LBCA1HN2TY-954

LBCA1HN2TY-954 MURATA | Alldatasheet

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Technical content

Renesas DA14531 Chipset for Bluetooth 5.1 - Rev. E ▪ Design Name: Type 2TY ▪ P/N: LBCA1HN2TY-954

Murata Type 2TY is a Bluetooth Low Energy module. This datasheet describes the specification of the module in detail. Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Audience & Purpose This document is intended audience includes any customer looking to integrate this module into their product. In particular, RF, hardware, software, and systems engineers. Document Conventions Table 1 describes the document conventions. Table 1: Document Conventions Conventions Description Warning Note Indicates very important note. Users are strongly recommended to review. Info Note Intended for informational purposes. Users should review. Menu Reference Indicates menu navigation instructions. Example: Insert➔Tables➔Quick Tables➔Save Selection to Gallery External Hyperlink This symbol indicates a hyperlink to an external document or website. Example: Murata Click on the text to open the external link. Internal Hyperlink This symbol indicates a hyperlink within the document. Example: Scope Click on the text to open the link. Console input/output or code snippet Console I/O or Code Snippet This text Style denotes console input/output or a code snippet. # Console I/O comment // Code snippet comment Console I/O or Code Snippet Comment This text Style denotes a console input/output or code snippet comment.

• Console I/O comment (preceded by “#”) is for informational purposes only and does not denote actual console input/output.
• Code Snippet comment (preceded by “//”) may exist in the original code.

1 Scope

This specification is applied to the Bluetooth low energy module. Interface: GPIO (supporting UART / SPI / I2C / ADC) IC P/N: DA14531-FCGQFN24 (Renesas) Reference Clock: Internal Crystal Weight: 0.09 g MSL: Level 3 RoHS : This component can meet with RoHS compliance.

2 Part Number

Table 2 describes the ordering part numbers. Table 2: Ordering Information Ordering Part Number Description LBCA1HN2TY-954 Module order LBCA1HN2TY-SMP In case of sample order LBCA1HN2TY-EVB1 Evaluation Board (EVB) “Type 2TY” is the design name of this module. Design name may be used in certification test report.

3 Block Diagram

Figure 1 shows the block diagram.

Figure 1: Block Diagram

4 Reference

1. Dialog semiconductor, DA14531 Datasheet, v3.6, 2022

5 Certification Information

This section has certification information.

5.1 Radio Certification

This product is certified for the following regulations.

• TELEC (日本電波法)
• Type certification （工事設計認証） R001-P01775
• FCC (United States) FCC Part 15 subpart C
• Limited Modular Approval FCC ID: VPYLBCA2HN2AY
• IC (Canada) RSS-247 GPIO UART SPI I2C LC Network for DCDC ANT Ref Clock (32 MHz) Type 2TY Bluetooth Low Energy Tx/Rx VBAT Matching External X’tal (32.768 kHz) (Optional) DA14531

• Limited Modular Approval IC: 772C-LBCA2HN2AY
• CE (Europe)EN 300 328 V2.2.2
• Conducted Test Report available CE marking and declaration should be done by customer as a final product.

5.2 Radio Regulatory Certification by Country

Murata have prepared the document about Radio Regulatory Certification separately. This document is designed to ensure that module manufacturers correctly communicate the necessary information to host manufacturers that incorporate their modules. Refer to Type 2TY Radio Law Approval Application Note If you don’t follow the rule written in Type 2TY Radio Law Approval Application Note, there is a risk of conflict Radio Law Certification. Please be sure to check the documents.

5.3 Bluetooth® Qualification

• Bluetooth® SIG Qualifications Please refer to the following QDID.
• QDID: 113959 (Controller Subsystem by Dialog Semiconductor (Renesas))  Design Name: DA14531 - Controller Profile subsystem QDID is needed only if SIG standard profile is used.

6 Dimensions, Marking, and Terminal Configurations

Figure 2 shows the dimensions, markings, and terminal configurations.

Figure 3: Structure Pin Layout Figure 4 shows the pin layout. Figure 4: Pin Layout Table 5 lists the pin names. Table 5: Pins No. Terminal Name No. Terminal Name No. Terminal Name No. Terminal Name

1 NC 10 P0_9 19 GND 28 GND

2 VBAT 11 P0_8 20 GND 29 GND

3 GND 12 GND 21 P0_6 30 GND

4 P0_1 13 NC 22 P0_5 31 GND

5 P0_2 14 NC 23 P0_11 32 NC

6 P0_3 15 GND 24 P0_10 33 NC

X’tal Antenna <Top View>

No. Terminal Name No. Terminal Name No. Terminal Name No. Terminal Name

7 P0_4 16 GND 25 P0_0

8 GND 17 GND 26 GND

9 P0_7 18 GND 27 GND

Table 6 describes the pins. Table 6: Pin Descriptions No. Terminal Name Connection to IC Pin Name Type Reset State

Description

1 NC No Connection. (Internal use)

2 VBAT VBAT_HIGH Power Power supply

3 GND GND GND Ground

4 P0_1 P0_1 DIO (Type B) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. ADC0 AI INPUT. Analog to Digital Converter input 0.

5 P0_2 P0_2 DIO (Type B) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. ADC1 AI INPUT. Analog to Digital Converter input 1. SWCLK DIO INPUT JTAG clock signal (by default).

6 P0_3 P0_3 DIO (Type B) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. Check GP_DATA_REG[P03_P04_FILT_DIS] for correct pad filter settings. XTAL32kp AI INPUT. Analog input of the XTAL32K crystal oscillator DI INPUT. Digital input for an external clock (square wave).

7 P0_4 P0_4 DIO (Type B) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. XTAL32km AO OUTPUT. Analog output of the XTAL32K crystal oscillator.

8 GND GND Ground

9 P0_7 P0_7 DIO (Type A) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. ADC3 AI INPUT. Analog to Digital Converter input 3.

10 P0_9 P0_9 DIO (Type A) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset.

No. Terminal Name Connection to IC Pin Name Type Reset State General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.

11 P0_8 P0_8 DIO (Type A) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.

12 GND GND Ground

13 NC Connect to the GND on the customer board. 14 NC Connect to the GND on the customer board.

15 GND GND Ground

16 GND GND

17 GND GND

18 GND GND

19 GND GND

20 GND GND - -

21 P0_6 P0_6 DIO (Type A) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. ADC2 AI INPUT. Analog to Digital Converter input 2.

22 P0_5 P0_5 DIO (Type B) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.

23 P0_11 P0_11 DIO (Type A) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down.

24 P0_10 P0_10 DIO (Type A) I-PD INPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. SWDIO DIO INPUT/OUTPUT. JTAG Data input/output. Bidirectional data and control communication (by default).

25 P0_0 P0_0 DIO (Type B) I-PD NPUT/OUTPUT with selectable pull up/down

resistors. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contains state retention mechanism during power down. RST DIO (Type B) RST active high hardware reset (default).

26 GND GND Ground

27 GND GND

28 GND GND

29 GND GND

30 GND GND

No. Terminal Name Connection to IC Pin Name Type Reset State

31 GND GND

32 NC No connection

For differences between Type A and Type B GPIO pads, please refer to Dialog semiconductor, DA14531 Datasheet - “Types of GPIO Pads”.

7 Ratings

Table 7 describes the ratings. Table 7: Rating Parameter Minimum Maximum Unit Storage Temperature -40 +85 °C VBAT Supply Voltage -0.2 3.6 V Input voltage for all other pins -0.2 3.6 V Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition.

8 Operating Conditions

Table 8 describes the operating conditions. Table 8: Operating Conditions Parameter Minimum Typical Maximum Unit Operating Temperature Range1 -40 +85 °C Supply Voltage VBAT2 1.8 3.0 3.3 V VBAT for OTP programming3 2.25 3.3 V VBAT for OTP reading 1.8 3.3 V Input voltage for all other pins -0.2 VBAT + 0.2 V RF Load Impedance 50 Ω Peak current VBAT 10 mA 1 Please keep derating / margin as much as possible at extreme temperature. 2 Type 2TY works only in Buck mode.

3 Required temperature for programming is between -20°C and 70°C

9 Power Up Sequence

Figure 5 shows the power up sequence. Figure 5: Power Up Sequence Figure 6 shows the reset and power cycle sequence. Figure 6: Reset and Power Cycle Sequence Table 9 describes the power sequence parameters. Table 9: Power Sequence Parameters Symbol Description Typical Unit Ta Time between VBAT valid and GPIO enabled Ta > 2.5 ms Tb Length of RST pulse Tb > 15 µs V1 Threshold voltage of VBAT V1 ≥ 1.8 V VBAT GPIO Ta H L H L VBAT P0_0 H H L Tb

10 Digital I/O Requirements

Table 10 describes the digital I/O requirements. Table 10: Digital I/O Requirements Description Conditions Symbol Minimum Typical Maximum Unit Input low voltage VDD = 0.9 V (Active mode) VDD = 0.75 V (Deep or Extended Sleep mode)4 VIL 0.3 × VDD V Input high voltage VIH 0.7 × VDD V Output low voltage Active mode VOL 0.2 × VBAT V Output high voltage VOH 0.8 × VBAT V LOW level input current with internal pull up enabled VI = VSS = 0V5 VBAT = 3.0V IIL_PU -180 60 µA HIGH level input current with internal pull down enabled VI = VBAT = 3.0V IIH_PD 60 180 µA

11 DC/RF Characteristics

Normal Conditions: +25 °C, VBAT = 3.0V Table 11: 2 Mbps PHY Condition Items Contents Bluetooth specification (power class) Version 5.1 Channel frequency (spacing) 2402 to 2480 MHz (2MHz) Number of RF Channel 40 Current Consumption Minimum Typical Maximum Unit

• Tx Mode 3.2 mA
• Rx Mode 2.4 mA Tx Characteristics Minimum Typical Maximum Unit Center Frequency 2402 2480 MHz Channel Spacing 2 MHz Number of RF channel 40 Max Output power 2.5 4.9 dBm Modulation Characteristics
• Δf1avg 225 275 kHz
• Δf2max (at 99.9%) 185 kHz
• Δf2avg / Δf1avg 0.8 Carrier frequency offset and drift

4 VDD: IC internal power rail

5 VSS: Digital ground

• Frequency offset 150 kHz
• Frequency drift 50 kHz
• Drift rate 20 kHz Spurious Emissions
• 30-47 MHz (BW = 100 kHz) -36 dBm
• 47-74 MHz (BW = 100 kHz) -54 dBm
• 74-87.5 MHz (BW = 100 kHz) -36 dBm
• 87.5-118 MHz (BW = 100 kHz) -54 dBm
• 118-174 MHz (BW = 100 kHz) -36 dBm
• 174-230 MHz (BW = 100 kHz) -54 dBm
• 230-470 MHz (BW = 100 kHz) -36 dBm
• 470-862 MHz (BW = 100 kHz) -54 dBm
• 862-1000 MHz (BW = 100 kHz) -36 dBm
• 1000-12750 MHz (BW = 1 MHz) -30 dBm Rx Characteristics Minimum Typical Maximum Unit Receiver sensitivity (PER < 30.8%) -93 -70 dBm Maximum input signal level (PER < 30.8%) -10 dBm PER Report Integrity (-30 dBm input) -50 65.4 %

12 Land Patterns

Figure 7 shows the land patterns. Figure 7: Land Patterns *1 = Pin No.13 and No.14 are NC pins, but please connect to the GND on the customer board Top View (Unit: mm)

13 Reference Circuit

This section describes reference circuit configurations using internal OTP and external flash.

13.1 Configuration Using Internal OTP

Figure 8 shows the reference circuit configuration using internal OTP. Figure 8: Configuration Using Internal OTP

• Connection is necessary for software debugging in your product via J-Link.
• OTP writing can also be done using J-Link.
• RST input logic should be inverted externally if J-Link reset is enabled.
• 12 GPIOs (P0_0 to P0_11) are available for multipurpose use.
• P0_1 to P0_3, P0_6 and P0_7 can be used for analog input.

13.2 Configuration Using External Flash

Figure 9 shows the reference circuit configuration using external flash. Figure 9: Configuration Using External Flash

• Connection is necessary for software debugging in your product via J-Link.
• OTP writing can also be done using J-Link.
• RST input logic should be inverted externally if J-Link reset is enabled.

14 Tape and Reel Packing

This section provides the general specifications for tape and reel packing.

14.1 Dimensions of Tape (Plastic Tape)

Figure 10 is a graphical representation of the tape dimension (plastic tape). Cumulative tolerance of maximum 40.0 ± 0.15 mm every 10 pitches. Figure 10: Dimension of Tape (Plastic Tape) 2.0±0.1 1.75±0.1 0.3±0.05 1.55 maximum (1.45±0.1) 12.0±0.1 7.5±0.1 1.5+0.1/-0.0 16.0±0.2 feeding direction 4.0±0.1 7.4±0.05 1.5±0.1 7.8±0.05 (Unit: mm)

14.2 Dimension of Reel

Figure 11 shows the dimensions of reel in millimeters. Figure 11: Dimensions of Reel Φ13±2 2±0.5 (Φ100) (Φ330) 17.5 22.5 max. (Unit: mm)

14.3 Taping Diagrams

Figure 12 show the taping diagrams. Figure 12: Taping Diagrams Mark Description 1 Feeding hole. As specified in Dimensions of Tape (Plastic tape) 2 Hole for Chip. As specified in Dimensions of Tape (Plastic tape) 3 Cover tape. 62 μm in thickness. 4 Base tape. As specified in Dimensions of Tape (Plastic tape) [2] [3] [4] [3] [1] Feeding Hole Chip Feeding Direction Pin 1 Marking

14.4 Leader and Tail Tape

Figure 13 shows the leader and tail tape. Figure 13: Leader and Tail Tape

• The tape for chips is wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.
• The cover tape and base tape are not adhered at no components area for 250 millimeters minimum.
• Tear off strength against pulling of cover tape : 5N minimum.
• Packaging unit : 1000pcs./ reel
• Material :
• Base tape: Plastic
• Real: Plastic
• Cover tape, cavity tape and reel are made the anti-static processing.
• Peeling of force: 1.1N maximum in the direction of peeling as shown in Figure 14. Tail tape (No components) 40 to 200 mm Components No Components 150 mm minimum Leader tape (Cover tape alone) 250 mm minimum Feeding direction

Figure 14: Peeling Force

14.5 Packaging (Humidity Proof Packing)

Figure 15 shows the humidity proof packaging. Figure 15: Packaging Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 1.1 N maximum. Base tape Cover tape Label Anti-humidity Plastic Bag 湿度 インジケ－タ 乾燥剤 表示ラべル 防湿梱包袋 表示ラベル Humidity Indicator Desiccant Label

14.6 Certification Label

Figure 16 shows the certification label. Figure 16: Certification Label This label is an example. Please check the Section 5 for each certification number. The above label is attached on the anti-humidity Plastic Bag.

15 Notice

15.1 Storage Conditions

• Please use this product within 6 months after receipt.
• The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH (Packing materials, in particular, may be deformed at the temperature over 40 °C).
• The product left more than 6 months after reception; it needs to be confirmed the solderability before used.
• The product must be stored in noncorrosive gas (Cl2, NH3, SO2, NOX, etc.).
• Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, must not be applied in order not to damage the packing materials.
• This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
• After the packing opened, the product must be stored at <30 °C / <60 %RH and the product must be used within 168 hours after opening. XXXXXXX XXXXXXX XXXXXXX

• When the color of the indicator in the packing changed, the product shall be baked before soldering.
• Baking condition: 125 +5/-0 °C, 24 hours, 1 time
• The products must be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) is not heat-resistant.

15.2 Handling Conditions

• Be careful in handling or transporting products because excessive stress or mechanical shock may break products.
• Handle with care if products may have cracks or damages on their terminals. If there is any such damage, the characteristics of products may change. Do not touch products with bare hands that may result in poor solder ability and destroy by static electrical charge.

15.3 Standard PCB Design (Land Pattern and Dimensions)

• All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.
• The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

15.4 Notice for Chip Placer

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

15.5 Soldering Conditions

The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the above-mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.

Figure 17: Reflow Soldering Standard Conditions (Example) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

15.6 Cleaning

Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is done the customer is responsible for any issues or failures caused by the cleaning process.

15.7 Operational Environment Conditions

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity, and pressure). Therefore, products have no problems to be used under similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.

• In an atmosphere containing corrosive gas (Cl2, NH3, SOX, NOX etc.).
• In an atmosphere containing combustible and volatile gases.
• Dusty place.
• Direct sunlight place.
• Water splashing place.
• Humid place where water condenses.
• Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. Within 120 s Pre-heating time(s) 220 °C Within 60 s Cooling down Slowly 180 °C 150 °C 250 °C Within 10 s Tpeak-5°C

Do not apply static electricity or excessive voltage while assembling and measuring, as it might be a cause of degradation or destruction to apply static electricity to products.

16 Preconditions to Use Our Products

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIM ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and blob) we may provide or to be embedded into our product (“Software”) provided that you use the Software bundled with our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU “AS IS” BASIS, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You shall indemnify and hold harmless us, our affiliates, and our licensor from and against any and all claims, costs, expenses and liabilities (including attorney’s fees), which arise in connection with the using the Software. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS.

• Aircraft equipment.
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• Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by
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Revision History

Revision Date Description Change Description Aug 30, 2021 Initial Release A Dec 02, 2021 • 6. Dimensions, Marking and Terminal Configurations Pin Layout

• 12.Land Patterns
• Corrected the description of Pin No13 and 14
• Added comment B Jan 12, 2022 • DC/RF Characteristics
• 13. Reference Circuit
• 13.1 Configuration using internal OTP
• 13.2 Configuration using external flash
• Revised the table
• Added the reference circuit
• Added the reference circuit C May 20, 2020 • 13. Reference Circuit
• 13.1 Configuration using internal OTP
• 13.2 Configuration using external flash
• Added comment
• Added comment D Mar 02, 2023 • 5. Certification Information
• 5.1 Radio Certification
• 5.2 Bluetooth Qualification
• Added the certification No.
• Added QDID E Sep 28, 2023 • 11. DC/RF Characteristics Added Output power Max F Nov 28, 2023 • All sections Updated to new document template

Copyright © Murata Manufacturing Co., Ltd. All rights reserved. The information and content in this document are provided “as-is” with no warranties of any kind and are for informational purpose only. Data and information have been carefully checked and are believed to be accurate; however, no liability or responsibility for any errors, omissions, or inaccuracies is assumed. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Other brand and product names are trademarks or registered trademarks of their respective owners. Specifications are subject to change without notice.