LBEU5ZZ1WL-857 MURATA | Alldatasheet
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Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. LoRa + Wi-Fi + Bluetooth + GNSS Module Data Sheet Semtech LR1110 Chipset for 802.11 b/g/n (sniff),LoRa, GNSS ST Micro STM32WB55VGY6 Chipset for MCU and BT Design Name: Type1WL Sample Part Number: LBEU5ZZ1WL-857SMP MP Part Number: LBEU5ZZ1WL-857 This Datasheet is preliminary version, and subject to change without notice
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. The revision history of the product specification Revised Date Revision Code Revised Page Revised Item Change Reason 2022/09/20 - - - First release 2022-09-21 A 3,5 Added the weight information. Updated the laser mark information on top side Changed sample par number and EVK part number Update
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. TABLE OF CONTENTS Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 1. SCOPE This specification is applied to Geolocation module for LoRa, Wi-Fi, BT, and GNSS. - Interface : USB/UART/SPI/I2C - Chipset : Semtech LR1110 for LoRa, Wi-Fi, and GNSS STMicro STM32WB55 for MCU and BT - Module Size : 17.50 x 17.00 x 2.15(MAX) mm - Weight : 1130 mg - Structure : Metal case＋PCB (Lead Free Module) - RoHS : This component can meet with RoHS compliance. 2. Part Number Ordering Part Number Description LBEU5ZZ1WL-857-TEMP In case of sample order LBEU5ZZ1WL-857-EVB In case of EVB order LBEU5ZZ1WL-857 Mass Produced Product “Type1WL” is design name of this module. Design name may be used in certification test report. 3. Block Diagram
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 4. Certification Information 4.1. Radio Certification USA/Canada FCC ID IC *Please follow installation manual in Appendix Europe TBD Japan TBD 4.2. Bluetooth® Qualification QDID: T.B.D.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS 5.1. Dimensions A Pin 1 Hole B Murata Logo C Module model name D ES Version E Inspection Number F 2D Code Mark Dimension Mark Dimension Mark Dimension e4 0.80±0.10 T 2.15max Note: The laser mark is temporary.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 5.2. Pin Layout and Descriptions Pin NO. Terminal Name Type Connection to IC terminal Description
1 GND GND - Ground
2 NRST_MCU I STM32: NRST STM32 reset signal, active low
3 I2C_INT1 I/O STM32: PC2 Interrupt for I2C sensor
4 I2C_SCL I/O STM32: PB8 I2C clock
5 I2C_SDA I/O STM32: PB7 I2C data
6 I2C_POWER I/O STM32: PB9 Power for I2C sensor
7 GPIO1 I/O STM32: PD14 General purpose I/O
8 BOOT0 I STM32: PH3-BOOT0 STM32 BOOT0 pin. At start up, BOOT0 pin and BOOT1 option bit are used to select three boot option: Boot from user flash:(BOOT1:x, BOOT0:0) Boot from system memory: (BOOT1:0, Top View
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. BOOT0:1) Boot from embedded SRAM: (BOOT1:1, BOOT0:1)
9 GND GND - Ground
10 ANT_2G4 RF - 2.4GHz antenna(BLE/ Wi-Fi)
11 GND GND - Ground
12 GPIO2 I/O STM32: PD13 General purpose I/O
13 SWDIO I/O STM32: PA13 SWD interface data pin
14 SWCLK I/O STM32: PA14 SWD interface clock pin
15 SWO I/O STM32: PB3 SWD interface debug pin
16 GND GND - Ground
17 GND GND - Ground
18 GND GND - Ground
19 VDD Power - Power supply for MCU and LoRa
20 VDD Power - Power supply for MCU and LoRa
21 GND GND - Ground
22 GPIO3 I/O STM32: PD7 General purpose I/O
23 USB_DP I/O STM32: PA12 USB interface data positive
24 USB_DM I/O STM32: PA11 USB interface data minus
25 SPI_CS I/O STM32: PD2 SPI interface chip select
26 SPI_MOSI I/O STM32: PD4 SPI interface master output slave input
27 SPI_MISO I/O STM32: PD3 SPI interface master input slave output
28 SPI_SCK I/O STM32: PD1 SPI interface clock
29 GPIO4 I/O STM32: PD0 General purpose I/O
30 NC Power - NC
31 GND GND - Ground
32 NC Power - NC
33 GND GND - Ground
34 GND GND - Ground
35 GPIO11 I/O STM32: PC10 General purpose I/O
36 GPIO12 I/O STM32: PA15 General purpose I/O
37 GND GND - Ground
38 USART_RX I/O STM32: PA10 USART of STM32
39 USART_TX I/O STM32: PA9 USART of STM32
40 GPIO13 I/O STM32: PE4 General purpose I/O
41 GPIO14 I/O STM32: PB15 General purpose I/O
42 GND GND - Ground
43 GND GND - Ground
44 ANT_GNSS RF - GNSS antenna
45 GND GND - Ground
46 VBAT_SENSE AI/O STM32: PA1 Measure battery voltage
47 GPIO5 I/O STM32: PC9 General purpose I/O
48 LPUART_CTS I/O STM32: PB13 LPUART of STM32
49 GND GND - Ground
50 GND GND - Ground
51 NRST_LORA I LR1110: NRESET LR1110 reset, active low
52 GND GND - Ground
53 ANT_LORA RF - LoRa antenna
54 GND GND - Ground
55 GPIO6 I/O STM32: PD6 General purpose I/O
56 GPIO7 I/O STM32: PD10 General purpose I/O
57 LPUART_RTS I/O STM32: PB12 LPUART of STM32
58 PWM_CTRL I/O STM32: PB6 Load control
59 GPIO8 I/O STM32: PC4 General purpose I/O
60 GPIO9 I/O STM32: PC5 General purpose I/O
61 LPUART_TX I/O STM32: PB11 LPUART of STM32
62 LPUART_RX I/O STM32: PB10 LPUART of STM32
63 USR_ADC AI/O STM32: PA0 Analog IO
64 GPIO10 I/O STM32: PC11 General purpose I/O
65 I2C_INT2 I/O STM32: PC3 Interrupt for I2C sensor
66 GND GND GND Ground
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 67-102 GND GND - Ground 6. ABSOLUTE MAXIMUM RATINGS Parameter min. typ. max. unit Storage Temperature -40 - 85 deg.C Supply Voltage VDD_3V3 -0.3 3.6 V VDD_GNSS -0.3 4.3 V VDD_GNSS_BU -0.3 4.3 V 7. OPERATING CONDITION Parameter min. typ. max. unit Operating Temperature -30 - 85 deg.C Supply Voltage VDD_3V3 3.0 3.3 V VDD_GNSS 2.8 4.3 V VDD_GNSS_BU 2.0 4.3 V
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 8. RF Characteristics 8.1. RF Characteristics for Sub-GHz Sub-GHz Bands Receiver Specifications Symbol Description Conditions Min Typ. Max Unit FRRXLF RX input frequency Sub-GHz frequency range, LoRa and FSK 863 - 928 MHz RXS2F3 Sensitivity 2-FSK BRF = 4.8 kb/s, FDA = 5 kHz, BWF = 20 kHz - TBD - dBm RXS2F3HP3 Sensitivity 2-FSK, RxBoosted = 1 BRF = 4.8 kb/s, FDA = 5 kHz, BWF = 20 kHz - TBD - dBm RXSL3 RXSL4 RXSL5 RXSL6 RXSL7 RXSL8 Sensitivity LoRa® RxBoosted = 0 BWL = 125 kHz, SF = 7 BWL = 125 kHz, SF = 12 BWL = 250 kHz, SF = 7 BWL = 250 kHz, SF = 12 BWL = 500 kHz, SF = 7 BWL = 500 kHz, SF = 12 TBD TBD TBD TBD TBD TBD dBm RXSL3HP7 RXSL4HP7 RXSL5HP7 RXSL6HP7 RXSL7HP7 RXSL8HP7 Sensitivity LoRa®, RxBoosted = 1 BWL = 125 kHz, SF = 7 BWL = 125 kHz, SF = 12 BWL = 250 kHz, SF = 7 BWL = 250 kHz, SF = 12 BWL = 500 kHz, SF = 7 BWL = 500 kHz, SF = 12 TBD -140 TBD TBD TBD TBD dBm IDDR_F Supply current in receiver FSK mode RxBoost OFF RxBoost ON TBD TBD mA IDDR_L Supply current in receiver LoRa mode, RxBoost off BW = 125 kHz BW = 250 kHz BW = 500 kHz TBD TBD TBD mA
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. Sub-GHz Path Transmitter Specifications Symbol Description Conditions Min Typ. Max Unit TXOPLP TXOPHP Maximum TX power LP PA HP PA +13.5 +21 dBm dBm ΔRF_ OPH_V RF output power stability versus voltage supply VDD = 3.0 V to 3.3 V LP PA operating HP PA, operating TBD TBD - dB ΔRF_T RF output power stability versus temperature From T = -40 °C to +85 °C LP PA operating HP PA, operating TBD TBD - dB TXPRNGLF TX power range Programmable in steps of -1dB from maximum TX power - 31 - steps IDDT_L Supply current in LoRa transmitter mode with impedance matching LP PA setting = 14 dBm HP PA, setting = 22 dBm TBD TBD - mA 8.2. RF Characteristics for Wi-Fi Passive Scanner Conditions : 25deg.C, Items Description Conditions Min Typ. Max Unit FRRXWF RX input frequency Wi-Fi channels 2412 - 2484 MHz IDDRXWI-FI Supply Current in Wi-Fi scan mode Preambles detect phase Capture phase Processing phase TBD TBD TBD mA RXSWFB1 Wi-Fi sensitivity for Wi-Fi 802.11 b, DSSS DBPSK, DR = 1Mb/s -92 dBm RXSWFG1 Wi-Fi sensitivity for Wi-Fi 802.11 g, OFDM, 20MHz channel spacing BPSK, CR = 1/2, DR = 6 Mb/s TBD dBm RXSWFN1 Wi-Fi sensitivity for Wi-Fi 802.11 n, OFDM, 20MHz channel spacing, short guard interval BPSK, CR = 1/2, DR = 7.2 Mb/s TBD dBm
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 8.3. RF Characteristics for BLE RF characteristics are given at 1 Mbps, unless otherwise specified. Normal conditions : 25 deg.C, VDD= 3.3V Items Contents Bluetooth specification (power class) Version 5.0 (LE) Channel frequency (spacing) 2402 to 2480 MHz (2MHz) Number of RF Channel 40 Item / Condition Min. Typ. Max. Unit Center Frequency 2402 - 2480 MHz Channel Spacing - 2 - MHz Number of RF channel - 40 - - Maximum output power 0 dBm output power Minimum output power 5.0 dBm dBm dBm Modulation Characteristics 1) Δf1avg 225 - 275 kHz 2) Δf2max (at 99.9%) 185 - - kHz 3) Δf2avg / Δf1avg 0.8 - - - Carrier frequency offset and drift 1) Frequency offset -150 - 150 kHz 2) Frequency drift - - 50 kHz 3) Drift rate - - 20 kHz Receiver sensitivity (PER < 30.8%) - -92 - dBm Maximum input signal level (PER < 30.8%) - TBD - dBm PER Report Integrity (-30dBm input) 50 - 65.4 % RF BLE current consumption Symbol Parameter Typ. Unit Itxmax TX maximum output power consumption TBD mA Itx0dbm TX 0 dBm output power consumption TBD Irxlo Rx consumption TBD
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 8.4. RF Characteristics for GNSS LR1110 GNSS Scanner Receiver Specifications Symbol Description Conditions Min Typ. Max Unit IDDRXGPS1 IDDRXGPS2 Supply current in GNSS scan mode Capture phase Processing phase TBD TBD mA mA FRRXGPS RX input frequency GPS BeiDou 1.57542 1.5611 - GHz RXSGPS1E RXSGPS2E RXSBEI1E RXSBEI2E GNSS sensitivity GPS, indoor classification, and strong signal SV capture GPS, weak signal SV capture BeiDou, strong signal SV capture BeiDou, weak signal SV capture TBD TBD TBD TBD dBm dBm dBm dBm
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 9. LAND PATTERN (TOP VIEW)
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 10. REFERENCE CIRCUIT NC R5 0R NC ANT_GNSS R3 0RANT_2G4 NC NC SWCLK SWDIO CON1 CON4 100k Ty pe1WL Module GND nRST_MCU I2C_SCL I2C_SDA I2C_INT1 I2C_POWER GPIO1 BOOT0 GND ANT_2G4 GND GPIO2 SWCLK SWDIO SWO GND GND GND P3V3 P3V3 GND GPIO3 USB_DP USB_DM SPI_CS SPI_SCK SPI_MISO SPI_MOSI GPIO4 NC GND NC GND GND GPIO11 GPIO12 GND USART_RX USART_TX GPIO13 GPIO14 GND GND ANT_GNSS GND VBAT_SENSE GPIO5 LPUART_CTS GND GND nRST_LoRa GND ANT_LoRa GND GPIO6 GPIO7 LPUART_RTS GPIO8 PWM_Ctrl GPIO9 LPUART_TX LPUART_RX GPIO10 USR_ADC GND I2C_INT2 epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad epad 100 epad 101 epad 102 4.7uF 0.1uF nReset_ST USB_DP USB_DM COMMAND_UART_TX COMMAND_UART_RX VDD33 100k VDD33 NC R4 0R NC ANT_LORA SWDIO SWCLK
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 11. TAPE AND REEL PACKING 11.1. Dimension of Tape 11.2. Dimensions of Reel (unit: mm)
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 11.3. Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62μMin thickness [4] Base tape : As specified in (1) 11.4. Leader and Tail Tape Feeding Hole Chip Feeding Direction [2] [3] [4] [3] [1]
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. - The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. - The cover tape and base tape are not adhered at no components area for 250mm Min. - Tear off strength against pulling of cover tape: 5N Min. - Packaging unit : 800 pcs/ reel - Material Base tape : Plastic Reel : Plastic Cover tape, cavity tape and reel are made the anti-static processing. - Peeling of force: 1.3N max. in the direction of peeling as shown below. - Packaging (Humidity proof Packing) Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 0.7 N max. Base tape Cover tape 1.3 N max.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 12. NOTICE 12.1. Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanic al shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 12.2. Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 12.3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifica tions for the standard land dimensions.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 12.4. Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 12.5. Soldering Conditions: The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 2 60 °C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions(Example) Within 120s Pre- heating time(s) 220 deg.C Within 60s Cooling down Slowly 180 deg.C 150 deg.C 235 to 245 deg.C Within 3s
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 12.6. Cleaning: Since this Product is Moisture Sensitive, any cleaning is not permitted. 12.7. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 12.8. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. 13. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS , DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. -Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse -engineering, remodeling altering, and reproducing our product. Our product cannot be used for the prod uct which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third -party products or services does not constitute a license from us to use such produ cts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from u s under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", t he "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval she et, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days fr om receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defect s due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the insta llation or integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales.
Preliminary Specification Number : SP-ZZ1WL-857 Preliminary & Confidential < Specification may be changed by Murata without notice > Murata(China) Investment Co., Ltd. Appendix