td = 20µs Pulse Waveform Normalized Capacitance vs. Reverse Voltage 100 110 0 25 50 75 100 125 150 175 Ambient Temperature - T A (oC) % of Rated Power or IPP 0 2 04 06 08 0 1 0 0 Peak Pulse Current - I PP (A) Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs Line-To-Ground Line-To-Line 0.1 100 0.1 1 10 100 1000 Pulse Duration - tp (µs) Peak Pulse Power - Ppk (kW) Insertion Loss S21 (Line to Ground) CH1 S21 LOG 3 dB/ REF 0 dB START . 030 MHz 3 STOP 000 . 000 000 MHz 0.2 0.4 0.6 0.8 1.2 1.4 00 . 511 . 522 . 533 . 5 Reverse Voltage - VR (V) CJ(VR) / CJ(VR=0) f = 1 MHz

4 2008 Semtech Corp. www.semtech.com PRELIMINARYPROTECTION PRODUCTS LC03-3.3 Connection for Differential (Line-to-Line) and Com- mon Mode Protection (Line-to-Ground) Device Connection Options for Protection of Two High-Speed Data Lines The LC03-3.3 is designed to protect two high-speed data lines (one differential pair) from transient over- voltages which result from lightning and ESD. The device can be configured to protect in differential (Line- to-Line) and common (Line-to-Ground) mode. Data line inputs/outputs are connected at pins 1 to 8, and 4 to 5 as shown. Pins 2, 3, 6, and 7 are connected to ground. These pins should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. In applications where high common mode voltages are present, differential protection is achieved by leaving pins 2, 3, 6, and 7 not connected. Connection for Differential Protection (Line-to-Line) Applications Information Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.

5 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS LC03-3.3 Applications Information - SPICE Model LC03-3.3 Spice Model sretemaraPecipS3.3-30CL retemaraPt inU) SVT(1D) DRCL(2D SIp mA0 2-E0.13 1-E89.3 VBt loV5 .30 42 JVt loV8 .314 6.0 SRm hO7 520.08 40.0 VBIp mA3 -E13 -E1 OJCd araF9 -e4.32 1-E0.8 TTc es9 -E145.29 -E145.2 M- -5 41.02 20.0 N- -1 .11 .1 GEV e1 1.11 1.1 0.7 nH

6 2008 Semtech Corp. www.semtech.com PRELIMINARYPROTECTION PRODUCTS LC03-3.3 Land Pattern -SO-8 Outline Drawing - SO-8 bxN 2X N/2 TIPS SEATING aaa C E/22X N A D bbb C A-B D ccc C e/2 SEE DETAIL A SIDE VIEW A B C De DETAIL A c L (L1) 01 0.25 GAGE PLANE h h H PLANE 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -B- CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES: 2. -A- -H- REFERENCE JEDEC STD MS-012, VARIATION AA.4. .050 BSC .236 BSC .010 .150 .189 .154 .193 .012 - 0.25

1.27 BSC

6.00 BSC

3.90 4.90 .157 .197 3.80 4.80 .020 0.31 4.00 5.00 0.51 (.041) .004 .008 .028 .016 .007 .049 .004 .053 8° 0° 0.20 0.10 - 8° 0.40 0.17 1.25 0.10 .041 .010 .069 .065 .010 1.35 (1.04) 0.72 1.04 0.25 - 1.75 1.65 0.25 N bbb aaa ccc A b D E L h e c DIM MIN MILLIMETERS NOM DIMENSIONS INCHES MIN MAX MAX NOM E (.205) (5.20) ZG Y P (C) 3.00.118 1.27.050 0.60.024 2.20.087 7.40.291 X INCHES DIMENSIONS Z P Y X DIM C G MILLIMETERS THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: REFERENCE IPC-SM-782A, RLP NO. 300A.2.

7 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS LC03-3.3 Contact Information Semtech Corporation Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804 rebmuNtraPh siniFdaeL repytQ leeR eziSleeR BT.3.3-30CLb PnS0 05h cnI7 TBT.3.3-30CLe erFbP0 05h cnI7

Ordering Information

LC03-3.3 Marking Diagram Note: YYWW = Date Code