LBA710 LITTELFUSE | Alldatasheet
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LBA710 is a 60V, 1A, 0.6 dual Solid State Relay integrating independent single-pole normally open (1-Form-A) and single-pole normally closed (1-Form-B) relays into a single package. It features a superior combination of low on-resistance and 1A load current handling capability. Security Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Medical Equipment-Patient/Equipment Isolation Industrial Controls Low On-Resistance (0.6) Low Control Current (2mA) 3750V rms Input/Output Isolation 100% Solid State Low Drive Power Requirements No EMI/RFI Generation Surface Mount Version Small 8-Pin Package Tape & Reel available + Control – Control + Control – Control Normally Closed Form-B Normally Open Form-A Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices Form-B IF 10% 90% ILOAD toff ton Form-A IF ILOAD 10% 90% ton toff UL Recognized Component: File # E76270 CSA Certified Component: Certificate # 1175739 TUV EN 62368-1: Certificate # B 082667 0008
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R06 LBA710 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Parameter Conditions Symbol Min Typ Max Units Output Characteristics: Form-A (Normally Open) Blocking Voltage I L=1AV DRM 60 - - V P Load Current Continuous IF=2mA I L --1 Arms / ADC Peak IF=2mA, t < 10ms I LPK -- ± 5 A P On-Resistance I F=2mA, IL=1A R ON - 0.21 0.6 Switching Speeds T urn-On Output (Activate) IF=5mA, VL=10V ton - 0.7 5 ms T urn-Off Output (Deactivate) t off - 0.09 5 Off-State Leakage Current I F=0mA, VL=60V I LEAK --1 A Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -4 4- p F Output Characteristics: Form-B (Normally Closed) Blocking Voltage I F=2mA, IL=1AV DRM 60 - - V P Load Current Continuous IF=0mA I L --1 Arms / ADC Peak IF=0mA, t < 10ms I LPK -- ± 5 A P On-Resistance I F=0mA, IL=1A R ON - 0.39 0.6 Switching Speeds T urn-On Output (Deactivate) IF=5mA, VL=10V ton - 0.63 5 ms T urn-Off Output (Activate) t off - 1.5 5 Off-State Leakage Current I F=2mA, VL=60V I LEAK --1 A Output Capacitance I F=2mA, VL=50V , f=1MHz C OUT - 125 - pF Input Characteristics: Form-A and Form-B Input Control Current to Activate I L=1A I F --2 m A Input Control Current to Deactivate - I F 0.1 - - mA Input Voltage Drop I F=5mA V F 0.9 1.36 1.5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics: Form-A and Form-B Capacitance, Input to Output V IO=0V , f=1MHz C IO -3- p F *NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package total power dis sipation value. Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms ESD Rating, Human Body Model 8 kV Operational T emperature, Ambient -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION LBA710 www.ixysic.com 3R06 LED Forward Voltage Drop (V) Device Count (N) Form-A Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Form-A Typical Turn-On Time (N=50, IF=5mA) Turn-Off Time (ms) Device Count (N) Form-A Typical Turn-Off Time (N=50, IF=5mA) On-Resistance (:) Device Count (N) Form-A Typical On-Resistance Distribution (N=50, IF=2mA, IL=1A) Blocking Voltage (VP) Device Count (N) Form-A Typical Blocking Voltage Distribution (N=50) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.70 0.75 0.80 0.85 0.90 0.95 Form-A Typical IF for Switch Operation vs. Temperature (IL=500mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 500 1000 1500 2000 2500 Form-A Typical Turn-On Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) Form-A Typical Turn-Off Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -50 -25 0 25 50 75 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Typical LED Forward Voltage Drop vs. Temperature IF=10mA IF=5mA IF=2mA LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 200 400 600 800 1000 1200 Form-A Typical Turn-On vs. LED Forward Current (IL=100mA, TA=25ºC) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (Ps) 77.1 77.2 77.3 77.4 77.5 77.6 77.7 77.8 Form-A Typical Turn-Off vs. LED Forward Current (IL=100mA, TA=25ºC) Form-A PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R06 LBA710 Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 0.12 0.14 0.16 0.18 0.20 0.22 0.24 0.26 Form-A Typical On-Resistance vs. Temperature (IF=2mA, IL=500mA) Voltage (V) Current (A) -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 Typical Load Current vs. Load Voltage (IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (A) 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Form-A Maximum Load Current vs. Temperature (IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Form-A Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) Form-A Typical Leakage vs. Temperature Measured Across Pins 5&6 (VL=60V) Load Voltage (V) 0.1 1 10 100 Output Capacitence (pF) 100 120 Form-A Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) Form-A Energy Rating Curve Form-A PERFORMANCE DATA (continued)* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION LBA710 www.ixysic.com 5R06 LED Forward Voltage Drop (V) Device Count (N) Form-B Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Form-B Typical Turn-On Time (N=50, IF=5mA) Turn-Off Time (ms) Device Count (N) Form-B Typical Turn-Off Time (N=50, IF=5mA) On-Resistance (:) Device Count (N) Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=1A) Blocking Voltage (VP) 69 71 73 75 77 79 81 Device Count (N) Form-B Typical Blocking Voltage Distribution (N=50, IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.12 0.16 0.20 0.24 0.28 0.32 Form-B Typical IF for Switch Operation vs. Temperature (IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (ms) 0.4 0.5 0.6 0.7 0.8 0.9 Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (ms) 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Form-B Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mA) Temperature (ºC) -50 -25 0 25 50 75 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Typical LED Forward Voltage Drop vs. Temperature IF=10mA IF=5mA IF=2mA LED Forward Current (mA) 0 1 02 03 04 05 0 Turn-On Time (ms) 0.620 0.622 0.624 0.626 0.628 0.630 0.632 0.634 0.636 0.638 0.640 Form-B Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (ms) Form-B Typical Turn-Off Time vs. LED Forward Current (IL=100mA) Form-B PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R06 LBA710 Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 0.28 0.32 0.36 0.40 0.44 0.48 Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=500mA) Voltage (V) Current (A) -1.0 -0.5 0.0 0.5 1.0 Form-B Typical Load Current vs. Load Voltage (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (A) 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Form-B Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Form-B Typical Blocking Voltage vs. Temperature (IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (PA) 0.00 0.02 0.04 0.06 0.08 0.10 Form-B Typical Leakage vs. Temperature Measured Across Pins 7&8 (IF=2mA, VL=60V) Load Voltage (V) 0.1 1 10 100 Output Capacitance (pF) 100 150 200 250 300 350 400 450 Form-B Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) Form-B Energy Rating Curve Form-B PERFORMANCE DATA (continued)* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
INTEGRATED CIRCUITS DIVISION LBA710 www.ixysic.com 7R06 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation LBA710S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classifi cation Temperature (Tc) Dwell Time (t P) Max Refl ow Cycles LBA710S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device Maximum Pin Temperature Maximum Body Temperature Maximum Dwell Time Wave Cycles LBA710 260ºC 250ºC 10 seconds* 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents.
INTEGRATED CIRCUITS DIVISION www.ixysic.com8 R06 LBA710 Mechanical Dimensions Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7 .239 TYP . (0.285) 7 .620 ± 0.254 (0.300 ± 0.010)
4.064 TYP
(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Notes: 1 . Controlling dimension: Inches 2. Leadframe thickness does not include solder plating (1000μinches max) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7 .620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1 .65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Notes: 1 . Controlling dimension: Inches 2. Coplanarity = 0.004” (0.102 mm) max 3. Leadframe thickness does not include solder plating (1000μinches max) LBA710 LBA710S
INTEGRATED CIRCUITS DIVISION LBA710 Specification: DS-LBA710-R06 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/2025 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. Dimensions mm (inches)User Direction of Feed NOTES: 1 . Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1=4.20 (0.165) K0=4.90 (0.193) P1=12.00 (0.472) 16.0±0.3 (0.63±0.012) B0=10.30 (0.406) A0=10.30 (0.406) 4.0 (0.16) 2.0 (0.08) 7. 5 (0.30) LBA710STR Tape & Reel