LBP01-0810B STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

■ Bidirectional device: LBP01-0810B ■ Unidirectional device: LBP01-0803SC5 ■ RoHS compliant Benefits ■ Keep LED strings on in case of LED open mode failure ■ Reduced maintenance cost ■ Increase lifetime of the lighting system Complies with the following standards: ■ IEC61000-4-2 level 4 – ±15 kV (air discharge) – ±8 kV (contact discharge) ■ IEC 61000-4-5 – ±1kV / 24 A

Applications

This device shunts failed LEDs in applications where LED strings can not be turned-off for safety reason due to a LED failure. Main applications are: ■ Automotive headlights ■ Traffic lights ■ Aircraft runaway lights ■ Emergency lighting systems ■ Display panel backlighting ■ Street lighting Figure 1. Functional diagrams

Description

The LBP01 series are bypass switches to be connected in parallel with 1 or 2 LEDs. In case of LED failure, this allows the current to flow through the other LEDs. It also provides an overvoltage protection against surges defined in IEC 61000-4-2 and IEC 61000-4-5 Their robust dice also protect LEDs against surge. These devices are compatible with LEDs up to 1A . LBP01 are packaged either in SMB or SOT23-5L SMB (DO-214AA) LBP01-0810B SOT23-5L LBP01-0803SC5 Control circuit Control circuit LBP01-0803SC5 LBP01-0810B

1 Characteristics

Table 1. Absolute maximum ratings (T amb = 25 °C) Table 2. Electrical characteristics (T amb = 25 °C)

  1. Measured between pin 1, 3, 4, or 5 and pin 2

2 Ordering information scheme

Figure 4. Ordering information scheme Figure 2. Thermal resistance, junction to Figure 3. Thermal resistance, junction to

3 Package information

  • Epoxy meets UL94, V0
  • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Table 3. SMB dimensions Figure 5. Footprint, dimensions in mm Figure 6. Marking (1)

  1. Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product

4 Recommendations on PCB assembly

4.1 PCB design

  1. To control the solder paste amount, the closed via is recommended instead of open
  2. The position of tracks and open vias in the solder area should be well balanced. The

asymmetrical solder paste amount due to the solder flow away. Figure 9. Printed circuit board layout

4.2 Reflow profile

Figure 10. ST ECOPACK ® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement.

5 Ordering information

6 Revision history

Table 5. Ordering information

  1. The marking can be rotated by 90° to differentiate assembly location.

Table 6. Document revision history 20-Mar-2012 1 Initial release.