LBWA0ZZ2DS-688

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Type 2DS Wi-Fi® Module 2020

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NXP 88W8801 Chipset for 802.11b/g/n Datasheet - Rev. I ▪ Design Name: Type 2DS ▪ P/N: LBWA0ZZ2DS-688

Type 2DS Wi-Fi Module Datasheet Table of Contents

Type 2DS Wi-Fi Module Datasheet

Type 2DS Wi-Fi Module Datasheet About This Document Type 2DS is a small and high-performance module (integrated PCB antenna) based on NXP 88W8801 chipset, supporting IEEE 802.11b/g/n. This datasheet describes Type 2DS module in detail. Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Audience & Purpose Intended audience includes any customer looking to integrate this module into their product. In particular, RF, hardware, software, and systems engineers. Document Conventions Table 1 describes the document conventions. Table 1: Document Conventions Conventions Description Warning Note Indicates very important note. Users are strongly recommended to review. Info Note Intended for informational purposes. Users should review. Menu Reference Indicates menu navigation instructions. Example: Insert➔Tables➔Quick Tables➔Save Selection to Gallery External Hyperlink This symbol indicates a hyperlink to an external document or website. Example: Embedded Artists AB Click on the text to open the external link. Internal Hyperlink This symbol indicates a hyperlink within the document. Example: Scope Click on the text to open the link. Console input/output or code snippet Console I/O or Code Snippet This text Style denotes console input/output or a code snippet. # Console I/O comment // Code snippet comment Console I/O or Code Snippet Comment This text Style denotes a console input/output or code snippet comment.

Console I/O comment (preceded by “#”) is for informational purposes only and does not denote actual console input/output.
Code Snippet comment (preceded by “//”) may exist in the original code.

Type 2DS Wi-Fi Module Datasheet

1 Scope

This specification characterizes the IEEE 802.11b/g/n module.

2 Key Features

Supports IEEE 802.11b/g/n specification: Single band 2.4 GHz SISO with 20 MHz channels Up to MCS 7 data rates (72.2 Mbps) WLAN Interface: SDIO 2.0 and USB 2.0 Dimensions: 25.0 x 14.0 x 2.32 mm Weight: 1.07 mg MSL: 3 Surface-mount type RoHS compliant Total Fit: 29 Optional WLAN-USB interface may not be supported. Refer to Type 2DS webpage or check 2DS Community Forum page

3 Ordering Information

Table 2: Ordering Information Ordering Part Number Description LBWA0ZZ2DS-688 Module order LBWA0ZZ2DS-SMP Sample module order (If module samples are not available through distribution, contact Murata referencing this part number) EAR00386 Embedded Artists Type 2DS M.2 EVB (default EVB available through distribution) “LBWA0ZZ2DS” is used in certification test report.

Type 2DS Wi-Fi Module Datasheet

4 Block Diagram

The Type 2DS block diagram is presented in Figure 1. Figure 1: Block Diagram Optional WLAN-USB interface may not be supported. Refer to Type 2DS webpage or check 2DS Community Forum page Type 2DS 88W8801 LPF VBAT VIO SDIO USB

38.4 MHz

2.4G Tx/Rx Antenna

Type 2DS Wi-Fi Module Datasheet

5 Certification Information

This section has information about radio certification.

5.1 Radio Certification

All regulatory testing is on-going Transmit output power setting is defined by “txpower_XX.bin” (XX is country code). The transmit power files are hosted at Murata GitHub for Linux and FreeRTOS . Table 3 shows the transmit power file required for each region. Table 3: Transmit Power Limit Files Country ID Country Code Tx Power Limit File Linux FreeRTOS USA (FCC) VPYLBWA0ZZ2DS US txpower_US.bin wlan_txpwrlimit_cfg_murata_2DS_US.h Canada (IC) 772C-LBWA0ZZ2DS CA txpower_CA.bin wlan_txpwrlimit_cfg_murata_2DS_CA.h Europe EN300328/301893, EN300440 conducted test report is prepared. DE txpower_EU.bin wlan_txpwrlimit_cfg_murata_2DS_EU.h Japan Japanese type certification is prepared. 001-P01579 JP txpower_JP.bin wlan_txpwrlimit_cfg_murata_2DS_JP.h Each country code is defined by Murata’s db.txt file. Please ask your contact person from Murata.

Type 2DS Wi-Fi Module Datasheet

6 Dimensions, Marking and Terminal Configurations

This section provides information about dimensions, markings, and terminal configuration for Type 2DS. Figure 2: Dimensions, Marking and Terminal Configurations T Top view Bottom view Side view

Type 2DS Wi-Fi Module Datasheet Table 4: Dimensions Mark Dimensions (mm) Mark Dimensions (mm) Mark Dimensions (mm) Mark Dimensions (mm)

6.1 Structure

The structure for Type 2DS module is shown in Figure 3. Figure 3: Structure SMD IPD 88W8801 XTAL Metal Shielding PWB Substrate Terminal Printed Antenna

Type 2DS Wi-Fi Module Datasheet

6.2 Marking

The marking for Type 2DS module is shown in Figure 4. Figure 4: Markings Table 5: Markings Marking Meaning

1 Pin 1 Marking

2 Module Type

3 Inspection Number

4 Serial Number

5 Murata Logo

7 TELEC Mark/ID

8 FCC ID

9 IC ID

UL mark and factory code of one of below two PCB factories shall be displayed on the PCB. Figure 5: UL Marks and Factory Codes SHINKO FSQuality

Type 2DS Wi-Fi Module Datasheet

7 Module Pin Descriptions

This section has the pin descriptions and pin assignments layout descriptions of Type 2DS.

7.1 Pin Assignments

The pin assignment layout is shown in Figure 6. Figure 6: Pin Assignment - Top view

Type 2DS Wi-Fi Module Datasheet The terminal configurations are listed in Table 6. Table 6: Terminal Configurations No. Terminal Name No. Terminal Name No. Terminal Name No. Terminal Name

1 GND 18 GND 35 GND 52 GND

2 GND 19 GND 36 GND 53 GND

3 USB_DMNS 20 GND 37 GND 54 GND

4 USB_DPLS 21 GND 38 GND 55 VIO

5 GND 22 GND 39 GND 56 GPIO3

6 GND 23 GND 40 GND 57 GPIO2

7 GND 24 GND 41 VBAT 58 GPIO1

8 PDN 25 GND 42 GND 59 GPIO0

9 GND 26 GND 43 GND 60 GND

10 GND 27 GND 44 GND 61 VIO_SD

11 GND 28 GND 45 GND 62 SD_CLK

12 GND 29 NC 46 Reserved 63 SD_CMD

(REF_CLK_OUT) 30 GND 47 Reserved 64 SD_DAT3

14 CON0 31 Reserved 48 NC

(TMS) 65 SD_DAT2

15 CON1 32 GND 49 NC

(TDO) 66 SD_DAT1 16 NC (HOST_WAKE) 33 GND 50 NC (TCLK) 67 SD_DAT0

17 GND 34 GND 51 NC

(TDI) 68-88 GND

7.2 Pin Descriptions

Do not need any termination to the open pins in input mode that have an Internal Pull- up/Pull-down resistor (PU/PD). Do not need any termination to the open pins in output mode. Do not need any termination to the USB pins if do not use USB. Table 7 describes the Type 2DS pins. Table 7: Pin Descriptions No. Pin Name Type Connection to IC Pin Name Supply Internal PU/PD Int’l Pull Value [Ω] Description

1 GND GND Ground

2 GND GND Ground

3 USB_DMNS I/O USB_DMNS VBAT USB Serial Differential Data

4 USB_DPLS I/O USB_DPLS VBAT USB Serial Differential Data

Type 2DS Wi-Fi Module Datasheet No. Pin Name Type Connection to IC Pin Name Supply Internal PU/PD Int’l Pull Value [Ω] Description

5 GND GND Ground

6 GND GND Ground

7 GND GND Ground

8 PDN I PDn VPD

Full Power-Down (active low) 0 = full power-down mode 1 = normal mode

Connect to power-down pin of host or 3.3V/1.8V
External host required to drive this pin high for normal operation No internal pull-up on this pin.

9 GND GND Ground

10 GND GND Ground

11 GND GND Ground

12 GND GND Ground

13 NC A,O REF_CLK_OUT AVDD18 NC

14 CON0 I CON[0] AVDD18 weak PU

enable 600K Configuration Pin (CON[0]) See Configuration Pins

15 CON1 I CON[1] AVDD18 weak PU

Configuration Pin (CON[1]) See Configuration Pins 16 NC (HOST_WAKE) I HOST_WAKE AVDD18 weak PD enable 700K NC

17 GND GND Ground

18 GND GND Ground

19 GND GND Ground

20 GND GND Ground

21 GND GND Ground

22 GND GND Ground

23 GND GND Ground

24 GND GND Ground

25 GND GND Ground

26 GND GND Ground

27 GND GND Ground

28 GND GND Ground

29 NC GND NC

30 GND GND Ground

31 NC Ground

32 GND GND Ground

33 GND GND Ground

34 GND GND Ground

35 GND GND Ground

36 GND GND Ground

Type 2DS Wi-Fi Module Datasheet No. Pin Name Type Connection to IC Pin Name Supply Internal PU/PD Int’l Pull Value [Ω] Description

37 GND GND Ground

38 GND GND Ground

39 GND GND Ground

40 GND GND Ground

41 VBAT Power VDD33 3.3V Digital Power Supply

42 GND GND Ground

43 GND GND Ground

44 GND GND Ground

45 GND GND Ground

46 NC O RF_CNTL1_P- weak PU

47 NC O RF_CNTL0_N- weak PU

48 NC I TMS nominal

49 NC O TDO nominal

50 NC I TCK nominal

51 NC I TDI nominal

52 GND GND Ground

53 GND GND Ground

54 GND GND Ground

55 VIO Power VIO 1.8V/3.3V Digital I/O Power Supply

56 GPIO3 I/O GPIO[3] VIO nominal

PU enable 100k GPIO Mode: GPIO[3]

57 GPIO2 I/O GPIO[2] VIO weak PU

enable 600k GPIO Mode: GPIO[2]

58 GPIO1 I/O GPIO[1] VIO weak PU

GPIO Mode: GPIO[1] Host Wakeup: SoC-to-Host wakeup (output)

59 GPIO0 I/O GPIO[0] VIO nominal

PU enable 100k GPIO Mode: GPIO[0]

60 GND GND Ground

61 VIO_SD Power VIO_SD 1.8V/3.3V Digital I/O SDIO Power Supply

62 SD_CLK I SD_CLK VIO_SD nominal

SDIO 4-bit Mode: Clock input SDIO 1-bit Mode: Clock input SDIO SPI Mode: Clock input

63 SD_CMD I/O SD_CMD/

USB_VBUS_ON VIO_SD nominal PU enable 100k SDIO 4-bit Mode: Command/response (input/output) SDIO 1-bit Mode: Command line

Type 2DS Wi-Fi Module Datasheet No. Pin Name Type Connection to IC Pin Name Supply Internal PU/PD Int’l Pull Value [Ω] Description SDIO SPI Mode: Data input USB Mode: USB_VBUS_ON (input)

64 SD_DAT3 I/O SD_DAT[3] VIO_SD nominal

SDIO 4-bit Mode: Data line Bit[3] SDIO 1-bit Mode: Reserved SDIO SPI Mode: Card select (active low)

65 SD_DAT2 I/O SD_DAT[2] VIO_SD nominal

SDIO 4-bit Mode: Data line Bit[2] or read wait (optional) SDIO 1-bit Mode: Read wait (optional) SDIO SPI Mode: Reserved

66 SD_DAT1 I/O SD_DAT[1] VIO_SD nominal

SDIO 4-bit Mode: Data line Bit[1] SDIO 1-bit Mode: Interrupt SDIO SPI Mode: Interrupt SDO is tristate when SCSn is inactive. Enables multiple devices driving SDO line.

67 SD_DAT0 I/O SD_DAT[0] VIO_SD nominal

SDIO 4-bit Mode: Data line Bit[0] SDIO 1-bit Mode: Data line SDIO SPI Mode: Data output 68 -

88 GND GND Ground

7.3 Configuration Pins

Table 8 shows the configuration pins for Type 2DS module. Table 8: Configuration Pins Configuration Bits Pin Name Configuration Function CON[1] CONFIG_HOST[1] Firmware Boot Options 00 = reserved 01 = reserved 10 = SDIO 11 = USB CON[0] CONFIG_HOST[0]

7.4 SDIO Pin Descriptions

Table 9 shows the SDIO pin descriptions. Table 9: SDIO Pin Descriptions No. Pin Name (i) SD 4-bit Mode (ii) SD 1-bit Mode

62 SDI_CLK CLK Clock input CLK Clock input

67 SD_DAT0 DATA0 Data line 0 DATA Data line

66 SD_DAT1 DATA1 Data line 1 IRQ Interrupt

Type 2DS Wi-Fi Module Datasheet No. Pin Name (i) SD 4-bit Mode (ii) SD 1-bit Mode

65 SD_DAT2 DATA2 Data line 2

or read wait (optional) RW Read wait (optional)

64 SD_DAT3 DATA3 Data line 3 NC Reserved

63 SD_CMD CMD Command/response

(input/output) CMD Command line Figure 7 shows the different SDIO modes. Figure 7: SDIO Modes

8 Absolute Maximum Ratings

The absolute maximum ratings are shown in Table 10: Absolute Maximum Ratings. Table 10: Absolute Maximum Ratings Parameter Minimum Maximum Unit Storage Temperature -40 +85 °C Supply Voltage VBAT 4.0 V VIO 4.0 V Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. DATA[3:0] SD Host Type 2DS CMD CLK SD Host Type 2DS CMD CLK DATA IRQ (i) SD 4-bit Mode (ii) SD 1-bit Mode

Type 2DS Wi-Fi Module Datasheet

9 Operating Condition

9.1 Operating Condition

The operating conditions are shown in Table 11. Table 11: Operating Conditions Parameter Minimum Typical Maximum Unit Operating Temperature Range Ta -40 +25 +85 °C Tj +125 °C Supply Voltage VBAT 2.97 3.3 3.63 V VIO 1.62 1.8 1.98 V 2.97 3.3 3.63 V Internal 1.8V AVDD18 1.71 1.8 1.89 V IO Current VIO 0.1 0.5 mA Peak current1 VBAT 430 550 mA Operation beyond the recommended operating conditions is neither recommended nor guaranteed.

9.2 Digital I/O Requirements

Table 12: Digital I/O Requirements Symbol Parameter Condition Minimum Typical Maximum Unit VIH Input high voltage 0.7 * VIO VIO + 0.4 V VIL Input low voltage -0.4 0.3 * VIO V VHYS Input hysteresis 100 mV VOH Output high voltage VIO - 0.4 V VOL Output low voltage 0.4 V VPDH Input high voltage 1.4 5.5 V VPDL Input low voltage -0.4 0.5 V

9.3 Package Thermal Conditions

The package thermal conditions as shown in Figure 8 are as below:

RΨjt: 7.09 °C/W
RΨjt = (Tj - Tt)/P Tj: Junction temperature (℃), Tt: Top temperature (℃), P: Total Power Consumption (W) 1 Peak current of VBAT (RF portion) occurs during DPD calibration when the firmware is downloaded.

Type 2DS Wi-Fi Module Datasheet Figure 8: Package Thermal Conditions

10 Power Sequence

This section describes the power-on and power-off sequences along with their parameters.

10.1 Power-On Sequence

External VBAT/VIO/VIO_SD from host.
PDn driven by host Figure 9 shows the power-on sequence graph for PDn driven by host. Figure 9: Power-On Sequence Graph (PDn driven by Host)
Assert PDn low (active) during VBAT/VIO/VIO_SD ramp-up.
Continue to assert low for a minimum of 1 ms after VBAT/VIO/VIO_SD are stable. Option 2
External VBAT/VIO/VIO_SD from host.
PDn is tied to VBAT. Figure 10 shows the power-on sequence graph for PDn tied to VBAT. Silicon Die Tt RΨjt Tj VBAT/VIO/ VIO_SD PDn 1 ms

Type 2DS Wi-Fi Module Datasheet Figure 10: Power-On Sequence Graph (PDn tied to VBAT)

10.2 Power-Off Sequence

Figure 11 shows the power-off sequence graph. Figure 11: Power-Off Sequence Graph All power rails can be powered off. In this case, the state of the PDn Pin is irrelevant.

11 Interface Timing

This section describes the SDIO/USB timing for different modes.

11.1 SDIO Specifications

The SDIO host interface pins are powered from the VIO_SD voltage supply.
The SDIO electrical specifications are identical for 1-bit SDIO and 4-bit SDIO modes.

11.1.1 Normal, High Speed Modes

Figure 12 shows the SDIO protocol timing diagram in normal mode. VBAT/VIO/ VIO_SD PDn VBAT/VIO/ VIO_SD PDn

Type 2DS Wi-Fi Module Datasheet Symbol Parameter Condition Minimum Typical Maximum Unit TODLY Output delay time Normal 14 ns High speed 14 ns TOH Output hold time High speed 2.5 ns Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.

11.2 USB Specifications

The USB device interface is compliant with the Universal Serial Bus Specification, Revision 2.0, April 27, 2000. A USB host uses the USB cable bus and the USB 2.0 device interface to communicate with the chip. Main features of the USB device interface include:

High/full speed operation (480/12 Mbps)
Suspend/host resume/device resume (remote wake-up)
Built-in DMA engine that reduces interrupt loads on the embedded processor and reduces the system bus bandwidth requirement for serving the USB device operation
Supports Link Power Management (LPM), corresponding host resume, or device resume (remote wakeup) to exit from L1 sleep state The USB 2.0 device interface is designed with 3.3V signal level pads. Table 14: Interface Signal Description Module signal name USB2.0 spec name Type Description VBAT VBUS USB Bus Power Supply On-board regulator regulates voltage from VBUS level to voltage levels used by USB PHY. SD_CMD/USB_VBUS_ON I USB Vbus On USB power valid indication GND USB Bus Ground Common ground on SoC device USB_DPLS D+ I/O USB Bus Data Plus 1 of the differential data pair. USB_DMNS D- I/O USB Bus Data Minus 1 of the differential data pair. USB 2.0 device host interface pins are powered from the VBAT voltage supply.

11.2.1 USB Electrical Characteristics

Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.

Type 2DS Wi-Fi Module Datasheet Table 15: USB Electrical Characteristics Symbol Parameter Condition Minimum Typical Maximum Units Supply Current ICCHPF High-power function 500 mA ICCLPF Low-power function 100 mA ICCINIT Unconfigured function 100 mA ICCSH Suspended high-power device 2.5 mA ICCSL Suspended low-power device 500 µA Input Levels for Low/Full Speed VIH Input high voltage (driven) 2.0 V VIHZ Input high voltage (floating) 2.7 3.6 V VIL Input low voltage 0.8 V VDI Differential input sensitivity 0.2 V VCM Differential common mode range 0.8 2.5 V Input Levels for High Speed VHSSQ High speed squelch detection threshold (differential signal amplitude) 100 150 mV VHSDSC High speed disconnect detection threshold (differential signal amplitude) 525 625 mV - High speed differential input signaling levels Specified by eye pattern templates; see Section 7.1.7.2 in the USB 2.0 specification. VHSCM High speed data signaling common mode voltage range -50 500 mV Output Levels for Low/Full Speed VOL Output low voltage 0.0 0.3 V VOH Output high voltage (driven) 2.8 3.6 V VOSE1 Output SE1 voltage 0.8 V VCRS Output signal crossover voltage 1.3 2.0 V Output Levels for High Speed VHSOI High speed idle level -10.0 10.0 mV VHSOH High speed data signaling high 360 440 mV VHSOL High speed data signaling low -10.0 10.0 mV VCHIRPJ Chirp J level (differential voltage) 700 1100 mV VCHIRPK Chirp K level (differential voltage) -900 -500 mV Decoupling Capacitance CRPB Upstream facing port bypass capacitance 1.0 10.0 µF Input Capacitance for Low/Full Speed CINUB Upstream facing port capacitance (without cable) 100 pF

Type 2DS Wi-Fi Module Datasheet Symbol Parameter Condition Minimum Typical Maximum Units CEDGE Transceiver edge rate control capacitance 75 pF Input Impedance for High Speed TDR spec for high speed termination Differential impedance 80 100 W Terminations RPUI Bus pull-up resistor on upstream port (idles bus) 0.900 1.575 kΩ RPUA Bus pull-up resistor on upstream port (receiving) 1.425 3.090 kΩ ZINP Input impedance exclusive of pull-up/pull-down (for low/full speed) 300 kΩ VTERM Termination voltage for upstream facing port pull-up resistor (RPU) 3.0 3.6 V Terminations in High Speed VHSTERM Termination voltage in high speed -10 10 mV

11.2.2 High Speed Source Electrical Characteristics

Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 16: High Speed Source Electrical Characteristics Symbol Parameter Condition Minimum Typical Maximum Units Driver Characteristics THSR Rise Time (10% - 90%) 500 ps THSF Fall Time (10% - 90%) 500 ps - Driver waveform requirements Specified by eye pattern templates in Section 7.1.2 in the USB 2.0 specification. ZHSDRV Driver output resistance (also serves as high speed termination) 40.5 49.5 W Clock Timings THSDRAT High speed data rate 479.760 480.240 Mb/s THSFRAM Micro frame interval 124.9375 125.0625 µs THSRFI Consecutive micro frame interval difference 4 high speed bit times High Speed Data Timings Data source jitter Specified by eye pattern templates in Section 7.1.2.2 in the USB 2.0 specification. Received jitter tolerance Specified by eye pattern templates in

Type 2DS Wi-Fi Module Datasheet Symbol Parameter Condition Minimum Typical Maximum Units Section 7.1.2.2 in the USB 2.0 specification.

11.2.3 Full Speed Source Electrical Characteristics

Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 17: Full Speed Source Electrical Characteristics Symbol Parameter Condition Minimum Typical Maximum Units Driver Characteristics TFR Rise time 4 20 ns TFF Fall time 4 20 ns TFRFM Differential rise and fall time matching TFR/TFF 90 111.11 % Clock Timings TFDRATHS Full speed data rate Average bit rate 11.9940 12.0060 Mb/s TFDRATE Frame interval 0.9995 1.00005 ms TRFI Consecutive frame interval difference No clock adjustment 42 ms Full Speed Data Timings TDJ1 Source jitter total to next transition (including frequency tolerance) -3.5 3.5 ns TDJ2 Source jitter total for paired transitions (including frequency tolerance) -4 4 ns TFDEOP Source jitter for differential transition to SE0 transition -2 5 ns TJR1 Receiver jitter to next transition -18.5 18.5 ns TJR2 Receiver jitter to next transition -9 9 ns TFEOPT Source SE0 interval of EOP 160 175 ns TFEOPR Receiver SE0 interval of EOP 82 ns TFST Width of SE0 interval during differential transition 14 ns

Type 2DS Wi-Fi Module Datasheet

11.2.4 Device Event Timing Characteristics

Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Table 18: Device Event Timing Characteristics Symbol Parameter Condition Minimum Typical Maximum Units TSIGATT Time from internal power good to device pulling D+/D- beyond VIHZ (minimum) (signaling attach) 100 ms TATTDB Debounce interval provided by USB system software after attach 100 ms T2SUSP Maximum time a device can draw power > suspend power when bus is continuously in idle state 10 ms TSUSAVGI Maximum duration of a suspend averaging interval 1 s TWTRSM Period of idle bus before device can initiate resume Device must be remote-wake-up enabled 5 ms TDRSMUP Duration of driving resume upstream 1 15 ms TRSMCY Resume recovery time Provided by USB system software 10 ms TRSTRCY Reset recovery time 10 ms TIPD Inter-packet delay (for low/full speed) 2 bit times TRSPIPD1 Inter-packet delay for device response with detachable cable for low/full speed 6.5 bit times TRSPIPD2 Inter-packet delay for device response with captive cable for low/full speed 7.5 bit times TDSETADDR SetAddress() completion time 50 ms TDRQCMPLTND Time to complete standard request with no data 50 ms TDRETDATA1 Time to deliver first and subsequent (except last) data for standard request 500 ms TDRETDATAN Time to deliver last data for standard request 50 ms THSRSPIPD2 Inter-packet delay for device response with captive cable (high speed) 192 bit times + 52 ns Reset Handshake Protocol FFILTSE0 Time for which a suspended high speed capable device must see a continuous SE0 before beginning the high speed detection handshake 2.5 µs TWTRSTFS Time for which a high speed capable device operating in non- suspended full speed must wait 2.5 3000 µs

Type 2DS Wi-Fi Module Datasheet Symbol Parameter Condition Minimum Typical Maximum Units after start of SE0 before beginning the high speed detection handshake TWTREV Time for which a high speed capable device operating in high speed must wait after start of SE0 before reverting to full speed 3.0 3.125 ms TWTRSTHS Time for which a device must wait after reverting to full speed before sampling the bus state for SE0 and beginning the high speed detection handshake 100 875 µs TUCH Minimum duration of a Chirp K from a high speed capable device within the reset protocol 1.0 ms TUCHEND Time after start of SE0 by which a high speed device capable device is required to have completed its Chirp K within the reset protocol 7.01 ms TWTHS Time after end of upstream chirp at which device enters the high speed default state if downstream chirp is detected 500 µs TWTFS Time after end of upstream chirp at which device reverts to full speed default state if no downstream chirp is detected 1.0 2.5 ms

11.2.5 LPM Timing Characteristics

Table 19: LPM Timing Characteristics Symbol Parameter Condition Minimum Typical Maximum Units TL1Residency L1 residency 50 >50 µs TL1TokenRetry Device delay before transitioning to L1 after transmitting ACK 8 10 µs TL1HubDrvResume1 Host initiated L1 exit host drives resume time 50 ± 1 1200 ± 1 µs TL1DevDrvResume Device initiated L1 exit Device drives resume time 50 ± 1 µs TL1ExitDevRecovery L1 exit device recovery time 10 µs TL1ExitLatency1 L1 exit latency (host initiated) 60 1210 µs TL1ExitLatency2 L1 exit latency (device initiated) 70 1000 µs

Type 2DS Wi-Fi Module Datasheet

12 DC/RF Characteristics

ALL DC/RF characteristics are defined by following files. Table 20: DC/RF Characteristics and Files Characteristic Filenames WLAN Tx Power txpower_US.bin, txpower_CA.bin, txpower_EU.bin, txpower_JP.bin WLAN Regulatory Limit db.txt Energy Detect ed_mac.bin Figure 14: Burst Current Definition 12.1 DC/RF Characteristics for IEEE 802.11b - 2.4 GHz Table 21: Characteristics Values for IEEE 802.11b - 2.4 GHz Items Contents Specification IEEE 802.11b – 2.4 GHz Mode DSSS / CCK Channel Frequency 2412 - 2472 MHz (5 MHz) Data rate 1, 2, 5.5, 11 Mbps

Type 2DS Wi-Fi Module Datasheet 12.1.1 High-Rate Condition for IEEE 802.11b - 2.4 GHz Conditions: 25 °C, VBAT = 3.3V, Output power setting = 17 dBm at module pad, 11 Mbps mode Table 22: High-Rate Condition for IEEE 802.11b - 2.4 GHz Items Contents DC Characteristics Minimum Typical Maximum Unit DC current

Tx mode 330 408 mA
Rx mode 69 92 mA Tx Characteristics Minimum Typical Maximum Unit Output Power 14.5 17.0 19.5 dBm Spectrum Mask Margin
1st side lobes (-30 dBr) 0 dB
2nd side lobes (-50 dBr) 0 dB Power-on/off ramp 2.0 µs RF Carrier Suppression 15 dB Modulation Accuracy 35 % Frequency tolerance -25 25 ppm Spurious Emissions
30 - 47 MHz (BW = 100 kHz) -36 dBm
47 - 74 MHz (BW = 100 kHz) -54 dBm
74 - 87.5 MHz (BW = 100 kHz) -36 dBm
87.5 - 118 MHz (BW = 100 kHz) -54 dBm
118 - 174 MHz (BW = 100 kHz) -36 dBm
174 - 230 MHz (BW = 100 kHz) -54 dBm
230 - 470 MHz (BW = 100 kHz) -36 dBm
470 - 862 MHz (BW = 100 kHz) -54 dBm
862 - 1000 MHz (BW = 100 kHz) -36 dBm
1000 - 12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit Minimum Input Level (FER ≤ 8%) -76 dBm Maximum Input Level (FER ≤ 8%) -10 dBm Adjacent Channel Rejection (FER < 8%) 35 dB

Type 2DS Wi-Fi Module Datasheet 12.1.2 Low-Rate Condition for IEEE 802.11b - 2.4 GHz Conditions: 25 °C, VBAT = 3.3V, Output power setting = 17 dBm at module pad, 1 Mbps mode Table 23: Low-Rate Condition for IEEE 802.11b - 2.4 GHz Items Contents DC Characteristics Minimum Typical Maximum Unit DC current

Tx mode 335 417 mA
Rx mode 69 91 mA Tx Characteristics Minimum Typical Maximum Unit Output Power 14.5 17.0 19.5 dBm Spectrum Mask Margin
1st side lobes (-30 dBr) 0 dB
2nd side lobes (-50 dBr) 0 dB Power-on/off ramp 2.0 µs RF Carrier Suppression 15 dB Modulation Accuracy 35 % Frequency tolerance -25 25 ppm Spurious Emissions
30 - 47 MHz (BW = 100 kHz) -36 dBm
47 - 74 MHz (BW = 100 kHz) -54 dBm
74 - 87.5 MHz (BW = 100 kHz) -36 dBm
87.5 - 118 MHz (BW = 100 kHz) -54 dBm
118 - 174 MHz (BW = 100 kHz) -36 dBm
174 - 230 MHz (BW = 100 kHz) -54 dBm
230 - 470 MHz (BW = 100 kHz) -36 dBm
470 - 862 MHz (BW = 100 kHz) -54 dBm
862 - 1000 MHz (BW = 100 kHz) -36 dBm
1000 - 12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit Minimum Input Level (FER ≤ 8%) -80 dBm Maximum Input Level (FER ≤ 8%) -4 dBm Adjacent Channel Rejection (FER < 8%) 35 dB

Type 2DS Wi-Fi Module Datasheet 12.2 DC/RF Characteristics for IEEE 802.11g - 2.4 GHz Table 24: Characteristics Values for IEEE 802.11g - 2.4 GHz Items Contents Specification IEEE 802.11g Mode OFDM Channel Frequency 2412 - 2472 MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54 Mbps 12.2.1 High-Rate Condition for IEEE 802.11g - 2.4 GHz Conditions: 25 °C, VBAT = 3.3V, Output power setting = 14 dBm at module pad, 54 Mbps mode Table 25: High-Rate Condition for IEEE 802.11g - 2.4 GHz Items Contents DC Characteristics Minimum Typical Maximum Unit DC current

Tx mode 302 376 mA
Rx mode 72 94 mA Tx Characteristics Minimum Typical Maximum Unit Output Power 11.5 14.0 16.5 dBm Spectrum Mask Margin
9 MHz to 11 MHz (0 ~ -20 dBr) 0 dB
11 MHz to 20 MHz (-20 ~ -28 dBr) 0 dB
20 MHz to 30 MHz (-28 ~ -40 dBr) 0 dB
30 MHz to 33 MHz (-40 dBr) 0 dB Constellation Error (EVM) -25 dB Frequency tolerance -25 25 ppm Spurious Emissions
30 - 47 MHz (BW = 100 kHz) -36 dBm
47 - 74 MHz (BW = 100 kHz) -54 dBm
74 - 87.5 MHz (BW = 100 kHz) -36 dBm
87.5 - 118 MHz (BW = 100 kHz) -54 dBm
118 - 174 MHz (BW = 100 kHz) -36 dBm
174 - 230 MHz (BW = 100 kHz) -54 dBm
230 - 470 MHz (BW = 100 kHz) -36 dBm
470 - 862 MHz (BW = 100 kHz) -54 dBm
862 - 1000 MHz (BW = 100 kHz) -36 dBm
1000 - 12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit Minimum Input Level (PER < 10%) -65 dBm Maximum Input Level (PER < 10%) -20 dBm Adjacent Channel Rejection (PER < 10%) -1 dB

Type 2DS Wi-Fi Module Datasheet 12.2.2 Low-Rate Condition for IEEE 802.11g - 2.4 GHz Conditions: 25 °C, VBAT = 3.3V, Output power setting = 15 dBm at module pad, 6 Mbps mode Table 26: Low-Rate Condition for IEEE 802.11g - 2.4 GHz Items Contents DC Characteristics Minimum Typical Maximum Unit DC current

Tx mode 313 391 mA
Rx mode 71 93 mA Tx Characteristics Minimum Typical Maximum Unit Output Power 12.5 15.0 17.5 dBm Spectrum Mask Margin
9 MHz to 11 MHz (0 ~ -20 dBr) 0 dB
11 MHz to 20 MHz (-20 ~ -28 dBr) 0 dB
20 MHz to 30 MHz (-28 ~ -40 dBr) 0 dB
30 MHz to 33 MHz (-40 dBr) 0 dB Constellation Error (EVM) - -5 dB Frequency tolerance -25 25 ppm Spurious Emissions
30 - 47 MHz (BW = 100 kHz) -36 dBm
47 - 74 MHz (BW = 100 kHz) -54 dBm
74 - 87.5 MHz (BW = 100 kHz) -36 dBm
87.5 - 118 MHz (BW = 100 kHz) -54 dBm
118 - 174 MHz (BW = 100 kHz) -36 dBm
174 - 230 MHz (BW = 100 kHz) -54 dBm
230 - 470 MHz (BW = 100 kHz) -36 dBm
470 - 862 MHz (BW = 100 kHz) -54 dBm
862 - 1000 MHz (BW = 100 kHz) -36 dBm
1000 - 12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit
Minimum Input Level (PER < 10%) -82 dBm
Maximum Input Level (PER < 10%) -20 dBm
Adjacent Channel Rejection (PER < 10%) -1 dB

Type 2DS Wi-Fi Module Datasheet 12.3 DC/RF Characteristics for IEEE 802.11n - 2.4 GHz Table 27: Characteristics Values for IEEE 802.11n - 2.4 GHz Items Contents Specification IEEE 802.11n Mode OFDM Channel Frequency 2412 - 2472 MHz Data rate MCS0 - MCS7 12.3.1 High-Rate Condition for IEEE 802.11n - 2.4 GHz Conditions: 25 °C, VBAT = 3.3V, Output power setting = 13 dBm at module pad, MCS7 mode Table 28: High-Rate Condition for IEEE 802.11n - 2.4 GHz Items Contents DC Characteristics Minimum Typical Maximum Unit DC current

Tx mode 302 378 mA
Rx mode 72 94 mA Tx Characteristics Minimum Typical Maximum Unit Output Power 11.5 14.0 16.5 dBm Spectrum Mask Margin
9 MHz to 11 MHz (0 ~ -20 dBr) 0 dB
11 MHz to 20 MHz (-20 ~ -28 dBr) 0 dB
20 MHz to 30 MHz (-28 ~ -45 dBr) 0 dB
30 MHz to 33 MHz (-45 dBr) 0 dB Constellation Error (EVM) (measured at enhanced mode) -27 dB Frequency tolerance -25 25 ppm Spurious Emissions
30 - 47 MHz (BW = 100 kHz) -36 dBm
47 - 74 MHz (BW = 100 kHz) -54 dBm
74 - 87.5 MHz (BW = 100 kHz) -36 dBm
87.5 - 118 MHz (BW = 100 kHz) -54 dBm
118 - 174 MHz (BW = 100 kHz) -36 dBm
174 - 230 MHz (BW = 100 kHz) -54 dBm
230 - 470 MHz (BW = 100 kHz) -36 dBm
470 - 862 MHz (BW = 100 kHz) -54 dBm
862 - 1000 MHz (BW = 100 kHz) -36 dBm
1000 - 12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit
Minimum Input Level (PER ≤ 10%) -64 dBm
Maximum Input Level (PER < 10%) -20 dBm
Adjacent Channel Rejection (PER ≤ 10%) -2 dB

Type 2DS Wi-Fi Module Datasheet 12.3.2 Low-Rate Condition for IEEE 802.11n - 2.4 GHz Conditions: 25 °C, VBAT = 3.3V, Output power setting = 15 dBm at module pad, MCS0 mode Table 29: Low-Rate Condition for IEEE 802.11n - 2.4 GHz Items Contents DC Characteristics Minimum Typical Maximum Unit DC current

Tx mode 315 392 mA
Rx mode 71 93 mA Tx Characteristics Minimum Typical Maximum Unit Output Power 12.5 15.0 17.5 dBm Spectrum Mask Margin
9 MHz to 11 MHz (0 ~ -20 dBr) 0 dB
11 MHz to 20 MHz (-20 ~ -28 dBr) 0 dB
20 MHz to 30 MHz (-28 ~ -45 dBr) 0 dB
30 MHz to 33 MHz (-45 dBr) 0 dB Constellation Error (EVM) (measured at enhanced mode) -5 dB Frequency tolerance -25 25 ppm Spurious Emissions
30 - 47 MHz (BW = 100 kHz) -36 dBm
47 - 74 MHz (BW = 100 kHz) -54 dBm
74 - 87.5 MHz (BW = 100 kHz) -36 dBm
87.5 - 118 MHz (BW = 100 kHz) -54 dBm
118 - 174 MHz (BW = 100 kHz) -36 dBm
174 - 230 MHz (BW = 100 kHz) -54 dBm
230 - 470 MHz (BW = 100 kHz) -36 dBm
470 - 862 MHz (BW = 100 kHz) -54 dBm
862 - 1000 MHz (BW = 100 kHz) -36 dBm
1000 - 12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit
Minimum Input Level (PER ≤ 10%) -82 dBm
Maximum Input Level (PER < 10%) -20 dBm
Adjacent Channel Rejection (PER ≤ 10%) -2 dB

Type 2DS Wi-Fi Module Datasheet

13 Land Pattern

The Land Pattern is shown in Figure 15. Figure 15: Land Pattern

Type 2DS Wi-Fi Module Datasheet

14 Radio Regulatory Certification by Country for

This section includes regulatory certification information all the following countries:

Japan
FCC
ISED
Europe

14.1 Japan

Application Model Name: LBWA0ZZ2DS
Certification Number: 001-P01579

14.1.1 About Notations

It is recommended that the indication of (1) or (2) below is described on the product incorporating this module in Japanese. If there is any problem with the indication of (1) or (2) on the product, we recommend indicating (1) or (2) in the user manual or on the package of the product incorporating this module, or electronic display on the product. In the case of the electronic display, it is necessary to describe "using the electronic display" + "how to reach to below indication" in the user manual of the product.

Recommended Indication 1 Japanese Version 本製品は、電波法に基づく工事設計認証(認証番号:001-P01579)を受けた特定無線設備を内蔵しています。 English Version This product incorporates specified radio equipment that has received CERTIFICATION for TYPE CERTIFICATION (certification number: 001-P01579) based on the Japan Radio Act.
Recommended Indication 2 R 001-P01579

Type 2DS Wi-Fi Module Datasheet

14.1.2 Power Level for Japan

Table 30 shows the per antenna port power table for 2.4 GHz for WLAN. Table 30: Japan Power Level Per Antenna Port Mode Data Rate Maximum Tune Up Tolerance [dBm] Ch. 1-13 IEEE 802 11b All Rates 13 ± 2.5 IEEE 802 11g 6, 9, 12, 18, 24 Mbps 15 ± 2.5 36, 48, 54 Mbps 14 ± 2.5 IEEE 802 11n (HT20) MCS0, MCS1, MCS2, MCS3, MCS4, MCS5 15 ± 2.5 MCS6, MCS7 14 ± 2.5

14.1.3 Japan/Europe Operation Mode and Frequency Band

Table 31 shows the operation and frequency band for Japan and Europe. Table 31: Japan/Europe Operation Mode and Frequency band WLAN STA 2.4 GHz 11b/g/n HT20 1ch - 13ch AP 2.4 GHz 11b/g/n HT20 1ch - 13ch

14.1.4 Japan/Europe Theory of Operation – Channel List

Table 32 shows the theory of operation for Japan and Europe. Table 32: Japan/Europe Theory of Operation - Channel List Frequency of Operation Scan Ad-hoc mode

2.4 GHz 11b/g/n (HT20) 2412 - 2472 MHz Active Yes

14.1.5 Approved Antenna for Japan and Europe

Table 33 lists the approved antenna for Japan and Europe. Table 33: Japan/Europe Approved Antenna Antenna Name LBWA0ZZ2DS-Antenna Antenna Type Inverted-F Antenna Gain 4.0 dBi Frequency 2400 - 2483.5 MHz Built-in Antenna

Type 2DS Wi-Fi Module Datasheet

14.2 FCC

Model Name: LBWA0ZZ2DS
FCC ID: VPYLBWA0ZZ2DS This module is not directly sold to general end users. Therefore, there is no user manual of module. For the details about this module, please refer to the specification sheet of module. 1. This module should be installed in the host device according to the interface specification (installation procedure). 2. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the end user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in User manual. This modular is a limited single modular as without its own power supply regulation, it can only be installed in the host device according to the interface specification (installation procedure).

14.2.1 Information to Display on Host Device and User Manual

14.2.1.1 Information on Host Device

The following statements must be described on the host device of this module.

Contains transmitter module FCC ID: VPYLBWA0ZZ2DS or Contains FCC ID: VPYLBWA0ZZ2DS This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
This device may not cause harmful interference
This device must accept any interference received, including interference that may cause undesired operation. If it is difficult to describe this statement on the host product due to the size, please describe in the User's manual and also either describe on the device packaging or on a removable label attached to the device.

14.2.1.2 Information in User Manual

The following statements must be described on the user manual of the host device of this module.

FCC CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter.

14.2.2 Equipment Installation for FCC

There are two types of installation for host device.

Type 2DS Wi-Fi Module Datasheet

14.2.2.1 Portable Equipment

Equipment for which the spaces between human body and antenna are used within 20 cm. When installing it in a portable equipment, please describe the following warning to the manual. It is necessary to take a SAR test with your set mounting this module. Class II permissive change application is necessary using the SAR report. Please contact Murata.

14.2.2.2 Mobile Equipment

14.2.3 Power Level for FCC

Table 34 shows the per antenna port power table for 2.4 GHz for WLAN for both FCC and ISED. Table 34: FCC/ISED Power Level Per Antenna Port Mode Rate Channel Maximum Tune Up Tolerance [dBm] IEEE 802.11b All Rate 1 - 11 17 ± 2.5 IEEE 802.11g 6/9/12/18 Mbps 1, 11 12 ± 2.5 2 - 10 15 ± 2.5 24/36/48/54 Mbps 1, 11 12 ± 2.5 2 - 10 14 ± 2.5 IEEE 802 11n (HT20) MCS0, MCS1, MCS2, MCS3, MCS4 1, 11 11 ± 2.5 2 - 10 15 ± 2.5 MCS5, MCS6, MCS7 1, 11 11 ± 2.5 2 - 10 14 ± 2.5

14.2.1 FCC/ISED Operation Mode and Frequency Band

Table 35 shows the operation and frequency band for FCC and ISED. Table 35: FCC/ISED Operation Mode and Frequency band WLAN STA 2.4 GHz 11b/g/n HT20 1ch - 11ch AP 2.4 GHz 11b/g/n HT20 1ch - 11ch

Type 2DS Wi-Fi Module Datasheet

14.2.2 FCC/ISED Theory of Operation – Channel List

Table 36 shows the theory of operation for FCC and ISED. Table 36: FCC/ISED Theory of Operation - Channel List Frequency of Operation Scan Ad-hoc mode

2.4 GHz 11b/g/n (HT20) 2412 - 2462 MHz Active Yes

14.3 ISED

Model Name: LBWA0ZZ2DS
IC Number: 772C-LBWA0ZZ2DS This module is not sold to general end users directly, therefore, there is no user manual of module. For details about this module, please refer to the specification sheet of module.
This module should be installed in the host device according to the interface specification (installation procedure).
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the end user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in User manual. This modular is a limited single modular as without its own power supply regulation, it can only be installed in the host device according to the interface specification (installation procedure).

14.3.1 Information to Display on Host Device and User Manual

14.3.1.1 Information on Host Device

The following information must be indicated on the host device of this module.

Contains IC: 772C-LBWA0ZZ2DS

14.3.1.2 Information in User Manual

The following statements must be described on the user manual of the host device of this module. English Version This device complies with Industry Canada’s applicable license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. French Version Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. l’appareil ne doit pas produire de brouillage; 2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

Type 2DS Wi-Fi Module Datasheet English Version Data transmission is always initiated by software, which is the passed down through the MAC, through the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then turns off at the end of the packet. Therefore, the transmitter will be on only while one of the aforementioned packets is being transmitted. In other words, this device automatically discontinue transmission in case of either absence of information to transmit or operational failure. French Version La transmission des données est toujours initiée par le logiciel, puis les données sont transmises par l'intermédiaire du MAC, par la bande de base numérique et analogique et, enfin, à la puce RF. Plusieurs paquets spéciaux sont initiés par le MAC. Ce sont les seuls moyens pour qu'une partie de la bande de base numérique active l'émetteur RF, puis désactive celui-ci à la fin du paquet. En conséquence, l'émetteur reste uniquement activé lors de la transmission d'un des paquets susmentionnés. En d'autres termes, ce dispositif interrompt automatiquement toute transmission en cas d'absence d'information à transmettre ou de défaillance.

14.3.2 Equipment Installation for ISED

There are two types of installation for host device.

14.3.2.1 Portable Equipment

Equipment for which the spaces between human body and antenna are used within 20 cm. When installing it in a portable equipment, please describe the following warning to the manual. It is necessary to take a SAR test with your set mounting this module. Class 4 permissive change application is necessary using the SAR report. Please contact Murata.

14.3.2.2 Mobile Equipment

Equipment used at position in which the spaces between human body and antenna exceeded 20 cm. When installing it in a mobile equipment, please describe the following warning to the manual. English Version This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment and meets RSS- 102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and operated keeping the radiator at least 20 cm or more away from person’s body. French Version Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un environnement non contrôlé et respecte les règles d’exposition aux fréquences radioélectriques (RF) CNR-102 de l’IC. Cet équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus entre le radiateur et le corps humain.

Type 2DS Wi-Fi Module Datasheet

14.4 Europe

Product name: Communication Module Model: LBWA0ZZ2DS Manufacturer: Murata Manufacturing Co.Ltd. The following reports have been published: Standard: EN 300 328 V2.2.2:2019 EN 62311:2020 These reports can be leveraged as part of the TCF of the final product. In particular, we believe that the conducted test can be used directly as the TCF of the final product. The radiated test as TCF for the final product should be performed by you again with the final product. When shipping final products with this module to Europe, make a self-declaration that the final product complies with European regulations and apply the CE mark.

14.4.1 Europe Maximum Radio Frequency Power

Table 37 show the maximum radio frequency power to transmit within the operating frequency band. Table 37: Europe Maximum Radio Frequency Power Band Maximum Radio Frequency Power [dBm E.I.R.P] 2.4 GHz 19.98

14.4.2 Power Level for Europe

Table 38 shows the per antenna port power level for 2.4 GHz for WLAN. Table 38: Europe Power Level Per Antenna Port Mode Data Rate Output Power in dBm (typical) Ch. 1-13 11b All Rates 12 + 3.0/-2.0 11g All Rates 13 + 3.0/-2.0 11n-20 All Rates 13 + 3.0/-2.0

Type 2DS Wi-Fi Module Datasheet

15 Tape and Reel Packing

This section provides the general specifications for tape and reel packing.

15.1 Dimensions of Tape (Plastic tape)

Figure 16 is a graphical representation of the tape dimension (plastic tape)3. Figure 16: Dimensions of Tape (Unit: mm) 3 Cumulative tolerance of maximum 40 +/- 0.15 mm for every 10 pitches. 2.0±0.1 0.3±0.05 2.62±0.1 24.0±0.1 20.2±0.1 ɸ1.5+0.1/-0.0 44.0±0.2 feeding direction 4.0±0.1 14.5±0.05 ɸ2.0±0.1 26.0±0.05 40.4±0.1 1.75±0.1

Type 2DS Wi-Fi Module Datasheet

15.2 Dimensions of Reel

Figure 17 shows the reel dimensions. Figure 17: Dimensions of Reel (Unit: mm)

Type 2DS Wi-Fi Module Datasheet

15.3 Taping Diagrams

Figure 18 shows the taping diagrams. Figure 18: Taping Diagrams Table 39: Taping Specifications Mark Description 1 Feeding Hole. As specified in Dimensions of Tape (Plastic tape) 2 Hole for chip. As specified in Dimensions of Tape (Plastic tape) 3 Cover tape. 62 μm in thickness. 4 Base tape. As specified in Dimensions of Tape (Plastic tape) [2] [3] [4] [3] [1] Feeding Hole Chip Feeding Direction Antenna Area

Type 2DS Wi-Fi Module Datasheet

15.4 Leader and Tail tape

The leader and tail tape are shown in Figure 19. Figure 19: Leader and Tail Tape

The tape for chips is wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.
The cover tape and base tape are not adhered at no components area for 250 mm minimum.
Tear off strength against pulling of cover tape : 5 N minimum.
Packaging unit : 500 pcs./ reel
Material
Base tape : Plastic
Real : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
Peeling of force: 1.1 N maximum in the direction of peeling as shown in Figure 20. Tail tape (No components) 40 to 200 mm Components No components 150 mm minimum Leader tape (Cover tape alone) 250 mm minimum Feeding direction

Type 2DS Wi-Fi Module Datasheet Figure 20: Peeling Off Force

15.5 Packaging (Humidity Proof Packing)

Figure 21 shows the humidity proof packaging. Figure 21: Humidity Proof Packaging Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 °

1.1 N maximum

湿度インジケ－タ乾燥剤表示ラべル防湿梱包袋表示ラベル Label Label Desiccant Humidity Indicator Anti-humidity Plastic Bag

Type 2DS Wi-Fi Module Datasheet

16 Notice

16.1 Storage Conditions

Please use this product within 6 months after receipt.
The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 °C)
The product left more than 6 months after reception; it needs to be confirmed the solderability before used.
The product shall be stored in noncorrosive gas (Cl2, NH3, SO2, NOX, etc.).
Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours.
When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition : 125 +5/-0 °C, 24 hours, 1 time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) is not heat-resistant.

16.2 Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bare hands that may result in poor solder ability and destroy by static electrical charge.

16.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

Type 2DS Wi-Fi Module Datasheet

16.4 Notice for Chip Placer

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

16.5 Soldering Conditions

The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the above-mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions. Figure 22: Reflow Soldering Standard Conditions (Example) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

16.6 Cleaning

Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is done the customer is responsible for any issues or failures caused by the cleaning process. Within 120 s Pre-heating time(s) 220 °C Within 60 s Cooling down Slowly 180 °C 150 °C 250 °C Within 10 s Tpeak-5 °C

Type 2DS Wi-Fi Module Datasheet

16.7 Operational Environment Conditions

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity, and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.

In an atmosphere containing corrosive gas (Cl2, NH3, SOX, NOX etc.).
In an atmosphere containing combustible and volatile gases.
Dusty place.
Direct sunlight place.
Water splashing place.
Humid place where water condenses.
Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring.

Type 2DS Wi-Fi Module Datasheet

17 Preconditions to Use Our Products

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIM ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and blob) we may provide or to be embedded into our product (“Software”) provided that you use the Software bundled with our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU “AS IS” BASIS, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You shall indemnify and hold harmless us, our affiliates, and our licensor from and against any and all claims, costs, expenses and liabilities (including attorney’s fees), which arise in connection with the using the Software. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS.

Aircraft equipment.
Aerospace equipment.
Undersea equipment.
Power plant control equipment.
Medical equipment.
Traffic signal equipment.

Type 2DS Wi-Fi Module Datasheet

Burning / explosion control equipment.
Disaster prevention / crime prevention equipment.
Transportation equipment (vehicles, trains, ships, elevator, etc.).
Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by
The use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,
Deviation or lapse in function of engineering sample,
Improper use of engineering samples.
We disclaim any liability for consequential and incidental damages. If you can’t agree with the above contents, please contact sales.

Type 2DS Wi-Fi Module Datasheet

Revision History

Code Date Changed Item Comments - 2020.07.15 - First issue. A 2020.12.16 7. Module Pin Descriptions 9. Operating Conditions 12. DC / RF Characteristics 14. Reference Circuit 15. Tape and Reel Packing

Updated
Added Internal 1.8V(AVVD18)
Updated
Added
Added B 2021.01.14 5. Certification Information 12. DC/RF Characteristics
Added certification information
Updated file name of configuration files
Added information (Section 11.2.1 to 11.2.5) C 2021.03.15 6. Dimensions, Marking and Terminal Configurations 9. Operating Conditions 10. Power Up Sequence 12. DC/RF Characteristics 12.3.3 High Rate Conditions for IEEE 802.11n 14. Reference Circuit Appendix
Added Marking
Updated Peak current
Updated
Updated DC current
Updated Tx power.
Updated Reference Circuit
Added configuration manual D 2021.05.19 6. Dimensions, Marking and Terminal Configurations

7.2 Pin Description

Added Dimensional tolerance
Added Internal pull values E 2021.08.20 5. Certification Information • Added configuration files for FreeRTOS F 2021.12.14 3. Ordering Information 9. Operating Conditions
Added Updated the list
Defined IO current and Peak current G 2022.06.09 Appendix • Translated Japanese to English H 2022.12.01 2. Key Features
Added Total Fit
Added
Added Europe
Changed the description of the RF power setting I 2022.12.12 2. Key Features 3. Ordering Information

Reference Circuit Appendix

Updated information
Added Embedded Artists’ M.2 module information.
Added comments on termination of open pins.
Moved section to HW app note.
Moved Appendix information into Sections 14.
Moved antenna sections to HW app note. Updated to new format

Type 2DS Wi-Fi Module Datasheet Copyright © Murata Manufacturing Co., Ltd. All rights reserved. The information and content in this document are provided “as-is” with no warranties of any kind and are for informational purpose only. Data and information have been carefully checked and are believed to be accurate; however, no liability or responsibility for any errors, omissions, or inaccuracies is assumed. Wi-Fi® is a registered trademark of Wi-Fi Alliance. Other brand and product names are trademarks or registered trademarks of their respective owners. Specifications are subject to change without notice.

Product Information

LBWA0ZZ2DS-688 specifications and overview.

Summary

Type 2DS Wi-Fi® Module 2020

Description

Type 2DS Wi-Fi® Module 2020

Source title LBWA0ZZ2DS-688 Datasheet(PDF) - Murata Manufacturing Co., Ltd

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