LB66B1 CTS | Alldatasheet
Document overview
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Technical content
METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LB66B1 Natural Conv. (°C/W): 17.1 Forced Air (°C/W): 5.3 Mounting Envelope: 1.40" x 1.12" x .50" DESCRIPTION OF CURVES N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss.• Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
- Derate 1.4 °C/watt for unplated part in natural convection only.
Ordering Information
CTS IERC PART NO. Unplated Comm'l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. ref. no. Max. Weight (Grams) LB66B1-76U LB66B1U LB66B1-67U LB66B1-77U LB66B1-76CB LB66B1CB LB66B1-67CB LB66B1-77CB LB66B1-76B LB66B1B LB66B1-67B LB66B1-77B Undrilled TO-66 TO-66 IC TO-66 IC (Socket) 6.2 6.2 6.2 6.2 HOLE PATTERNS 9. Hole Pattern no. 133 accommodates TO-66s. Available in LB series heat dissipators only. 7. Hole pattern no. 191 accommodates To-66 Ics. Available in LA-A, LA-B, and LB series heat dissipators only. 10. Hole pattern no. 225 accommodates TO-66 ICs (socket). Available in LB series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions
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Rev. 08-29-03