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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Features
- Supports 12V power supply systems
- Low saturation voltage: VO(sat) = 0.5V (typical) at IO = 400mA
- Zero current drawn in standby mode
- Braking function
- Supports parallel connection: IO max = 1.6A, V O(sat) = 0.6V (typical) at IO = 800mA
- Built-in spark killer diode
- Built-in thermal shutdown circuit
- Miniature package: MFP10SK (6.4mm 5.0mm) Typical Applications
- Refrigerator
- Thermal printers
- POS terminal
- Hot-water supplies
- Time Recorder www.onsemi.com
ORDERING INFORMATION
Ordering Code: LB1948MC-AH (MSL3) LB1948MC-BH (MSL1) Package MFP10SK (Pb-Free / Halogen Free) Shipping (Qty / packing) 1000 / Tape & Reel Motor Driver, Forward/Reverse, Low Saturation Voltage Drive, 12V MFP10SK (225mil) † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF XXXXXXXX YMDDD XXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM*
www.onsemi.com Specifications Absolute Maximum Ratings at Ta = 25C (Note 1) Parameter Symbol Conditions Ratings Unit Maximum supply voltage V CC max -0.3 to +20 V Output voltage V OUT -0.3 to +20 V Input voltage V IN -0.3 to +18 V Ground pin source current I GND Per channel 800 mA Allowable power dissipation Pd max Mounted on a specified board (Note 2) 870 mW Operating temperature Topr -20 to +85 C Storage temperature Tstg -40 to +150 C 1. Stresses exceeding those listed in the Maximum Rating table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Specified board: 114.3mm x 76.1mm x 1.6mm, glass epoxy board Recommendation Operating Condition at Ta = 25C (Note 3) Parameter Symbol Conditions Ratings Unit Supply voltage VCC 2.5 to 16 V Input high-level voltage V IH 1.8 to 10 V Input low-level voltage V IL -0.3 to +0.7 V 3. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Electrical Characteristics at Ta 25C, VCC = 12V (Note 4) Parameter Symbol Conditions Ratings Unit min typ max Current drain I CC0 IN1, 2, 3, 4 = 0V (Standby mode) 0.1 10 A ICC1 (Note 5) (Forward or reverse mode) 15 21 mA ICC2 (Note 6) (Brake mode) 30 40 mA Output saturation voltage V O(sat)1 I OUT = 200mA (High Side and Low Side) 0.25 0.35 V VO(sat)2 I OUT = 400mA (High Side and Low Side) 0.50 0.75 V Input current I IN V IN = 5V 85 110 A Spark Killer Diode Reverse current I S(leak) 30 A Forward voltage V SF I OUT = 400mA 1.7 V 4. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. IN1/IN2/IN3/IN4=H/L/L/L or L/H/L/L or L/L/H/L or L/L/L/H. 6. IN1/IN2/IN3/IN4=H/H/L/L or L/L/H/H.
www.onsemi.com Package Dimensions unit : mm MFP10SK (225 mil) CASE 751DA ISSUE A SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. (Unit: mm)1.0 5.60 0.47 1.0
www.onsemi.com Pdmax-Ta diagram Pin Assignment -20 0 20 40 60 80 1000 1.0 0.8 0.6 0.4 0.2 Pd max -- Ta 0.87 0.45 Ambient temperature, Ta -- C Allowable power dissipation, Pd max -- W Specified board: 114.3×76.1×1.6mm3 glass epoxy board. 1VCC 2IN1 3IN2 4IN3 5IN4 OUT1 OUT2 OUT3 OUT4 GND LB1948MC Top view
www.onsemi.com Truth Table Input Output Notes IN1 IN2 IN3 IN4 OUT1 OUT2 OUT3 OUT4 L L L L OFF OFF OFF OFF Standby mode L L OFF OFF 1CH Standby mode H L H L Forward L H L H Reverse H H L L Brake L L OFF OFF 2CH Standby mode H L H L Forward L H L H Reverse H H L L Brake Block Diagram VCC IN1 IN2 IN3 IN4 OUT1 OUT2 OUT3 OUT4 GND M M 60kΩ 80kΩ 60kΩ 80kΩ 60kΩ 80kΩ 60kΩ 80kΩ 10μF Control block Thermal shutdown circuit
www.onsemi.com Design Documentation (1) Voltage magnitude relationship There are no restrictions on the magnitude relationships between the voltages applied to VCC and IN1 to IN4. (2) Parallel connection The LB1948MC can be used as a single-channel H-bridge power supply by connecting IN1 to IN3, IN2 to IN4, OUT1 to OUT3, and OUT2 to OUT4 as shown in the figure. (IOmax = 1.6A, VO(sat) = 0.6V (typical) at IO = 800mA) 1V CC
2 IN1
3 IN2
4 IN3
5 IN4
M (3) Observe the following points when designing the printed circuit board pattern layout. Make the VCC and ground lines as wide and as short as possible to lower the wiring inductance. Insert bypass capacitors between VCC and ground mounted as close as possible to the IC. Resistors of about 10K must be inserted between the CPU output ports and the IN1 to IN4 pins if the microcontroller and the LB1948MC are mounted on different printed circuit boards and the ground potentials differ significantly. (4) Penetration electric current At the time of the next mode shift, a penetration electric current is generated in VCC-GND. There are not the deterioration of the IC by), the destruction as follows 1Atyp per this penetration electric current (1ch, 1μs; but for the stabilization of the power supply line of the IC is most recent, and, please can enter with a condenser. (i) Forward (Reverse) ↔ Brake (ii) Forward ↔ Reverse (iii) Standby → Brake In addition, the penetration electric current disappears when I put a wait mode of 10μs at the time of the change of the Forward ↔ Reverse. (5) Supplementary matter of the penetration electric current According to (4), a penetration electric current cannot influence IC life. Thermal Shutdown Temperature (1) Thermal shutdown temperature The thermal shutdown temperature Ttsd is 200 20C with fluctuations. (2) Thermal shutdown operation The operation of the thermal shutdown circuit is shown in the figure below. When the chip temperature Tj is in the direction of increasing (solid line), the output turns off at approximately 200C. When the chip temperature Tj is in the direction of decreasing (dotted line), the output turns on (returns) at approximately 125C. 100 120 140 160 180 200 220 VCC = 12V
100 C 220 C
220 C 100 C
Chip temperature, Tj -- C Output voltage, VO -- V LB1948MC Thermal shutdown reference chart
www.onsemi.com Thermal Shutdown Circuit Block Diagram Vref Reference voltage circuit Thermal shutdown circuit Drive circuit Function equivalent circuit Note: The above is an example of thermal shutdown circuits although there are some differences from the actual internal circuit. Thermal Shutdown Operation The thermal shutdown circuit compares the voltage of the heat sensitive element (diode) with the reference voltage and shuts off the drive circuit at a certain temperature to protect the IC chip from overheating. ICC -- VCC IIN -- VIN VO(sat) -- IO ICC -- Ta 0 5 10 15 20 0 5 10 15 20 400 100 200 300 0.6 0.1 0.3 0.5 0.2 0.4 0 100 200 300 400 500 600 -40 -20 0 20 40 60 80 100 120 140 VIN = 5V (= IN1 / IN2 or IN3 / IN4) H / H H / L, L /H L / L VCC = 12V IN1~4 VCC = 12V VCC = 12V (IN1 / 2) H /H H / L, L /H Current drain, ICC -- mA Supply voltage, VCC -- V Input current, IIN -- μA Input voltage, VIN -- V Output saturation voltage, VO(sat) -- V Current drain, ICC -- mA Output current, IO -- mA Ambient temperature, Ta -- °C High side and Low side
www.onsemi.com 0.1 0.2 0.3 0.4 0.5 0.7 0.6 0 40 80 12020 60 100 140 VCC = 12V High side and Low side IO = 400mA 300mA 200mA 100mA VO(sat) -- Ta -20-40 Output saturation voltage, VO(sat) -- V Ambient temperature, Ta -- °C ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and othe r Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety require ments or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any licenseunder its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life sup port systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended fo r implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, d amages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor isan Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.