LBAD0ZZ1SE-743

Murata Manufacturing Co...

LTE CAT M1/NB -IoT Module Rev 1.2 11/11/2021

Manufacturer: Murata Manufacturing Co...

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LBAD0ZZ1SE MURATA | Alldatasheet

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Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 26

Technical content

Features

LTE Cat M1 – Class 3, up to 23dBm
NB-IoT (NB1) Rel. 13
STM32L462RE/Cortex M4 w/512KB Flash and 160 KB SRAM
1MB on-board Serial Flash
Dimension: 15.4 x 18.0 x 2.5 mm (max)
Package: LGA
SIM card: internal eSIM (WLCSP)
Antenna configurations: U.FL antenna connection
3GPP eDRX and PSM modes
Power Consumption: enables up to 10-year battery life
Operating temperature range: -40 °c to 85 °c
Global Certifications: GCF and PTCRB
IPv4/IPv6 stack with TCP and UDP protocol
SSL/TLS
LTE universal modem supports (low-band and mid-band):
Low-band B5/B8/B12/B13/B14(CAT M1 Only)/B17/B18/B19/B20/B26/B28
Mid-band B1/B2/B3/B4/B25 Benefits
Certified as a host device for ease of integration with several different types of applications .
Quicker time to market (no additional carrier or regulatory certification).
Less development time and costs for developer/device manufacturer in need of LTE Cat M1/NB-loT connectivity
eSIM included in certification.
Build/Develop applications with the use of ST's vast set of software modules .
Availability of ST's Community and Development Forums. Notice
This module cannot be used in a smartphone or other wireless telephone or a tablet and any device that is capable of providing a wireless hotspot for other devices, is capable of providing two-way voice communication. LBAD0ZZ1SE LTE CAT M1/NB-IoT Module

Revision History

Revision Date Author Change Description 1.0 10/05/2020 RF PD Initial release 1.1 02/25/2021 RF PD Add Introduction section title and include block diagram, acronyms and reference to this section. 1.2 11/11/2021 RF PD Add Notice to Page1. Updated 7 Packaging and Marking Information

1 Introduction

1.1 Scope

This product is designed to meet 3GPP Rel-13 specifications. Table 1-1 Module Specifications Part Number LBAD0ZZ1SE Connectivity 3GPP Release 13/Optimized for LTE Class 3 output power (+23 dBm) Universal LTE (LB & MB) Low-band: B5/B8/B12/B13/B14(CAT M1 Only) /B17/B18/B19/B20/B26/B28 Mid-band: B1/B2/B3/B4/B25 Voltage Input 3.3-5V Antenna Off board multi-band antenna Dimension 15.4 x 18.0 x 2.5 mm (max) Peripheral Interfaces GPIO, ADC, I2C, PWM, SPI, UART Operating Temp -40° to 85° C

1.2 Block Diagram

Figure 1 Type 1SE Block Diagram

1.3 Acronyms

LTE Long Term Evolution - UART Universal Asynchronous Receiver Transmitter - eUICC Embedded SIM (Subscriber Identity Module - LGA Land Grid Array - BB Baseband - RFIC Radio Frequency Integrated Circuit - LB Low Band (699 MHz to 915 MHz frequency range) - MB Mid Band (1710 MHz to 2025 MHz frequency range) - PSM Power Save Mode - eDRX Extended Discontinuous Receive

1.4 Reference

[1] STMicroelectronics, STM32L462CE STM32L462RE STM32L462VE datasheet, May 2018. [2] STMicroelectronics, B-L462E-CELL1 Discovery Kit for NB/M1 communication Discovery Board, UM2743, User Manual

2 Mechanical Specification

2.1 Module Dimensions

Table 2-1: Module Dimensions Parameter Typical Unit

2.2 Top and Side View

Figure 2.1 Module Top and Side View (Unit: mm)

2.3 PCB Footprint Top View

Figure 2.2 Module Footprint Top View (Unit: mm) Tolerance Subject Tolerance(mm) Product Outline 18.0 ± 0.20 × 15.4 ± 0.20 Peripheral pin size 0.60 ± 0.10 × 0.30 ± 0.10 Peripheral pin size（Corner） 0.60 ± 0.10 × 0.55 ± 0.10 Center pin size（except pin103） 0.80 ± 0.10 × 0.80 ± 0.10 Location between pin to pin ±0.10 Location between pin to PCB edge ± 0.20

2.4 Pin Configuration

For further detail of the built-in STM32, please refer to the STM32L462CE STM32L462RE STM32L462VE datasheet [1]. Table 2-2 Pinouts Pin # Pin Name STM32L462 Type Description

1 USART2_RTS E6 I/O PA1/USART2_RTS

2 USART2_RX F6 I/O PA3/USART2_RX

3 USART2_TX G7 I/O PA2/USART2_TX

4 USART2_CTS H8 I/O PA0/USART2_CTS

5 VDDA F7 Power ADC power; connect to VDD_1V8 if not used

6 VSSA G8 Power ADC GND

7 NRST F8 Reset Reset STM32

8 NC No Connect

9 NC No Connect

10 GPIO_EXTI7 E1 I/O PC7/GPIO_EXTI7

11 NC_RST_IND I/O Reserved for internal usage and testing

12 NC No Connect

13 NC No Connect

14 NC No Connect

15 NC No Connect

16 RFT_UART2_CTS I Recovery UART_CTS

17 RFT_UART2_TX O Recovery UART_RX

18 RFT_UART2_RTS O Recovery UART_RTS

19 RFT_UART2_RX I Recovery UART_TX

20 NC No Connect

21 NC No Connect

22 NC No Connect

23 RFT_UART1_RTS O Log UART_RTS

24 RFT_UART1_TX O Log UART_TX

25 RFT_UART1_RX I Log UART_RX

26 RFT_UART1_CTS I Log UART_CTS

27 NC No Connect

28 GND GND GND

29 NC No Connect

30 NC No Connect

31 NC No Connect

32 NC No Connect

33 NC No Connect

34 NC No Connect

35 NC No Connect

36 NC No Connect

37 PMU_AT_IN I Connect to GND

38 NC No Connect

39 NC No Connect

40 NC No Connect

41 NC No Connect

42 GND GND

43 VDD Power Power supply for Type1SE

44 VDD Power Power supply for Type1SE

45 VDD Power Power supply for Type1SE

46 GND GND GND

47 NC No Connect

48 NC No Connect

49 NC_SIM_CLK O SIM clock

50 NC_VSIM O SIM power supply

51 GND GND GND

52 NC_SIM_DETECT I SIM detect

53 NC_SIM_RST O SIM reset

54 PH1_OSC_OUT E8 I/O PH1/RCC_OSC_OUT

55 PH0_OSC_IN D8 I/O PH0/RCC_OSC_IN

56 NC No Connect

57 NC_SIM_IO I/O SIM data

58 ADC1_IN1 D7 I/O PC0/ADC1_IN1

59 ADC1_IN3 D6 I/O PC2/ADC1_IN3

60 ADC1_IN2 D5 I/O PC1/ADC1_IN2

61 ADC1_IN4 E7 I/O PC3/ADC1_IN4

62 RTC_TAMP1 B8 I/O PC13/RTC_TAMP1

63 BOOT0 B6 I/O PH3/BOOT0

64 SF_EN B5 I/O PB6/SF_EN

65 RCC_MCO E3 I/O PA8/RCC_MCO

66 NC No Connect

67 NC No Connect

68 VDD_1V8 Power Reserved for codec supply/MCU VBAT/MCU VDDA

69 I2C1_SDA C6 I/O PB9/I2C1_SDA

70 I2C1_SCL A6 I/O PB8/I2C1_SCL

71 VBAT B7 Power Backup supply; connect to VDD_1V8 if not used

72 SPI1_SCK F5 I/O PA5/SPI1_SCK

73 SPI1_MOSI C5 I/O PB5/SPI1_MOSI

74 SPI1_MISO A4 I/O PB4/SPI1_MISO/NJTRST

75 SPI1_NSS A2 I/O PA15/SPI1_NSS/JTDI

76 TIM2_CH2 B4 I/O PB3/TIM2_CH2/JTDO/TRACESWO

77 NC No Connect

78 NC No Connect

79 GND GND GND

80 NC No Connect

81 eSIM_SWP I/O SWP for NFC to ST33

82 NC No Connect

83 NC No Connect

84 VDDUSB A1 Power 3.0 to 3.6 V supply for USB; connect to VDD_1V8 if not used

85 SWCLK C3 I/O PA14/JTCK/SWCLK

86 SWDIO C2 I/O PA13/JTMS/SWDIO

87 USB_DP D3 I/O PA12/USB_DP

88 USB_DM D2 I/O PA11/USB_DM

89 USART1_RX C1 I PA10/USART1_RX

90 USART1_TX D1 O PA9/USART1_TX

91 TIM15_CH2 F1 I/O PB15/TIM15_CH2

92 TIM15_CH1 G1 I/O PB14/TIM15_CH1

93 TIM3_CH4 E2 I/O PC9/TIM3_CH4

94 TIM3_CH1 F2 I/O PC6/TIM3_CH1

95 QUADSPI_IO0 F4 I/O PB1/QUADSPI_BK1_IO0

96 QUADSPI_CLK H4 I/O PB10/QUADSPI_CLK

97 QUADSPI_nCS H3 I/O PB11/QUADSPI_BK1_NCS; connect to 98 to use internal

98 SF_nCS I/O Internal serial flash chip select

99 QUADSPI_IO1 H5 I/O PB0/QUADSPI_BK1_IO1

100 QUADSPI_IO3 H6 I/O PA6/QUADSPI_BK1_IO3

101 QUADSPI_IO2 E5 I/O PA7/QUADSPI_BK1_IO2

126 GND GND Ground

3.1 Tx Output Power

The module is compliant to the 3GPP spec for release 13 and rated at a Class 3 device (23 dBm)

3.2 Rx Sensitivity

Min Typ. Max Unit Frequency Range LB 703 960 MHz MB 1710 2170 MHz Rx Sensitivity MCS5, BER<5% -103 dBm

4 Environmental Specification

4.1 Absolute Maximum Rating

Table 4-1 Absolute Maximum Rating Description Min Max Unit VDD -0.3 6 V PA Stability 6:1 VSWR

4.2 Recommended Operating Condition

Table 4-2 Recommended Operating Condition Description Min Max Unit VDD 3.3 5.0 V

4.3 Temperature Range

Table 4-3 Temperature Range Description Range Note Storage temperature range -40 ºC – 85 ºC Storage and non-operational Operating temperature range -40 ºC – 85 ºC Module is fully functional† -10 ºC – 55 ºC Module is fully functional† and fully meets 3GPP specification (†) Functional: the module is able to connect to PDN and transfer data.

5 Application Information

5.1 Recommended PCB Landing Pattern

The recommended PCB landing pattern is the same as the module footprint, see Figure 2.2.

5.2 External Antenna

The Type 1SE module has a built-in standard u.FL RF connector. To select any external antenna please read the regulatory information in section 8 Regulatory Information first. Make sure that you pick the antenna that covers the correct frequency for the appropriate band and make sure 50-Ohm impedance matching.

5.3 Development Kit and Reference Design

The development kit of type 1SE module is jointly developed by Murata and STMicroelectronics. Please refer to STMicroelectronics B-L462E-CELL1 Discovery Kit and related documents for detail [2].

6 Assembly Information

The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the conditions mentioned above to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions: Figure 6.1 Reflow Profile Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. Since this Product is Moisture Sensitive, any cleaning is NOT permitted.

7 Packaging and Marking Information

7.1 Dimensions of Tape (Plastic tape)

Figure 7.1 Tape Dimensions (Unit in mm)

7.2 Dimensions of Reel

Figure 7.2 Reel Dimensions (Unit in mm)

7.3 Taping Diagrams

7.4 Leader and Tail tape

Figure 7.3 Tape Leader and Tail The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at none components area for 250 mm min. Tear off strength against pulling of cover tape: 5 N min. Packaging unit: 500 pcs./ reel Material: - Base tape: Plastic - Reel : Plastic - Cover tape, cavity tape and reel are made the anti-static processing. Tail tape (No components) 40 to 200mm Components No components 150mm min. Leader tape (Cover tape alone) Feeding direction

7.5 Peeling Force

1.3 N max. in the direction of peeling as shown below. Figure 7.4 Peeling Force Diagram

7.6 PACKAGE (Humidity proof Packaging)

Figure 7.5 Packaging Diagram Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. 165 to 180 ° 1.3 N max. Base tape Cover tape

7.7 Module Marking Information

Figure 7.6 shows the module marking. Dimensions are nominal, not absolute. Number Items Description 1 #1 pin mark ● 2 2D code IMEI information

3 Murata mark

4 Product name Type1SE

7 FCC certification # FCCID:HSW-TY1SCDM

8 IC certification # IC:4492A-TY1SCDM

Figure 7.6 Module Marking Diagram

7.8 Moisture Sensitivity Level

The LBAD0ZZ1SE is planned to be qualified to moisture sensitivity level 4 (MSL4) in accordance with JEDEC J-STD-020. *This product is moisture sensitive. Please check the detail in 11.1 Storage Condition section.

8 Regulatory Information

8.1 FCC Info

This device has Single Modular Approval. This device is approved for mobile and fixed use with respect to RF exposure compliance and may only be marketed to OEM installers. The antenna(s) used for this transmitter, as described in this filing, must be installed to provide a separation distance of at least 20 cm from all persons. Installers and end -users must be provided with operating conditions for satisfying RF exposure compliance. Maximum permitted antenna gain including cable loss should be determined from tables 8.1 and 8.2. Failure to follow these guidelines will result in radiated RF levels that exceed FCC MPE limits.

8.2 FCC Test Data

Freq. (MHz) Operation Distance (cm) Conducted Average output power (dBm) Max. output Power include tolerance (dBm) Antenna Gain (dBi) EIRP (ERP) Limit (dBm) Max. output Power (mW) Power Density (PD) (mW/cm2) PD Limit (mW/cm2) Allowable Gain according to EIRP (dBi) Allowable Gain according to PD (dBi) Max Allowable Gain (dBi) Operation Mode Freq. (MHz) Operation Distance (cm) Conducted Average output power (dBm) Max. output Power include tolerance (dBm) Antenna Gain (dBi) EIRP (ERP) Limit (dBm) Max. output Power (mW) Power Density (PD) (mW/cm2) PD Limit (mW/cm2) Allowable Gain according to EIRP (dBi) Allowable Gain according to PD (dBi) Max Allowable Gain (dBi) FCC CAT M1 FCC NB IoT

8.3 ISED Test Data

8.4 List of Applicable FCC Rules

This module complies with below part 22, 24, 27 and 90 of the FCC Rules. Part 22 Subpart H Part 24 Subpart 24E Part 27 Subpart B, C & L Part 90 R & S Operation Mode Freq. (MHz) Operation Distance (cm) Conducted Average output power (dBm) Max. output Power include tolerance (dBm) Antenna Gain (dBi) EIRP (ERP) Limit (dBm) Max. output Power (mW) Power Density (PD) (W/m2) Limit (W/m2) Allowable Gain according to EIRP (dBi) Allowable Gain according to PD (dBi) Max Allowable Gain (dBi) Operation Mode Freq. (MHz) Operation Distance (cm) Conducted Average output power (dBm) Max. output Power include tolerance (dBm) Antenna Gain (dBi) EIRP (ERP) Limit (dBm) Max. output Power (mW) Power Density (PD) (W/m2) Limit (W/m2) Allowable Gain according to EIRP (dBi) Allowable Gain according to PD (dBi) Max Allowable Gain (dBi) ISED CAT M1 ISED NB IoT

8.5 Labeling Requirements

Any device incorporating this module must include an external, visible, permanent marking or label which states: “Contains FCC ID: HSW-TY1SCDM” and “Contains IC :4492A-TY1SCDM” Obligation d'étiquetage du produit final: Tout dispositif intégrant ce module doit comporter un externe, visible, marquage permanent ou une étiquette qui dit: "Contient IC: 4492A-TY1SCDM”

8.6 Additional Testing Requirements

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

8.7 Test Modes

Murata Manufacturing Co., Ltd. uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact Murata Manufacturing Co., Ltd. for assistance with test modes needed for module/host compliance test requirements. Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1) this device may not cause harmful interference and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. ISED Canadian Notice This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Avis Canadien L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

9 RoHS Information

The LBAD0ZZ1SE module is conformed to RoHS requirement. Table 10-1 Ordering Information Product Model Name Murata Ordering Part Number Standard Order Increment Sample Module Type 1SE LBAD0ZZ1SE-743SMP 1 pcs Production Module Type 1SE LBAD0ZZ1SE-743 500 pcs

11 Notice

11.1 Storage Conditions

Please use this product within 6 months after receipt. - The product shall be stored in original under with an ambient temperature from 5 to 35°C, and humidity from 20% to 70%RH. (Packing materials, in particular, may become deformed if the temperature exceeds 40°C.) - If the product is not used for more than 6months after receipt, confirm the solderability before use. - Store the product in non-corrosive gas (Cl2, NH3, SO2, NOx, etc.). - Avoid mechanical shock, such as dropping or puncturing the product, to preserve integrity of the packing materials. This product is applicable to MSL4 (Based on JEDEC Standard J-STD-020) - After the package is opened, store it at <30°C / <60%RH and use the product within 72hours. Please record and manage the time after opening. - Product should be repacked with desiccating agent immediately after using. - If the color of the indicator in the packing changes, bake the product before solde ring. Baking condition: 125+5/-0°C, 24hours, 1 time Baked the product on a heat-resistant tray because other materials (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. * For the MSL standard, see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org). If the storage environment is not conducted above standard conditions, it will cause some issue (e.g., Operation issue, Overcurrent, Malfunction) we shall not be responsible for that. Before using please refer to “PRECONDITIONS TO USE MURATA PRODUCTS”

11.2 Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge.

11.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characterist ics in the actual set. If use non-standard lands, contact Murata beforehand.

11.4 Notice for Chip Placer

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn -out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

11.5 Operational Environment Conditions

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above - mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas (Cl2, NH3, SOx, NOx, etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring.

11.6 Input Power Capacity

Products shall be used in the input power capacity as specified in this specification. Inform Murata beforehand, in case that the components are used beyond such input power capacity range.

12 PRECONDITIONS TO USE MURATA PRODUCTS

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribe d on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification . Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention o f such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL C LAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. -Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other in tellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third -party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receivin g date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to th eir development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the installation o r integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can’t agree the above contents, you should inquire our sales.

Product Information

LBAD0ZZ1SE-743 specifications and overview.

Summary

LTE CAT M1/NB -IoT Module Rev 1.2 11/11/2021

Description

LTE CAT M1/NB -IoT Module Rev 1.2 11/11/2021

Source title LBAD0ZZ1SE-743 Datasheet(PDF) - Murata Manufacturing Co., Ltd

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