LB145F LEIDITECH | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
Radial leaded devices High voltage surge capabilities Cured, flame retardant epoxy polymer insulating material meets UL94 V-0 requirements Agency Recognition: UL、CSA、TUV Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Product Dimensions (mm) A B C D E Lead Part number Marking system LB Product family Current rating * Lead materials: Tin-plated metal wire.
Electrical Characteristics
IH IT Ttrip Vmax Vint Imax Pd typ Rmin Rmax R1max Part number (A) (A) Current(A) Time(s) (Vdc) (Vac) (A) (W) (Ω) (Ω) (Ω) IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Ttrip=Maximum time to trip at 5 times hold current. Vmax=Maximum voltage device can withstand without damage at rated current. Vint = Maximum interrupt voltage device can withstand without damage at Rated current Imax=Maximum fault current device can withstand without damage at rated voltage. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. Rmax= Maximum device resistance at 25℃ prior to tripping. R1max= Maximum resistance of device when measured one hour post trip at 25℃. Thermal Derating Chart-IH(A) (Hold current at ambient temperature) Maximum ambient operating temperature(℃) Part number -40 -20 0 25 40 50 60 70 85
Package Information
Bulk: 1000pcs per bag. Tape & Reel: 1500pcs per reel. LB145F Phone: +86- 021-50828806 Email:sale1@leiditech.com http://www.leiditech.com SHANGHAI LEIDITECH ELECTRONICS TECHNOLOGY CO., LTD
Specifications are subject to change without notice page 2 of 2 Soldering Recommendations Wave Soldering Hand Soldering Soldering temperature：350℃±5℃. Soldering time：no more than 5s. Soldering position：away from PTC chip.