LC03-3.3 APMICRO | Alldatasheet

Document overview

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Technical content

Features

 Low capacitance for high speed interfaces  Ultra low leakage: nA level  Low operating voltage: 3.3V  Ultra low clamping voltage  Protects two lines in common and differential mode  JEDEC SO-8 package  Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge: ±30kV – IEC61000-4-5 (Lightning) 100A (8/20μs)  RoHS Compliant LC03-3.3 Low Capacitance 3.3V TVS Part Number Packaging Reel Size LC03-3.3 2500/Tape & Reel 13 inch LC-3.3 = Device Marking Code YYWW = Date Code Dot denotes Pin1 Circuit and Pin Schematic Dimensions and Pin Configuration Mechanical Characteristics  Package: SO-8  Lead Finish: Matte Tin  Case Material: “Green” Molding Compound.  Moisture Sensitivity: Level 3 per J-STD-020  Terminal Connections: See Diagram Below  Marking Information: See Below

Applications

 T1/E1 Line Cards  T3/E3 and DS3 Interfaces  STS-1 Interfaces  10/100/1000 BaseT Ethernet  Set Top Box  ISDN Interfaces  Low Voltage Interfaces Marking Information

Ordering Information

LC-3.3 All d ata sheet.com

Revision 12/2017 2 of 5 www.appliedpowermicro.com Absolute Maximum Ratings (TA=25°C unless otherwise specified) Electrical Characteristics (TA=25°C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppk 1800 W Peak Pulse Current (8/20µs) IPP 100 A ESD per IEC 61000−4−2 (Air) ESD per IEC 61000−4−2 (Contact) VESD ±30 ±30 kV Operating Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Parameter Symbol Min Typ Max Unit Test Condition Reverse Working Voltage VRWM 3.3 V Punch-Through Voltage VPT 3.5 V IT = 2µA Snap-Back Voltage VSB 2.8 V IT = 50mA Reverse Leakage Current IR 0.5 µA VRWM = 3.3V Clamping Voltage VC 11 V IPP = 50A (8 x 20µs pulse), any I/O pin to ground Clamping Voltage VC 13 V IPP = 50A (8 x 20µs pulse), between I/O pins Clamping Voltage VC 15 V IPP = 100A (8 x 20µs pulse), any I/O pin to ground Clamping Voltage VC 18 V IPP = 100A (8 x 20µs pulse), between I/O pins Junction Capacitance CJ 16 25 pF VR = 0V, f = 1MHz, between I/O pins and ground Junction Capacitance CJ 8 12 pF VR = 0V, f = 1MHz, between I/O pins LC03-3.3 Note 1: I/O pins are Pin 1, 4, 5 and 8 All d ata sheet.com

Revision 12/2017 3 of 5 www.appliedpowermicro.com Typical Performance Characteristics (TA=25°C unless otherwise Specified) LC03-3.3 Junction Capacitance vs. Reverse Voltage Clamping Voltage vs. Peak Pulse Current Power Derating Curve 100 120 0 25 50 75 100 125 150 % of Rated Power Ambient Temperature_Ta(℃) 0.00 5.00 10.00 15.00 20.00 0 1 2 3 4 Junction Capacitance _Cj (pF) Reverse Voltage_VR (V) 0 20 40 60 80 100 Clamping Voltage_VC (V) Peak Pulse Current_Ipp (A) I/O to I/O

8 X 20μs Pulse Waveform

Note：Data is taken with a 10x attenuator ESD Clamping Voltage +8 kV Contact per IEC61000−4−2 All d ata sheet.com

Revision 12/2017 4 of 5 www.appliedpowermicro.com Typical Application The LC03-3.3 is designed to protect two high speed data lines (one differential pair) from transient over -voltages which result from lightning and ESD. The device can be configured to protect in differential (Line to Line) and com- mon (Line to Ground) mode. Data line inputs/outputs are connected at pins 1 to 8, and 4 to 5 as shown below. Pins 2, 3, 6, 7 are connected to ground. These pins should be connected directly to a ground plane on the board for the best results, the path length is kept as short as possible to minimize parasitic inductance. In applications where high common voltages are present, differential protection is achieved by leaving pins 2, 3, 6, and 7 not connected. LC03-3.3 Connection for differential (Line to Line) and common mode protection (Line to Ground) Connection for differential protection (Line to Line) All d ata sheet.com

Revision 12/2017 5 of 5 www.appliedpowermicro.com Suggested Land Pattern Contact Information Applied Power Microelectronics Co., Ltd. Website: http://www.appliedpowermicro.com Email: sales@appliedpowermicro.com Phone: +86 (0519) 8399 3606 LC03-3.3 Applied Power Microelectronics Co., Ltd. (APM) reserves the right to make changes to the product specification and data in this document without notice. APM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does APM assume any liability arising fro m the application or use of any products or circuits, and specifically dis- claims any and all liability, including without limitation special, consequential or incidental damages. SY M DIMENSIONS MILLIMETERS INCHES MIN NOM MAX MIN NOM MAX A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.049 0.065 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 E 6.00 BSC 0.236 BSC e 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L1 (1.04) (0.041) N 8 8 θ1 0° 8° 0° 8° aaa 0.10 0.004 bbb 0.25 0.010 ccc 0.20 0.008 SYM DIMENSIONS MILLIMETERS INCHES C (5.20) 0.205 G 3.00 0.118 P 1.27 0.050 X 0.60 0.024 Y 2.20 0.087 Z 7.40 0.291 All d ata sheet.com