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Formosa MSLBS05 THRU LBS10 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 List

1.0A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers-50V-1000V

Features

Suffix "-H" indicates Halogen-free part, ex.LBS05-H. Low profile surface mounted application in order to optimize board space. Rating to 1000V PRV Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique results in inexpensive product Lead tin plated copper Mechanical data Epoxy:UL94-V0 rated flame retardant

  • Case : Molded plastic, LMBS
  • Terminals : Solder plated, solderable per MIL-STD-202, Method 208
  • Polarity : marked on body
  • Mounting Position : Any
  • Weight : Approximated 0.080 gram Package outline Page 2 PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Storage temperature 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Symbol MIN. TYP. MAX. UNIT IO IFSM IR TSTG A A μA O C 1.0 5.0 +150-55 O V = V T = 25 CR RRM J LBS05 LBS1 LBS2 50 35 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I =1.0AF VF (V) LBS4 LBS6 100 200 140 -55 to +150400 600 280 420 100 200 400 600 1.10 Dimensions in inches and (millimeters) LMBS Formosa MS O ( C) Operating temperature T ,J http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Thermal resistance Junction to ambient RθJA 80 O C/W LBS8 800 560 800 LBS10 1000 700 1000 at TA=40°C Mounted on P.C. board O V = V T = 125 CR RRM J 500 LBS05 THRU LBS10 DS-241172 2011/07/25 2012/04/05 B 7 Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) Rating for fusing (t < 8.3 ms) 2 I t 2 A s3.7 SMD Bridge Rectifier

Rating and characteristic curves (LBS05 THRU LBS10) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. DS-241172 2011/07/25 2012/04/05 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Suggested solder pad layout Dimensions in inches and (millimeters) B 0.024 (0.60)MIN A 0.031 (0.80)MIN C 0.157(4.00)REF PACKAGE LMBS B D C A D 0.244 (6.20)MAX LBS05 THRU LBS10 Example Marking code ABS8 DS-241172 2011/07/25 2012/04/05 B 7 1.For Halogen Device 1st line: Marking code ABS8― 2nd line: 2.For Halogen-free Device indicate Halogen-Free.― SMD Bridge Rectifier

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Packing information D Item Tolerance LMBS Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F t W P A D D Symbol 0.1 0.05 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.05 0.1 0.1 0.1 0.05 2.0 2.0 unit:mm 1.55 330.00 50.00 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 12~14.4 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 5.31 6.68 1.60 C LBS05 THRU LBS10 DS-241172 2011/07/25 2012/04/05 B 7 SMD Bridge Rectifier

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time TL TP Ramp-down Temperature Reel packing LMBS 13" 5,000 8.0 10,000 360*340*45 330 380*365*400 80,000 14.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) LBS05 THRU LBS10 DS-241172 2011/07/25 2012/04/05 B 7 SMD Bridge Rectifier

  1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16"±1/32" O at 245±5 C for 5 sec. O V =80% rate at T =150 C for 168 hrs.R J O Rated average rectifier current at T =25 C for 500hrs.A O T = 25 C, I = IA F O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. O 15P at T =121 C for 4 hrs.SIG A O O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. 8.3ms single half sine-wave superimposed on rated load, one surge. O at T =85 C, RH=85% for 1000hrs.A O at 175 C for 1000 hrs. O ± C ± MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference High reliability test capabilities http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. LBS05 THRU LBS10 DS-241172 2011/07/25 2012/04/05 B 7 SMD Bridge Rectifier