LB1668M ONSEMI | Alldatasheet

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Technical content

Features

  • Output protection Zener Diodes with Variable Breakdown V oltages ♦ When the Z1 and Z2 Pins are Open: VOLM = 57 V ♦ When the Z1 and Z2 Pins are Shorted: VOLM = 32 V ♦ An External Zener Diode can be Connected between Z1 and VCC
  • Can Support Both 12 V and 24 V Power Supplies by Changing an External Resistor
  • Hall Elements can be Connected Directly
  • 1.5 A Output Current Output Transistors Built in
  • Built-in Rotation Detection Function that Outputs Low when Driven and High when Stopped
  • Motor Lock Protection and Automatic Recovery Functions Built in
  • Thermal Shutdown Function www.onsemi.com MFP14S CASE 751CB MARKING DIAGRAM PIN ASSIGNMENT VIN RD OUT2 IN− IN+ C NC OUT1 7 (Top View) See detailed ordering and shipping information on page 7 of this data sheet.

ORDERING INFORMATION

XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data XXXXXXXXXX YMDDD

www.onsemi.com SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Symbol Parameter Conditions Ratings Unit ICC max Maximum Input Current t ≤ 20 ms 200 mA VOUT Output Supply Voltage Internal V IOUT Output Current 1.5 A IRD/IFG RD/FG Flow-in Current 10 mA VRD/VFG RD/FG Supply Voltage 30 V Pd max Allowable Power Dissipation With specified board (Note 1) 0.8 W Topr Operating Temperature −30 to +80 °C Tstg Storage Temperature −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. .Specified board: 20 mm × 15 mm × 1.5 mm, glass epoxy. ALLOWABLE OPERATING RANGES (TA = 25°C) Symbol Parameter Conditions Ratings Unit ICC Input Current Range 6.0 to 50 mA VICM Common-mode Input Voltage Range 0 to VIN−1.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C, ICC = 10 mA) Symbol Parameter Conditions Min Typ Max Unit VOLM1 Output Limit Voltage Z1, Z2 open 54 57 60 V VOLM2 Z1, Z2 short 31 33 35 V VO(sat)1 Output Saturation Voltage IO = 0.5 A − 0.95 1.2 V VO(sat)2 IO = 1.0 A − 1.15 1.5 V VO(sat)3 IO = 1.5 A − 1.4 2.0 V VIN VIN Input Voltage ICC = 7.0 mA 6.4 6.7 7.0 V VOFF Amp Input Offset Voltage −7.0 0 +7.0 mV IBA Amp Input Bias Current −250 − − nA VRD(sat) RD Output Saturation Voltage IRD = 5 mA − 0.1 0.3 V IC1 C Flow-out Current 2.1 3.0 3.9 /C0109A IC2 C Discharge Current 0.31 0.44 0.59 /C0109A VTH1 Comparator Input Threshold Voltage 0.77 0.8 VIN 0.83 V VTH2 0.42 0.45 VIN 0.48 V TSD Thermal Shutdown Current Operating Temperature Design target value (Note 2) − 180 − °C /C0068TSD Thermal Shutdown Circuit Hysteresis Design target value (Note 2) − 40 − °C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Design target value and si not measured.

www.onsemi.com DESIGN DOCUMENTATION (See the Sample Application Circuits) 1. Power Supply V oltage (VIN pin): The resistor R1 (when VCC = 12 V , R1 = 330/C0087, and when VCC = 24, R1 = about 1.2 k/C0087) is inserted between VIN and the power supply VCC pin. When the ICC current is set in the range 6 to 50 mA, the VIN pin will be regulated to be 6.7 V . Not only does this provide stability with respect to power supply voltage variations and motor kickback, but it also provides adequate strength to withstand surges. 2. Output Transistors (OUT1 and OUT2 Pins) A Zener diodes with the following characteristics is inserted between the collector and base of each output transistor to absorb kickback voltages at 57 V (typical) and provide output protection.

  • Sustained output voltage: VO = 65 V minimum (design guarantee)
  • Output current: I O = 1.5 A maximum
  • Output saturation voltage: V O sat = 1.25 V/1.0 A (typical)
  • Safe operating range: IO = 1.0 A, VOLM = 57 V , t = 200/C0109s 3. Output Circuit Kickback V oltage Protection (Z1 and Z2 pins): These ICs support output protection that minimizes kickback noise by changing the kickback absorption voltage and absorption method according to the output current and power supply voltage used. 1) When the Z1 and Z2 pins are shorted: The output protection voltage will be 32 V (typical) using a V CC = 12 V power supply. 2) When the Z1 and Z2 pins are open: The output protection voltage will be 57 V (typical) using a V CC = 24 V power supply. 3) With a Zener diode inserted between Z1 and VCC or between Z1 and ground: This technique handles 120mm square H speed applications which require large output currents and involve large amounts of heat generated in the IC by dissipating the motor coil switching loss in external Zener diodes. 4. Output Protection when the Motor is Lock (C and FG pins): This circuit detects motor stopping due to, for example, overloading, and cuts the coil current. It also automatically recovers drive and motor turning from the output stopped state when the load returns to an appropriate level. The lock detection time is set with the value of an external capacitor. When C = 0.47 /C0109F
  • Lock detection time: about 1 s
  • Lock protection time: about 0.5 s (output on) about 3 s (output off) The RD pin is an open collector output and outputs a low level during drive and a high level when stopped. 5. Thermal Shutdown: This circuit turns the output off in response to coil shorting or IC overheating. 6. In applications that use an external transistor to turn the cooling fan power on and off, connect a capacitor of about 0.47 to 10 /C0109F between the fan power supply V CC and ground to provide a regenerative route for the fan motor coil current. Figure 6.

www.onsemi.com Figure 10. VIN − ICC Device Package Wire Bond Shipping† (Qty / Packing) LB1668M−TLM−E MFP14S (225mil) (Pb−Free) Au−wire 1,000 / Tape & Reel LB1668M−TLM−H MFP14S (225mil) (Pb−Free / Halogen Free) Au−wire 1,000 / Tape & Reel LB1668M−W−AH MFP14S (225mil) (Pb−Free / Halogen Free) Cu−wire 1,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

SOIC14 W / MFP14S (225 mil) CASE 751CB ISSUE A DATE 25 OCT 2013 SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (Unit: mm) 5.70 0.47 1.10 1.00 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ /C0071”, may or may not be present. XXXXXXXXXX YMDDD MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS http://onsemi.com © Semiconductor Components Industries, LLC, 2002 October, 2002 − Rev. 0 Case Outline Number: XXX DOCUMENT NUMBER: STATUS: NEW STANDARD: DESCRIPTION: 98AON67224E ON SEMICONDUCTOR STANDARD SOIC14 W / MFP14S (225 MIL) Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2

DOCUMENT NUMBER: 98AON67224E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM SANYO ENACT# S−002 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.

29 FEB 2012

A ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D. TRUHITTE

25 OCT 2013

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