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Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ˙ Product information in this catalog is as of October 2013. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be- fore practical application or usage of the Products. Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor- porating such products, which are caused under the conditions other than those specified in this catalog or indi- vidual specification. ˙ Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification is available. ˙ Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. ˙ All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad- vance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma- rine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil- ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. ˙ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu- tors (so called ʠTAIYO YUDENʟs official sales channelʡ). It is only applicable to the products purchased from any of TAIYO YUDENʟ s official sales channel. ˙ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights. ˙ Caution for export Certain items in this catalog may require specific procedures for export according to ʠForeign Exchange and For- eign Trade Control Lawʡ of Japan, ʠU.S. Export Administration Regulationsʡ, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . INDUCTORS /STANDARD INDUCTORS WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) REFLOW i_wound_LBM_e-E02R01 WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) ■PARTS NUMBER *Operating Temp. : -40~+105℃(Including self-generated heat) L B M 2 0 1 6 T 1 0 0 J △ △=Blank space ① ② ③ ④ ⑤ ⑥ ①Series name Code Series name LBM Wound chip inductor for signal line ②Dimensions(L×W) 2016 2.0×1.6 ③Packaging Code Packaging T Taping ④Nominal inductance Code (example) Nominal inductance[μH] R12 0.12 1R0 1.00 100 10 101 100 ※R=Decimal point ⑤Inductance tolerance Code Inductance tolerance J ±5% ⑥Internal code ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY Recommended Land Patterns Surface Mounting ・Mounting and soldering conditions should be checked beforehand. ・Applicable soldering process to these products is reflow soldering only. Type A B C LBM2016 0.6 1.0 1.8 Unit:mm Type L W T e Standard quantity [pcs] Paper tape Embossed tape LBM2016 2.0±0.2 (0.08±0.008) 1.6±0.2 (0.063±0.008) 1.6±0.2 (0.063±0.008) 0.5±0.2 Unit:mm(inch)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . INDUCTORS /STANDARD INDUCTORS ■PARTS NUMBER
- LBM2016 type LBM 2016TR12J RoHS 0.12 ±5% 30 600 0.13 610 25.2 LBM 2016TR15J RoHS 0.15 ±5% 30 550 0.15 570 25.2 LBM 2016TR18J RoHS 0.18 ±5% 30 500 0.15 560 25.2 LBM 2016TR22J RoHS 0.22 ±5% 30 450 0.20 520 25.2 LBM 2016TR27J RoHS 0.27 ±5% 30 425 0.21 510 25.2 LBM 2016TR33J RoHS 0.33 ±5% 30 400 0.21 490 25.2 LBM 2016TR39J RoHS 0.39 ±5% 30 375 0.26 440 25.2 LBM 2016TR47J RoHS 0.47 ±5% 30 350 0.26 430 25.2 LBM 2016TR56J RoHS 0.56 ±5% 30 300 0.29 410 25.2 LBM 2016TR68J RoHS 0.68 ±5% 30 270 0.32 400 25.2 LBM 2016TR82J RoHS 0.82 ±5% 30 250 0.34 390 25.2 LBM 2016T1R0J RoHS 1.0 ±5% 30 220 0.38 385 7.96 LBM 2016T1R2J RoHS 1.2 ±5% 30 180 0.41 370 7.96 LBM 2016T1R5J RoHS 1.5 ±5% 30 135 0.47 350 7.96 LBM 2016T1R8J RoHS 1.8 ±5% 30 100 0.48 345 7.96 LBM 2016T2R2J RoHS 2.2 ±5% 30 75 0.54 340 7.96 LBM 2016T2R7J RoHS 2.7 ±5% 30 55 0.59 310 7.96 LBM 2016T3R3J RoHS 3.3 ±5% 30 48 0.68 290 7.96 LBM 2016T3R9J RoHS 3.9 ±5% 30 43 0.74 275 7.96 LBM 2016T4R7J RoHS 4.7 ±5% 30 40 0.78 270 7.96 LBM 2016T5R6J RoHS 5.6 ±5% 25 36 0.88 255 7.96 LBM 2016T6R8J RoHS 6.8 ±5% 25 33 0.97 240 7.96 LBM 2016T8R2J RoHS 8.2 ±5% 25 30 1.1 225 7.96 LBM 2016T100J RoHS 10 ±5% 25 27 1.2 215 2.52 LBM 2016T120J RoHS 12 ±5% 25 23 1.4 200 2.52 LBM 2016T150J RoHS 15 ±5% 25 20 1.5 190 2.52 LBM 2016T180J RoHS 18 ±5% 25 18 2.5 150 2.52 LBM 2016T220J RoHS 22 ±5% 25 17 2.8 140 2.52 LBM 2016T270J RoHS 27 ±5% 25 16 3.2 130 2.52 LBM 2016T330J RoHS 33 ±5% 25 15 3.6 125 2.52 LBM 2016T390J RoHS 39 ±5% 20 14 3.9 120 2.52 LBM 2016T470J RoHS 47 ±5% 20 13 4.1 115 2.52 LBM 2016T560J RoHS 56 ±5% 20 12 5.9 95 2.52 LBM 2016T680J RoHS 68 ±5% 20 11 7.0 90 2.52 LBM 2016T820J RoHS 82 ±5% 20 10 7.7 85 2.52 LBM 2016T101J RoHS 100 ±5% 15 9.0 8.0 80 0.796 Rated current [mA](max.) Measuring frequency [MHz] Q (min.)Parts number EHS Nominal inductance [μH] Inductance tolerance Self-resonant frequency [MHz](min.) DC Resistance i_wound_LBM_e-E02R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_pack_e-E02R01 WIRE-WOUND CHIP INDUCTORS (LB SERIES), WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES), WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) ■PACKAGING ①Minimum Quantity Type Standard Quantity [pcs] Paper Tape Embossed Tape LB C3225 CB C3225 - 1000 LB 3218 - 2000 LB R2518 LB C2518 L B 2 5 1 8 CB 2518 CB C2518 - 2000 LBM2016 LB C2016 L B 2 0 1 6 CB 2016 CB C2016 - 2000 L B 2 0 1 2 LB C2012 LB R2012 CB 2012 CB C2012 - 3000 CB L2012 4000 - LB 1608 4000 - LBMF1608 CBMF1608 - 3000 ②Tape material
- Embossed tape Top tape Base tape Sprocket hole Chip cavity Chip Chip Filled
- Card board carrier tape Top tape Base tape Sprocket hole Bottom tape Chip cavity Chip Chip Filled
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_pack_e-E02R01 ③Taping Dimensions
- Embossed Tape (0.315 inches wide) Type Chip cavity Insertion pitch Tape thickness A B F T K LBM2016 1.75±0.1 (0.069±0.004) 2.1±0.1 (0.083±0.004) 4.0±0.1 (0.157±0.004) 0.3±0.05 (0.012±0.002) 1.9max. (0.075max.) LB C3225 CB C3225 2.8±0.1 (0.110±0.004) 3.5±0.1 (0.138±0.004) 4.0±0.1 (0.157±0.004) 0.3±0.05 (0.012±0.002) 4.0max. (0.157max.) L B 3 2 1 8 2.1±0.1 (0.083±0.004) 3.5±0.1 (0.138±0.004) 4.0±0.1 (0.157±0.004) 0.3±0.05 (0.012±0.002) 2.2max. (0.087max.) L B 2 5 1 8 CB 2518 LB C2518 CB C2518 LB R2518 2.15±0.1 (0.085±0.004) 2.7±0.1 (0.106±0.004) 4.0±0.1 (0.157±0.004) 0.3±0.05 (0.012±0.002) 2.2max. (0.087max.) L B 2 0 1 6 CB 2016 LB C2016 CB C2016 1.75±0.1 (0.069±0.004) 2.1±0.1 (0.083±0.004) 4.0±0.1 (0.157±0.004) 0.3±0.05 (0.012±0.002) 1.9max. (0.075max.) L B 2 0 1 2 CB 2012 LB C2012 CB C2012 LB R2012 1.45±0.1 (0.057±0.004) 2.25±0.1 (0.089±0.004) 4.0±0.1 (0.157±0.004) 0.25±0.05 (0.010±0.002) 1.45max. (0.057max.) LBMF1608 CBMF1608 1.1±0.1 (0.043±0.004) 1.9±0.1 (0.075±0.004) 4.0±0.1 (0.157±0.004) 0.25±0.05 (0.010±0.002) 1.2max. (0.047max.) Unit:mm(inch)
- Card board carrier tape(0.315 inches wide) Type Chip cavity Insertion pitch Tape thickness A B F T CB L2012 1.55±0.1 (0.061±0.004) 2.3±0.1 (0.091±0.004) 4.0±0.1 (0.157±0.004) 1.1max. (0.043max.) L B 1 6 0 8 1.0±0.1 (0.039±0.004) 1.8±0.1 (0.071±0.004) 4.0±0.1 (0.157±0.004) 1.1max. (0.043max.) Unit:mm(inch)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_pack_e-E02R01 ④Leader and Blank Portion ⑤Reel Size ⑥Top Tape Strength The top tape requires a peel-off force 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_reli_e-E02R01 WIRE-WOUND CHIP INDUCTORS (LB SERIES), WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES), WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) ■RELIABILITY DATA 1.Operating temperature Range Specified Value LB, LBC, LBR, LBMF Series -40~+105℃(Including self-generated heat) CB, CBC, CBL, CBMF Series LBM Series 2. Storage Temperature Range(after soldering) Specified Value LB, LBC, LBR, LBMF Series -40~+85℃ CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks LB, CB Series: Please refer the term of "7. storage conditions" in precautions. 3.Rated Current Specified Value LB, LBC, LBR, LBMF Series Within the specified tolerance CB, CBC, CBL, CBMF Series LBM Series 4.Inductance Specified Value LB, LBC, LBR, LBMF Series Within the specified tolerance CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks LB・LBC・LBR・CB・CBC・CBL・LBMF・CBMF・LBM Series Measuring equipment :LCR Mat er(HP4285A or its equivalent) 5.Q Specified Value LB, LBC, LBR, LBMF Series CB, CBC, CBL, CBMF Series LBM Series Within the specified tolerance Test Methods and Remarks LBM Series Measuring equipment : LCR Mat er(HP4285A or its equivalent) 6.DC Resisitance Specified Value LB, LBC, LBR, LBMF Series Within the specified tolerance CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Measuring equipment : DC Ohmmeter (HIOKI 3227 or its equivalent ) 7.Self-Resonant Frequency Specified Value LB, LBC, LBR, LBMF Series Within the specified tolerance CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Measuring equipment : Impedance analyzer (HP4291A or its equiva lent)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_reli_e-E02R01 8.Temperature Characteristic Specified Value LBM2016 Inductance change : Within±5% LB1608 LB2012 LBR2012 CB2012 Inductance change : Within±20% CBL2012 LB2016 CB2016 LB2518 LBR2518 CB2518 LBC3225 CBC3225 LBMF1608 CBMF1608 LBC2016 CBC2016 Inductance change : Within±25% LBC2518 CBC2518 LB3218 LBC2012 CBC2012 Inductance change : Within±35% Test Methods and Remarks Change of maximum inductance deviation in step 1-5 Step Temperature(℃) LB, CB Series 1 20 2 -40 3 20(Reference temperature) 4 +85(Maximum operating temperature) 5 20 9.Rasistance to Flexure of Substrate Specified Value LB, LBC, LBR, LBMF Series No damage. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Warp : 2mm(LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF Series) Test substrate : Board according to JIS C0051 Thickness : 0.8mm(LB・LBMF・CBMF1608) : 1.0mm(Others) 10.Body Strength Specified Value LB, LBC, LBR, LBMF Series No damage. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Applied force : 10N Duration : 10sec. LB1608・LBMF1608・CBMF1608 Applied force : 5N Duration : 10sec. 11.Adhesion of terminal electrode Specified Value LB, LBC, LBR, LBMF Series No abnormality. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Applied force : 10N to X and Y directions Duration : 5 sec. Test substrate : Printed board LB1608・CBMF1608・LBMF1608 Applied force : 5N to X and Y directions Duration : 5 sec. Test substrate : Printed board
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_reli_e-E02R01 12.Resistance to vibration Specified Value LB, LBC, LBR, LBMF Series Inductance change : Within±10% No significant abnormality in appearance. CB, CBC, CBL, CBMF Series LBM Series Inductance change : Within±5% No significant abnormality in appearance. Test Methods and Remarks LB・LBR・LBC・CB・CBC・CBL・LBM・LBMF・CBMF : According to JIS C5102 clause 8.2. Vibration type : A Directions : 2 hrs each in X, Y and Z directions. Total:6 hrs Frequency range : 10 to 55 to 10 Hz(1min.) Amplitude : 1.5mm Mounting method : Soldering onto printed board Recovery : At least 2 hrs of recovery under the standard condi tion after the test, followed by the measurement within 48 hrs. 13.Drop test Specified Value LB, LBC, LBR, LBMF Series - CB, CBC, CBL, CBMF Series LBM Series 14.Solderability Specified Value LB, LBC, LBR, LBMF Series At least 90% of surface of terminal electrode is covered by new CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Solder temperature : 245±5℃ Duration : 5±0.5sec Flux : Methanol solution with 25% of colophony 15.Resistance to soldering Specified Value LB, LBC, LBR, LBMF Series Inductance change : Within±10% CB, CBC, CBL, CBMF Series LBM Series Inductance change : Within±5% Test Methods and Remarks 3 times of reflow oven at 230℃ MIN for 40sec. with peak tempera ture at 260 ℃ for 5sec. 16.Resisitance to solvent Specified Value LB, LBC, LBR, LBMF Series - CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Solvent temperature : Room temperature Type of solvent : Isopropyl alcohol Cleaning conditions : 90s. Immersion and cleaning. 17.Thermal shock Specified Value LB, LBC, LBR, LBMF Series Inductance change : Within±10% No significant abnormality in appearance. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF:-40~+85℃, maintain times 30min. ,100 cycle Recovery : At least 2 hrs of recovery under the standard condit ion after the test, followed by the measurement within 48 hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_reli_e-E02R01 18.Damp heat life test Specified Value LB, LBC, LBR, LBMF Series Inductance change : Within±10% No significant abnormality in appearance. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Temperature : 60±2℃ Humidity : 90~95%RH Duration : 1000 hrs Recovery : At least 2 hrs of recovery under the standard condi tion after the test, followed by the measurement within 48 hrs. 19.Loading under damp heat life test Specified Value Test Methods and Remarks LB, LBC, LBR, LBMF Series Inductance change : Within±10% No significant abnormality in appearance. CB, CBC, CBL, CBMF Series LBM Series Temperature : 60±2℃ Humidity : 90~95%RH Duration : 1000 hrs Applied current : Rated current Recovery : At least 2 hrs of recovery under the standard condi tion after the test, followed by the measurement within 48 hrs. 20.High temperature life test Specified Value LB, LBC, LBR, LBMF Series - CB, CBC, CBL, CBMF Series Inductance change : Within±10% No significant abnormality in appearance. LBM Series Test Methods and Remarks Temperature : 85±2℃ Duration : 1000 hrs Recovery : At least 2 hrs of recovery under the standard condi tion after the test, followed by the measurement within 48 hrs. 21.Loading at high temperature life test Specified Value LB, LBC, LBR, LBMF Series Inductance change : Within±10% (LBC3225 Series : Within±20%) No significant abnormality in appearance. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Temperature : 85±2℃ Duration : 1000 hrs Applied current : Rated current Recovery : At least 2 hrs of recovery under the standard condi tion after the test, followed by the measurement within 48 hrs. 22.Low temperature life test Specified Value LB, LBC, LBR, LBMF Series Inductance change : Within±10% No significant abnormality in appearance. CB, CBC, CBL, CBMF Series LBM Series Test Methods and Remarks Temperature : -40±2℃ Duration : 1000 hrs Recovery : At least 2 hrs of recovery under the standard condi tion after the test, followed by the measurement within 48 hrs. 23.Standard condition Specified Value LB, LBC, LBR, LBMF Series Standard test conditions Unless specified, Ambient temperature is 20±15℃ and the Relativ e humidity is 65±20%. If there is any doubt about the test results, further measurement shall be had within the following limits: Ambient Temperature: 20±2℃ Relative humidity: 65±5% Inductance value is based on our standard measurement systems. CB, CBC, CBL, CBMF Series LBM Series
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_prec_e-E02R01 WIRE-WOUND CHIP INDUCTORS (LB SERIES), WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES), WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) ■PRECAUTIONS 1.Circuit Design Precautions ◆Operating environment 1. The products described in this specification are intended fo r use in general electronic equi pment, (office supply equipment , telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliabi lity (traffic systems, safety equipment, aerospace systems, nuc lear control systems and medical equipment including life-support sy stems,) where product failure might result in loss of life, inj ury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2.PCB Design Precautions ◆Land pattern design 1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications. Technical considerations PRECAUTIONS 【Recommended Land Patterns】 Surface Mounting ・ Mounting and soldering conditi ons should be checked beforehand. ・ Applicable soldering process to those products is reflow sold ering only. 3.Considerations for automatic placement Precautions ◆Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Technical considerations 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4.Soldering Precautions ◆Reflow soldering( LB and CB Types) 1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended. ◆Recommended conditions for using a soldering iron 1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The solde ring iron should not come in contact with inductor directly. Technical considerations ◆Reflow soldering( LB and CB Types) 1. Reflow profile ◆Recommended conditions for using a soldering iron 1. Components can be damaged by excessive heat where soldering conditions exceed the specified range. 5.Cleaning Precautions ◆Cleaning conditions Washing by supersonic waves shall be avoided. Technical considerations ◆Cleaning conditions If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_prec_e-E02R01 6.Handling Precautions ◆Handling 1. Keep the inductors away from all magnets and magnetic objects. ◆Breakaway PC boards( splitting along perforations) 1. When splitting the PC board after mounting inductors, care s hould be taken not to give any stresses of deflection or twisti ng to the board. 2. Board separation should not be done manually, but by using the appropriate devices. ◆Mechanical considerations 1. Please do not give the inductors any excessive mechanical shocks. Technical considerations ◆Handling 1. There is a case that a characteristic varies with magnetic influence. ◆Breakaway PC boards( splitting along perforations) 1. Planning pattern configurations and the position of products should be carefully performed to minimize stress. ◆Mechanical considerations 1. There is a case to be damaged by a mechanical shock. 7.Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. ・ Recommended conditions Ambient temperature:0~40℃ / Humidity:Below 70% RH The ambient temperature must be kept below 30℃ even under ideal storage conditions, solderabilit y of products electrodes may decrease as time passes. For this reason, LB type:Should be used within 6 months from the time of delivery. Technical considerations ◆Storage 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place.