LBCA2HNZYZ-TEMP MURATA | Alldatasheet
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Preliminary Specification Number : SP-HNZY-J Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Bluetooth Low Energy Module Data Sheet Dialog Semiconductor Chipset for Bluetooth 4.1 Tentative P/N : LBCA2HNZYZ-TEMP
Preliminary Specification Number : SP-HNZY-J P1/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
Revision History
Oct.24.2013 First issue A Feb.13.2014 4. Dimensions and Terminal Configurations Added Dimensions of m6 and m7 5. Revised Absolute Maximum Ratings 6. Revised Operating Condition 10. Revised RF Characteristics 12. Recommended Land Pattern Corrected to Top view B Mar.20.2014 11. packing Information Added the figure of Tape and Reel C Apr.23.2014 1. Revised Scope Added the weight 5.Revised Absolute Maximum Ratings 8.Revised Sleep Clock for 32kHz Crystal 10.Revised RF Characteristics 13.Revised Application Circuit D Apr.29.2014 11.Revised Packing Information E Jun.04.2014 5.Revised Absolute Maximum Ratings Operating Conditions 10.Revised RF Characteristics F Jul.02.2014 4.Revised Dimensions and Terminal Configurations 10.Revised RF Characteristics 13.Revised Application Circuit G Nov.6.2014 1.Scope 2.Part Number 3.RoHS Compliance Dimensions and Terminal Configurations 6. Absolute Maximum Ratings 7.Operating Conditions Sleep Clock: Recommended Operating Conditions 14.Application Circuit 15,Other Attentions 16.Wireless / BT Certification Numbers H Feb.12.2014 14. Application Circuit I Feb.23.2015 16. Wireless / BT Certification Numbe rs J Feb.27.2015 14. Application Circuit
Preliminary Specification Number : SP-HNZY-J P2/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. TABLE OF CONTENTS Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
Preliminary Specification Number : SP-HNZY-J P3/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 1. Scope This specification is applied to the Bluetooth low energy module. - Interface : GPIO(supporting UART / SPI / I2C ) - IC : DA14580-01 (Dialog Semiconductor) - Reference Clock : Internal Crystal. - Weight : 0.107g - MSL : 3 2. Part Number 3. RoHS Compliance This component can meet with RoHS compliance. 4. Block Diagram Sample LBCA2HNZYZ-TEMP Design Kit LBCA2HNZYZ-TEMP-DK Daughter Board LBCA2HNZYZ-TEMP-D-MU Power Source Antenna X’tal (16MHz) External X’tal / TCXO (32.768kHz) LC Network for DCDC UART /SPI/I2C GPIO/ADC Quadrature Decoder BLE IC
Preliminary Specification Number : SP-HNZY-J P4/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 5. Dimensions and Terminal Configurations <Top View> <Side View> <Bottom View> (unit: mm) Dimension Mark Dimensions Mark Dimensions Mark Dimensions Mark Dimensions Pin 1 Marking
Preliminary Specification Number : SP-HNZY-J P5/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Terminal Configurations <Bottom View> 1234567 26 21 20 30 29 32 33 19 18 17 16 15 14 No. Terminal Name Connection to IC Terminal Description 1 P0_5 P0_5 INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down.
2 P0_7 P0_7
3 P0_6 P0_6
4 SWCLK SWCLK INPUT JTAG clock signal
5 SWDIO SWDIO INPUT/OUTPUT. JTAG Data input/output. Bidirectional data and control communication
6 GND GND Ground
7 VBAT VBAT INPUT Battery connection.
8 GND GND Ground
9 XTAL32KP XTAL32KP INPUT. Crystal input for the 32.768 kHz XTAL 10 XTAL32KM XTAL32KM OUTPUT. Crystal output for the 32.768 kHz XTAL 11 P0_3 P0_3 INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. 12 P0_2 P0_2 13 ANTout - RF input/output. Refer to reference schematic 14 ANTin -
15 GND GND
17 GND GND
18 GND GND
Preliminary Specification Number : SP-HNZY-J P6/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. No. Terminal Name Connection to IC Terminal Description
19 NC - No connection
20 GND GND Ground
21 GND GND
22 P0_1 P0_1 INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down.
23 P0_0 P0_0
24 P0_4 P0_4
25 RST RST INPUT. Reset signal (Active High, Internally Pulled Down). It can be open or connected to GND if not used.
26 GND GND
28 GND GND
29 GND GND
30 P1_1 P1_1
INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. 31 VPP VPP INPUT. This pin is used while OTP programming. Should be left open when not programming.
32 GND GND
34 GND GND
35 P1_0 P1_0
INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down.
36 NC No Connection
37 NC No Connection
Preliminary Specification Number : SP-HNZY-J P7/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 6. Absolute Maximum Ratings Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 7. Recommend Operating Condition Item Min Typ Max Unit Remarks Operating Temperature *1 -40 85 degC VBAT supply voltage 2.35 3.3 V VBAT supply voltage for cold boot 2.5 3.3 V VPP supply voltage 6.6 6.7 6.8 V Supply only during OTP programming. Input voltage for all other pins 0 Min(3.3,VBAT+0.2) V RF Load Impedance 50 Ω Output current for Each I/O pin 4.8 mA *1: Please keep derating / margin as much as poss ible at extreme temperature. Item Min Max Unit Remarks Storage Temperature -40 85 degC VBAT supply voltage -0.1 3.6 V VPP supply voltage -0.1 6.8 V Supply only during OTP programming Input voltage for XTAL32KM -0.2 Min(1.2,VBAT+0.2) V Input voltage for XTAL32KP -0.2 Min(1.5,VBAT+0.2) V Input voltage for all other pins -0.1 Min(3.6,VBAT+0.2) V
Preliminary Specification Number : SP-HNZY-J P8/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 8. DC Characteristics Parameters Description Conditions Min Typ Max Unit VIH HIGH level input voltage Active mode 0.84 V VIL LOW level input voltage Active mode 0.36 V VOH HIGH level output voltage Active mode 1.88 V VOL LOW level output voltage Active mode 0.47 V IIH (PD) HIGH level input current with internal pull down enabled Vin = VBAT = 2.5V 50 150 uA IIL (PU) LOW level input current with internal pull up enabled Vin = GND = 0V -150 -50 uA 9. Sleep Clock: Recommended Operating Conditions For 32kHz Crystal Parameters Description Conditions Min Typ Max Unit fXTAL Crystal frequency 32.768 kHz ESR Equivalent Series Resistance 100 kohm CL Load Capacitance 6 7 9 pF C0 Shunt Capacitance 1 2 pF df XTAL Crystal frequency tolerance -250 250 ppm DLmax Maximum drive level 0.1 uW For 32kHz Crystal Oscillator Parameters Description Conditions Min Typ Max Unit fXO Oscillator frequency 32.768 kHz AXO Amplitude 100 1500 mVpp df XO Frequency tolerance -250 250 ppm
Preliminary Specification Number : SP-HNZY-J P9/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 10. Power Sequence Power Up / Down Sequence V B A T GPIO Ta Tb H L H L Power Up Power Down Td Reset and Power Cycle Sequence Symbol Description Typ Unit Ta Time between VCC valid and GPIO enabled Ta > 500 us Tb Time between GPIO invalid and VCC invalid Tb > 0 us Tc Length of RST pulse Tc > 10 us Td Required VBAT ramp-up time Td < 50 ms V1 Threshold voltage of VBAT rise up V1 > 2.35 V
Preliminary Specification Number : SP-HNZY-J P10/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 11. RF Characteristics Normal Condition: VBAT=3.0V, +25deg.C, (otherwise notified) Item / Conditions Spec. Unit MIN TYP MAX Center frequency 2402 - 2480 MHz Channel Spacing - 2 - MHz Number of RF Channels - 40 - - Output power (Measured at ANT pin) - -1 - dBm Modulation characteristics 1) ∆f1 avg 225 - 275 kHz 2) ∆f2 max (at 99.9%) 185 - - kHz 3) ∆f2 avg / ∆f1 avg 0.8 - - - Carrier frequency offset and drift 1) Frequency offset: | f n – f TX | - - 150 kHz 2) Frequency drift: | f 0 – f n | - - 50 kHz 3) Drift rate #0: | f 1 – f 0 | - - 20 kHz 4) Drift rate #n: | f n – f n-5 | - - 20 kHz Receiver sensitivity (Ideal transmitter PER <= 30.8%) - -93 -70 dBm Maximum input signal level (PER <= 30.8%) -10 - - d Bm PER Report Integrity (-30dBm input) 50 - 65.4 % TX Current consumption - 4.8 - mA RX Current consumption - 5.1 - mA
Preliminary Specification Number : SP-HNZY-J P11/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 12. Packing Information (1) Dimensions of Tape (Plastic tape) Φ 1 .5 ± 0 . 1 Φ 1 .5 4 .0 ± 0 .1 2 .0 ± 0 . 1 1 2 .0 ± 0 .1 7.8± 0.1 7.5 ± 0.1 1.75 ± 0.1 16.0± 0.2 7 .5 ± 0 .1 1 .4 ma x . + 0 . 1 0 .3 0 ± 0 . 0 5 (2) Dimensions of Reel 22.4 max (φ 100) (in mm) φ 13.0±0.2 2.0±0.5 17.4 ± 1.0 330) (φ
Preliminary Specification Number : SP-HNZY-J P12/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. (3) Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62 um in thickness [4] Base tape : As specified in (1) (4) Leader and Tail tape Feeding Hole Chip Feeding Direction Pin 1 Marking Tail tape (No components) 40 to 200mm Components No components 150mm min. Leader tape (Cover tape alone) 250mm min. Feeding direction
Preliminary Specification Number : SP-HNZY-J P13/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. (5) The tape for chips are wound clockwise, the fe eding holes to the right side as the tape is pulled toward the user. (6) The cover tape and base tape are not adhered a t no components area for 250 mm min. (7) Tear off strength against pulling of cover tap e : 5 N min. (8) Packaging unit : 1000 pcs./ reel (9) material : Base tape : Plastic Reel : Plastic Cover tape , cavity tape and reel are made the anti-static processing. (10) Peeling of force : 1.3 N max. in the directio n of peeling as shown below. (11) PACKAGE (Humidity proof Packing) Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 1.3 N max. Base tape Cover tape 湿度 インジケ－タ 乾燥 剤 表示 ラべル 防湿 梱包 袋 表示 ラベルLabel Label Desiccant Humidity Indicator Anti-humidity Plastic Bag
Preliminary Specification Number : SP-HNZY-J P14/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 13. Recommended Land Pattern <Top View> (Unit : mm)
Preliminary Specification Number : SP-HNZY-J P15/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 14. Application Circuit (1) Configuration using internal OTP P0_2 P0_3 P1_0 P1_1 VBAT XTAL32KM XTAL32KP No load No load RST P0_4 P0_0 P0_1 P0_6 P0_7 P0_5 0 ohm Test Pads for OTP writing via UART Test Pads for OTP Writing and Software Debugging via J-Link GND 8 VBAT 7 GND 6 SWDIO 5 SWCLK 4 P0_6 3 P0_7 2 P0_5 1 P0_3 11 P0_2 12 ANTout 13 ANTin 14 GND 15 GND 16 GND 17 NC 19 GND 18 GND 20 GND 21 P0_1 22 P0_0 23 P0_4 24 RST 25 GND 26 GND 27 GND 28 GND 29 P1_1 30 VPP 31 GND 32 GND 33 GND 34 P1_0 35 NC 36 NC 37 XTAL32KM 10 XTAL32KP 9 typeZY P0_4 GND P0_5 P0_7 RST VPP UART_TX UART_RX VPP_CONTROL RST VPP 2.2uF VPP VPP XTAL X1 XTAL32KM XTAL32KP Use External XTAL 32kHz_CLK Option XTAL32KM XTAL32KP 32K_CLK NC Use External OSC RST VBAT GND RST SWCLK SWDIO VPP VPP *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) Connection is necessary for writing program to the OTP via UART. Other GPIO pin can be used for VPP_CONTROL instead of P0_7. Please see the document "Hardware setup Guide for OTP Programming". Other pairs of GPIO can be used for UART instead of P0_4 and P0_5. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. OTP writing can also be done using J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. *4) 10 GPIOs (P0_0 to P0_7, P1_0 and P1_1) are available for multipurpose use. P0_0 to P0_3 can be used for analog input. Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer’s responsibility. *1) *2) *3) *4)
Preliminary Specification Number : SP-HNZY-J P16/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. (2) Configuration using external Flash ROM P1_0 P1_1 VBAT No load No load RST P0_4 P0_1 0 ohm VBAT SWDIO SWCLK RST GND RST Test Pads for Software Debugging via J-Link GND 8 VBAT 7 GND 6 SWDIO 5 SWCLK 4 P0_6 3 P0_7 2 P0_5 1 P0_3 11 P0_2 12 ANTout 13 ANTin 14 GND 15 GND 16 GND 17 NC 19 GND 18 GND 20 GND 21 P0_1 22 P0_0 23 P0_4 24 RST 25 GND 26 GND 27 GND 28 GND 29 P1_1 30 VPP 31 GND 32 GND 33 GND 34 P1_0 35 NC 36 NC 37 XTAL32KM 10 XTAL32KP 9 typeZY 2.2uF SPI Flash ROM for Software Storing VBAT DI CLK #HOLD VCC #CS DO #WP GND SPI FLASH P0_2 XTAL32KM XTAL32KP P0_7 XTAL X1 XTAL32KM XTAL32KP Use External XTAL 32kHz_CLK Option XTAL32KM XTAL32KP 32K_CLK NC Use External OSC *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) 6 GPIOs (P0_1, P0_2, P0_4, P0_7, P1_0 and P1_1) are available for multipurpose use. P0_1 and P0_2 can be used for analog input. Please do NOT toggle those pins by external devices during starting up. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer’s responsibility. *1) *2) *3)
Preliminary Specification Number : SP-HNZY-J P17/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. (3) Configuration using external I2C EEPROM *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) 8 GPIOs (P0_0, P0_1, P0_4 to P0_7, P1_0 and P1_1) are available for multipurpose use. P0_0 and P0_1 can be used for analog input. Please do NOT toggle those pins by external devices during starting up. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer’s responsibility. *1) *2) *3)
Preliminary Specification Number : SP-HNZY-J P18/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 15. Other Attentions This product is not confirmed connectivity to all Bluetooth(R) Smart Ready devices, so the connectivity to all devices in actual use is not guaranteed. Also the Bluetooth(R) Low Energy wireless technology sometimes fails connections depending on surrounding environment (radio interference, noise, disturbance etc.), so it is highly recommended to implement connection-retry scheme in the customer’s application software. When starting design the device, please refer to following application notes provided by Murata. Hardware Setup Guide for OTP Programming - Hardware Setup Guide for Software Debugging - Overview of OTP Header Structure - Overview of DA1458X Initial Boot Sequence and Av ailable Interface Pins. - TypeZY/ZS What should you do for Wireless Certif ication? - TypeZY/ZS Antenna Performance Layout Guide 16. Wireless / BT Certification Numbers This product is certified by following regulation bodies. - Japanese Radio Law （日本電波法 ） Type certification （工事設計認証） R001-P00500 - FCC (United States) FCC Part 15 subpart C Limited Modular Approval FCC ID: VPYLBZY - IC (Canada) RSS-210 Limited Modular Approval IC: 772C-LBZY - CE (Europe) EN 300328 V1.8.1 Conducted Test Report available Note: CE marking and declaration should be done by customer as a final product. - Bluetooth(R) SIG Qualifications QDID: 56016 (Controller Subsystem by Murata) Design Name: Bluemodule Type93 QDID: 52696 (Host Subsystem by Dialog) Design Name: DA14580 - HOST - Updated QDID: 56907 (Profile Subsystem by Dialog) Design Name: DA14580 - Profiles Note: Profile subsystem QDID is needed only if SIG standard profile is used
Preliminary Specification Number : SP-HNZY-J P19/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. NOTICE 1.Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1ti me The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 2.Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 3.Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4.Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.
Preliminary Specification Number : SP-HNZY-J P20/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 5.Soldering Conditions: The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 ° C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 ° C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions Reflow soldering standard conditions(Example) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 6.Cleaning: Since this Product is Moisture Sensitive, any cleaning is not permitted. 7.Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. Within 120s Pre-heating time(s) 220 deg.C Within 60s Cooling down Slowly 180 deg.C 150 deg.C 240to 250 deg.C Within 3s
Preliminary Specification Number : SP-HNZY-J P21/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 8.Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range.
Preliminary Specification Number : SP-HNZY-J P22/22 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluat ed and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specif ication/datasheet/catalog have been prescribed on t he premise that our product is used for the purpose, under the cond ition and in the environment specified in this spec ification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the sp ecifications provided herein. Accordingly, we shall not be respo nsible for any defects in products or equipment inc orporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNES S FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application li sted below which requires especially high reliabili ty for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we wi ll not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US A ND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipmen t. -Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and repr oducing our product. Our product cannot be used for the produc t which is prohibited from being manufactured, used , and sold by the regulations and laws in the world. We do not warrant or represent that any license, ei ther express or implied, is granted under any our p atent right, copyright, mask work right, or our other intellectu al property right relating to any combination, mach ine, or process in which our products or services are used. Informatio n provided by us regarding third-party products or services does not constitute a license from us to use such products o r services or a warranty or endorsement thereof. Us e of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange an d foreign trade law", the "U.S. export administrati on regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet , you acknowledge that you are the legal representa tive for your company and that you understand and accept the vali dity of the contents herein. When you are not able to return the signed version of specification sheet or approval s heet within 30 days from receiving date of specific ation sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate f rom specifications and may contain defects due to t heir development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales.