Features

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Features

Single-phase full-wave drive (15V-1.5A output transistor built in) upper output Tr incorporated half pre-driver. Variable speed control by an external signal. Separately-excited upper TR direct PWM control method, enabling silent, low-vibration variable speed control. Lowest speed setting possible. Current limiter circuit (the circuit actuated at IO = 1A when Rf = 0.5, Rf determines the limiter value.) Kickback absorption circuit built in. Soft switching circuit achieves low power consumption, low loss, and low noise driving at a time of phase change. HB built in. Lock protection and automatic reset functions incorporated (including a circuit that changes the ON/OFF ratio according to the power supply voltage). RD (lock detection) output. Thermal protection circuit incorporated (design guaranteed). Monolithic Digital IC Half-pre Motor Driver Single-Phase Full-Wave Drive, for Fan Motor SSOP16 (225mil)

www.onsemi.com Absolute Maximum Ratings at Ta = 25C Parameter Symbol Conditions Ratings Unit VCC maximum power supply voltage V CC max 20 V VM maximum power supply voltage VM max 20 V OUT pin maximum output current I OUT max Rf 0.39 1.5 A OUT pin output withstand voltage 1 V OUT max1 20 V OUT pin output withstand voltage 2 V OUT max2 T 0.4s 26.5 V PRE pin maximum source current IPSO max 30 mA PRE pin maximum sink current IPSI max 7 mA PRE pin output withstand voltage VP max 20 V HB maximum output current HB 10 mA VTH input pin withstand voltage VTH max 7 V RD output pin output withstand voltage VRD max 18 V RD output current IRD max 10 mA Allowable power dissipation Pd max Mounted on a specified board *1 0.8 W Operating temperature range Topr *2 30 to 95 C Storage temperature range Tstg 55 to 150 C *1 A circuit board for mounting (114.3mm76.1mm1.6mm, glass epoxy resin) *2 Tj max = 150C. Must be used within the operating temperature range in which Tj does not exceed 150C. Recommended Operating Range at Ta = 25C Parameter Symbol Conditions Ratings Unit VCC power supply voltage V CC 4 to 15 V VM power supply voltage V CC 3 to 15 V Current limiter operating range ILIM 0.6 to 1.2 A VTH input level voltage range VTH 0 to 6 V Hall input common phase input voltage range VICM 0.2 to 3 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recomme nded Operating Ranges limits mayaffect device reliability.

www.onsemi.com Electrical Characteristics at Ta = 25C, VCC = 12V, unless otherwise specified Parameter Symbol Conditions Ratings Unit min typ max Circuit current I CC1 During driving 9 12 mA HB voltage VHB IHB=5mA 1.05 1.25 1.40 V 6VREG voltage V6VREG 6VREG=5mA 5.80 6 6.20 V CT pin H level voltage VCTH 3.4 3.6 3.8 V CT pin L level voltage VCTL 1.4 1.6 1.8 V ICT pin charge current 1 ICTC1 V CC=12V 1.7 2.2 2.7 A ICT pin charge current 2 ICTC2 V CC=6V 1.3 1.8 2.3 A ICT pin discharge current 1 ICTD1 V CC=12V 0.11 0.15 0.19 A ICT pin discharge current 2 ICTD2 V CC=6V 0.34 0.44 0.54 A ICT charge/discharge ratio 1 RCT1 V CC=12V 12 15 18 ICT charge/discharge ratio 2 RCT2 V CC=6V 3 4 5 ICT charge/discharge ratio threshold voltage VRCT 6 6.6 7.3 V VTH bias current IBVTH 2 1 0 A OUT output H saturation voltage VOH I O=200mA, RL=1 0.6 0.8 V PRE output L saturation voltage VPL I O=5mA 0.2 0.4 V PRE output H saturation voltage VPH I O= 20mA 0.9 1.2 V Current limiter VRf V CC  VM 450 500 550 mV PWM output H level voltage VPWMH 2.2 2.5 2.8 V PWM output L level voltage VPWML 0.4 0.5 0.7 V PWM external C capacitor charge current IPWM1 23 18 14 A PWM external C capacitor discharge current IPWM2 18 24 30 A PWM oscillation frequency FPWM C=200pF 19 23 27 kHz Hall input sensitivity VHN Zero peak value (including offset and hysteresis) 15 25 mV RD output pin L voltage VRD IRD=5mA 0.2 0.3 V RD output pin leak current IRDL VRD=7V 30 A Thermal protection circuit THD Design target value *3 150 180 210 C *3 These are design guarantee values, and are not tested. The thermal protection circuit is implemented to prevent the IC from being thermally damaged or burned when exposed to an environment exceeding the guaranteed operating temperature range. Thermal design must be carried out so that the thermal protection circuit will never be activated while the fan is running in a stable condition. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product per formance may not be indicated by the Electrical Characteristics if operated under different conditions.

www.onsemi.com Package Dimensions unit : mm SSOP16 (225mil) CASE 565AM ISSUE A XXXXXXXXXX YMDDD XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. (Unit: mm) *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1.0 5.80 0.32 0.65 to

www.onsemi.com Pin Assignment Truth Table IN- IN+ VTH CPWM CT OUT1 OUT2 PRE1 PRE2 RD Mode H L L H L H OFF L H L Rotating - drive L H OFF H H L H L H L OFF OFF L H Rotating - regeneration L H OFF OFF H L H L - - H OFF OFF L H OFF Lock protection L H OFF OFF H L CPWM-H: CPWM>VTH, CPWM-L: CPWM<VTH OUT2 LB11660RV VCC VTH VM RMI CPWM RD IN+ HB IN- CT 6VREG GND OUT1 PRE2 PRE1 Top view 03 0-30 60 90 120 0.2 0.8 0.6 1.2 ILB01805 Pd max - Ta 0.35 0.4 Mounted on a specified board: 114.3mm76.1mm1.6mm glass epoxy Ambient Temperature, Ta -C Allowable Power Dissipation, Pd max - W

www.onsemi.com Sample Application Circuit 1 *1 <Power supply - GND wiring> GRD of the IC is connected to the co ntrol circuit power supply system and GRD of the external N-channel is connected to the motor power supply system. Groundings must be installed separately and all external control components must be connected to the GND line of the IC. *2 <Power stabilization capacitor for regeneration> For the CM capacitor, that is a power stabilization capacitor for PW M drive and for absorption of kick-back, a capacitance of 4.7F/25V or higher must be used. The CM capacitor must be connected without fail to prevent the IC from being damaged when power is tuned on or off. *3 <Speed control> 1) Control voltage The PWM duty ratio is determined by comparing the VTH pin voltage and the PWM oscillation waveforms. When the VTH pin voltage drops, the 'ON' duty ratio increases, and when it drops to or below the PWM output L level voltage, the duty ratio is 100%. 2) Thermistor In thermistor applications, the 6VREG voltage is usually divided by a resistor, and the voltage thus generated is supplied to the VTH pin. The PWM duty ratio is varied by the changes in the VTH pin voltage which result from changes in temperature. *4 < Setting the current limiter > The current limiter is actuated when the voltage of the current-sensing resistors between V CC and VM increases to 0.5V or more. Since the current of a current limiter circuit is limited by the current determined by I O = VRf/Rf (where VRf = 0.5V typ, Rf: current-sensing resistance), th e current limiter is actuated at I O = 1A when Rf = 0.5 . The Rf resistor must be connected without fail, and its constant must be within the recommended operating range for current limiters. VCC RD OUT1 OUT2 CT=0.47 to 1F CT VTH IN+ IN- CPWM CP=200pF *f=23kHz CP=100pF *f=46kHz H HB GND 6VREG VM Rf *4 Control voltage RMI PRE1 PRE2 CM=4.7F or higher

www.onsemi.com *5 <Hall input> Wiring need to be short to prevent carrying of the noise. The Hall input circuit is a comparator having a hysteresis of 20mV. It is recommended that the Hall input level be more than three times (60mVp-p) this hysteresis. *6 < PWM oscillation frequency setting capacitor > The oscillation frequency is 23kHz when CP = 200pF and 46kHz when CP = 100pF, and this serves as the PWM fundamental frequency. For the most part, the PWM frequency can be obtained from the following formula: f [kHz]  (4.610 6) ÷C [pF] *7 <RD output> This is the open collector type output, which outputs ''L'' duri ng rotation. It is set to 'OFF' when a lock is detected. This output is left open when not in use. *8 <HB pin> This is a Hall element bias pin, that is, the 1.25V constant-voltage output pin. *9 <RMI pin> Lowest speed setting pin for speed control. The minimum output duty setting is made with R3 and R4. The R4 is left open to stop operation at a duty ratio of 0%. Rotation Speed Control Chart Minimum output duty VTH (V) PWM DUTY(%) Duty100% Duty0% VPWML VPWMH RMI CPWM 2.5V 0.5V PWM control variable speed Full speed ON Duty Rotation set to minimum speed RMI voltage VTH voltage ON OFF

www.onsemi.com Sample Application Circuit 2 <no minimum speed setting, thermistor input> VCC RD OUT1 OUT2 CT=0.47 to 1F CT VTH IN+ IN- CPWM *5 H HB GND 6VREG VM RL RMI TH RTU PRE1 PRE2 CM=4.7F or higher CP=200pF *f=23kHz CP=100pF *f=43kHz

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ORDERING INFORMATION

Device Package Wire Bond Shipping (Qty / Packing) LB11660RV-MPB-H SSOP16 (225mil) (Pb-Free / Halogen Free) Au-Wire 90 / Fan-Fold LB11660RV-TLM-H SSOP16 (225mil) (Pb-Free / Halogen Free) Au-Wire 2000 / Tape & Reel LB11660RV-W-AH SSOP16 (225mil) (Pb-Free / Halogen Free) Cu-Wire 2000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF Amplifier with hysteresis CPWM M Control circuit HALL IN- IN+ VCC OUT1 RD OUT2 Delay circuit Delay circuit VTHGND 6VREG Constant voltage circuit Thermal protection circuit Charge/ discharge circuit 1.25V HB RMICT VM Pre-Driver Pre-Driver PRE2 PRE1 Oscillation circuit